TWI766105B - 晶圓級封裝組裝體處置 - Google Patents
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Abstract
一種卡盤總成包括被建構成支撐晶圓級封裝組裝體之上表面、以及將該晶圓級封裝組裝體固定於該上表面之夾持機構。
Description
本發明關於晶圓級封裝組裝體處置。
晶圓級封裝組裝體能以各種不同的形狀及尺寸被形成,這使得晶圓級封裝組裝體在檢查及提供像是檢查及沉積重分佈層(redistribution layer)的各種不同處理作業時的處置是困難的。
10:卡盤總成
12:晶圓級封裝組裝體,封裝組裝體,封裝,組裝體
14:支撐表面,頂表面,表面
16:側邊緣表面
17:彈性體環,密封件
18:下表面,表面
20:台座
24:通道
26:推銷
28:真空源
30:夾持機構
31:罩覆件,領圈
32:中心口孔,口孔
34:閂鎖機構
34’:閂鎖機構
36:鉸鏈
40:軸桿
42:內孔
50:卡盤總成,卡盤
52:頂表面
54:抓握構件
54’:抓握位置
60:頂表面
100:材料處置系統
102:檢查工具
120:置放機構,機構
122A:第一臂件,臂件
122B:第二臂件,臂件
124A:遠端工具
124B:遠端工具
126:致動器總成
128A:臂件
128B:臂件
圖1A是支撐晶圓級封裝組裝體的卡盤總成之示意上視圖。
圖1B是圖1A的卡盤總成的示意側視圖。
圖1C是致動器銷及在卡盤總成的支撐表面上的彈性體密封件之示意剖面圖。
圖1D是真空源及在卡盤總成的支撐表面上的彈性體密封件之示意剖面圖。
圖2A是支撐晶圓級封裝組裝體的材料處置系統之上視圖,其中夾持機構將晶圓級封裝組裝體固定於卡盤總成。
圖2B是圖2A的材料處置系統之示意側視圖。
圖2C是圖2A的材料處置系統中的替代的閂鎖機構之示意側視圖。
圖3是具有置放工具的材料處置系統之示意側視圖。
圖4是替代的卡盤總成之示意上視圖,其中晶圓級封裝組裝體被支撐在卡盤總成上。
圖5是抓持構件的示意側視圖。
圖6是顯示抓持構件的行進路徑之示意圖。
圖7是抓持構件的行進路徑之示意側視圖。
圖1A及圖1B繪示在平面狀的支撐表面14上支撐晶圓級封裝組裝體(wafer-leveL package assembly)12之範例卡盤總成(chuck assembly)10。平面狀的支撐表面14以通常延伸成與表面14垂直之側邊緣表面16為界。如所繪示,側邊緣表面16是連續的邊緣,使得支撐表面14形成體育場(stadium)形狀。支撐表面14能依所想要來形成其他形狀,像是長方形、圓角長方形、圓形、不規則形、或其他者。此外,支撐表面能由被運用在材料處置系統中的各種不同材料(例如,金屬)所形成。
在一個實施例中,表面14能包括被定位在表面14上的彈性體(elastomeric)環17(參圖1C及圖1D),彈性體環17能被使用來在組裝體12與表面14之間建立真空密封。卡盤總成10還包括下表面18及台座20。在一個實施例中,晶圓級封裝組裝體12是重構晶圓(reconstituted wafer),其包括被配置在模製材料內的多個個別的電裝置(例如,矽晶粒)。卡盤總成10能被使用來例如藉由使用檢查工具而協助檢查晶圓級封裝組裝體12。晶圓級封裝組裝體12的檢查能在施作重分佈層(redistribution layer;RDL)以前、期間、及/或以後被施行,重分佈層被使用來將晶圓級封裝組裝體12中的裝置連接。
台座20能被使用來在晶圓級封裝組裝體12的檢查的期間將卡盤
總成10平移。此外,如圖1C及圖1D中所示,台座20能被建構成容納各種不同組件。例如,台座20能包括一個以上的通道24,其用於推銷26的將晶圓級封裝組裝體12相對於頂表面14垂直地致動的操作。替代地或額外地,真空源28能被與通道24耦接,以用來在封裝組裝體12被定位在表面14上且利用密封件17而抵頂表面14來密封時將負壓施加於封裝組裝體12的底表面。
