201112345 , 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種晶圓壓膜機離形膜保護機構，詳而言之係一種應用於 a曰圓進行麼膜作業的保護裝置’利用離形膜對執行塵膜作業之晶圓於勝膜 產生溢膠之部位做黏附排除，以保持晶圓後續壓膜作業之良率。 【先前技術】 ^ 按，習用之晶圓切膜裝置係利用長方形膜料，並將臈料貼附於晶圓上， 再以刀模除去多餘部份，為了避免刀具與晶圓接觸，則所裁切之膜料係勢 必皆大於晶圓面積，但配合晶圓製程中，需要於晶圓外圍預留一圈不貼附 膜料； 請參閱中華民國專利申請案號第〇962〇2954號「晶圓之貼膜裁切機」， 係於一呈水平狀之座體上設置包括有：一框架體，設於座體上；一上貼合 裁切機構’紐於购體下^ ’該上貼合肋機射軸純架體利用數 • 只活動桿上下移動；該上貼合裁切機構底部包括有上外環體'内環體與刀 片環；-下貼錢域構，設於上齡裁诚構下方之紐處包含有底 板、下外環體與置料盤；一進料單元，設於下貼合裁切機構一側，可供膠 膜卷組置及供U料單元，設於下貼合裁域構姆於進料單元另一 側’可捲收膠膜卷； 習狀娜設備係姻該上貼合肋機構向下移動，該上外環體係先 y壓並禮張賴，且_環體下降纽置晶狀置料虹，歸膜黏貼於 晶圓與框架頂面’朗時將内環體外_刀片環下降將膠膜切斷，再利用 201112345 充氣單元將夥膜緊密貼合於晶圓上； 續請參照日本特開昭63__7號專利「半導體保護膜之自動切膜裝 置」’其係_捲筒裝置輸送_，將欲進行切割之薄職送至晶圓表面' 上’利用下活塞桿承接晶圓’並將下活塞桿由上至下作動，使晶圓外周緣 之圓形刀刃凸出’並藉由上活塞桿向下推抵將薄賴切，再將裁切之薄膜 連同晶圓往旁邊推移； 此種習財式湘晶_緣之_刀刀，彻位於中央承載晶圓之 下活塞桿將晶圓連同薄膜向下位移，並配合上活塞桿向下作動使薄膜裁切； 前述兩種_均是晶_護默切難置，經完絲城之膠膜後續 動作通常魏進行預職再加壓使其緊密貼合於晶圓上，然而經完成裁切 及預貼後之晶保護膜表㈣產生溢膠，朗是保護膜經裁切過後之外 周圍，若無進行排除作業，於後續進行保護膜與晶圓壓合作業易影響其良 率。 有‘於此本發明人即推出—種晶圓壓膜機離形膜保護機構，其係一 種應用於晶圓完成獅後執行壓膜作業的保護裝置，透過離賴對晶圓的 膠膜部㈣壓職生卿部⑽行_排除，簡持晶暖續壓膜作業之 良率。 【發明内容】 本發明係有關-種晶圓翻機離形膜保護機構，其係—種應用於晶圓 進行壓膜作業祕縣置離形麟執行_作業之關於勝膜產生 鱗之部位做_獅，以爾晶圓後續顧作業之良率。 201112345 . 為達到前述之創作目的，本發明「晶圓壓膜機離形膜保護機構」係包 括一下腔體、一上腔體、一吹氣裝置、一離形膜輸送裝備及一穩固裝置， 該下腔體係供晶圓置放用’該上腔體係位於下腔體上方，且該上腔體係可 相對下腔體上下移動以接近或遠離下腔體，以利晶圓置放或分離於下腔 體’且遠上腔體係垂直開設有複數供吹氣裝置將氣體朝下腔體方向吹送之 耽孔’該吹氣裝置係設置於上腔虹方並可與上腔體呈期步上下位移； 該離賴觀裝備係包括—銳滾輪及_收料雜，該紐滾輪係捲 籲捆有做為吸附晶圓表面溢膠之離形膜，該離形膜輸送裝備係可將離形膜穿 過上腔體及下腔體之間’並得藉由輸送滾輪及收料滾輪之滾動替換離形膜 對應於晶圓之位置，該收料滚輪係做為捲收使用過後之離形膜，另該離形 膜輸送裝備位社㈣與下腔體關距_係各設#—做為延展離形膜， 以利離形麟岐現平整態樣錄上腔體與下腔體間之展酿筒另該展 膜滚筒係與上腔體連動設置，當上腔體升降時該展膜滾筒亦可同步升降， 以利離形輯上題同步升降，另雜送滾輪係可透過—直流馬達做為驅 ® 動’而該收料滾輪係可透過-轉矩馬達做為驅動； 該穩固裝置係位於上腔體與下腔體兩側，並得於上腔體下降時進行橫 移以呈現套固上腔體及下腔體。 糟此’透過吹氣裝置由上腔體的的氣孔朝下腔體所置放之晶圓進行吹 氣’介於上職及下腔體間之離賴即受加壓吹氣影響貼附於晶圓表面， 當吹氣停止後離頻則恢復分離晶圓及膠膜表面態樣並可將晶圓表面之溢 膠黏除。 m 由月〕述創轴谷可知’本發明「晶圓翻機離形娜護機構」係可對 201112345 執行壓膜作業之晶_行蹄的黏附及排除，避免晶圓上之溢膝黏附於麼 膜機具，進而影響後續晶圓進行壓膜作業之良率。 【實施方式】 本發明係有關-種晶圓壓膜機離形膜保護機構，其係—種應用於晶圓 進行壓膜作⑽紐裝置，制離形麟執行顧作業之晶圓於膠膜產生 溢夥之部位做黏附排除，以保持晶圓後續壓膜作業之良率，請參閱第一圖 至第二圖所示’本發明「晶圓壓膜機離形膜保護機構」係包括—下腔體（、 一上腔體2、一吹氣裝置3及一離形膜輸送裝備4 ; 該下腔體1係供晶圓置放用，該上腔體2係位於下腔體i上方，且該 上腔體2係可相對下腔體丨上下移動以接近或雜下腔體丨，以利晶圓置放 或刀離於下腔體1 ’且該上腔體2係垂直開設有複數供吹氣裝置3將氣體朝 下腔體1方向加壓吹送之氣孔21(見於第五圖），該吹氣裝置3係設置於上 腔體2上方並可與上腔體2呈現同步上下位移； 該離形膜輸送裝備4係包括-輸送滾輪41及一收料滾輪&，該輸送滾 輪41係捲捆有做為吸附晶圓表面溢膠之離形膜，該離形膜輸送裝備*係可 將離形膜穿過上腔體2及下腔體1之間，並得藉由輪送滾輪Μ及收料滚輪 42之滾鱗換舞麟應㈣獻健，該嶋錄⑯顧絲收使用過 後之離形膜，另該離賴輸送裝備4位於上腔體2與下腔體丨的間距兩側 係各設有-做為延展離顧，以讎賴得以呈現平整態樣位於上腔體2 與下腔體i間之展膜滾筒43 (見於第三圖），另該展财筒43係與上腔體 2連動設置’當上腔體2升㈣該展職筒43亦可同步升降，以利離形膜 隨上腔體2同步升降（如第—圖與第二圖所示），另該輸送滾輪μ係可透 201112345 過一直流馬達5 (見於第三圖）做為驅動，而該收料滾輪42係可透過一轉 矩馬達6 (見於第三圖）做為驅動； 該穩固裝置7係位於上腔體2與下腔體1兩側，並得於上腔體2下降 時進行橫移以呈現套固上腔體2及下腔體1。 藉此，透過吹氣裝置3由上腔體2的的氣孔21朝下腔體1所置放之晶 圓進行加壓吹氣，介於上腔體2及下腔體1間之離形膜即受加壓吹氣影響 貼附於晶圓及膠膜表面，當吹氣停止後離形膜則恢復分離晶圓表面態樣並 可將晶圓表面之溢膠黏除。 晴參閱第二圖至第七圖所示，其係本發明「晶圓壓膜機離形膜保護機 構」進仃晶®表面祕瓣流程示意’該完賴麟作之晶_位於下腔 體1 (如第三圖所示），該上腔體2即下降至接近下腔體】之位置(如第四圖 所示）’續透過吹氣裝置3將氣體由氣孔2卜欠出以帶動離形膜貼附於晶圓 表面(如第五圖所不）’完成吹氣作紐停止錢使離賴恢復分離晶圓表 面之祕’料透過離形麟晶圓表面之溢轉除(如第六圖卿），最後 在由上腔體2上升以利進行晶_換，及透過輸送滾輪&及收料滚輪犯 之滚動替換離形膜未經使狀部位(如第七圖所示），其溢膠黏除係、部物 。可參閱第至第十’第人圖㈣應第_狀態為上腔體 Γ至接近下雜1之位置，第爛㈣絲五離縣吹氣畴動離形 圓表㈣⑽輸®嶋停爾離顧黏除晶 由前述創作内容可知，本發「曰 月日日®壓胰機離形膜保護機構」係可 執仃壓膜健之晶圓進行溢 」们對 黏附及排除，避免晶圓上之溢膠黏附於壓 201112345 膜機具，進而影響後續晶圓進行壓膜作業之良率。 由上所述者僅用以解釋本發明之較佳實施例，並非企圖具以對本發明 作任何形式上之關，是以，凡有在相同之創作精神下所做有關本發明之 何t飾或變更者，皆仍應包括在本發明意圖保護之範嘴内。 ‘上所述’本發明「晶圓壓膜機離形膜保護機構」在結構設計、使用 實用性及成本效益上’確實是完全符合產業上發展所需要，且所揭露之結 構創作亦是具有前所未有_新構造，所以其具有「_性」應無疑慮， 又本發明較習知結構更具械之增進，因此亦具有「進步性」，衫全符合 我國專利材關發明專利之㈣要件的規定，乃依法狀專利中請，並敬 6月韵局早日審查，並給予肯定。 