TW201641407A - Peeling device and peeling method for laminate, and manufacturing method of electronic device - Google Patents

Abstract

To provide a peeling device of laminate. A peeling device of a laminate comprises: a lower side peeling unit which supports a laminate including a substrate; an upper side peeling unit which adsorbs a reinforcement plate of the laminate; a drive unit which deforms the reinforcement plate in a flexural manner by being moved independently with respect to the lower side peeling unit and sequentially peels interfaces; and a connection mechanism which makes the substrate and the reinforcement plate relatively slide in the direction parallel to the interface.

Description

Stripping device and peeling method of laminated body, and manufacturing method of electronic device

The present invention relates to a peeling device and a peeling method for a laminate, and a method for manufacturing the electronic device.

In order to reduce the thickness and weight of an electronic device such as a display panel, a solar cell, or a thin film secondary battery, a thin plate of a substrate such as a glass plate, a resin plate, or a metal plate for the electronic devices is required.

However, when the thickness of the substrate is reduced, the handleability of the substrate is deteriorated, so that it is difficult to form a functional layer for an electronic device on the first surface of the substrate (Thin Film Transistor (TFT), color filter (CF) :Color Filter).

Therefore, a method of manufacturing an electronic device in which a reinforcing plate is attached to the second surface of the substrate to form a laminated body and a functional layer is formed on the first surface of the substrate has been proposed. In this manufacturing method, since the handleability of the substrate is improved, the functional layer can be favorably formed on the first surface of the substrate. Further, after the functional layer is formed, the reinforcing plate is peeled off from the substrate (for example, Patent Document 1, Patent Document 2, and Patent Document 3).

The peeling method of the reinforcing plate disclosed in Patent Documents 1, 2, and 3 is such that the reinforcing plate or the substrate or both of them are made from one end side of the two corner portions on the diagonal line of the rectangular laminated body to the other end side. They are flexed and deformed in the direction of being separated from each other. This flexural deformation is performed by moving at least one of the flexible plates and fixing the other by the support portion, and moving the plurality of movable bodies fixed to the flexible plate independently.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 5155454

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2013-52998

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2014-159337

When the reinforcing plate is peeled off from the substrate, the position of the end portions of the respective members is made uniform by positioning the flexible plate and the support portion before starting the peeling. However, the end portion of the flexible plate and the support portion does not coincide with the bending operation (state) of the flexible plate during the peeling operation.

The inconsistency in the end portions (the phenomenon in which the end portions are staggered) is converted into a load in which the interface between the reinforcing plate and the substrate is to be shifted in parallel with the substrate. As a result, there is a case where the substrate is broken due to the load.

The present invention has been made in view of the above problems, and an object of the invention is to provide a peeling device, a peeling method, and a method for manufacturing an electronic device which are capable of suppressing breakage due to a bent state at the time of peeling.

An aspect of the peeling apparatus for a laminated body according to the present invention is as follows: a laminated body including a first substrate, a second substrate, and an adhesive layer that bonds the first substrate and the second substrate, from the subsequent layer The first substrate is separated from the second substrate, and has a driving portion that flexes and deforms one of the first substrate or the second substrate, and a sliding portion that causes the first substrate and the first substrate The substrate slides in a direction parallel to the first substrate or the second substrate.

The peeling device for a laminated body according to the present invention preferably includes a support portion that supports the first substrate of the laminated body, and an adsorption portion that adsorbs the second substrate of the laminated body by an adsorption surface; and the driving The part is attached to the adsorption unit and the suction The surface on the opposite side of the surface is moved independently of the support portion to flexibly deform the second substrate, and is sequentially peeled off at the interface between the first substrate and the second substrate.

Preferably, the adsorption unit includes a flexible plate.

Preferably, the sliding portion is provided in a connection mechanism that connects the flexible plate to the driving portion.

Preferably, the sliding portion is provided at a connecting portion that connects the support portion and the holding portion that holds the support portion.

An aspect of the method for peeling a laminated body according to the present invention is as follows: a laminated body including a first substrate, a second substrate, and an adhesive layer that bonds the first substrate and the second substrate, from the adhesive layer The first substrate and the second substrate are separated from each other, and the peeling step is performed by flexing and deforming one of the first substrate or the second substrate by a driving portion, and the first substrate and the first substrate are separated by a sliding portion The second substrate is peeled off while sliding in a direction parallel to the first substrate or the second substrate.

The method of manufacturing an electronic device according to the present invention includes a functional layer forming step of providing a laminate including a first substrate, a second substrate, and an adhesive layer that bonds the first substrate and the second substrate. a step of forming a functional layer on the exposed surface of the substrate; and a separating step of separating the second substrate from the first substrate on which the functional layer is formed; and the separating step has a peeling step of causing the first portion by using a driving portion One of the substrate or the second substrate is flexibly deformed, and the first substrate and the second substrate are detached while being slid in a direction parallel to the first substrate or the second substrate by a sliding portion.

According to the peeling device, the peeling method, and the method of manufacturing the electronic device of the laminated body of the present invention, it is possible to suppress breakage due to the bent state at the time of peeling.