圖2A及圖2B繪示材料處置系統100,其在晶圓級封裝組裝體12的檢查的期間運用卡盤總成10。為了在檢查處理期間將晶圓級封裝組裝體12固定於卡盤總成10,系統100包括夾持機構(clamping mechanism)30。夾持機構30包括罩覆件或領圈31,其界定中心口孔32,中心口孔32在檢查期間將晶圓級封裝組裝體12的頂表面露出。如所描繪,罩覆件31及中心口孔32是長方形,雖然供罩覆件31及/或中心口孔32用的其他形狀(例如,正方形、圓形、橢圓形、體育場形、不規則形)能依所想要被使用。
在關於檢查方法的一個實施例中,封裝12被定位或裝載在表面14上。彈性體環17建立密封,且真空源28被使用來促使板12朝向表面14。一旦真空壓力被施加,夾持機構30被定位在晶圓級封裝12及頂表面14上方。在一個實施例中,夾持機構30能包括環繞口孔32的周圍之彈性體環(未示出),以避免損壞封裝12。一個以上的閂鎖機構(latch mechanism)34(示意地繪示)能被使用來環繞邊緣表面16延伸且夾持在下表面18上以施加壓力,以便將晶圓級封裝組裝體12固定於卡盤總成10。一旦晶圓級封裝組裝體12被固定,能有助於晶圓級封裝組裝體12的平移及/或檢查。在一個範例中,像是光學系統(例如,相機)或其他裝置的檢查工具102能被使用來檢查組裝體12。
閂鎖機構34能採用多種不同形式,且以不同方式(例如,旋轉地、線性地)操作來將夾持機構30固定於卡盤總成10。在一個實施例中,閂鎖機構34如圖2B中所示形成“L”形,且利用彈簧加載的鉸鏈36而被附接於罩覆件31。在此
實施例中,每一個閂鎖機構34可從第一、打開位置調整至第二、關閉位置。“L”的頂部透過鉸鏈36被附接於罩覆件31,在此位置,鉸鏈36的彈簧將閂鎖機構偏壓至關閉位置,在此位置,“L”的下部接合卡盤總成10的下表面18。在打開位置,“L”的下部可被移動離開下表面18,使得夾持機構30能被從卡盤總成10移除(例如,藉由將夾持機構垂直地升起離開卡盤總成10)。在一個實施例中,該閂鎖機構34延伸通過該罩覆件31中的內孔,該閂鎖機構34包括指件,該指件可從該指件接合該卡盤總成來將該罩覆件固定於該卡盤總成之第一位置操作至該指件接合該罩覆件來將該罩覆件相對於該卡盤總成升起之第二位置。
另一個閂鎖機構34’被繪示在圖2C中,閂鎖機構34’被與延伸通過罩覆件31中的對應的內孔42之軸桿40耦接。閂鎖機構34’是“L”形,“L”的上部被附接於軸桿40,且“L”的下部被建構成在關閉位置接合表面18(如圖2C的右側所示)。在一個實施例中,鎖定機構(locking mechanism)(例如,螺母、夾持器、或其他裝置)能被與軸桿40耦接,以將閂鎖機構34’固定於表面18,且因而將夾持機構30固定於卡盤總成10。為了將閂鎖機構34’從表面18脫離,軸桿40能被調整,使得閂鎖機構34’的“L”的下部與表面18隔開(如圖2C的左側所示)。軸桿40然後能在閂鎖機構34’從表面18脫離時被垂直地升起,以將夾持機構30從卡盤總成10釋放。
在圖3的實施例中,置放機構(placement mechanism)或工具120能被與材料處置系統100一起使用。如所繪示,機構120包括末端在遠端工具124A處的第一臂件122A(例如,端效器及機械臂)、以及末端在遠端工具124B處的第二臂件122B。臂件122中的每一者被與致動器總成126耦接,致動器總成126操作來移動臂件122及遠端工具124。在一個實施例中,致動器總成126能為一個以上的液壓或氣壓汽缸。當工具124就位時,致動器總成126能將臂件128A及128B分別相對於臂件122A及122B致動至閂鎖機構34。在打開位置,臂件128A及128B致動在打開位置的閂鎖機構34。在此位置,置放機構能將夾持機構30置放在封裝組裝
體12上方。在一些實施例中,置放機構還將中心口孔32與卡盤總成10上的封裝組裝體12對準。當夾持機構30就位時,臂件128的從閂鎖機構34的釋放允許彈簧加載的閂鎖機構34返回至閂鎖機構34接合表面18之關閉位置。