【圖式簡單說明】 第-圖至第二_本發明之上腔體連動展膜滾筒同步升降作動示意圖 第三圖至第七_本發明之晶圓表面溢膠黏除作業流程示意圖。 第八圖至針_本發明溢雜除伽局贼大示意圖。 【主要元件符號說明】 1下腔體 2上腔體 21氣孔 3吹氣裝置 4離形膜輸送裝備 41輸送滾輪 42收料滾輪 43展膜滾筒 5直流馬達 6轉矩馬達 7穩固裝置201112345, VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a release film protection mechanism for a wafer laminator, and more specifically relates to a protection device for use in a film operation The release film adheres to the wafer where the dust film operation is performed, and the adhesion of the film to the film is adhered to maintain the yield of the subsequent filming operation of the wafer. [Prior Art] ^ According to the conventional wafer cutting device, a rectangular film material is used, and the material is attached to the wafer, and the excess portion is removed by a die to avoid contact between the tool and the wafer. The film material that is cut must be larger than the wafer area. However, in the wafer process, a circle of film material is not required to be attached to the periphery of the wafer; please refer to the Republic of China Patent Application No. 〇962〇2954" The wafer film cutting machine is provided on a horizontal seat body comprising: a frame body disposed on the seat body; and an upper matching cutting mechanism 'Newly purchased body ^' Fitted rib machine shot shaft pure frame use number • Only the movable rod moves up and down; the bottom of the upper matching cutting mechanism includes an upper outer ring body 'inner ring body and a blade ring; The button below the ageing structure includes a bottom plate, a lower outer ring body and a loading tray; a feeding unit is arranged on the side of the lower fitting cutting mechanism for the film roll assembly and the U material unit. Set on the other side of the feeding unit on the other side of the feeding unit can be rolled up the film roll; Xi Na Na equipment is attached to the marriage The rib mechanism moves downwards, and the upper outer ring system first presses and slaps the ribs, and the _ ring body drops to the center of the crystal, and the film is adhered to the wafer and the top surface of the frame. The blade ring is lowered to cut the film, and the film is adhered to the wafer by the 201112345 inflating unit. For the continuation, please refer to the Japanese Patent Application No. 63__7 "Automatic Film Cutting Device for Semiconductor Protective Film". The barrel device conveys _, the thin part to be cut is sent to the wafer surface 'on' to take the wafer with the lower piston rod' and the lower piston rod is actuated from top to bottom, so that the circular blade edge of the outer periphery of the wafer protrudes 'And by pushing the upper piston rod down to cut the thin, and then cutting the cut film alongside the wafer; this kind of wealth-style Xiangjing_edge_knife is located in the central carrier wafer The lower piston rod displaces the wafer and the film downward, and cooperates with the piston rod to move downward to cut the film; the above two kinds of _ are all crystallized and difficult to set, and the follow-up action of the film after the silk city is usually Wei Pre-stress and re-pressurize it to fit snugly on the wafer, but after finishing cutting and pre-posting (Iv) a protective film crystal table generating excess glue, Lang, after the protective film cropped around the