TWI583554B - Soft suction fit platform - Google Patents
Soft suction fit platform Download PDFInfo
- Publication number
- TWI583554B TWI583554B TW105111213A TW105111213A TWI583554B TW I583554 B TWI583554 B TW I583554B TW 105111213 A TW105111213 A TW 105111213A TW 105111213 A TW105111213 A TW 105111213A TW I583554 B TWI583554 B TW I583554B
- Authority
- TW
- Taiwan
- Prior art keywords
- platform
- soft
- film
- absorbing
- base
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laminated Bodies (AREA)
Description
本發明係提供一種軟性吸著貼合平台，尤指在一般工作環境中，可針對各種尺寸片材表面進行貼模作業之貼合平台，不需在真空環境中作業無貼附過程破真空之問題，亦避免在真空室中薄膜易損壞之缺失，達到對各種尺寸片材進行全面或部分貼附薄膜之目的。 The invention provides a soft absorbing and affixing platform, in particular, a splicing platform capable of performing a stenciling operation on a surface of various sizes in a general working environment, and does not need to work in a vacuum environment without a process of attaching a vacuum. The problem is also to avoid the loss of the film in the vacuum chamber, and to achieve the purpose of fully or partially attaching the film to various sizes of the sheet.
按，現今製造產業面臨勞工需求短缺的嚴重問題，且製造產業容易對環境造成污染，而再環保意識高漲的情況下，對於傳統加工製造的作業模式也產生極大影響，在勞工與環境等因素影響下，製造產業在面對人工與經營成本等皆提高的問題時，則由勞力密集的加工產業轉型成技術性密集的壓力，因此業者也都利用產業外移或引進外籍勞工的方式來因應生產成本上漲的壓力，亦或是運用生產線自動化的技術及治具輔助加工的作業模式，進一步改善經營體質與降低製造成本，且可達到減縮人力、節省製造工時而提高產能之目的。 According to the current manufacturing industry, there is a serious problem of shortage of labor demand, and the manufacturing industry is prone to pollution to the environment. However, in the case of high environmental awareness, it also has a great impact on the operation mode of traditional processing and manufacturing, and is affected by factors such as labor and the environment. Under the pressure of the labor-intensive processing industry to become technically intensive, the manufacturing industry is also using technology to move out or introduce foreign workers to respond to production. The pressure of rising costs, or the use of production line automation technology and tooling-assisted processing mode, further improve the management of the body and reduce manufacturing costs, and can achieve the purpose of reducing manpower, saving manufacturing hours and increasing production capacity.
而隨著平面顯示器製作技術進步，使得新一代的產品都朝向更為輕、薄、可撓性或曲面的方向設計，其目的都是期望能提供更精緻的電子、電氣產品供消費者使用；因此這些顯示器的組成結構之各式膜類，比如液晶面板上之偏光板、抗反射膜、光學膜、觸控膜，或可撓式主動 有機顯示發光裝置面板(Flexible AMOLED)上之結構上、下膜、功能膜、封裝膜、保護膜、支撐膜…等，也隨之有更為輕、薄之傾向，以至於這些各式輕、薄之膜類在與其結合片材進行貼合時，更不容易保持、對準、無氣泡與無貼合痕跡之高貼合品質。 With the advancement of flat panel display technology, the new generation of products are designed to be lighter, thinner, flexible or curved. The purpose is to provide more sophisticated electronic and electrical products for consumers to use; Therefore, various types of films of the composition of these displays, such as a polarizing plate, an anti-reflection film, an optical film, a touch film, or a flexible active on a liquid crystal panel The structural upper and lower films, functional films, encapsulating films, protective films, support films, etc. on the organic display panel (Flexible AMOLED) are also lighter and thinner, so that these various types are light and When the thin film is bonded to the bonded sheet, it is less likely to be maintained, aligned, and has a high conforming quality of no bubbles and no conformation marks.
再者，目前於片材進行表面貼膜加工作業之方式，如第六圖所示，會在真空箱A內部具有真空室A0，為於真空室A0內設置有移動式之貼合輪A1，並於真空室A0頂部設置吸料區A2，而位於吸料區A2周圍的無吸料區A3即以黏膠或膠帶等予以密封，藉以防止真空箱A漏氣，且吸料區A2為設置網版吸著平台A21，可供固定待貼合膜片B，再於真空箱A上方設置吸物平台C可吸附片材加工物C1，加工作業進行時，需將真空箱A的真空室A0抽吸呈真空狀態，但因抽真空必須等待較長的時間，且要防止真空箱A的無吸料區A3發生漏氣現象，增加貼膜加工的作業難度、相當耗時費工，且真空室A0中利用貼合輪A1上升頂推網版吸著平台A21，以將置於網版吸著平台A21上之待貼合膜片B貼合在片材加工物C1表面，而一般的待貼合膜片B都相當薄且軟，則當貼合輪A1將網版吸著平台A21及待貼合膜片B往上頂升進行貼合時，也容易將網版吸著平台A21的網痕、予以轉印在待貼合膜片B或片材加工物C1表面，則使片材加工物C1因產生網紋而成為不良品。 Further, in the current surface film processing operation of the sheet, as shown in the sixth drawing, the vacuum chamber A0 is provided inside the vacuum chamber A, and the movable fitting wheel A1 is disposed in the vacuum chamber A0, and The suction zone A2 is disposed at the top of the vacuum chamber A0, and the non-suction zone A3 located around the suction zone A2 is sealed by adhesive or tape to prevent the vacuum box A from leaking, and the suction zone A2 is a set net. The plate suction platform A21 can be used to fix the film B to be bonded, and then the suction platform C can be disposed above the vacuum box A to adsorb the sheet processing material C1. When the processing operation is performed, the vacuum chamber A0 of the vacuum box A needs to be sucked. It is in a vacuum state, but it has to wait for a long time due to vacuuming, and it is necessary to prevent air leakage in the suction-free area A3 of the vacuum box A, which increases the difficulty of processing the film processing, is time-consuming and labor-intensive, and is in the vacuum chamber A0. Lifting the screen absorbing platform A21 by the bonding wheel A1 to adhere the film B to be attached placed on the screen absorbing platform A21 to the surface of the sheet processing product C1, and the general film to be laminated The film B is quite thin and soft, and when the bonding wheel A1 moves the screen plate A21 and the film B to be bonded When the top lift is applied, it is also easy to transfer the screen mark of the screen suction platform A21 to the surface of the film B to be bonded or the surface of the sheet processed material C1, so that the sheet processed material C1 is textured. And become a bad product.