在閂鎖機構34將封裝組裝體12固定於表面14以後,置放機構120能縮回,且組裝體12能被定址於檢查工具,以在組裝體12上進行檢查。一旦檢查完成,閂鎖機構34能被釋放,且置放機構120能被移動成與夾持機構30接觸。置放機構120能將夾持機構30從組裝體12及表面14縮回,以致組裝體12能從表面14被卸載以供未來處理。
圖4是替代的卡盤總成50的示意上視圖,卡盤總成50包括頂表面52且還能被與置放機構120一起使用,如以上所描述。卡盤50還包括多個抓握構件(gripping member)54,其被環繞晶圓級封裝組裝體12定位。抓握構件54能被從第一、凹入位置平移至第二、抓握位置,以便將晶圓級封裝組裝體12固定於卡盤50。
圖5繪示抓握構件54的操作之示意側視圖。如所繪示,抓握構件54從頂表面52凹入。特別地,抓握構件54的頂表面60能與頂表面52共平面,及或當抓握構件54在凹入位置時從頂表面52凹入。為了將晶圓級封裝組裝體12固定於卡盤總成50,抓握構件54能被操作至抓握構件54將壓力施加至晶圓級封裝組裝體12且後來將晶圓級封裝組裝體12固定於卡盤總成50之抓握位置54’。在一個實施例中,抓握構件54的移動能藉由氣壓致動器而被控制。
抓握構件54的操作能以線性方式移動,如圖6中所示意繪示者。特別地,抓握構件54的至抓握位置54’的平移涉及垂直移動、水平移動、及另一個垂直移動。替代地,如圖7中所繪示,抓握構件54能界定垂直移動、曲線移動、及另一個垂直移動,以將晶圓級封裝組裝體12固定於卡盤總成50。
本發明的各種不同實施例已經在以上描述,其以繪示實施例的細
節為目的,且使本領域具有通常技術人士能夠製作且使用本發明。所揭示的實施例的細節及特徵並非旨在為限制性,因為許多變型及修改對於本領域的技術人士將是輕易地明白的。因此,本揭示的範疇旨在被廣泛地解釋,且包括此範疇及隨附申請專利範圍及其法定等效物的精神內所帶來之全部變型及修改。
12‧‧‧晶圓級封裝組裝體,封裝組裝體,封裝,組裝體
14‧‧‧支撐表面,頂表面,表面
18‧‧‧下表面,表面
20‧‧‧台座
30‧‧‧夾持機構
31‧‧‧罩覆件,領圈
34‧‧‧閂鎖機構
120‧‧‧置放機構,機構
122A‧‧‧第一臂件,臂件
122B‧‧‧第二臂件,臂件
124A‧‧‧遠端工具
124B‧‧‧遠端工具
128A‧‧‧臂件
128B‧‧‧臂件
Claims (19)
- 一種晶圓級封裝處置系統,包含:卡盤總成,其界定上表面,該上表面被建構成支撐晶圓級封裝組裝體;夾持機構,其將該晶圓級封裝組裝體固定於該上表面,其中所述夾持機構包括:具有中心口孔的罩覆件,所述中心口孔暴露該晶圓級封裝組裝體的頂表面;以及閂鎖機構,其環繞該卡盤總成的側邊緣延伸以從該卡盤總成的下表面施加壓力,以便將該晶圓級封裝組裝體固定到該卡盤總成。
- 如申請專利範圍第1項所述的晶圓級封裝處置系統,其中該中心口孔與該晶圓級封裝組裝體對準。
- 如申請專利範圍第1項所述的晶圓級封裝處置系統,其中該閂鎖機構將壓力施加在該夾持機構與該晶圓級封裝組裝體之間。
- 如申請專利範圍第1項所述的晶圓級封裝處置系統,其中該閂鎖機構是彈簧加載的。
- 如申請專利範圍第1項所述的晶圓級封裝處置系統,其中該上表面包括彈性體環,該彈性體環被建構成在該夾持機構與該上表面之間建立密封以及建立真空,以將壓力朝向該上表面施加於該晶圓級封裝組裝體。
- 如申請專利範圍第1項所述的晶圓級封裝處置系統,還包含光學系統,該光學系統被使用來檢查該晶圓級封裝組裝體。
- 如申請專利範圍第1項所述的晶圓級封裝處置系統,還包含置放機構,該置放機構被建構成將該夾持機構相對於該晶圓級封裝組裝體定位。
- 如申請專利範圍第7項所述的晶圓級封裝處置系統,還包含致動器,該致動器被建構成操作閂鎖機構來將該夾持機構固定於該卡盤總成。
- 一種處置半導體裝置的封裝組裝體之方法,包含:將該封裝組裝體裝載在卡盤總成的表面上; 將罩覆件定位在該封裝組裝體之上,其中該罩覆件具有暴露該封裝組裝體的頂表面之中心口孔;施加壓力於該罩覆件,以將該封裝組裝體固定於該表面,其中施加壓力包括環繞該卡盤總成的邊緣操作閂鎖機構,以從該卡盤總成的下表面施加壓力,以便將該封裝組裝體固定到該卡盤總成;及檢查該封裝組裝體。