1‧‧ ‧ laminated body

1A‧‧‧1st laminate

1B‧‧‧2nd layer body

1C‧‧‧ corner

1D‧‧‧ corner

2‧‧‧Substrate

2A‧‧‧Substrate

2B‧‧‧Substrate

3‧‧‧ reinforcing plate

3A‧‧‧ reinforcing plate

3B‧‧‧ reinforcing plate

4‧‧‧ resin layer

4A‧‧‧ resin layer

4B‧‧‧ resin layer

6‧‧‧Layer

6A, 6B‧‧‧ corner

7‧‧‧ functional layer

8‧‧‧Main seals

10‧‧‧ peeling start production unit

12‧‧‧ platform

14‧‧‧Retainer

16‧‧‧ Height adjustment device

18‧‧‧ Feeding device

20‧‧‧Liquid

22‧‧‧Liquid supply device

24‧‧‧ interface

26‧‧‧ peeling start

28‧‧‧ interface

30‧‧‧ peeling start

40‧‧‧ peeling device

42‧‧‧ peeling unit

44‧‧‧ movable body

46‧‧‧ movable device

48‧‧‧ drive

52‧‧‧Flexible board

54‧‧‧Adsorption Department

56‧‧‧Double-sided adhesive tape

58‧‧‧Flexible board

60‧‧‧ breathable sheet

62‧‧‧ Sealing frame members

64‧‧‧Double-sided adhesive tape

66‧‧‧ slots

68‧‧‧through holes

70‧‧‧ pole

80‧‧‧Linked institutions

82‧‧‧ concave spherical face

84‧‧‧Shell

86‧‧‧Retaining components

88‧‧‧ convex spherical face

90‧‧‧Sliding path

92‧‧‧Restrictions

94‧‧‧ Positioning device

100‧‧‧ peeling device

112‧‧‧Elastic sheet

114‧‧‧ platform

116‧‧‧Elastic sheet

118‧‧‧Flexible board

118A‧‧‧ Body Department

118B, 118C‧‧‧ protruding parts

120‧‧‧ pedestal

122‧‧‧Axis

124‧‧‧ Bearing

126‧‧‧Servo cylinder

126A‧‧‧Cylinder body

126B‧‧‧Piston

128‧‧‧Axis

130‧‧‧ bearing

132‧‧‧Axis

134‧‧‧ bearing

140‧‧ ‧stop

142‧‧ ‧ spring

N‧‧‧ knife

Fig. 1 is an enlarged side elevational view of an essential part showing an example of a laminate which is supplied to a manufacturing step of an electronic device.

Fig. 2 is an enlarged side elevational view showing an essential part of an example of a laminate produced in the middle of the step of manufacturing an LCD.

3(A) to 3(E) are explanatory views showing a method of producing a peeling start portion by the peeling start portion producing device.

Fig. 4 is a plan view showing a laminated body in which a peeling start portion is produced by a peeling start portion producing method.

5(A) and 5(B) are explanatory views showing the configuration and operation of the peeling device of the first embodiment.

6(A) and 6(B) are explanatory views showing the configuration and operation of the peeling device of the first embodiment.

7(A) and 7(B) are explanatory views showing the configuration and operation of the peeling device of the first embodiment.

Fig. 8 is a plan view schematically showing a flexible plate in which a plurality of movable bodies are disposed at positions with respect to a peeling unit.

9(A) to 9(C) are explanatory views showing the configuration of the peeling unit.

Fig. 10 is an enlarged cross-sectional view showing the main part of the state of the connection mechanism before the start of peeling.

Fig. 11 is an enlarged cross-sectional view showing the main part of the state of the joint mechanism after the start of peeling.

Fig. 12 is an enlarged cross-sectional view showing the main part of another state of the joint mechanism after the start of peeling.

Fig. 13 is a plan view showing the peeling device of the second embodiment.

Fig. 14 is a side view of the peeling device of the second embodiment.

15(A) and 15(B) are explanatory views showing the operation of the peeling device of the second embodiment.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. The invention is illustrated by the following preferred embodiments. The embodiment can be modified by a large number of methods without departing from the scope of the invention, and other embodiments than the present embodiment can be utilized. Therefore, all changes within the scope of the invention are included in the scope of the claims.

Here, in the figures, the parts indicated by the same symbols are the same elements having the same function. Further, in the present specification, when "~" is used to indicate a numerical range, the numerical values of the upper limit and the lower limit indicated by "~" are also included in the numerical range.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

Hereinafter, a case where the peeling device and the peeling method of the laminated body of the present invention are used in the manufacturing steps of the electronic device will be described.

The electronic device refers to an electronic component such as a display panel, a solar cell, or a thin film secondary battery. As the display panel, a liquid crystal display (LCD) panel, a plasma display panel (PDP: Plasma Display Panel), and an organic EL display (OELD: Organic Electro Luminescence Display) panel can be exemplified.

[Manufacturing method of electronic device]

In the electronic device, a functional layer for an electronic device (in the case of an LCD, a thin film transistor (TFT) or a color filter (CF)) is formed by a first surface of a substrate made of glass, resin, or metal. Manufacturing.

