TW497255B - Semiconductor device and method for making the same - Google Patents
Semiconductor device and method for making the same Download PDFInfo
- Publication number
- TW497255B TW497255B TW090101415A TW90101415A TW497255B TW 497255 B TW497255 B TW 497255B TW 090101415 A TW090101415 A TW 090101415A TW 90101415 A TW90101415 A TW 90101415A TW 497255 B TW497255 B TW 497255B
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- electrode
- forming
- conductive material
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/42—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a gas or vapour
- H10P14/43—Chemical deposition, e.g. chemical vapour deposition [CVD]
- H10P14/432—Chemical deposition, e.g. chemical vapour deposition [CVD] using selective deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
- H10B12/315—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor with the capacitor higher than a bit line
Landscapes
- Semiconductor Memories (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000021758A JP3976462B2 (ja) | 2000-01-26 | 2000-01-26 | 半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW497255B true TW497255B (en) | 2002-08-01 |
Family
ID=18548127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090101415A TW497255B (en) | 2000-01-26 | 2001-01-20 | Semiconductor device and method for making the same |
Country Status (4)
| Country | Link |
|---|---|
| US (4) | US6503791B2 (https=) |
| JP (1) | JP3976462B2 (https=) |
| KR (1) | KR100737192B1 (https=) |
| TW (1) | TW497255B (https=) |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100403435B1 (ko) * | 1998-10-14 | 2003-10-30 | 가부시끼가이샤 히다치 세이사꾸쇼 | 반도체장치 및 그 제조방법 |
| KR100389913B1 (ko) * | 1999-12-23 | 2003-07-04 | 삼성전자주식회사 | 공정조건을 변화시키면서 화학기상 증착법으로 루테늄막을형성하는 방법 및 그에 의해 형성된 루테늄막 |
| KR100423913B1 (ko) * | 2001-12-28 | 2004-03-22 | 삼성전자주식회사 | 루테늄 함유 박막 형성 방법 |
| JP4034518B2 (ja) * | 2000-03-31 | 2008-01-16 | 株式会社日立国際電気 | 半導体装置の製造方法 |
| KR100569587B1 (ko) * | 2000-06-30 | 2006-04-10 | 주식회사 하이닉스반도체 | 고유전체 캐패시터의 제조 방법 |
| US6440495B1 (en) * | 2000-08-03 | 2002-08-27 | Applied Materials, Inc. | Chemical vapor deposition of ruthenium films for metal electrode applications |
| JP4041396B2 (ja) | 2000-08-11 | 2008-01-30 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
| KR100396891B1 (ko) * | 2001-03-21 | 2003-09-03 | 삼성전자주식회사 | 반도체 소자의 금속 배선 형성 방법 |
| KR100429876B1 (ko) * | 2001-07-27 | 2004-05-04 | 삼성전자주식회사 | 고밀도 씨딩층을 갖는 루테늄막을 구비하는 반도체 소자의제조 방법 및 그러한 반도체 소자를 형성하기 위한 제조장비 |
| JP4065670B2 (ja) * | 2001-08-09 | 2008-03-26 | 株式会社ルネサステクノロジ | 半導体集積回路装置の製造方法 |
| US6545287B2 (en) * | 2001-09-07 | 2003-04-08 | Intel Corporation | Using selective deposition to form phase-change memory cells |
| KR100422594B1 (ko) * | 2001-09-12 | 2004-03-16 | 주식회사 하이닉스반도체 | 반도체 소자의 커패시터 및 제조방법 |
| KR20030058039A (ko) * | 2001-12-29 | 2003-07-07 | 주식회사 하이닉스반도체 | 반도체소자의 캐패시터 형성방법 |
| US6787460B2 (en) * | 2002-01-14 | 2004-09-07 | Samsung Electronics Co., Ltd. | Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses and conductive contacts so formed |
| JP4218350B2 (ja) * | 2002-02-01 | 2009-02-04 | パナソニック株式会社 | 強誘電体薄膜素子およびその製造方法、これを用いた薄膜コンデンサ並びに圧電アクチュエータ |