又如第七圖所示，係為另一種真空貼膜加工作業模式，為於真空箱A內部真空室A0的底部設有軟性膠膜A01，則於軟性膠膜A01外部下方設置貼合輪A1，再於真空室A0頂部設置吸料區A2，而位於吸料區A2周圍的無吸料區A3即以黏膠或膠帶等予以密封，藉以防 止真空箱A漏氣，且吸料區A2為設置網版吸著平台A21，可供固定待貼合膜片B，再於真空箱A上方設置吸物平台C可吸附片材加工物C1，如此將貼合輪A1設置在真空箱A外部，可將真空箱A體積減縮、並縮短真空室A0抽真空的作業時間，則於加工作業進行時，貼合輪A1向上抵持軟性膠膜A01以頂推網版吸著平台A21將待貼合膜片B、予以貼合於片材加工物C1表面，但貼合輪A1持續頂推軟性膠膜A01，容易造成軟性膠膜A01的損壞、破裂，則必須經常更換軟性膠膜A01，且仍需注意真空箱A的真空室A0保持真空狀態不可漏氣，也會發生將網版吸著平台A21的網紋轉印至待貼合膜片B或片材加工物C1表面，造成片材加工物C1因產生網紋則成為不良品的情況。 As shown in the seventh figure, it is another vacuum film processing operation mode. In order to provide a soft film A01 at the bottom of the vacuum chamber A0 of the vacuum box A, a bonding wheel A1 is disposed below the soft film A01. The suction zone A2 is further disposed on the top of the vacuum chamber A0, and the non-suction zone A3 located around the suction zone A2 is sealed by adhesive or tape, thereby preventing The vacuum box A is leaking, and the suction area A2 is provided with a screen suction platform A21 for fixing the film B to be bonded, and then the suction platform C is disposed above the vacuum box A to adsorb the sheet processing material C1. The fixing wheel A1 is disposed outside the vacuum box A, the volume of the vacuum box A can be reduced, and the working time of vacuuming the vacuum chamber A0 can be shortened. When the processing operation is performed, the bonding wheel A1 is pressed upward against the soft film A01. The push-pull screen absorbing platform A21 will be attached to the film B and attached to the surface of the sheet processed material C1, but the bonding wheel A1 continues to push the soft adhesive film A01, which easily causes damage and cracking of the soft adhesive film A01. , the soft film A01 must be replaced frequently, and it should be noted that the vacuum chamber A0 of the vacuum box A is kept in a vacuum state and cannot be leaked, and the texture of the screen absorbing platform A21 is transferred to the film to be bonded B. Or the surface of the sheet processed material C1 may cause the sheet processed product C1 to become a defective product due to the occurrence of the texture.
則上述目前所採用之真空網印式貼膜之加工方法，在保持真空箱A內部真空室A0的真空狀態時，必須注意吸料區A2周圍的無吸料區A3的密封完整，以避免發生漏氣現象，而不論貼合輪A1設置在真空箱A的真空室A0內部或外部，都容易造成網版吸著平台A21及軟性膠膜A01的損壞，且發生將網版吸著平台A21的網紋轉印至待貼合膜片B或片材加工物C1表面等，而因片材加工物C1尺寸大小不同時，待貼合膜片B的尺寸也隨之變化，則吸料區A2與無吸料區A3的尺寸也要改變，無吸料區A3即需重新以黏膠或膠帶予以密封，防止真空室A0發生漏氣現象，也導致加工作業的準備工作更加繁瑣、不便，在實際應用實施時所發生的諸多缺失，有待改善。 In the above-mentioned vacuum screen printing film processing method, when the vacuum state of the vacuum chamber A0 inside the vacuum box A is maintained, it is necessary to pay attention to the complete sealing of the non-suction area A3 around the suction area A2 to avoid leakage. The gas phenomenon, regardless of whether the bonding wheel A1 is disposed inside or outside the vacuum chamber A0 of the vacuum box A, is liable to cause damage to the screen absorbing platform A21 and the soft adhesive film A01, and the net of the screen absorbing platform A21 occurs. The texture is transferred to the surface of the film B to be bonded or the surface of the sheet processed material C1, and the size of the film B to be bonded is also changed when the size of the processed material C1 is different, and the suction area A2 is The size of the suction-free zone A3 also needs to be changed. The suction-free zone A3 needs to be re-sealed with adhesive or tape to prevent air leakage in the vacuum chamber A0, which also leads to more complicated and inconvenient preparation work for the machining operation. Many of the shortcomings that occurred during the implementation of the application need to be improved.