- 如申請專利範圍第9項所述的處置半導體裝置的封裝組裝體之方法,還包含:將該罩覆件的口孔與該封裝組裝體對準。
- 如申請專利範圍第9項所述的處置半導體裝置的封裝組裝體之方法,還包含:操作置放機構來將該罩覆件相對於該封裝組裝體定位。
- 如申請專利範圍第11項所述的處置半導體裝置的封裝組裝體之方法,還包含:使用該置放機構的臂件來操作該閂鎖機構。
- 如申請專利範圍第9項所述的處置半導體裝置的封裝組裝體之方法,還包含:操作該置放機構來將該罩覆件從該卡盤總成移除。
- 如申請專利範圍第12項所述的處置半導體裝置的封裝組裝體之方法,還包含:將第二封裝組裝體裝載至該卡盤總成上;操作該置放機構來將該罩覆件相對於該第二封裝組裝體定位;及施加壓力於該罩覆件,以將該第二封裝組裝體固定於該卡盤總成。
- 如申請專利範圍第9項所述的處置半導體裝置的封裝組裝體之 方法,其中該閂鎖機構是彈簧加載的。
- 如申請專利範圍第9項所述的處置半導體裝置的封裝組裝體之方法,其中該閂鎖機構延伸通過該罩覆件中的內孔,該閂鎖機構包括指件,該指件可從該指件接合該卡盤總成來將該罩覆件固定於該卡盤總成之第一位置操作至該指件接合該罩覆件來將該罩覆件相對於該卡盤總成升起之第二位置。
- 如申請專利範圍第9項所述的處置半導體裝置的封裝組裝體之方法,還包含:使用光學系統來檢查該封裝組裝體。
- 如申請專利範圍第17項所述的處置半導體裝置的封裝組裝體之方法,還包含:將該卡盤總成相對於該光學系統移動。
- 一種晶圓封裝組裝體,其係根據申請專利範圍第9項所述的處置半導體裝置的封裝組裝體之方法所形成。
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020153676A1 (en) * | 2001-04-23 | 2002-10-24 | Ikuo Noguchi | Wafer holding device |
JP2004128202A (ja) * | 2002-10-02 | 2004-04-22 | Tokyo Electron Ltd | 真空プローブ装置及び真空プローブ方法 |
TW201243991A (en) * | 2004-07-12 | 2012-11-01 | August Technology Corp | Wafer holding mechanism |
US20130330154A1 (en) * | 2010-09-24 | 2013-12-12 | Ralph Sowden | Support for semiconductor substrate |
WO2017054146A1 (en) * | 2015-09-30 | 2017-04-06 | Acm Research (Shanghai) Inc. | Apparatus and methods for cleaning wafers |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3705769A (en) | 1970-11-12 | 1972-12-12 | Johannsmeier Karl Heinz | Optical alignment and contact printing system with improved chuck assembly |
US4746256A (en) | 1986-03-13 | 1988-05-24 | Roboptek, Inc. | Apparatus for handling sensitive material such as semiconductor wafers |
JP3776174B2 (ja) | 1996-09-12 | 2006-05-17 | アピックヤマダ株式会社 | 半導体部品の搬送装置 |
