JP2021514116A - ウェハおよびフォトマスクの組み合わせ検査のシステム、装置、および方法 - Google Patents
ウェハおよびフォトマスクの組み合わせ検査のシステム、装置、および方法 Download PDFInfo
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- JP2021514116A JP2021514116A JP2020543780A JP2020543780A JP2021514116A JP 2021514116 A JP2021514116 A JP 2021514116A JP 2020543780 A JP2020543780 A JP 2020543780A JP 2020543780 A JP2020543780 A JP 2020543780A JP 2021514116 A JP2021514116 A JP 2021514116A
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- chuck
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N21/03—Cuvette constructions
- G01N2021/0339—Holders for solids, powders
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95676—Masks, reticles, shadow masks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Abstract
Description
Claims (12)
- 取り外し可能なインサート、および第1の構造体を含むチャックであって、
前記取り外し可能なインサートは、前記チャックが第1の構成にある場合にウェハの試験面が焦点距離内にあるように前記ウェハを支持するように構成されており、
前記第1の構成にある場合、前記取り外し可能なインサートは、前記チャックに挿入され、
前記第1の構造体は、前記チャックが第2の構成にある場合にフォトマスクの試験面が前記焦点距離内にあるように前記フォトマスクを支持するのに十分な深度を有する窪みを形成し、
前記第2の構成にある場合、前記取り外し可能なインサートは、前記チャックに挿入されず、かつ
前記チャックは検査システムに連結されており、前記チャックは、前記取り外し可能なインサートが前記チャックから取り外された場合に前記検査システムの動作を無効にするセンサを含む、前記チャック。 - 前記チャックが前記第1の構成にある場合に前記ウェハが係合し、かつ前記チャックが前記第2の構成にある場合に前記フォトマスクが係合するように構成されている少なくとも1つの真空経路を形成する第2の構造体をさらに含む、請求項1に記載のチャック。
- 前記焦点距離の厚さは1mmである、請求項1に記載のチャック。
- ロボット式システムに連結されているエンドエフェクタ、
顕微鏡検査装置、
自動検査システムの1つ以上の構成要素を制御する制御部、および
試料台に連結されているチャックを含み、
前記チャックは、取り外し可能なインサート、および第1の構造体を含み、
前記取り外し可能なインサートは、前記チャックが第1の構成にある場合にウェハの試験面が焦点距離内にあるように前記ウェハを支持するように構成されており、
前記取り外し可能なインサートは、前記第1の構成にある場合に前記チャックに挿入され、
前記第1の構造体は、前記チャックが第2の構成にある場合にフォトマスクの試験面が前記焦点距離内にあるように前記フォトマスクを支持するのに十分な深度を有する窪みを形成し、
前記取り外し可能なインサートは、前記第2の構成にある場合に前記チャックに挿入されず、
前記自動検査システムは、前記チャックが前記第1の構成にある場合に第1の動作モードで動作し、前記自動検査システムは、前記チャックが前記第2の構成にある場合に第2の動作モードで動作し、
前記制御部は、前記取り外し可能なウェハインサートの連動ピンが前記チャックのセンサを起動した場合に前記チャックが前記第1の構成にあると判定するように構成されている、自動検査システム。 - 前記自動検査システムは格納されている、請求項4に記載の自動検査システム。
- 前記エンドエフェクタはウェハを前記自動検査システム内に自動的に装着するように構成されている、請求項4に記載の自動検査システム。
- 前記エンドエフェクタはフォトマスクを前記自動検査システム内に自動的に装着するように構成されている、請求項4に記載の自動検査システム。
- 前記取り外し可能なインサートが前記チャックに挿入されない場合に前記ロボット式システムに関連付けられた動作が停止される、請求項4に記載の自動検査システム。
- 前記自動検査システムの点検扉が開いている場合に前記ロボット式システムに関連付けられた動作が停止される、請求項4に記載の自動検査システム。
- 前記ロボット式システムの緊急電源遮断ボタンが起動された場合に前記ロボット式システムに関連付けられた動作が停止される、請求項4に記載の自動検査システム。
- 前記取り外し可能なウェハインサートは、前記チャックが前記第1の構成にある場合に前記取り外し可能なウェハインサートを前記窪みに接続する1つ以上の位置決めピンを有する、請求項4に記載の自動検査システム。
- 前記チャックは、前記チャックが前記第1の構成にある場合に前記ウェハが係合し、かつ前記チャックが前記第2の構成にある場合に前記フォトマスクが係合するように構成されている少なくとも1つの真空経路を形成する第2の構造体をさらに含む、請求項4に記載の自動検査システム。
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JP2022130221A JP2022166211A (ja) | 2018-02-20 | 2022-08-17 | ウェハおよびフォトマスクの組み合わせ検査のシステム、装置、および方法 |
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US15/899,456 | 2018-02-20 | ||
US15/899,456 US10254214B1 (en) | 2018-02-20 | 2018-02-20 | Systems, devices, and methods for combined wafer and photomask inspection |
PCT/US2019/017513 WO2019164695A1 (en) | 2018-02-20 | 2019-02-11 | Systems, devices, and methods for combined wafer and photomask inspection |
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JP2022130221A Division JP2022166211A (ja) | 2018-02-20 | 2022-08-17 | ウェハおよびフォトマスクの組み合わせ検査のシステム、装置、および方法 |
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JP7130273B2 JP7130273B2 (ja) | 2022-09-05 |
