|
US5320728A
(en)
*
|
1990-03-30 |
1994-06-14 |
Applied Materials, Inc. |
Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
|
|
USD363464S
(en)
*
|
1992-08-27 |
1995-10-24 |
Tokyo Electron Yamanashi Limited |
Electrode for a semiconductor processing apparatus
|
|
USD351450S
(en)
*
|
1993-05-19 |
1994-10-11 |
Riteflite Pty. Limited |
Target for shooting
|
|
USD376744S
(en)
|
1994-08-03 |
1996-12-24 |
Gerd Eisenblatter Gmbh |
Support plate
|
|
USD381030S
(en)
*
|
1995-11-21 |
1997-07-15 |
Avi Tepman |
Sputtering target
|
|
AU129071S
(en)
*
|
1996-06-07 |
1997-01-14 |
Riteflite Pty Ltd |
Target
|
|
US6114216A
(en)
*
|
1996-11-13 |
2000-09-05 |
Applied Materials, Inc. |
Methods for shallow trench isolation
|
|
USD423026S
(en)
*
|
1997-08-20 |
2000-04-18 |
Tokyo Electron Limited |
Quartz cover
|
|
US6086725A
(en)
*
|
1998-04-02 |
2000-07-11 |
Applied Materials, Inc. |
Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
|
|
JP3551867B2
(ja)
|
1999-11-09 |
2004-08-11 |
信越化学工業株式会社 |
シリコンフォーカスリング及びその製造方法
|
|
US6390905B1
(en)
|
2000-03-31 |
2002-05-21 |
Speedfam-Ipec Corporation |
Workpiece carrier with adjustable pressure zones and barriers
|
|
USD446231S1
(en)
*
|
2000-08-21 |
2001-08-07 |
Komatsu Industries Corporation |
Nozzle for a plasma arc torch
|
|
US6638402B2
(en)
*
|
2001-06-05 |
2003-10-28 |
Praxair S.T. Technology, Inc. |
Ring-type sputtering target
|
|
USD487254S1
(en)
*
|
2002-05-24 |
2004-03-02 |
Nichia Corporation |
Light emitting diode
|
|
ATE340277T1
(de)
|
2002-12-16 |
2006-10-15 |
Ifire Technology Corp |
Zusammengesetztes zerstäubungs-target und phosphor-abscheidungsmethode
|
|
USD496951S1
(en)
*
|
2003-01-30 |
2004-10-05 |
Thermal Dynamics Corporation |
Mechanized cap for a plasma arc torch
|
|
USD503729S1
(en)
*
|
2003-10-31 |
2005-04-05 |
Nordson Corporation |
Nozzle for dispensing adhesives and sealants
|
|
JP4744855B2
(ja)
|
2003-12-26 |
2011-08-10 |
日本碍子株式会社 |
静電チャック
|
|
KR101112029B1
(ko)
|
2004-02-13 |
2012-03-21 |
에이에스엠 아메리카, 인코포레이티드 |
자동 도핑 및 후면 증착의 감소를 위한 기판 지지 시스템
|
|
TWD110109S1
(zh)
*
|
2004-04-21 |
2006-04-11 |
東京威力科創股份有限公司 |
半導體製造用靜電夾盤吸附板
|
|
USD559066S1
(en)
|
2004-10-26 |
2008-01-08 |
Jsr Corporation |
Polishing pad
|
|
USD559993S1
(en)
|
2005-03-30 |
2008-01-15 |
Tokyo Electron Limited |
Cover ring
|
|
TWD121115S1
(zh)
|
2005-03-30 |
2008-01-21 |
東京威力科創股份有限公司 |
遮護環
|
|
TWD125340S1
(zh)
*
|
2005-07-29 |
2008-10-11 |
東京威力科創股份有限公司 |
電漿處理裝置之微波導入窗用頂板
|
|
TWD117940S1
(zh)
*
|
2005-07-29 |
2007-07-01 |
東京威力科創股份有限公司 |
電漿處理裝置之微波導入窗用頂板
|
|
TWD117941S1
(zh)
*
|
2005-07-29 |
2007-07-01 |
東京威力科創股份有限公司 |
電漿處理裝置之微波導入窗用頂板
|
|
TWD117939S1
(zh)
*
|
2005-07-29 |
2007-07-01 |
東京威力科創股份有限公司 |
電漿處理裝置之微波導入窗用頂板
|
|
USD557226S1
(en)
|
2005-08-25 |
2007-12-11 |
Hitachi High-Technologies Corporation |
Electrode cover for a plasma processing apparatus
|
|
US20070076345A1
(en)
|
2005-09-20 |
2007-04-05 |
Bang Won B |
Substrate placement determination using substrate backside pressure measurement
|
|
USD545851S1
(en)
*
|
2006-03-30 |
2007-07-03 |
Dave Hawley |
Plasma gun nozzle holder
|
|
USD570310S1
(en)
*