JPH1174164A (ja) | 1997-08-27 | 1999-03-16 | Canon Inc | 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法 |
JP3282796B2 (ja) | 1998-04-13 | 2002-05-20 | 東京エレクトロン株式会社 | アライナー |
WO1999067812A1 (en) | 1998-06-24 | 1999-12-29 | Medallion Technology, Llc | Chuck table for semiconductor wafer |
US6187134B1 (en) * | 1999-07-09 | 2001-02-13 | The Board Of Trustees Of The Leland Stanford Junior University | Reusable wafer support for semiconductor processing |
US6580283B1 (en) | 1999-07-14 | 2003-06-17 | Aehr Test Systems | Wafer level burn-in and test methods |
US6692219B2 (en) | 2000-11-29 | 2004-02-17 | Tokyo Electron Limited | Reduced edge contact wafer handling system and method of retrofitting and using same |
US20040025322A1 (en) | 2002-08-06 | 2004-02-12 | Michael Binnard | Waffle wafer chuck apparatus and method |
US10468288B2 (en) | 2016-10-19 | 2019-11-05 | Kla-Tencor Corporation | Methods and systems for chucking a warped wafer |
TWI766105B (zh) | 2017-09-28 | 2022-06-01 | 美商魯道夫科技股份有限公司 | 晶圓級封裝組裝體處置 |
US10811299B2 (en) | 2018-05-04 | 2020-10-20 | Lam Research Corporation | Wafer chuck assembly |
-
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020153676A1 (en) * | 2001-04-23 | 2002-10-24 | Ikuo Noguchi | Wafer holding device |
JP2004128202A (ja) * | 2002-10-02 | 2004-04-22 | Tokyo Electron Ltd | 真空プローブ装置及び真空プローブ方法 |
TW201243991A (en) * | 2004-07-12 | 2012-11-01 | August Technology Corp | Wafer holding mechanism |
US20130330154A1 (en) * | 2010-09-24 | 2013-12-12 | Ralph Sowden | Support for semiconductor substrate |
WO2017054146A1 (en) * | 2015-09-30 | 2017-04-06 | Acm Research (Shanghai) Inc. | Apparatus and methods for cleaning wafers |
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