TW571416B - Semiconductor device and method of fabricating the same - Google Patents

Semiconductor device and method of fabricating the same Download PDF

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Publication number
TW571416B
TW571416B TW91137702A TW91137702A TW571416B TW 571416 B TW571416 B TW 571416B TW 91137702 A TW91137702 A TW 91137702A TW 91137702 A TW91137702 A TW 91137702A TW 571416 B TW571416 B TW 571416B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
semiconductor
metal wiring
electrode
connection terminal
Prior art date
Application number
TW91137702A
Other languages
English (en)
Chinese (zh)
Other versions
TW200305264A (en
Inventor
Yoshihiko Nemoto
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of TW200305264A publication Critical patent/TW200305264A/zh
Application granted granted Critical
Publication of TW571416B publication Critical patent/TW571416B/zh

Links

Classifications

    • H10W74/019—
    • H10W72/20—
    • H10W74/111—
    • H10W90/00—
    • H10W99/00—
    • H10W70/05—
    • H10W70/60—
    • H10W70/65—
    • H10W72/01225—
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07504—
    • H10W72/07507—
    • H10W72/07521—
    • H10W72/07533—
    • H10W72/07553—
    • H10W72/241—
    • H10W72/242—
    • H10W72/251—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5445—
    • H10W72/552—
    • H10W72/5524—
    • H10W72/583—
    • H10W72/59—
    • H10W72/801—
    • H10W72/932—
    • H10W72/9413—
    • H10W72/944—
    • H10W74/00—
    • H10W74/10—
    • H10W74/142—
    • H10W90/288—
    • H10W90/722—
    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
TW91137702A 2001-09-28 2002-12-27 Semiconductor device and method of fabricating the same TW571416B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001299756 2001-09-28
JP2002103684A JP4014912B2 (ja) 2001-09-28 2002-04-05 半導体装置

Publications (2)

Publication Number Publication Date
TW200305264A TW200305264A (en) 2003-10-16
TW571416B true TW571416B (en) 2004-01-11

Family

ID=26623238

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91137702A TW571416B (en) 2001-09-28 2002-12-27 Semiconductor device and method of fabricating the same

Country Status (3)

Country Link
US (2) US20030062631A1 (enExample)
JP (1) JP4014912B2 (enExample)
TW (1) TW571416B (enExample)

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US8138024B2 (en) * 2008-02-26 2012-03-20 Stats Chippac Ltd. Package system for shielding semiconductor dies from electromagnetic interference
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US7851893B2 (en) * 2008-06-10 2010-12-14 Stats Chippac, Ltd. Semiconductor device and method of connecting a shielding layer to ground through conductive vias
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JP2010141066A (ja) * 2008-12-11 2010-06-24 Rohm Co Ltd 半導体装置
JP5112275B2 (ja) * 2008-12-16 2013-01-09 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
JP5588150B2 (ja) * 2009-02-06 2014-09-10 セイコーインスツル株式会社 樹脂封止型半導体装置
US8357563B2 (en) * 2010-08-10 2013-01-22 Spansion Llc Stitch bump stacking design for overall package size reduction for multiple stack
US8304900B2 (en) 2010-08-11 2012-11-06 Stats Chippac Ltd. Integrated circuit packaging system with stacked lead and method of manufacture thereof
JP6246507B2 (ja) * 2012-11-05 2017-12-13 新光電気工業株式会社 プローブカード及びその製造方法
JP5763696B2 (ja) * 2013-03-04 2015-08-12 スパンション エルエルシー 半導体装置およびその製造方法
JP6208486B2 (ja) 2013-07-19 2017-10-04 新光電気工業株式会社 プローブカード及びその製造方法
JP6092729B2 (ja) 2013-07-19 2017-03-08 新光電気工業株式会社 プローブカード及びその製造方法
JP6219227B2 (ja) * 2014-05-12 2017-10-25 東京エレクトロン株式会社 ヒータ給電機構及びステージの温度制御方法
JP6219229B2 (ja) * 2014-05-19 2017-10-25 東京エレクトロン株式会社 ヒータ給電機構
CN106486443A (zh) * 2015-08-27 2017-03-08 冠研（上海）专利技术有限公司 简易半导体芯片封装结构及其封装方法
CN106486429A (zh) * 2015-08-27 2017-03-08 冠研（上海）专利技术有限公司 半导体芯片封装结构及其封装方法
CN105514074B (zh) * 2015-12-01 2018-07-03 上海伊诺尔信息技术有限公司 智能卡芯片封装结构及其制造方法
IT201700073501A1 (it) * 2017-06-30 2018-12-30 St Microelectronics Srl Prodotto a semiconduttore e corrispondente procedimento
US10453820B2 (en) 2018-02-07 2019-10-22 Micron Technology, Inc. Semiconductor assemblies using edge stacking and methods of manufacturing the same
FR3104317A1 (fr) * 2019-12-04 2021-06-11 Stmicroelectronics (Tours) Sas Procédé de fabrication de puces électroniques
US12046525B2 (en) 2020-11-27 2024-07-23 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
US12159850B2 (en) 2020-12-25 2024-12-03 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
US12154884B2 (en) 2021-02-01 2024-11-26 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
US12500203B2 (en) 2021-02-22 2025-12-16 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly

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Also Published As

Publication number Publication date
US20030062631A1 (en) 2003-04-03
TW200305264A (en) 2003-10-16
US7148576B2 (en) 2006-12-12
JP4014912B2 (ja) 2007-11-28
JP2003174120A (ja) 2003-06-20
US20050224949A1 (en) 2005-10-13

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