| KR100455382B1 (ko) * | 2002-03-12 | 2004-11-06 | 삼성전자주식회사 | 듀얼 다마신 구조를 가지는 반도체 소자의 금속 배선 형성방법 |
| JP4047631B2 (ja) * | 2002-05-28 | 2008-02-13 | エルピーダメモリ株式会社 | 王冠構造のキャパシタを有する半導体集積回路装置およびその製造方法 |
| US6703272B2 (en) * | 2002-06-21 | 2004-03-09 | Micron Technology, Inc. | Methods of forming spaced conductive regions, and methods of forming capacitor constructions |
| US6984301B2 (en) * | 2002-07-18 | 2006-01-10 | Micron Technology, Inc. | Methods of forming capacitor constructions |
| KR100476375B1 (ko) * | 2002-12-27 | 2005-03-17 | 주식회사 하이닉스반도체 | 캐패시터 및 그를 구비하는 비휘발 소자의 제조 방법 |
| JP4470144B2 (ja) | 2003-03-19 | 2010-06-02 | エルピーダメモリ株式会社 | 半導体集積回路装置の製造方法 |
| US7163828B2 (en) * | 2003-03-24 | 2007-01-16 | Seiko Epson Corporation | Electrode, method of manufacturing the same, ferroelectric memory, and semiconductor device |
| KR100988082B1 (ko) * | 2003-05-21 | 2010-10-18 | 삼성전자주식회사 | 스택형 커패시터, 그를 구비한 반도체 메모리 소자 및 그제조방법 |
| US7101767B2 (en) * | 2003-08-25 | 2006-09-05 | Micron Technology, Inc. | Methods of forming capacitors |
| DE102005015138A1 (de) * | 2004-03-31 | 2005-11-03 | Magnachip Semiconductor, Ltd. | Verfahren zur Herstellung eines Halbleiterbauelements |
| KR100568306B1 (ko) | 2004-07-23 | 2006-04-05 | 삼성전기주식회사 | 박막형 다층 세라믹 캐패시터 및 그 제조방법 |
| JP2006108291A (ja) * | 2004-10-04 | 2006-04-20 | Seiko Epson Corp | 強誘電体キャパシタ及びその製造方法、並びに強誘電体メモリ装置 |
| JP4376761B2 (ja) * | 2004-11-24 | 2009-12-02 | パナソニック株式会社 | 容量素子及び半導体記憶装置 |
| KR100641546B1 (ko) * | 2004-12-16 | 2006-11-01 | 동부일렉트로닉스 주식회사 | 금속-절연체-금속 커패시터의 제조 방법 |
| KR100583964B1 (ko) * | 2004-12-27 | 2006-05-26 | 삼성전자주식회사 | 도드라진 셀 랜딩패드를 갖는 반도체소자 및 그 제조방법 |
| JP4628862B2 (ja) * | 2005-05-12 | 2011-02-09 | エルピーダメモリ株式会社 | 半導体装置の製造方法 |
| JP2007081189A (ja) * | 2005-09-15 | 2007-03-29 | Elpida Memory Inc | 半導体記憶装置及びその製造方法 |
| JP2007266474A (ja) * | 2006-03-29 | 2007-10-11 | Hitachi Ltd | 半導体記憶装置 |
| KR101368803B1 (ko) * | 2007-10-02 | 2014-02-28 | 삼성전자주식회사 | 반도체 기억 장치 및 그 형성 방법 |
| US20090141426A1 (en) * | 2007-11-29 | 2009-06-04 | Cheol-Seong Hwang | Thin film multi-layered ceramic capacitor and method of fabricating the same |
| JP2010067638A (ja) * | 2008-09-08 | 2010-03-25 | Tokyo Electron Ltd | ルテニウム膜の成膜方法 |
| US8753933B2 (en) * | 2008-11-19 | 2014-06-17 | Micron Technology, Inc. | Methods for forming a conductive material, methods for selectively forming a conductive material, methods for forming platinum, and methods for forming conductive structures |
| JP2010177257A (ja) * | 2009-01-27 | 2010-08-12 | Panasonic Corp | 半導体装置及びその製造方法 |
| EP2584588B1 (en) * | 2011-10-21 | 2017-10-04 | Imec | Method of forming MIM capacitor with Ru-comprising oxygen diffusion barrier |
| JP6107430B2 (ja) * | 2012-06-08 | 2017-04-05 | 豊田合成株式会社 | 半導体装置 |
| TWI549168B (zh) * | 2014-01-20 | 2016-09-11 | 華亞科技股份有限公司 | 電容器結構之製造方法及半導體裝置 |
| KR102143438B1 (ko) * | 2014-12-04 | 2020-08-11 | 삼성전자주식회사 | 반도체 소자용 액티브 구조물 및 이의 형성 방법 |
| US10505034B2 (en) | 2015-06-19 | 2019-12-10 | Intel Corporation | Vertical transistor using a through silicon via gate |
| KR101748193B1 (ko) | 2015-07-02 | 2017-06-19 | 연세대학교 산학협력단 | 저항변화 메모리 제조 방법 및 그 메모리 |