Before the substrate is formed into a functional layer, the second surface thereof is attached to the reinforcing plate to form a laminated body. Thereafter, a functional layer is formed on the first surface of the substrate in the state of the laminate. Further, after the functional layer is formed, the reinforcing plate is peeled off from the substrate.

That is, the method of manufacturing an electronic device includes a functional layer forming step of forming a functional layer on the first surface of the substrate in a state of the laminated body, and a separating step of separating the reinforcing plate from the substrate on which the functional layer is formed. In the separation step, the laminate of the present invention is applied Body stripping device and peeling method.

[layered body]

Fig. 1 is an enlarged side elevational view showing an essential part of an example of the laminated body 1.

The laminated body 1 includes a substrate 2 on which a functional layer is formed as a first substrate, and a reinforcing plate 3 as a second substrate that reinforces the substrate 2. Further, the reinforcing plate 3 is provided with a resin layer 4 as an adhesive layer on the first surface (surface facing the substrate 2), and the second surface of the substrate 2 is attached to the resin layer 4 (the first surface on which the functional layer is formed) The opposite side). The substrate 2 is bonded to the reinforcing plate 3 in a peelable manner by the resin layer 4 by the van der Waals force acting on the resin layer 4 or the adhesion of the resin layer 4. The reinforcing plate 3 has its second surface (the surface opposite to the first surface facing the substrate 2) supported by a platform (not shown) or the like.

[substrate]

The substrate 2 as the first substrate has a functional layer formed on the first surface (exposed surface). The substrate 2 can be exemplified by a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate. Among the substrates exemplified, the glass substrate is excellent in chemical resistance and moisture permeability resistance, and has a small coefficient of linear expansion, and is suitable as the substrate 2 for an electronic device. Further, the glass substrate also has an advantage that as the coefficient of linear expansion becomes smaller, the pattern of the functional layer formed at a high temperature becomes difficult to be staggered during cooling.

Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high cerium oxide glass, and other oxide-based glass containing cerium oxide as a main component. The oxide-based glass is preferably a glass having a cerium oxide content of 40 to 90% by mass in terms of oxide.

The glass of the glass substrate is preferably selected and used as a glass suitable for the type of electronic device to be manufactured, and a glass suitable for the manufacturing steps thereof. For example, a glass substrate for a liquid crystal panel preferably uses a glass (alkali-free glass) which does not substantially contain an alkali metal component.

The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when the substrate 2 is a glass substrate, the thickness thereof is preferably set by the weight reduction and thinning of the electronic device. The thickness is set to 0.7 mm or less, more preferably set to 0.3 mm or less, and further preferably set to 0.1 mm or less. When the thickness is 0.3 mm or less, the glass substrate can be imparted with good flexibility. Further, when the thickness is 0.1 mm or less, the glass substrate can be wound into a roll shape. Further, from the viewpoint of the production of the glass substrate and the operation of the glass substrate, the thickness thereof is preferably 0.03 mm or more.

In FIG. 1, the substrate 2 is composed of one substrate, but the substrate 2 may be composed of a plurality of substrates. In other words, the substrate 2 can be composed of a laminate in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the substrate 2 is the thickness of the substrate 2.

[reinforcing board]

The reinforcing plate 3 as the second substrate may, for example, be a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, or a semiconductor substrate.

The type of the reinforcing plate 3 is selected depending on the type of electronic device to be manufactured, the type of the substrate 2 used for the electronic device, and the like. When the reinforcing plate 3 and the substrate 2 are made of the same material, it is possible to reduce warpage and peeling which are caused by temperature changes unexpectedly in the functional layer forming step.

The difference (absolute value) between the average linear expansion coefficients of the reinforcing plate 3 and the substrate 2 is appropriately set depending on the size and shape of the substrate 2 and the like. The difference in the average linear expansion coefficient is preferably 35 × 10 ^-7 / ° C or less. Here, the "average linear expansion coefficient" means an average linear expansion coefficient in a temperature range of 50 to 300 ° C (JIS R3102: 1995).

The thickness of the reinforcing plate 3 is set to 0.7 mm or less, and is set according to the type of the reinforcing plate 3, the type and thickness of the substrate 2 to be reinforced, and the like. Further, the reinforcing plate 3 may have a thickness thicker than the substrate 2 or may be thinner than the substrate 2, but is preferably 0.4 mm or more in order to reinforce the substrate 2.

Further, in the present embodiment, the reinforcing plate 3 is composed of one substrate, but the reinforcing plate 3 may be composed of a laminated body in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the reinforcing plate 3 is the thickness of the reinforcing plate 3.

[resin layer]

The resin layer 4 is used to prevent peeling between the resin layer 4 and the reinforcing plate 3, and the resin is used. The bonding force between the layer 4 and the reinforcing plate 3 is set to be higher than the bonding force between the resin layer 4 and the substrate 2. Thereby, in the peeling step, the interface between the resin layer 4 and the substrate 2 is peeled off.

