TW480617B - Substrate processing method, and substrate fabrication method - Google Patents

Substrate processing method, and substrate fabrication method Download PDF

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Publication number
TW480617B
TW480617B TW087113446A TW87113446A TW480617B TW 480617 B TW480617 B TW 480617B TW 087113446 A TW087113446 A TW 087113446A TW 87113446 A TW87113446 A TW 87113446A TW 480617 B TW480617 B TW 480617B
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TW
Taiwan
Prior art keywords
substrate
wafer
substrates
contact
central
Prior art date
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TW087113446A
Other languages
English (en)
Chinese (zh)
Inventor
Toru Takisawa
Takao Yonehara
Kenji Yamagata
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of TW480617B publication Critical patent/TW480617B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW087113446A 1997-08-27 1998-08-14 Substrate processing method, and substrate fabrication method TW480617B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9231132A JPH1174164A (ja) 1997-08-27 1997-08-27 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法

Publications (1)

Publication Number Publication Date
TW480617B true TW480617B (en) 2002-03-21

Family

ID=16918791

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087113446A TW480617B (en) 1997-08-27 1998-08-14 Substrate processing method, and substrate fabrication method

Country Status (8)

Country Link
US (2) US6451670B1 (enExample)
EP (1) EP0899778A3 (enExample)
JP (1) JPH1174164A (enExample)
KR (1) KR100396014B1 (enExample)
CN (1) CN1209644A (enExample)
AU (1) AU732569B2 (enExample)
SG (1) SG65092A1 (enExample)
TW (1) TW480617B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI585867B (zh) * 2013-09-25 2017-06-01 Shibaura Mechatronics Corp A method of manufacturing a bonding table, a bonding apparatus and a bonded substrate

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Publication number Priority date Publication date Assignee Title
TWI585867B (zh) * 2013-09-25 2017-06-01 Shibaura Mechatronics Corp A method of manufacturing a bonding table, a bonding apparatus and a bonded substrate
US10586727B2 (en) 2013-09-25 2020-03-10 Shibaura Mechatronics Corporation Suction stage, lamination device, and method for manufacturing laminated substrate

Also Published As

Publication number Publication date
EP0899778A2 (en) 1999-03-03
US6706618B2 (en) 2004-03-16
AU732569B2 (en) 2001-04-26
EP0899778A3 (en) 2001-03-21
US20020034859A1 (en) 2002-03-21
US20020182038A1 (en) 2002-12-05
KR100396014B1 (ko) 2003-10-17
KR19990023901A (ko) 1999-03-25
JPH1174164A (ja) 1999-03-16
AU8190298A (en) 1999-03-11
SG65092A1 (en) 1999-05-25
US6451670B1 (en) 2002-09-17
CN1209644A (zh) 1999-03-03

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