是以，如何解決在真空環境中進行片材上貼合薄膜，相當耗時費工之問題與困擾，且容易將網版吸著平台之網紋轉印至貼合膜片或 片材加工物表面，而使片材加工物貼膜後成為不良品之麻煩與不便，即為從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the problem of laminating the film on the sheet in a vacuum environment is quite time-consuming and troublesome, and it is easy to transfer the texture of the screen suction platform to the bonding film or It is troublesome and inconvenient for the sheet to be processed on the surface of the material to make the sheet processed into a defective product, which is the direction for the relevant manufacturers engaged in the industry to research and improve.
故，發明人有鑑於上述之問題與缺失，乃蒐集相關資料，經由多方評估及考量，並以從事於此行業累積之多年經驗，經由不斷試作及修改，始設計出可在一般環境空間中，直接對片材進行貼合薄膜加工，以縮短加工處理時間，且不會在片材或薄膜表面產生網紋，而能提升片材貼膜的產品良率之軟性吸著貼合平台的發明專利誕生。 Therefore, in view of the above-mentioned problems and deficiencies, the inventors have collected relevant information, evaluated and considered through multiple parties, and through years of experience in the industry, through continuous trial and modification, they have been designed to be in a general environmental space. Directly processing the film on the sheet to shorten the processing time, and does not produce a texture on the surface of the sheet or film, and the patent for the invention of the soft absorbing and bonding platform which can improve the product yield of the sheet film is born. .
本發明之主要目的乃在於該貼合平台係於基座設有之軟性靜電吸著平台(ESC)供吸附薄膜，而軟性靜電吸著平台上方設有上吸著平台，並利用吸附平面吸著片材，且於軟性靜電吸著平台下方形成中空狀作業空間，則作業空間下方設有移動機台，以供移動機台之抵持體於作業空間處縱向升降及左右位移，可頂持軟性靜電吸著平台升降將薄膜貼合於片材表面，並透過軟性靜電吸著平台產生之靜電供薄膜順利服貼於片材表面，不需在真空作業環境中即可於片材表面完整貼附薄膜，達到不造成薄膜損壞之目的，可針對各種尺寸片材表面進行全面吸著或部分吸著，不易受限制，並提升貼附薄膜作業之實用性。 The main purpose of the present invention is that the bonding platform is attached to a soft electrostatic adsorption platform (ESC) provided on the base for the adsorption film, and the upper surface of the soft electrostatic adsorption platform is provided with an upper suction platform and is sucked by the adsorption plane. a sheet and a hollow working space formed under the soft electrostatic adsorption platform, wherein a moving machine is arranged below the working space for the vertical movement of the moving body to the working space and the left and right displacement, and the softness can be maintained The electrostatic suction platform lifts and attaches the film to the surface of the sheet, and the static electricity generated by the soft electrostatic adsorption platform allows the film to be smoothly applied to the surface of the sheet, and can be completely attached to the surface of the sheet without being in a vacuum working environment. The film can achieve the purpose of not causing damage to the film, and can be fully or partially absorbed for the surface of various sizes of the sheet, which is not easy to be restricted, and improves the practicality of attaching the film.
本發明之次要目的乃在於該基座係設有鏤空狀之座體，並於座體頂部固設有軟性之靜電吸著平台(Electrostatic Chuck，ESC)，而該軟性靜電吸著平台可為一種包覆在塑膠薄膜內之銅箔線路，在通以經過控制之電流、電壓後可產生靜電吸著力用以來吸附物料的結構體，此結構體係包括位於頂層及底層相對之PI薄膜( Polyimide Film)、位於二PI薄膜相對內側之二黏著膠層及位於二黏著膠層相對內側之銅線路層，以供軟性靜電吸著平台表面可以產生靜電，以供靜電吸著平台表面上之薄膜藉由靜電吸附於片材表面，且該片材係可為鏡子、玻璃基板、液晶面板、觸控面板、壓克力板、不銹鋼板、軟性顯示器(Flexible Display)、有機發光裝置面板(OLED)、聚乙烯(Polyethylene，PE)、聚對苯二甲酸乙二酯(Polyethylene terephthalate，PET或PETE)或聚醯亞胺(Polyimide，PI)等，各種軟式或硬式材質之片材。 The secondary object of the present invention is that the base is provided with a hollow seat body, and a soft electrostatic adsorption platform (ESC) is fixed on the top of the base body, and the soft electrostatic adsorption platform can be A copper foil circuit wrapped in a plastic film, which is capable of generating an electrostatic attraction force after passing through a controlled current and voltage, and the structure includes a PI film on the top and bottom layers ( Polyimide Film), a two-adhesive layer on the opposite side of the two PI film and a copper circuit layer on the opposite side of the two adhesive layer, so that the surface of the soft electrostatic adsorption platform can generate static electricity for electrostatically absorbing the film on the surface of the platform. It is electrostatically adsorbed on the surface of the sheet, and the sheet can be a mirror, a glass substrate, a liquid crystal panel, a touch panel, an acrylic plate, a stainless steel plate, a flexible display, an organic light-emitting device panel (OLED). Polyethylene (PE), polyethylene terephthalate (PET or PETE) or Polyimide (PI), etc., various soft or hard materials.