The resin constituting the resin layer 4 is not particularly limited, and examples thereof include an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a polyoxymethylene resin, and a polyimide resin. Several types of resins can also be used in combination. Among them, from the viewpoint of heat resistance or peelability, a polydecene oxide resin or a polyamidene polyimide resin is preferable.

The thickness of the resin layer 4 is not particularly limited, but is preferably 1 to 50 μm, more preferably 4 to 20 μm. When the thickness of the resin layer 4 is 1 μm or more, when bubbles or foreign matters are mixed between the resin layer 4 and the substrate 2, the thickness of the bubbles or foreign matter can be absorbed by the deformation of the resin layer 4. On the other hand, by setting the thickness of the resin layer 4 to 50 μm or less, the formation time of the resin layer 4 can be shortened, and since the resin of the resin layer 4 is not required to be used, it is economical.

Further, the resin layer 4 is shaped such that the reinforcing plate 3 can support the entirety of the resin layer 4, and preferably has the same shape as the reinforcing plate 3 or is smaller than the reinforcing plate 3. Further, the resin layer 4 is shaped such that the resin layer 4 can be in close contact with the entire substrate 2, and is preferably the same as the outer shape of the substrate 2 or larger than the outer shape of the substrate 2.

Further, in FIG. 1, the resin layer 4 is composed of one layer, and the resin layer 4 may be composed of two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 becomes the thickness of the resin layer 4. Moreover, in this case, the kind of the resin which comprises each layer may differ.

Further, in the embodiment, the resin layer 4 of the organic film is used as the adhesive layer, and an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer contains, for example, at least one selected from the group consisting of metal halides, nitrides, carbides, and carbonitrides.

The metal halide includes, for example, at least one selected from the group consisting of W, Fe, Mn, Mg, Mo, Cr, Ru, Re, Co, Ni, Ta, Ti, Zr, and Ba, preferably Tungsten telluride.

The nitride, for example, comprises selected from the group consisting of Si, Hf, Zr, Ta, Ti, Nb, Na, Co, At least one of the group consisting of Al, Zn, Pb, Mg, Sn, In, B, Cr, Mo, and Ba is preferably aluminum nitride, titanium nitride, or tantalum nitride.

The carbide includes, for example, at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, and preferably ruthenium carbide.

The carbonitrides include, for example, at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, and preferably hafnium carbonitride.

Regarding metal tellurides, nitrides, carbides, and carbonitrides, the difference in the electrical and electrical properties between Si, N, or C contained in the material and other elements contained in the material is small, and the polarization is relatively small. small. Therefore, the reactivity of the inorganic film with water is low, and it is difficult to generate a hydroxyl group on the surface of the inorganic film. Therefore, when the substrate 2 is a glass substrate, the mold release property of the inorganic film and the substrate 2 can be favorably maintained.

Further, the laminated body 1 of Fig. 1 includes the resin layer 4 as an adhesive layer. However, the resin layer 4 may be provided without the resin layer 4 and may include the substrate 2 and the reinforcing plate 3. In this case, the substrate 2 and the reinforcing plate 3 are detachably bonded to each other by the van der Waals force acting between the substrate 2 and the reinforcing plate 3. Further, in this case, in the case where the substrate 2 and the reinforcing plate 3 are glass substrates, it is preferable that the substrate 2 and the reinforcing plate 3 are not attached to each other at a high temperature to form an inorganic layer on the first surface of the reinforcing plate 3. film.

[Forming a laminated body with a functional layer]

The functional layer is formed on the first surface of the substrate 2 of the laminated body 1 by the functional layer forming step. As a method of forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method or a PVD (Physical Vapor Deposition) method or a sputtering method is used. The functional layer is formed into a specific pattern by photolithography and etching.

Fig. 2 is an enlarged side elevational view showing an essential part of an example of the laminated body 6 produced in the middle of the manufacturing process of the LCD.

The laminated body 6 is a layered reinforcing plate 3A, a resin layer 4A, a substrate 2A, and a functional layer 7, The substrate 2B, the resin layer 4B, and the reinforcing plate 3B are formed. The reinforcing plate 3A is detachably bonded to the substrate 2A via the resin layer 4A, and the reinforcing plate 3B is detachably bonded to the substrate 2B via the resin layer 4B. In other words, the laminated body 6 of Fig. 2 corresponds to a laminated body in which the laminated body 1 shown in Fig. 1 is symmetrically arranged with the functional layer 7 interposed therebetween. Hereinafter, the laminated body composed of the substrate 2A, the resin layer 4A, and the reinforcing plate 3A is referred to as a first laminated body 1A, and the laminated body composed of the substrate 2B, the resin layer 4B, and the reinforcing plate 3B is referred to as a second laminated body. 1B.

A thin film transistor (TFT) as the functional layer 7 is formed on the first surface of the substrate 2A of the first layered body 1A. A color filter (CF) as the functional layer 7 is formed on the first surface of the substrate 2B of the second layered body 1B.

The first layered body 1A and the second layered body 1B are integrated so that the first surface of the substrate 2A and the substrate 2B overlap each other. In this way, the laminated body 6 having the structure in which the functional layer 7 is interposed and the first laminated body 1A and the second laminated body 1B are symmetrically arranged is manufactured.

In the laminated body 6, the reinforcing plates 3A and 3B are peeled off in the peeling step, and thereafter, a polarizing plate, a backlight, or the like is attached to manufacture an LCD as a product.

In addition, the laminated body 6 of FIG. 2 has a structure in which the reinforcing plates 3A and 3B are disposed on both the front and back surfaces, and the laminated body may have a configuration in which a reinforcing plate is disposed only on one side.

[Peeling start part making device]

3(A) to 3(E) are explanatory views showing the configuration of the peeling start portion creating device 10 used in the peeling start portion producing step, and Fig. 3(A) shows the positional relationship between the laminated body 6 and the blade N. 3(B) is an explanatory view in which the peeling start portion 26 is formed by the knife N at the interface 24, and FIG. 3(C) is an explanatory view showing a state immediately before the peeling start portion 30 is formed at the interface 28, and FIG. (D) is an explanatory view in which the peeling start portion 30 is formed by the blade N at the interface 28, and FIG. 3(E) is an explanatory view in which the laminated body 6 of the peeling start portions 26 and 30 is produced. In addition, FIG. 4 is a plan view of the laminated body 6 in which the peeling start portions 26 and 30 are formed.

When the peeling start portions 26 and 30 are produced, as shown in FIG. 3(A), the second layer of the reinforcing plate 3B is adsorbed and held by the stage 12 and supported horizontally (in the X-axis direction in the drawing).

The blade N is horizontally supported by the holder 14 in such a manner that the end faces of the corner portions 6A on one end side of the laminated body 6 face each other. Further, the knife N is adjusted in the height direction (the Z-axis direction in the drawing) by the height adjusting device 16. Further, the blade N and the laminated body 6 are relatively moved in the horizontal direction by the feeding device 18 such as a ball screw device. Regarding the feeding device 18, at least one of the blade N and the stage 12 may be moved in the horizontal direction, and in the embodiment, the blade N is moved. Further, the liquid supply device 22 that supplies the liquid 20 is disposed above the blade N before the piercing or the upper surface of the blade N that is pierced.

[How to make peeling start unit]

In the method of producing the peeling start portion by the peeling start portion forming apparatus 10, the piercing position of the blade N is set to the corner portion 6A of the laminated body 6, that is, the position where the laminated body 6 is overlapped in the thickness direction, and the knife N is set. The amount of penetration is set in such a manner that the interfaces 24 and 28 are different.

The order in which they are made will be explained.

In the initial state, the blade edge of the blade N is present at a position shifted from the interface 24 between the substrate 2B and the resin layer 4B as the first piercing position in the height direction (Z-axis direction). Therefore, first, as shown in Fig. 3(A), the blade N is moved in the height direction, and the height of the blade edge of the blade N is set to the height of the interface 24.

Thereafter, as shown in Fig. 3(B), the blade N is horizontally moved toward the corner portion 6A of the laminated body 6, and the blade N is pierced by a specific amount at the interface 24. Further, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the blade N at the time of piercing of the blade N or before piercing. Thereby, the substrate 2B of the corner portion 6A is peeled off from the resin layer 4B, and thus the peeling start portion 26 having a triangular shape in plan view is formed at the interface 24 as shown in FIG. Further, the supply of the liquid 20 is not essential. When the liquid 20 is used, the liquid 20 remains in the peeling start portion 26 after the blade N is removed, so that the peeling start portion 26 that cannot be attached again can be obtained.

Further, instead of the liquid 20, a protruding portion or the like is provided in the blade N, and the resin layer 4B is cut, whereby the peeling start portion 26 that cannot be attached again can be produced.

Then, the blade N is pulled out from the corner portion 6A in the horizontal direction, and as shown in Fig. 3(C), the blade edge of the blade N is set to the height of the interface 28 between the substrate 2A and the resin layer 4A as the second piercing position.

Thereafter, as shown in Fig. 3(D), the knife N is horizontally moved toward the laminated body 6, and the knife N is pierced by a specific amount at the interface 28. Similarly, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the blade N. Thereby, as shown in FIG. 3(D), the peeling start part 30 is produced in the interface 28. Here, the amount of penetration of the knife N with respect to the interface 24 is set to be smaller than the amount of penetration with respect to the interface 28. The above is the production method of the peeling start unit. Further, the amount of penetration of the knife N with respect to the interface 28 may be set to be smaller than the amount of penetration with respect to the interface 24.

The layered body 6 on which the peeling start portions 26 and 30 are formed is taken out from the peeling start portion forming apparatus 10, and conveyed to a peeling device which is sequentially peeled off at the interfaces 24 and 28 by the peeling device.

The details of the peeling method will be described later, as shown by the arrow A in Fig. 4, by bending the laminated body 6 from the corner portion 6A of one side to the corner portion 6B facing the other side of the corner portion 6A. At the interface 28 where the area of the peeling start portion 30 is large, the peeling start portion 30 is first peeled off as a starting point. Thereby, the reinforcing plate 3A is peeled off. Then, the laminated body 6 is bent again from the corner portion 6A toward the corner portion 6B, and the peeling start portion 26 is peeled off from the interface 24 having a small area of the peeling start portion 26 as a starting point. Thereby, the reinforcing plate 3B is peeled off.