outside, without exclusion operation, pressure protection film of the wafer to a subsequent sector cooperation is likely to affect its good rate. There is a 'wafer laminator release film protection mechanism introduced by the inventor, which is a protection device for performing a lamination operation on a wafer after the lion is performed, through the film portion of the wafer. (4) Pressing the Ministry of Health and Health (10) OK _ Exclusion, the holding rate of crystal heating and continuous film operation. SUMMARY OF THE INVENTION The present invention relates to a type of wafer flip-flop protective film protection mechanism, which is applied to a wafer for film lamination operation, and the county is disposed of a detached lining. _ lion, the yield of the follow-up work of the Ehr wafer. 201112345. In order to achieve the above-mentioned creative purpose, the "wafer laminator release film protection mechanism" of the present invention comprises a lower cavity, an upper cavity, an air blowing device, a release film conveying device and a stabilization device. The lower cavity system is used for wafer placement. The upper cavity system is located above the lower cavity, and the upper cavity system can move up and down relative to the lower cavity to approach or away from the lower cavity to facilitate placement or separation of the wafer. The lower cavity body 'and the upper cavity system is vertically opened with a plurality of holes for blowing the gas to blow the gas toward the lower cavity'. The air blowing device is disposed in the upper cavity and can be stepped up and down with the upper cavity Displacement; the deviating equipment includes: a sharp roller and a _ receiving material, the roller is bundled with a release film for adsorbing the surface of the wafer, and the release film conveying device can be dissected The film passes between the upper cavity and the lower cavity and replaces the position of the release film corresponding to the wafer by rolling of the conveying roller and the receiving roller, and the receiving roller is used as a release after being used for winding. Membrane, the other of the release film transport equipment (four) and the lower cavity off distance _ system each set # - as a stretched release film, in order to facilitate the separation of the smear, the sample between the cavity and the lower cavity, and the film roller system is arranged in conjunction with the upper cavity, when the upper cavity is raised and lowered The film roll can also be lifted and lowered synchronously to facilitate simultaneous lifting and lifting of the off-the-shelf item. The other type of feed roller can be transmitted through the DC motor as the drive. The receiving roller can be driven by the torque motor. The stabilizing device is located on both sides of the upper cavity and the lower cavity, and is traversed when the upper cavity is lowered to present the upper cavity and the lower cavity. The bad thing is that the air is blown from the air hole of the upper cavity toward the wafer placed by the lower cavity through the air blowing device. The separation between the upper and lower chambers is affected by the pressure blowing. On the surface of the wafer, when the blow is stopped, the off-frequency returns to separate the surface