1‧‧‧基座 1‧‧‧Base
10‧‧‧作業空間 10‧‧‧Workspace
11‧‧‧座體 11‧‧‧
12‧‧‧軟性靜電吸著平台 12‧‧‧Soft electrostatic adsorption platform
121‧‧‧PI薄膜 121‧‧‧PI film
122‧‧‧PI薄膜 122‧‧‧PI film
123‧‧‧黏著膠層 123‧‧‧Adhesive layer
124‧‧‧銅線路層 124‧‧‧ copper circuit layer
125‧‧‧黏著膠層 125‧‧‧Adhesive layer
2‧‧‧上吸著平台 2‧‧‧Sucking platform
21‧‧‧吸附平面 21‧‧‧Adsorption plane
22‧‧‧片材 22‧‧‧Sheet
3‧‧‧移動機台 3‧‧‧Mobile machine
31‧‧‧滑移座體 31‧‧‧Sliding seat
32‧‧‧升降機座 32‧‧‧ Lift base
321‧‧‧伸縮桿體 321‧‧‧ Telescopic rod body
322‧‧‧抵持體 322‧‧‧Resistance
4‧‧‧薄膜 4‧‧‧film
A‧‧‧真空箱 A‧‧‧vacuum box
A0‧‧‧真空室 A0‧‧‧vacuum room
A01‧‧‧軟性膠膜 A01‧‧‧Soft film
A1‧‧‧貼合輪 A1‧‧‧Fitting wheel
A2‧‧‧吸料區 A2‧‧‧ suction area
A21‧‧‧網版吸著平台 A21‧‧‧ Screen sorption platform
A3‧‧‧無吸料區 A3‧‧‧No suction zone
B‧‧‧待貼合膜片 B‧‧‧Finished diaphragm
C‧‧‧吸物平台 C‧‧‧Small platform
C1‧‧‧片材加工物 C1‧‧‧Sheet processing
第一圖 係為本發明之側視圖。 The first figure is a side view of the invention.
第二圖 係為本發明靜電吸著平台之結構分解圖。 The second figure is an exploded view of the structure of the electrostatic sorption platform of the present invention.
第三圖 係為本發明貼膜前之側視圖。 The third figure is a side view of the front of the film of the present invention.
第四圖 係為本發明貼膜時之側視圖。 The fourth figure is a side view of the film of the present invention.
第五圖 係為本發明貼膜後之側視圖。 The fifth drawing is a side view of the film of the present invention.
第六圖 係為習知貼膜機之側視圖。 The sixth figure is a side view of a conventional film laminating machine.
第七圖 係為另一種習知貼膜機之側視圖。 The seventh figure is a side view of another conventional film laminating machine.
為達成上述目的與功效，本發明所採用之技術手段及其構造、實施之方法等，茲繪圖就本發明之較佳實施例詳加說明其特徵與功能如下，俾利完全瞭解。 In order to achieve the above objects and effects, the technical means, the structure, the method of the implementation, and the like, which are used in the present invention, are described in detail in the preferred embodiments of the present invention.
請參閱第一、二、三、四、五圖所示，係分別為本發明之側視圖、靜電吸著平台之結構分解圖、貼膜前之側視圖、貼膜時之側視圖、貼膜後之側視圖，由圖中所示可以清楚看出，本發明之軟性吸著貼合平台係包括基座1、上吸著平台2及移動機台3，其中：該基座1係包括鏤空狀之座體11及固設於座體11頂部之軟性靜電吸著平台12，並於軟性靜電吸著平台12下方形成中空狀之作業空間10。 Please refer to the first, second, third, fourth and fifth figures, which are respectively a side view of the invention, an exploded view of the electrostatic sorption platform, a side view before the film, a side view when the film is applied, and a side after the film is attached. In the view, it can be clearly seen from the figure that the soft absorbing and fitting platform of the present invention comprises a base 1, an upper suction platform 2 and a moving machine table 3, wherein the base 1 comprises a hollow seat. The body 11 and the soft electrostatic adsorption platform 12 fixed to the top of the base 11 form a hollow working space 10 below the soft electrostatic adsorption platform 12.
該上吸著平台2係於底部具有吸附平面21，以利用吸附平面21吸著預設片材22。 The upper suction platform 2 has an adsorption plane 21 at the bottom to suck the predetermined sheet 22 by the adsorption plane 21.
該移動機台3為設有滑移座體31，且於滑移座體31上組裝升降機座32，則供升降機座32於滑移座體31上橫向活動滑行，而升降機座32係可為氣壓缸、液壓缸、電動升降台或複合組合氣壓、液壓、電動等之作動升降平台等各式升降機台，並設有伸縮桿體321，再於伸縮桿體321上設有軟性材質之抵持體322。 The moving machine table 3 is provided with a sliding seat body 31, and the elevator base 32 is assembled on the sliding seat body 31, so that the elevator seat 32 slides laterally on the sliding seat body 31, and the elevator base 32 can be Pneumatic cylinders, hydraulic cylinders, electric lifting platforms or composite air pressure, hydraulic, electric and other operating lifting platforms, etc., and a telescopic rod body 321 is provided, and then a flexible material is placed on the telescopic rod body 321 Body 322.