| TWI790320B (zh) * | 2017-12-16 | 2023-01-21 | 美商應用材料股份有限公司 | 釕的選擇性原子層沉積 |
| US11664172B2 (en) * | 2018-03-30 | 2023-05-30 | The Research Foundation For The State University Of New York | Performance of capacitors |
| US10741442B2 (en) * | 2018-05-31 | 2020-08-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Barrier layer formation for conductive feature |
| KR102196447B1 (ko) * | 2020-01-08 | 2020-12-29 | 엘지디스플레이 주식회사 | 플렉서블 표시장치 및 그의 제조방법 |
| KR102339385B1 (ko) * | 2020-01-08 | 2021-12-15 | 엘지디스플레이 주식회사 | 플렉서블 표시장치 및 그의 제조방법 |
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| US5200635A (en) * | 1988-12-21 | 1993-04-06 | Hitachi, Ltd. | Semiconductor device having a low-resistivity planar wiring structure |
| US5381365A (en) * | 1990-01-26 | 1995-01-10 | Mitsubishi Denki Kabushiki Kaisha | Dynamic random access memory having stacked type capacitor and manufacturing method therefor |
| JPH05198525A (ja) * | 1992-01-21 | 1993-08-06 | Sony Corp | 配線構造及び配線の形成方法 |
| JPH06236879A (ja) * | 1993-02-09 | 1994-08-23 | Kawasaki Steel Corp | 半導体集積回路装置の配線の形成方法 |
| US5508881A (en) * | 1994-02-01 | 1996-04-16 | Quality Microcircuits Corporation | Capacitors and interconnect lines for use with integrated circuits |
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| JP3430771B2 (ja) * | 1996-02-05 | 2003-07-28 | 株式会社デンソー | 半導体力学量センサの製造方法 |
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| US6165864A (en) * | 1998-07-28 | 2000-12-26 | Siemens Aktiengesellschaft | Tapered electrode for stacked capacitors |
| US6211035B1 (en) * | 1998-09-09 | 2001-04-03 | Texas Instruments Incorporated | Integrated circuit and method |
| KR100272172B1 (ko) * | 1998-10-16 | 2000-11-15 | 윤종용 | 반도체장치의 커패시터 및 그 제조방법 |
| US6265262B1 (en) * | 1999-06-02 | 2001-07-24 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method of fabricating the same |
| US6294425B1 (en) * | 1999-10-14 | 2001-09-25 | Samsung Electronics Co., Ltd. | Methods of forming integrated circuit capacitors by electroplating electrodes from seed layers |
-
2000
- 2000-01-26 JP JP2000021758A patent/JP3976462B2/ja not_active Expired - Fee Related
-
2001
- 2001-01-20 TW TW090101415A patent/TW497255B/zh not_active IP Right Cessation
- 2001-01-24 US US09/767,706 patent/US6503791B2/en not_active Expired - Lifetime
- 2001-01-26 KR KR1020010003750A patent/KR100737192B1/ko not_active Expired - Fee Related
- 2001-03-19 US US09/810,401 patent/US6483143B2/en not_active Expired - Lifetime
- 2001-03-19 US US09/810,627 patent/US6555429B2/en not_active Expired - Lifetime
-
2002
- 2002-08-05 US US10/211,569 patent/US6521494B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20010023955A1 (en) | 2001-09-27 |
| KR20010083146A (ko) | 2001-08-31 |
| US6521494B2 (en) | 2003-02-18 |
| US20020192896A1 (en) | 2002-12-19 |
| JP3976462B2 (ja) | 2007-09-19 |
| US6555429B2 (en) | 2003-04-29 |
| JP2001210802A (ja) | 2001-08-03 |
| US6483143B2 (en) | 2002-11-19 |
| US20010026988A1 (en) | 2001-10-04 |
| US6503791B2 (en) | 2003-01-07 |
| US20020030210A1 (en) | 2002-03-14 |
| KR100737192B1 (ko) | 2007-07-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |