JP7130273B2 - ウェハおよびフォトマスクの組み合わせ検査のシステム、装置、および方法 - Google Patents
ウェハおよびフォトマスクの組み合わせ検査のシステム、装置、および方法 Download PDFInfo
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- JP7130273B2 JP7130273B2 JP2020543780A JP2020543780A JP7130273B2 JP 7130273 B2 JP7130273 B2 JP 7130273B2 JP 2020543780 A JP2020543780 A JP 2020543780A JP 2020543780 A JP2020543780 A JP 2020543780A JP 7130273 B2 JP7130273 B2 JP 7130273B2
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- 238000007689 inspection Methods 0.000 title claims description 114
- 238000000034 method Methods 0.000 title description 36
- 239000012636 effector Substances 0.000 claims description 39
- 238000000386 microscopy Methods 0.000 claims description 20
- 238000012360 testing method Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 description 178
- 230000008569 process Effects 0.000 description 23
- 238000012545 processing Methods 0.000 description 19
- 239000000523 sample Substances 0.000 description 19
- 230000007246 mechanism Effects 0.000 description 15
- 230000004044 response Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000004630 atomic force microscopy Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 238000000339 bright-field microscopy Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001446 dark-field microscopy Methods 0.000 description 1
- 230000000881 depressing effect Effects 0.000 description 1
- 238000001152 differential interference contrast microscopy Methods 0.000 description 1
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- 230000000977 initiatory effect Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N21/03—Cuvette constructions
- G01N2021/0339—Holders for solids, powders
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95676—Masks, reticles, shadow masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Description
Claims (12)
- 自体を貫通するように形成された開口を有する本体であって、第1の支持外面及び第2の支持外面を有し、前記第2の支持外面は前記第1の支持外面より下に位置し、前記第2の支持外面はチャックが第1の構成にある場合にフォトマスクを支持するように構成されている、本体と;
前記チャックが第2の構成にある場合に前記第2の支持外面と整合するよう構成された取り外し可能なインサートであって、前記取り外し可能なインサートと前記第1の支持外面とが、前記基板を支持するように構成された第1の一体型支持外面を形成するような、厚みを有する取り外し可能なインサートと;
を含む、チャック。 - 前記チャックが前記第1の構成にある場合に前記基板が係合し、かつ前記チャックが前記第2の構成にある場合に前記フォトマスクが係合するように構成されている少なくとも1つの真空経路を形成する構造体をさらに含む、請求項1に記載のチャック。
- 前記取り外し可能なインサートは、前記基板の試験面が焦点距離内に位置するように前記基板を支持する構成とされている、請求項1に記載のチャック。
- ロボット式システムに連結されているエンドエフェクタ、
顕微鏡検査装置、
自動検査システムの1つ以上の構成要素を制御する制御部、および
試料台に連結されているチャックを含み、
前記チャックは、自体を貫通するように形成された開口を有する本体であって、第1の支持外面及び第2の支持外面を有し、前記第2の支持外面は前記第1の支持外面より下に位置し、前記第2の支持外面はチャックが第1の構成にある場合にフォトマスクを支持するように構成されている、本体と;
前記チャックが第2の構成にある場合に前記第2の支持外面と整合するよう構成された取り外し可能なインサートであって、前記取り外し可能なインサートと前記第1の支持外面とが、前記基板を支持するように構成された第1の一体型支持外面を形成するような、厚みを有する取り外し可能なインサートと;
を含む、自動検査システム。 - 前記自動検査システムは格納されている、請求項4に記載の自動検査システム。
- 前記エンドエフェクタは前記基板を前記自動検査システム内に自動的に装着するように構成されている、請求項4に記載の自動検査システム。
- 前記エンドエフェクタは前記フォトマスクを前記自動検査システム内に自動的に装着するように構成されている、請求項4に記載の自動検査システム。
- 前記取り外し可能なインサートが前記チャックに挿入されない場合に前記ロボット式システムに関連付けられた動作が停止される、請求項4に記載の自動検査システム。
- 前記自動検査システムの点検扉が開いている場合に前記ロボット式システムに関連付けられた動作が停止される、請求項4に記載の自動検査システム。
- 前記ロボット式システムの緊急電源遮断ボタンが起動された場合に前記ロボット式システムに関連付けられた動作が停止される、請求項4に記載の自動検査システム。
- 前記取り外し可能なインサートは、前記チャックに前記取り外し可能なインサートを接続する1つ以上の位置決めピンを有する、請求項4に記載の自動検査システム。
- 前記チャックは、前記チャックが前記第1の構成にある場合に前記基板が係合し、かつ前記チャックが前記第2の構成にある場合に前記フォトマスクが係合するように構成されている少なくとも1つの真空経路を形成する構造体をさらに含む、請求項4に記載の自動検査システム。
Priority Applications (1)
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JP2022130221A JP7521824B2 (ja) | 2018-02-20 | 2022-08-17 | ウェハおよびフォトマスクの組み合わせ検査のシステム、装置、および方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/899,456 | 2018-02-20 | ||