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JP2022130221A Pending JP2022166211A (ja) | 2018-02-20 | 2022-08-17 | ウェハおよびフォトマスクの組み合わせ検査のシステム、装置、および方法 |
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US (2) | US10254214B1 (ja) |
EP (1) | EP3755991A4 (ja) |
JP (2) | JP7130273B2 (ja) |
CN (1) | CN111819433B (ja) |
TW (3) | TWI795647B (ja) |
WO (1) | WO2019164695A1 (ja) |
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US10254214B1 (en) * | 2018-02-20 | 2019-04-09 | Nanotronics Imaging, Inc. | Systems, devices, and methods for combined wafer and photomask inspection |
TWI689454B (zh) * | 2019-08-02 | 2020-04-01 | 樂華科技股份有限公司 | 光罩取用裝置 |
CN112864075A (zh) * | 2019-12-26 | 2021-05-28 | 南京力安半导体有限公司 | 晶圆几何参数以及晶圆上掩膜层的厚度的测量方法 |
US20230035556A1 (en) * | 2021-07-29 | 2023-02-02 | Taiwan Semiconductor Manufacturing Company Limited | Portable robotic semiconductor pod loader |
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JP2001069566A (ja) * | 1999-08-26 | 2001-03-16 | Nec Shizuoka Ltd | 複合携帯端末装置 |
US20040012776A1 (en) * | 2002-07-16 | 2004-01-22 | Bae Sang-Man | Particle inspection device and inspection method using the same |
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US10254214B1 (en) * | 2018-02-20 | 2019-04-09 | Nanotronics Imaging, Inc. | Systems, devices, and methods for combined wafer and photomask inspection |
-
2018
- 2018-02-20 US US15/899,456 patent/US10254214B1/en active Active
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2019
- 2019-02-11 CN CN201980014082.6A patent/CN111819433B/zh active Active
- 2019-02-11 TW TW109121398A patent/TWI795647B/zh active
- 2019-02-11 JP JP2020543780A patent/JP7130273B2/ja active Active
- 2019-02-11 WO PCT/US2019/017513 patent/WO2019164695A1/en unknown
- 2019-02-11 TW TW111121732A patent/TWI791409B/zh active
- 2019-02-11 EP EP19756755.5A patent/EP3755991A4/en active Pending
- 2019-02-11 TW TW108104488A patent/TWI700777B/zh active
- 2019-04-08 US US16/378,049 patent/US11125677B2/en active Active
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2022
- 2022-08-17 JP JP2022130221A patent/JP2022166211A/ja active Pending
Patent Citations (3)
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JPH10172897A (ja) * | 1996-12-05 | 1998-06-26 | Nikon Corp | 基板アダプタ,基板保持装置及び基板保持方法 |
JP2001069566A (ja) * | 1999-08-26 | 2001-03-16 | Nec Shizuoka Ltd | 複合携帯端末装置 |
US20040012776A1 (en) * | 2002-07-16 | 2004-01-22 | Bae Sang-Man | Particle inspection device and inspection method using the same |
Also Published As
Publication number | Publication date |
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JP2022166211A (ja) | 2022-11-01 |
TWI795647B (zh) | 2023-03-11 |
TWI700777B (zh) | 2020-08-01 |
JP7130273B2 (ja) | 2022-09-05 |
TW202117922A (zh) | 2021-05-01 |
EP3755991A4 (en) | 2021-12-01 |
TWI791409B (zh) | 2023-02-01 |
US11125677B2 (en) | 2021-09-21 |
US10254214B1 (en) | 2019-04-09 |
EP3755991A1 (en) | 2020-12-30 |
US20190257741A1 (en) | 2019-08-22 |
CN111819433A (zh) | 2020-10-23 |
TW201937650A (zh) | 2019-09-16 |
WO2019164695A1 (en) | 2019-08-29 |
CN111819433B (zh) | 2023-09-05 |
TW202238821A (zh) | 2022-10-01 |
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