上述各構件於組裝時，係於基座1的軟性靜電吸著平台12上方設置上吸著平台2，以供上吸著平台2可朝基座1作縱向的升降位移，再於軟性靜電吸著平台12的作業空間10下方設置移動機台3，且可供移動機台3之升降機座32，利用伸縮桿體321帶動抵持體322於作業空間10處進行縱向升降及左右位移，在以升降機座32於滑移座體31上進行橫向的往復位移，則藉由基座1、上吸著平台2及移動機台3組構成本發明之軟性吸著貼合平台。 When assembling the above components, the upper suction platform 2 is disposed above the soft electrostatic adsorption platform 12 of the base 1 so that the upper suction platform 2 can be vertically moved up and down toward the base 1, and then softly electrostatically sucked. The moving machine table 3 is disposed below the working space 10 of the platform 12, and the lifting base 32 of the movable machine table 3 is used to drive the resisting body 322 to vertically move up and down and shift left and right at the working space 10 by using the telescopic rod body 321 The lift base 32 is laterally reciprocally displaced on the slide base 31, and the soft suction attachment platform of the present invention is constituted by the base 1, the upper suction platform 2, and the moving machine 3.
而上述基座1之座體11係呈鏤空狀，則於座體11頂部 設有軟性靜電吸著平台12，且該軟性靜電吸著平台12可為一種包覆在塑膠薄膜內之銅箔線路，在通以經過控制之電流、電壓後可產生靜電吸著力用以來吸附物料的結構體，此結構體係包括位於頂層及底層相對之PI薄膜(Polyimide Film)121、122、位於二PI薄膜121、122相對內側之二黏著膠層123、125及位於二黏著膠層123、125相對內側之銅線路層124，以供軟性靜電吸著平台12可以在外表面產生靜電，即可於軟性靜電吸著平台12表面置放薄膜4，則供薄膜4位於軟性靜電吸著平台12不會扭曲、起皺等，可保持良好的平面度；而軟性靜電吸著平台12的黏著膠層123、125係可為環氧樹脂(Epoxy)或有機矽膠黏著劑(Silicome Adhetive)等黏著膠或接著劑。 The base 11 of the base 1 is hollow, and is on the top of the base 11. The soft electrostatic absorbing platform 12 is provided, and the soft electrostatic absorbing platform 12 can be a copper foil circuit wrapped in a plastic film, and the absorbing material can be generated after the controlled current and voltage are generated to generate electrostatic absorbing force. The structure includes a PI film 121 and 122 opposite to the top and bottom layers, two adhesive layers 123 and 125 on the opposite sides of the two PI films 121 and 122, and two adhesive layers 123 and 125. The inner side of the copper circuit layer 124, so that the soft electrostatic absorbing platform 12 can generate static electricity on the outer surface, that is, the film 4 can be placed on the surface of the soft electrostatic sorption platform 12, and the film 4 is not located on the soft electrostatic absorbing platform 12. Twisting, wrinkling, etc., can maintain good flatness; and the adhesive layer 123, 125 of the soft electrostatic absorbing platform 12 can be an adhesive such as epoxy resin or silicone adhesive or Agent.
且上述之上吸著平台2，係可透過底部之吸附平面21以真空吸引、靜電吸引或吸盤吸引方式等，將預設片材22吸附在吸附平面21處，該預設片材22係可為鏡子、玻璃基板、液晶面板、觸控面板、壓克力板、不銹鋼板、軟性顯示器(Flexible Display)、有機發光裝置面板(OLED)、聚乙烯(Polyethylene，PE)、聚對苯二甲酸乙二酯(Polyethylene terephthalate，PET或PETE)或聚醯亞胺(Polyimide，PI)等，各種軟式或硬式材質之片材22。 The absorbing platform 2 is affixed to the adsorption plane 21 by vacuum suction, electrostatic attraction or suction suction, etc. through the adsorption plane 21 at the bottom. The preset sheet 22 is detachable. For mirrors, glass substrates, liquid crystal panels, touch panels, acrylic sheets, stainless steel sheets, flexible displays, organic light-emitting devices (OLED), polyethylene (PE), polyethylene terephthalate A sheet 22 of various soft or hard materials, such as a polyethylene terephthalate (PET or PETE) or a polyimide (PI).
至於上述移動機台3之滑移座體31、升降機座32之間係可透過凹凸相對之軌道、鳩尾座及鳩尾槽或滑輪及軌道等方式配合，以 供升降機座32可於滑移座體31上進行橫向的往復滑行、位移，而位於升降機座32的伸縮桿體321上之抵持體322，係可為軟性材質之塑膠、橡膠或矽膠等材質所製成之光滑體或輪體。 As for the sliding seat body 31 and the elevator base 32 of the moving machine table 3, the rails, the tailstock seat and the tail groove or the pulley and the rail are matched by the concave and convex opposing rails, etc. The lifting base 32 can be laterally reciprocated and displaced on the sliding base 31, and the resisting body 322 on the telescopic rod body 321 of the lifting base 32 can be made of soft material such as plastic, rubber or silicone. A smooth body or wheel body made.