Further, the amount of penetration of the knife N is preferably set to 7 mm or more, and more preferably set to about 15 to 20 mm, depending on the size of the laminated body 6.

Hereinafter, the peeling device of the present embodiment will be described.

[Peeling device of the first embodiment]

5 to 7 are explanatory views (longitudinal cross-sectional views) showing the configuration and operation of the peeling device 40 of the first embodiment, and FIG. 8 is a view schematically showing a plurality of movable bodies 44 of the peeling device 40 with respect to the peeling unit 42. A top view of the stripping unit 42 at the location. 5 to 7 correspond to a cross-sectional view taken along line C-C of Fig. 8, and further, the laminated body 6 is indicated by a solid line in Fig. 8.

As shown in FIG. 5(A), the peeling device 40 is provided with a pair of movable devices 46 and 46 arranged up and down with the laminated body 6 interposed therebetween. Since the movable devices 46 and 46 have the same configuration, the movable device 46 disposed on the upper side of FIG. 5(A) will be described here, and the same reference numerals will be given to the movable device 46 disposed on the lower side, and the description thereof will be omitted.

The movable device 46 includes a plurality of movable bodies 44, a plurality of driving devices 48 as driving portions for moving up and down the movable body 44 for each of the plurality of movable bodies 44, and controlling the driving device 48 for each of the driving devices 48. Controller (not shown). Further, the movable device 46 will be described later.

Since the peeling unit 42 as the adsorption unit flexes and deforms the reinforcing plate 3A in this order, the reinforcing plate 3A is vacuum-sucked and held. Furthermore, instead of vacuum adsorption, electrostatic adsorption, magnetic adsorption or adhesion adsorption can also be performed.

[Peeling unit]

Fig. 9(A) is a plan view of the peeling unit 42, and Fig. 9(B) is an enlarged longitudinal cross-sectional view of the peeling unit 42 taken along the line D-D of Fig. 9(A). In addition, FIG. 9(C) shows a peeling unit 42 that is provided with a rectangular plate-shaped flexible plate 52 that constitutes the peeling unit 42 and that is provided with the adsorption unit 54 that constitutes the peeling unit 42 so as to be detachably attached to the double-sided adhesive tape 56. Enlarged longitudinal section view.

As described above, the peeling unit 42 is configured by attaching the adsorption portion 54 to the flexible plate 52 via the double-sided tape and then attaching and detaching the tape 56.

The adsorption unit 54 includes a flexible plate 58 having a thickness thinner than the flexible plate 52. The upper surface of the flexible plate 58 is detachably attached to the lower surface of the flexible plate 52 via a double-sided adhesive tape 56. The upper surface means a surface opposite to the side facing the reinforcing plate 3A side, and the lower surface means a surface facing the side of the reinforcing plate 3A.

Further, the adsorption unit 54 includes a rectangular gas permeable sheet 60 constituting an adsorption surface for holding and holding the inner surface of the reinforcing plate 3A of the laminated body 6. The thickness of the gas permeable sheet 60 is 2 mm or less, preferably 1 mm or less, in order to reduce the tensile stress generated in the reinforcing sheet 3A at the time of peeling, and a tensile stress of 0.5 mm is used in the embodiment.

Further, the adsorption unit 54 is provided with a seal frame member 62 that surrounds the gas permeable sheet 60 and abuts against the outer peripheral surface of the reinforcing plate 3A. The sealing frame member 62 is interposed with the gas permeable sheet 60 and the adhesive tape 64 is then attached to the lower surface of the flexible sheet 58. Further, the sealing frame member 62 is a sponge of independent bubbles having a Shore E hardness of 20 degrees or more and 50 degrees or less, and the thickness thereof is configured to be 0.3 mm to 0.5 mm thick with respect to the thickness of the gas permeable sheet 60.

A frame-shaped groove 66 is provided between the gas permeable sheet 60 and the sealing frame member 62. Further, a plurality of through holes 68 are opened in the flexible plate 52, and one end of the through holes 68 communicates with the groove 66, and the other end is connected to an intake source (for example, a vacuum pump) via a suction line (not shown).

Therefore, when the suction source is driven, the inner surface of the reinforcing plate 3A of the laminated body 6 is vacuum-sucked and held by the gas permeable sheet 60 by suctioning the suction duct, the through hole 68, and the air of the groove 66. The outer peripheral surface of the reinforcing plate 3A is pressed against the sealing frame member 62. Thereby, the airtightness of the adsorption space surrounded by the seal frame member 62 is improved.