|
2006-08-01 |
2008-06-03 |
Tokyo Electron Limited |
Attracting plate of an electrostatic chuck for semiconductor manufacturing
|
|
US7402098B2
(en)
|
2006-10-27 |
2008-07-22 |
Novellus Systems, Inc. |
Carrier head for workpiece planarization/polishing
|
|
TWD130501S1
(zh)
*
|
2006-12-15 |
2009-08-21 |
東京威力科創股份有限公司 |
電漿處理裝置的加熱平台用遮罩
|
|
US20080173541A1
(en)
*
|
2007-01-22 |
2008-07-24 |
Eal Lee |
Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
|
|
US8968536B2
(en)
*
|
2007-06-18 |
2015-03-03 |
Applied Materials, Inc. |
Sputtering target having increased life and sputtering uniformity
|
|
TWD130834S1
(zh)
*
|
2008-03-28 |
2009-09-11 |
東京威力科創股份有限公司 |
半導體製造用保溫筒之散熱翼片
|
|
KR101571558B1
(ko)
*
|
2008-04-16 |
2015-11-24 |
어플라이드 머티어리얼스, 인코포레이티드 |
웨이퍼 프로세싱 증착 차폐 컴포넌트들
|
|
KR101337306B1
(ko)
*
|
2008-04-21 |
2013-12-09 |
허니웰 인터내셔널 인코포레이티드 |
필드-강화 스퍼터링 타겟 및 그 생산 방법
|
|
USD614593S1
(en)
|
2008-07-21 |
2010-04-27 |
Asm Genitech Korea Ltd |
Substrate support for a semiconductor deposition apparatus
|
|
US8371904B2
(en)
|
2008-08-08 |
2013-02-12 |
Globalfoundries Singapore Pte. Ltd. |
Polishing with enhanced uniformity
|
|
US8070925B2
(en)
*
|
2008-10-17 |
2011-12-06 |
Applied Materials, Inc. |
Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter target
|
|
USD616389S1
(en)
|
2008-10-20 |
2010-05-25 |
Ebara Corporation |
Vacuum contact pad
|
|
USD649126S1
(en)
|
2008-10-20 |
2011-11-22 |
Ebara Corporation |
Vacuum contact pad
|
|
US8133368B2
(en)
*
|
2008-10-31 |
2012-03-13 |
Applied Materials, Inc. |
Encapsulated sputtering target
|
|
TWI397600B
(zh)
*
|
2009-01-07 |
2013-06-01 |
Solar Applied Mat Tech Corp |
Recycled sputtering target and its making method
|
|
USD616390S1
(en)
|
2009-03-06 |
2010-05-25 |
Tokyo Electron Limited |
Quartz cover for manufacturing semiconductor wafers
|
|
USD633452S1
(en)
|
2009-08-27 |
2011-03-01 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing apparatus
|
|
US9181619B2
(en)
*
|
2010-02-26 |
2015-11-10 |
Fujifilm Corporation |
Physical vapor deposition with heat diffuser
|
|
CN103081088B
(zh)
*
|
2010-08-06 |
2016-04-06 |
应用材料公司 |
静电夹盘和使用静电夹盘的方法
|
|
TWD146490S
(zh)
|
2011-01-12 |
2012-04-21 |
荏原製作所股份有限公司 |
半導體晶圓研磨用彈性膜
|
|
WO2012142408A2
(en)
*
|
2011-04-14 |
2012-10-18 |
Veeco Instruments Inc. |
Substrate holders and methods of substrate mounting
|
|
USD678745S1
(en)
|
2011-07-07 |
2013-03-26 |
Phuong Van Nguyen |
Spinning insert polishing pad
|
|
JP1438319S
(GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
*
|
2011-09-20 |
2015-04-06 |
|
|
|
USD669509S1
(en)
*
|
2011-10-19 |
2012-10-23 |
Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts |
Nozzle for torch
|
|
USD691974S1
(en)
|
2011-12-22 |
2013-10-22 |
Tokyo Electron Limited |
Holding pad for transferring a wafer
|
|
USD683806S1
(en)
*
|
2012-01-12 |
2013-06-04 |
Surefire, Llc |
Front plate for a firearm sound suppressor
|
|
USD687790S1
(en)
*
|
2012-03-20 |
2013-08-13 |
Veeco Instruments Inc. |
Keyed wafer carrier
|
|
USD687791S1
(en)
*
|
2012-03-20 |
2013-08-13 |
Veeco Instruments Inc. |
Multi-keyed wafer carrier
|