則於基座1的軟性靜電吸著平台12上置放薄膜4後，並於上吸著平台2的吸附平面21吸附預設片材22，再藉由基座1下方之移動機台3以滑移座體31供升降機座32橫向位移、且對位於軟性靜電吸著平台12表面之薄膜4一側邊下方，即由上吸著平台2帶動預設片材22下降至接近薄膜4上方，再以升降機座32驅動伸縮桿體321帶動抵持體322朝作業空間10上升，並以抵持體322頂持於軟性靜電吸著平台12底部，並將軟性靜電吸著平台12向上頂撐以供位於軟性靜電吸著平台12表面之薄膜4側邊可貼附在預設板材22表面，則以升降機座32沿著滑移座體31往另側滑行，帶動升降機座32之抵持體322沿著軟性靜電吸著平台12底面滑移，同時將軟性靜電吸著平台12表面之薄膜4貼合於預設片材22表面。 After the film 4 is placed on the soft electrostatic adsorption platform 12 of the susceptor 1, the predetermined sheet 22 is adsorbed on the adsorption plane 21 of the upper suction platform 2, and then moved by the moving table 3 below the susceptor 1. The sliding base 31 is laterally displaced by the elevator base 32 and is disposed below the side of the film 4 on the surface of the soft electrostatic adsorption platform 12, that is, the upper tray 22 is driven to lower the preset sheet 22 to the upper side of the film 4. Then, the lifting base 32 drives the telescopic rod body 321 to drive the abutting body 322 to rise toward the working space 10, and is held by the abutting body 322 on the bottom of the soft electrostatic adsorption platform 12, and the soft electrostatic adsorption platform 12 is supported upward. The side of the film 4 on the surface of the soft electrostatic adsorption platform 12 can be attached to the surface of the preset plate 22, and the elevator base 32 slides along the sliding seat body 31 to the other side to drive the abutting body 322 of the elevator base 32. The bottom surface of the soft electrostatic absorbing platform 12 is slid, and the film 4 on the surface of the soft electrostatic absorbing platform 12 is attached to the surface of the predetermined sheet 22.
再者，基座1之軟性靜電吸著平台12因內部具有銅線路層124，可產生靜電，因此在進貼合作業時，不需預設薄膜4的尺寸大小而變化軟性靜電吸著平台12的吸著範圍，也不必改變任何結構的尺寸，不需重新設置真空作業環境、進行抽真空、保持真空不漏氣等繁瑣加工步驟，即可降低製造加工之作業成本，更符合經濟效益，在一般作業環境中即可進行貼膜作業，有效簡化貼膜作業的流程與作業環境，可更為省時省工；且軟性靜電吸著平台12係為軟性多層材質，具有良好的韌性、延展性等，不易破裂、損壞，可延長使用壽命，實用性極佳。 Furthermore, since the soft electrostatic absorbing platform 12 of the susceptor 1 has a copper circuit layer 124 therein, static electricity can be generated. Therefore, when the bonding industry is engaged, the soft electrostatic absorbing platform 12 can be changed without predetermining the size of the film 4. The sorption range does not need to change the size of any structure, and it is not necessary to reset the vacuum working environment, perform vacuuming, keep vacuum and air leakage, and other cumbersome processing steps, thereby reducing the operating cost of manufacturing and processing, and more economical benefits. The filming operation can be carried out in the general working environment, which simplifies the process and working environment of the filming operation, and saves time and labor. The soft electrostatic absorbing platform 12 is a soft multi-layer material with good toughness and ductility. It is not easy to be broken or damaged, it can prolong the service life and has excellent practicability.
是以，以上所述僅為本發明之較佳實施例而已，非因此侷限本發明之專利範圍，本發明軟性吸著貼合平台，係利用基座1的座體11之軟性靜電吸著平台12上方設置上吸著平台2可吸附預設片材22，座體11的軟性靜電吸著平台12下方形成中空狀作業空間10，再於下方設有移動機台3，則可利用移動機台3之滑移座體31供升降機座32橫向滑移，而透過升降機座32之伸縮桿體321頂部抵持體322縱向升降位移，即利用抵持體322頂推軟性靜電吸著平台12，並將軟性靜電吸著平台12上置放之薄膜4向上頂推，使抵持體322頂推軟性靜電吸著平台12將薄膜4貼合於預設片材22表面，俾可達到節省貼膜作業時間之目的，簡化作業流程及環境，且可降低製造成本、提升工作效率之功能，而供貼模作業不受預設薄膜4的尺寸變化影響均可進行等之實用功效，故舉凡可達成前述效果之結構、裝置皆應受本發明所涵蓋，此種簡易修飾及等效結構變化，均應同理包含於本發明之專利範圍內，合予陳明。 Therefore, the above description is only a preferred embodiment of the present invention, and is not limited to the patent scope of the present invention. The soft absorbing and attaching platform of the present invention utilizes a soft electrostatic absorbing platform of the base 11 of the pedestal 1. 12, the upper suction platform 2 is disposed to adsorb the preset sheet 22, the hollow working space 10 is formed under the soft electrostatic adsorption platform 12 of the base 11, and the mobile machine 3 is disposed below, and the mobile machine can be used. The sliding seat body 31 of the sliding block 32 is laterally slidable, and the top end of the telescopic rod body 321 of the lifting base 32 is vertically moved up and down, that is, the soft electrostatic absorbing platform 12 is pushed by the abutting body 322, and The film 4 placed on the soft electrostatic adsorption platform 12 is pushed up, so that the resisting body 322 pushes the soft electrostatic adsorption platform 12 to adhere the film 4 to the surface of the preset sheet 22, so that the filming operation time can be saved. The purpose is to simplify the operation process and the environment, and to reduce the manufacturing cost and improve the work efficiency, and the paste work can be performed without being affected by the size change of the preset film 4, so that the foregoing effects can be achieved. Structure and device Encompassed by the present invention should, such simple modifications and equivalent structures change, it should Similarly included within the scope of the present invention, together to Chen.