Since the flexible plate 52 has higher bending rigidity than the flexible plate 58, the gas permeable sheet 60, and the sealing frame member 62, the bending rigidity of the flexible plate 52 controls the bending rigidity of the peeling unit 42. The bending rigidity per unit width (1 mm) of the peeling unit 42 is preferably 1000 to 40,000 N. Mm ² /mm. For example, in the portion where the stripping unit 42 has a width of 100 mm, the bending rigidity becomes 100000 to 4000000 N. Mm ² . By setting the bending rigidity of the peeling unit 42 to 1000N. When mm ² /mm or more, the bending of the reinforcing plate 3A held by the peeling unit 42 can be prevented. Moreover, by setting the bending rigidity of the peeling unit 42 to 40,000 N. When it is mm ² /mm or less, the reinforcing plate 3A which is adsorbed and held by the peeling unit 42 can be flexibly deformed moderately.

The flexible sheets 52 and 58 are resin members having a Young's modulus of 10 GPa or less, such as polycarbonate resin, polyvinyl chloride (PVC) resin, acrylic resin, polyacetal (POM) resin. A resin member.

[movable device]

On the upper surface of the peeling unit 42, a plurality of disk-shaped movable bodies 44 shown in Fig. 5(A) are fixed in a checkerboard shape as shown in Fig. 8 . The movable bodies 44 are solidified by fastening members such as bolts. Set at the stripping unit 42. Furthermore, it can be fixed instead of a bolt. The movable bodies 44 are independently moved up and down by a driving device 48 that is driven and controlled by a controller (not shown).

In other words, the controller controls the driving device 48 to sequentially move the movable body 44 from the side of the corner portion 6A of the laminated body 6 in Fig. 4 to the movable body 44 on the side of the corner portion 6B of the peeling traveling direction indicated by the arrow A. Rise and move. By this operation, as shown in FIGS. 5 to 7, the peeling start portion 30 (see FIG. 4) is gradually peeled off from the interface 28 of the laminated body 6 as a starting point. Further, the laminated body 6 shown in Figs. 5 to 7 is formed by laminating the starting portions 26 and 30 by the peeling start portion forming method described in Fig. 3 . Further, the laminated body 6 includes a main seal 8 formed around the functional layer 7 and sealing the functional layer 7.

The drive device 48 includes, for example, a rotary servo motor, a ball screw mechanism, and the like. The rotary motion of the servo motor is converted into a linear motion in the ball screw mechanism and transmitted to the rod 70 of the ball screw mechanism.

As shown in FIG. 5, a plurality of movable bodies 44 are respectively coupled to the corresponding rods 70 via corresponding coupling mechanisms 80. The plurality of movable bodies 44 are movable in the axial direction of the rod 70 together with the rods 70 coupled to the respective ones, and are detachably separated from each other with respect to the peeling unit 42. The reinforcing plates 3A and 3B are flexibly deformed by moving the plurality of movable bodies 44 with respect to the peeling unit 42. By driving a plurality of driving devices 48 as driving portions of the movable device 46, the peeling unit 42 can be moved up and down, and one of the reinforcing plates 3A and 3B can be flexibly deformed.

Further, the drive device 48 is not limited to the rotary servo motor and the ball screw mechanism, and may be a linear servo motor or a hydraulic cylinder (for example, a pneumatic cylinder).

The controller is configured as a computer including a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). The controller controls a plurality of driving devices 48 for each of the driving devices 48 by causing the CPU to execute a program recorded on the recording medium, thereby controlling the lifting movement of the plurality of movable bodies 44.

[link institution]

As shown in Fig. 10, the coupling mechanism 80 according to the embodiment includes a concave spherical portion 82 coupled to the rod 70, a casing 84 coupled to the movable body 44, and a housing movably housed inside the casing 84 and holding the concave spherical portion. The retaining member 86 of 82. The holding member 86 includes a convex spherical surface portion 88 that slidably contacts the concave spherical surface portion 82, and a restricting portion 92 for forming a sliding path 90 of the concave spherical surface portion 82 with the convex spherical surface portion 88.

As shown in FIG. 10, the size of the internal space of the casing 84 is formed larger in the left-right direction of the holding member 86 than the size of the holding member 86. The holding member 86 can move the inside of the casing 84 in the left-right direction so as to be slidable (so-called lateral sliding). Therefore, it is possible to release the load on the substrate 2A caused by the staggering phenomenon in the direction parallel to the interface which occurs when the peeling unit 42 is flexibly deformed. In the present embodiment, the connection mechanism 80 functions as a sliding portion.

Further, the concave spherical portion 82 and the convex spherical portion 88 are positioned by the restricting portion 92 so as not to be spaced apart. Since the concave spherical surface portion 82 and the convex spherical surface portion 88 are slidably positioned, the movable body 44 can be tilted following the flexural deformation of the peeling unit 42.

Next, a peeling method using the reinforcing plates 3A and 3B of the peeling device 40 will be described with reference to Figs. 5 to 7 .

As shown in FIG. 5(A), the lower peeling unit 42 and the upper peeling unit 42 are relatively moved in advance to a position sufficiently retracted. The laminated body 6 is placed on the lower peeling unit 42 by a conveying device (not shown). The reinforcing plate 3B of the laminated body 6 is vacuum-adsorbed by the peeling unit 42 on the lower side. The lower peeling unit 42 functions as a support portion for supporting the substrate 2A as the first substrate. In the embodiment, the substrate 2A is indirectly supported by the lower peeling unit 42.