|
KR20130131120A
(ko)
|
2012-05-23 |
2013-12-03 |
삼성전자주식회사 |
연마 헤드용 가요성 멤브레인
|
|
JP5875950B2
(ja)
|
2012-06-29 |
2016-03-02 |
株式会社荏原製作所 |
基板保持装置および研磨装置
|
|
USD732094S1
(en)
*
|
2012-07-20 |
2015-06-16 |
Ivoclar Vivadent Ag |
Firing plate for a dental furnace
|
|
USD703162S1
(en)
|
2012-10-17 |
2014-04-22 |
Sumitomo Electric Industries, Ltd. |
Wafer holder for stepper
|
|
US9475996B2
(en)
|
2012-10-17 |
2016-10-25 |
Richard Max Mandle |
Centrifugal fluid ring plasma reactor
|
|
WO2014107558A1
(en)
*
|
2013-01-04 |
2014-07-10 |
Tosoh Smd, Inc. |
Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same
|
|
FR3002241B1
(fr)
|
2013-02-21 |
2015-11-20 |
Altatech Semiconductor |
Dispositif de depot chimique en phase vapeur
|
|
FR3002242B1
(fr)
|
2013-02-21 |
2015-04-03 |
Altatech Semiconductor |
Dispositif de depot chimique en phase vapeur
|
|
US9534286B2
(en)
*
|
2013-03-15 |
2017-01-03 |
Applied Materials, Inc. |
PVD target for self-centering process shield
|
|
USD808349S1
(en)
*
|
2013-05-15 |
2018-01-23 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing apparatus
|
|
USD769200S1
(en)
|
2013-05-15 |
2016-10-18 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing apparatus
|
|
TWD169790S
(zh)
|
2013-07-10 |
2015-08-11 |
日立國際電氣股份有限公司 |
基板處理裝置用氣化器之部分
|
|
USD754468S1
(en)
*
|
2013-07-23 |
2016-04-26 |
Michael F. Nason |
Disposable splatter shield
|
|
US9779920B2
(en)
*
|
2013-08-14 |
2017-10-03 |
Applied Materials, Inc. |
Sputtering target with backside cooling grooves
|
|
USD724553S1
(en)
|
2013-09-13 |
2015-03-17 |
Asm Ip Holding B.V. |
Substrate supporter for semiconductor deposition apparatus
|
|
USD716742S1
(en)
|
2013-09-13 |
2014-11-04 |
Asm Ip Holding B.V. |
Substrate supporter for semiconductor deposition apparatus
|
|
US9960021B2
(en)
|
2013-12-18 |
2018-05-01 |
Applied Materials, Inc. |
Physical vapor deposition (PVD) target having low friction pads
|
|
USD741921S1
(en)
|
2014-04-15 |
2015-10-27 |
Q-Linea Ab |
Positive mold for manufacturing a sample holding disc
|
|
US9991101B2
(en)
*
|
2014-07-29 |
2018-06-05 |
Applied Materials, Inc. |
Magnetron assembly for physical vapor deposition chamber
|
|
USD750728S1
(en)
*
|
2014-12-02 |
2016-03-01 |
John K. Kremer |
Laser target
|
|
USD767234S1
(en)
|
2015-03-02 |
2016-09-20 |
Entegris, Inc. |
Wafer support ring
|
|
USD801942S1
(en)
|
2015-04-16 |
2017-11-07 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
|
USD797067S1
(en)
|
2015-04-21 |
2017-09-12 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
|
JP1545222S
(GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
*
|
2015-06-10 |
2016-03-07 |
|
|
|
JP1546800S
(GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
|
2015-06-12 |
2016-03-28 |
|
|
|
USD798248S1
(en)
|
2015-06-18 |
2017-09-26 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
|
US10174437B2
(en)
*
|
2015-07-09 |
2019-01-08 |
Applied Materials, Inc. |
Wafer electroplating chuck assembly
|
|
JP1549882S
(GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
|
2015-08-18 |
2016-05-23 |
|
|
|
USD810705S1
(en)
|
2016-04-01 |