of the wafer and the surface of the film and can remove the overflow on the surface of the wafer. m According to the description of the magazine, the "wafer turning machine" can perform the adhesion and elimination of the crystal hoof of the filming operation in 201112345, so as to prevent the knee sticking on the wafer from sticking to The film machine, which in turn affects the yield of subsequent wafers for lamination. [Embodiment] The present invention relates to a wafer film laminating machine protective film protection mechanism, which is applied to a wafer for film lamination (10) device, and the wafer is processed by a wafer. The part of the spill is made to adhere and exclude, in order to maintain the yield of the subsequent filming operation of the wafer, please refer to the first to second figures of the present invention, "wafer laminating machine protective film protection mechanism" includes - a lower cavity (an upper cavity 2, an air blowing device 3 and a release film conveying device 4; the lower cavity 1 is for wafer placement, the upper cavity 2 is located above the lower cavity i And the upper cavity 2 is movable up and down relative to the lower cavity to approach or mix the lower cavity, so that the wafer is placed or the knife is separated from the lower cavity 1' and the upper cavity 2 is vertically opened. a plurality of air holes 21 (see FIG. 5) for blowing the gas into the lower chamber 1 in a direction in which the air blowing device 3 is disposed, and the air blowing device 3 is disposed above the upper chamber 2 and can be synchronized with the upper chamber 2 Displacement; the release film conveying device 4 includes a conveying roller 41 and a receiving roller & the conveying roller 41 is bundled as an adsorption crystal The release film of the surface overflowing, the release film conveying device* can pass the release film between the upper cavity 2 and the lower cavity 1, and is rolled by the roller and the receiving roller 42 The scales are changed to the dance lining (4) to provide health, and the 嶋 嶋 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 In order to extend the distraction, the film-forming roller 43 located between the upper cavity 2 and the lower cavity i is displayed in a flat state (see the third figure), and the extension cylinder 43 is arranged in conjunction with the upper cavity 2. 'When the upper chamber is 2 liters (4), the display cylinder 43 can also be lifted and lowered synchronously, so as to facilitate the simultaneous lifting and lowering of the release film with the upper cavity 2 (as shown in the first and second figures), and the conveying roller μ can be Through the 201112345 through the continuous flow motor 5 (see the third figure) as the drive, and the receiving roller 42 can be driven by a torque motor 6 (see the third figure); the stabilization device 7 is located in the upper cavity 2 and the two sides of the lower cavity 1 and traverse when the upper cavity 2 is lowered to present the upper cavity 2 and the lower cavity 1. Thereby, the upper cavity 2 is passed through the air blowing device 3 gas The hole 21 is pressed and blown toward the wafer placed on the lower cavity 1, and the release film between the upper cavity 2 and the lower cavity 1 is attached to the wafer and