故，本發明為主要針對軟性吸著貼合平台進行設計，係利用基座之鏤空狀座體上設軟性置靜電吸著平台，並於軟性靜電吸著平台上置放薄膜、其上方設有上吸著平台以吸附預設片材，再於軟性靜電吸著平台下方中空狀作業空間下方設有移動機台，則移動機台之滑移座體供升降機座橫向位移，可利用升降機座的伸縮桿體頂部抵持體同時頂推軟性靜電吸著平台、薄膜向上貼合於預設片材表面，而可達到簡化貼膜作業流程、降低製造作業成本為主要保護重點，且靜電吸著平台具有多層軟性材質，乃僅使軟性靜電吸著平台具有良好韌性、延展性、不易損壞或破裂且使用壽命長之目的，並可適用任何不同尺寸預設薄膜進行貼膜作業，不需新建 置作業環境，實用性極佳，惟，以上所述僅為本發明之較佳實施例而已，非因此即侷限本發明之專利範圍，故舉凡運用本發明說明書及圖式內容所為之簡易修飾及等效結構變化，均應同理包含於本發明之專利範圍內，合予陳明。 Therefore, the present invention is mainly designed for a soft absorbing and affixing platform, wherein a soft electrostatic absorbing platform is arranged on the vacant seat of the pedestal, and a film is placed on the soft electrostatic absorbing platform, and the upper portion is disposed thereon. The platform is sucked up to adsorb the preset sheet, and then the moving machine is arranged below the hollow working space below the soft electrostatic suction platform, and the sliding seat of the moving machine is laterally displaced by the elevator seat, and the elevator seat can be utilized. The top end of the telescopic rod body simultaneously pushes the soft electrostatic adsorption platform, and the film is attached to the surface of the preset sheet, which can achieve the main protection point of simplifying the filming operation process and reducing the manufacturing operation cost, and the electrostatic adsorption platform has The multi-layer soft material only makes the soft electrostatic adsorption platform have good toughness, ductility, not easy to be damaged or broken and has a long service life, and can be applied to any different size preset film for the filming operation, no need to newly build The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, it is a simple modification of the present invention and the contents of the drawings. Equivalent structural changes shall be included in the scope of the patent of the present invention and shall be combined with Chen Ming.
綜上所述，本發明上述軟性吸著貼合平台於實際執行、實施時，為確實能達到其功效及目的，故本發明誠為一實用性優異之研發，為符合發明專利之申請要件，爰依法提出申請，盼 審委早日賜准本案，以保障發明人之辛苦研發、創設，倘若 鈞局審委有任何稽疑，請不吝來函指示，發明人定當竭力配合，實感德便。 In summary, the soft absorbing and attaching platform of the present invention can achieve its efficacy and purpose in actual implementation and implementation. Therefore, the present invention is an excellent research and development, and is an application for conforming to the invention patent.提出 Submit an application in accordance with the law, and hope that the trial committee will grant this case as soon as possible to protect the inventor's hard work in research and development, and create a report. If there is any doubt in the trial committee, please do not hesitate to give instructions to the inventor, and the inventor will try his best to cooperate.
1‧‧‧基座 1‧‧‧Base
10‧‧‧作業空間 10‧‧‧Workspace
11‧‧‧座體 11‧‧‧
12‧‧‧軟性靜電吸著平台 12‧‧‧Soft electrostatic adsorption platform
2‧‧‧上吸著平台 2‧‧‧Sucking platform
21‧‧‧吸附平面 21‧‧‧Adsorption plane
22‧‧‧片材 22‧‧‧Sheet
3‧‧‧移動機台 3‧‧‧Mobile machine
31‧‧‧滑移座體 31‧‧‧Sliding seat
32‧‧‧升降機座 32‧‧‧ Lift base
321‧‧‧伸縮桿體 321‧‧‧ Telescopic rod body
322‧‧‧抵持體 322‧‧‧Resistance
4‧‧‧薄膜 4‧‧‧film
Claims (5)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105111213A TWI583554B (en) | 2016-04-11 | 2016-04-11 | Soft suction fit platform |
| KR2020170001647U KR20170003628U (en) | 2016-04-11 | 2017-04-03 | Electrostatic chuck system |
| JP2017001551U JP3211002U (en) | 2016-04-11 | 2017-04-07 | Flexible adsorption bonding chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105111213A TWI583554B (en) | 2016-04-11 | 2016-04-11 | Soft suction fit platform |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI583554B true TWI583554B (en) | 2017-05-21 |
| TW201736144A TW201736144A (en) | 2017-10-16 |
Family
ID=59061401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105111213A TWI583554B (en) | 2016-04-11 | 2016-04-11 | Soft suction fit platform |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3211002U (en) |
| KR (1) | KR20170003628U (en) |
| TW (1) | TWI583554B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109264074A (en) * | 2017-07-17 | 2019-01-25 | 阳程科技股份有限公司 | Film sticking apparatus |
| CN109264123A (en) * | 2017-07-17 | 2019-01-25 | 阳程科技股份有限公司 | The holding meanss of plate |
| CN109429438A (en) * | 2017-08-25 | 2019-03-05 | 阳程科技股份有限公司 | The compression method and its pressing device of thin-film display and flexible circuit board |
| CN109774289A (en) * | 2017-11-15 | 2019-05-21 | 南昌欧菲显示科技有限公司 | The manufacturing method and fitting mold of touch-control display component |
| TWI690425B (en) * | 2017-06-13 | 2020-04-11 | 陽程科技股份有限公司 | Film sticking device |