2018-02-20 |
Veeco Instruments Inc. |
Self-centering wafer carrier for chemical vapor deposition
|
|
USD819580S1
(en)
*
|
2016-04-01 |
2018-06-05 |
Veeco Instruments, Inc. |
Self-centering wafer carrier for chemical vapor deposition
|
|
USD830434S1
(en)
|
2015-12-28 |
2018-10-09 |
Ntn Corporation |
Inner ring for tapered roller bearing
|
|
TWD178424S
(zh)
*
|
2016-01-08 |
2016-09-21 |
Asm Ip Holding Bv |
用於半導體製造設備的氣流控制板
|
|
TWD178699S
(zh)
*
|
2016-01-08 |
2016-10-01 |
Asm Ip Holding Bv |
用於半導體製造設備的氣體分散板
|
|
USD790039S1
(en)
|
2016-04-08 |
2017-06-20 |
Applied Materials, Inc. |
Showerhead for a semiconductor processing chamber
|
|
USD794753S1
(en)
|
2016-04-08 |
2017-08-15 |
Applied Materials, Inc. |
Showerhead for a semiconductor processing chamber
|
|
USD797691S1
(en)
|
2016-04-14 |
2017-09-19 |
Applied Materials, Inc. |
Composite edge ring
|
|
USD804230S1
(en)
*
|
2016-06-23 |
2017-12-05 |
Cbd Consolidated Llc |
Bench top gripping device
|
|
USD813181S1
(en)
*
|
2016-07-26 |
2018-03-20 |
Hitachi Kokusai Electric Inc. |
Cover of seal cap for reaction chamber of semiconductor
|
|
USD836572S1
(en)
*
|
2016-09-30 |
2018-12-25 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
|
USD839224S1
(en)
*
|
2016-12-12 |
2019-01-29 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing
|
|
CN206573738U
(zh)
|
2017-03-16 |
2017-10-20 |
江苏亨通光导新材料有限公司 |
低损耗光纤
|
|
US10662520B2
(en)
|
2017-03-29 |
2020-05-26 |
Applied Materials, Inc. |
Method for recycling substrate process components
|
|
USD830981S1
(en)
|
2017-04-07 |
2018-10-16 |
Asm Ip Holding B.V. |
Susceptor for semiconductor substrate processing apparatus
|
|
US10811232B2
(en)
|
2017-08-08 |
2020-10-20 |
Applied Materials, Inc. |
Multi-plate faceplate for a processing chamber
|
|
USD851613S1
(en)
|
2017-10-05 |
2019-06-18 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
|
USD868124S1
(en)
*
|
2017-12-11 |
2019-11-26 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
|
TWD197827S
(zh)
|
2017-12-19 |
2019-06-01 |
Ebara Corp |
半導體晶圓研磨用彈性膜
|
|
USD880437S1
(en)
*
|
2018-02-01 |
2020-04-07 |
Asm Ip Holding B.V. |
Gas supply plate for semiconductor manufacturing apparatus
|
|
USD877101S1
(en)
|
2018-03-09 |
2020-03-03 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
|
USD846514S1
(en)
*
|
2018-05-03 |
2019-04-23 |
Kokusai Electric Corporation |
Boat of substrate processing apparatus
|
|
USD888903S1
(en)
|
2018-12-17 |
2020-06-30 |
Applied Materials, Inc. |
Deposition ring for physical vapor deposition chamber
|
|
USD891382S1
(en)
|
2019-02-08 |
2020-07-28 |
Applied Materials, Inc. |
Process shield for a substrate processing chamber
|
|
USD893441S1
(en)
|
2019-06-28 |
2020-08-18 |
Applied Materials, Inc. |
Base plate for a processing chamber substrate support
|
|
USD908645S1
(en)
|
2019-08-26 |
2021-01-26 |
Applied Materials, Inc. |
Sputtering target for a physical vapor deposition chamber
|
|
USD913979S1
(en)
*
|
2019-08-28 |
2021-03-23 |
Applied Materials, Inc. |
Inner shield for a substrate processing chamber
|
|
JP1716516S
(ja)
|
2021-11-25 |
2022-06-02 |
|
包装用袋
|