the film by the influence of the pressurized air blowing. On the surface, when the blowing is stopped, the release film recovers the surface morphology of the wafer and can remove the overflow of the surface of the wafer. As shown in the second to seventh figures, it is the wafer pressure of the present invention. Membrane machine release film protection mechanism "Into the crystal surface of the surface of the crystal clear valve" 'The finished crystal _ is located in the lower cavity 1 (as shown in the third figure), the upper cavity 2 is lowered to near The position of the cavity (as shown in the fourth figure) 'continued to vent the gas from the air hole 2 through the air blowing device 3 to drive the release film to the surface of the wafer (as shown in the fifth figure) The gas is used to stop the money to restore the separation of the surface of the wafer. The material passes through the surface of the off-line wafer (such as the sixth figure), and finally rises from the upper chamber 2 to facilitate the crystal exchange. And through the conveying roller & and the receiving roller to make a roll to replace the unshaped part of the film (as shown in the seventh figure), the glue overflows the system and parts. See the tenth to the tenth figure (four) should be the _ state of the upper cavity to the position close to the next 1, the second (four) silk five away from the county blown domain dynamic off-shaped round table (four) (10) transmission 嶋 尔 离According to the above-mentioned creations, the "May of the Day® Pressing Machine Protecting Mechanism" can be used to adhere and remove the wafers. The overflow glue adheres to the 201112345 film machine, which in turn affects the yield of subsequent wafers for lamination. The above description is only for explaining the preferred embodiments of the present invention, and is not intended to be in any form to the present invention, so that what is related to the present invention in the same spirit of creation Or the changer should still be included in the scope of the invention intended to be protected. The above-mentioned "wafer laminating machine release film protection mechanism" is indeed in full compliance with the needs of industrial development in terms of structural design, practicality and cost-effectiveness, and the disclosed structural creation also has Unprecedented _ new structure, so its "_ sex" should be undoubtedly considered, and the invention is more mechanically improved than the conventional structure, so it is also "progressive", and the shirt is in full compliance with the requirements of China's patented invention patent (4) The regulations are in accordance with the law-based patents, and the June rhyme bureau will be reviewed early and given affirmation. [Simplified Schematic Description] The first to the second embodiment of the present invention is a schematic diagram of the operation of the wafer surface overflowing and dispersing operation of the wafer. The eighth figure to the needle _ the present invention is a schematic diagram of the thief. [Main component symbol description] 1 lower cavity 2 upper cavity 21 air hole 3 air blowing device 4 release film conveying equipment 41 conveying roller 42 receiving roller 43 film rolling roller 5 DC motor 6 torque motor 7 stabilizer