| CN111114084A (en) * | 2020-02-17 | 2020-05-08 | 公安部第一研究所 | Rapid bonding method for multilayer thin film material |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6450430B1 (en) * | 2017-08-28 | 2019-01-09 | 陽程科技股▲ふん▼有限公司 | Film deposition device |
| CN109830617A (en) * | 2019-01-14 | 2019-05-31 | 深圳市华星光电半导体显示技术有限公司 | Abutted equipment |
| KR200494428Y1 (en) * | 2020-03-03 | 2021-10-08 | 우순 테크놀로지 컴퍼니, 리미티드 | Electrostatic chuck system |
| CN112885238B (en) * | 2021-02-03 | 2022-12-23 | 京东方科技集团股份有限公司 | Attaching jig, attaching device and attaching method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101803000A (en) * | 2007-08-02 | 2010-08-11 | 株式会社爱发科 | Method of manufacturing electrostatic chuck mechanism |
| CN104339808A (en) * | 2013-07-26 | 2015-02-11 | 大量科技股份有限公司 | Rolling type film pasting machine |
| TW201515845A (en) * | 2013-10-18 | 2015-05-01 | Debound New Technology Corp | A controlled-direction negative-pressure laminator |
-
2016
- 2016-04-11 TW TW105111213A patent/TWI583554B/en active
-
2017
- 2017-04-03 KR KR2020170001647U patent/KR20170003628U/en not_active Application Discontinuation
- 2017-04-07 JP JP2017001551U patent/JP3211002U/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101803000A (en) * | 2007-08-02 | 2010-08-11 | 株式会社爱发科 | Method of manufacturing electrostatic chuck mechanism |
| CN104339808A (en) * | 2013-07-26 | 2015-02-11 | 大量科技股份有限公司 | Rolling type film pasting machine |
| TW201515845A (en) * | 2013-10-18 | 2015-05-01 | Debound New Technology Corp | A controlled-direction negative-pressure laminator |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI690425B (en) * | 2017-06-13 | 2020-04-11 | 陽程科技股份有限公司 | Film sticking device |
| CN109264074A (en) * | 2017-07-17 | 2019-01-25 | 阳程科技股份有限公司 | Film sticking apparatus |
| CN109264123A (en) * | 2017-07-17 | 2019-01-25 | 阳程科技股份有限公司 | The holding meanss of plate |
| CN109264123B (en) * | 2017-07-17 | 2020-10-27 | 阳程科技股份有限公司 | Holding device for sheet material |
| CN109429438A (en) * | 2017-08-25 | 2019-03-05 | 阳程科技股份有限公司 | The compression method and its pressing device of thin-film display and flexible circuit board |
| CN109429438B (en) * | 2017-08-25 | 2020-08-14 | 阳程科技股份有限公司 | Method and device for laminating thin film display and flexible circuit board |
| CN109774289A (en) * | 2017-11-15 | 2019-05-21 | 南昌欧菲显示科技有限公司 | The manufacturing method and fitting mold of touch-control display component |
| CN111114084A (en) * | 2020-02-17 | 2020-05-08 | 公安部第一研究所 | Rapid bonding method for multilayer thin film material |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201736144A (en) | 2017-10-16 |
| KR20170003628U (en) | 2017-10-19 |
| JP3211002U (en) | 2017-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI583554B (en) | Soft suction fit platform | |
| TWI643754B (en) | Curved surface bonding device and method | |
| CN110014717B (en) | Curved surface laminating device and laminating method thereof | |
| KR101614591B1 (en) | Method and system for manufacturing display panel | |
| KR20200068026A (en) | Curved surface lamination apparatus and method | |
| JP6450430B1 (en) | Film deposition device | |
| KR101996090B1 (en) | Bonding apparatus and bonding method | |
| US20160279917A1 (en) | Vacuum laminating device | |
| KR20150077164A (en) | Lamination Equipment | |
| CN211467771U (en) | Membrane vacuum laminating device and vacuum laminating equipment composed of same | |
| CN112644135A (en) | Vacuum adsorption pad assembly, display laminating device and display laminating method | |
| TWI632982B (en) | Plate retaining device | |
| JP5512259B2 (en) | Method for manufacturing flat display device and attaching device therefor | |
| JP2018069702A (en) | Vacuum lamination device and jig for vacuum lamination device | |
| CN109955471A (en) | A kind of vacuum adhering platform of fexible film | |
| KR102203395B1 (en) | Vacuum laminator | |
| KR101695482B1 (en) | Lamination apparatus for flexible display panel | |
| CN109264123B (en) | Holding device for sheet material | |
| CN206307332U (en) | liquid crystal panel laminator | |
| TWI690425B (en) | Film sticking device | |
| JP2015187648A (en) | Bonding method and bonding device | |
| CN109264074A (en) | Film sticking apparatus | |
| CN1445588A (en) | Working platform structure of binding machine and its control method | |
| KR20130047093A (en) | Apparatus for aligning touch screen panel | |
| TWI601677B (en) | Device capable of adsorbing curved objects and a fitting device using the device |