US15/899,456 US10254214B1 (en) | 2018-02-20 | 2018-02-20 | Systems, devices, and methods for combined wafer and photomask inspection |
PCT/US2019/017513 WO2019164695A1 (en) | 2018-02-20 | 2019-02-11 | Systems, devices, and methods for combined wafer and photomask inspection |
Related Child Applications (1)
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JP2022130221A Division JP7521824B2 (ja) | 2018-02-20 | 2022-08-17 | ウェハおよびフォトマスクの組み合わせ検査のシステム、装置、および方法 |
Publications (2)
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JP2021514116A JP2021514116A (ja) | 2021-06-03 |
JP7130273B2 true JP7130273B2 (ja) | 2022-09-05 |
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JP2020543780A Active JP7130273B2 (ja) | 2018-02-20 | 2019-02-11 | ウェハおよびフォトマスクの組み合わせ検査のシステム、装置、および方法 |
JP2022130221A Active JP7521824B2 (ja) | 2018-02-20 | 2022-08-17 | ウェハおよびフォトマスクの組み合わせ検査のシステム、装置、および方法 |
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Country Status (6)
Country | Link |
---|---|
US (2) | US10254214B1 (ja) |
EP (1) | EP3755991A4 (ja) |
JP (2) | JP7130273B2 (ja) |
CN (1) | CN111819433B (ja) |
TW (3) | TWI795647B (ja) |
WO (1) | WO2019164695A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US10254214B1 (en) * | 2018-02-20 | 2019-04-09 | Nanotronics Imaging, Inc. | Systems, devices, and methods for combined wafer and photomask inspection |
TWI689454B (zh) * | 2019-08-02 | 2020-04-01 | 樂華科技股份有限公司 | 光罩取用裝置 |
CN112880597B (zh) * | 2019-12-26 | 2022-12-27 | 南京力安半导体有限公司 | 晶圆平整度的测量方法 |
US20230035556A1 (en) * | 2021-07-29 | 2023-02-02 | Taiwan Semiconductor Manufacturing Company Limited | Portable robotic semiconductor pod loader |
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JP2001069566A (ja) | 1999-08-26 | 2001-03-16 | Nec Shizuoka Ltd | 複合携帯端末装置 |
US20040012776A1 (en) | 2002-07-16 | 2004-01-22 | Bae Sang-Man | Particle inspection device and inspection method using the same |
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-
2018
- 2018-02-20 US US15/899,456 patent/US10254214B1/en active Active
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2019
- 2019-02-11 TW TW109121398A patent/TWI795647B/zh active
- 2019-02-11 TW TW108104488A patent/TWI700777B/zh active
- 2019-02-11 JP JP2020543780A patent/JP7130273B2/ja active Active
- 2019-02-11 CN CN201980014082.6A patent/CN111819433B/zh active Active
- 2019-02-11 WO PCT/US2019/017513 patent/WO2019164695A1/en unknown
- 2019-02-11 EP EP19756755.5A patent/EP3755991A4/en active Pending
- 2019-02-11 TW TW111121732A patent/TWI791409B/zh active
- 2019-04-08 US US16/378,049 patent/US11125677B2/en active Active
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2022
- 2022-08-17 JP JP2022130221A patent/JP7521824B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001069566A (ja) | 1999-08-26 | 2001-03-16 | Nec Shizuoka Ltd | 複合携帯端末装置 |
US20040012776A1 (en) | 2002-07-16 | 2004-01-22 | Bae Sang-Man | Particle inspection device and inspection method using the same |
Also Published As
Publication number | Publication date |
---|---|
US20190257741A1 (en) | 2019-08-22 |
TWI700777B (zh) | 2020-08-01 |
WO2019164695A1 (en) | 2019-08-29 |
TW202117922A (zh) | 2021-05-01 |
CN111819433B (zh) | 2023-09-05 |
TW201937650A (zh) | 2019-09-16 |
JP2021514116A (ja) | 2021-06-03 |
US11125677B2 (en) | 2021-09-21 |
JP2022166211A (ja) | 2022-11-01 |
EP3755991A4 (en) | 2021-12-01 |
TW202238821A (zh) | 2022-10-01 |
JP7521824B2 (ja) | 2024-07-24 |
CN111819433A (zh) | 2020-10-23 |
EP3755991A1 (en) | 2020-12-30 |
TWI795647B (zh) | 2023-03-11 |
TWI791409B (zh) | 2023-02-01 |
US10254214B1 (en) | 2019-04-09 |
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