As shown in FIG. 5(A), the positioning means 94 disposed in the opposite direction is disposed on both sides of the lower peeling unit 42. The position of the lower peeling unit 42 is set to a specific position by the positioning device 94. Similarly, the positioning device 94 disposed in the opposite direction is disposed on both sides of the upper peeling unit 42. By positioning device 94, the position of the upper peeling unit 42 is set to a specific position. Set. The relative positional relationship between the upper peeling unit 42 and the lower peeling unit 42 is determined by the positioning of the positioning device 94. As the positioning device 94, for example, a cylinder that can control the positioning lever forward and backward, a servo motor, or the like can be used.

As shown in Fig. 5(B), the lower peeling unit 42 and the upper peeling unit 42 move in the relatively close direction, and the reinforcing plate 3A of the laminated body 6 is vacuum-sucked by the upper peeling unit 42. The reinforcing plate 3A as the second substrate is adsorbed by a gas permeable sheet (see FIG. 9) constituting the adsorption surface of the peeling unit 42 on the upper side of the adsorption portion.

In the case where the substrate 2 of the laminated body 1 shown in FIG. 1 is peeled off from the reinforcing plate 3 by the peeling device 40, the substrate 2 as the first substrate is supported by the upper peeling unit 42 (support step). The reinforcing plate 3 as the second substrate is adsorbed and held by the lower peeling unit 42 (adsorption step). In this case, the support portion of the support substrate 2 is not limited to the peeling unit 42, and the substrate 2 may be detachably supported. However, by using the peeling unit 42 as the support portion, the substrate 2 and the reinforcing plate 3 can be simultaneously bent and peeled off, and thus the form in which the substrate 2 or the reinforcing plate 3 is bent only has an advantage that the peeling force can be reduced. The substrate 2 as the first substrate can be supported by the lower peeling unit 42 (support step), and the reinforcing plate 3 as the second substrate can be adsorbed and held by the upper peeling unit 42 (adsorption step).

As shown in FIG. 5(B), the positioning device 94 can move in accordance with the ascending and descending of the peeling unit 42, and the positioning device 94 can be fixed in advance at a position where the peeling unit 42 is in contact with the laminated body 6.

Then, as shown in FIG. 6(A), the upper positioning device 94 is moved in the direction away from the upper peeling unit 42, and the lower positioning device 94 is moved in the direction away from the lower positioning device 94. As shown in FIG. 6(A), for example, the positioning lever is retracted in a direction away from the peeling unit 42. Thereby, preparation for peeling off the reinforcing plate 3A is completed. As shown by the two-dot chain line in the figure, the end portions of the upper peeling unit 42 and the lower peeling unit 42 coincide with each other when viewed from the side direction.

Then, as shown in FIG. 6(B), the upper side peeling unit 42 is bent and deformed upward from the corner portion 6A on one end side of the laminated body 6 toward the corner portion 6B on the other end side, and is on the interface of the laminated body 6. The reinforcing plate 3A (including the resin layer 4A) is peeled off from the peeling start portion 30 (see FIG. 4). In other words, in the plurality of movable bodies 44 of the upper peeling unit 42, the movable body 44 located on the side of the corner portion 6A of the laminated body 6 and the movable body 44 located on the side of the corner portion 6B are sequentially moved upward and peeled off at the interface. (Peeling step). Further, in conjunction with the operation, the movable body 44 located on the side of the corner portion 6A of the laminated body 6 to the movable body 44 located on the side of the corner portion 6B may be provided in the plurality of movable bodies 44 of the lower peeling unit 42. The movement is sequentially decreased and the interface is peeled off. Thereby, the peeling force can be reduced as compared with the form in which only the reinforcing plate 3A is bent.

As shown in Fig. 6(B), when the movable body 44 located on the side of the corner portion 6A is moved upward, the end portion of the peeling unit 42 on the upper side and the end portion of the peeling unit 42 on the lower side are inconsistent (staggered) when viewed from the side surface direction. )S. The reason for this inconsistency is that when the movable body 44 located on the side of the corner portion 6A (the right side in the drawing) of the laminated body 6 is moved upward, the remaining movable body 44 is not moved upward and stays at the position before peeling. On the side of the corner portion 6B (the left side in the drawing), no difference occurs in the end portions of the peeling unit 42 on the upper side and the lower side. When the end portions are not coincident at the corner portion 6A side, the coupling mechanism 80 of the present embodiment relatively slid the reinforcing plate 3A and the substrate 2A in a direction parallel to the interface or in a direction parallel to the reinforcing plate 3A or the substrate 2A. This action will be described with reference to Figs. 11 and 12 .

Fig. 11 is an enlarged view of a main portion of the joint mechanism 80 on the right side of the upper side in Fig. 6(B). As shown in Fig. 11, the connection mechanism 80 is inconsistent with respect to the end portions, and as shown by an arrow E (left direction), the reinforcing plate 3A is slid in a direction opposite to the direction in which the end portions are aligned, that is, in a direction in which the end portions are not aligned. In the present embodiment, the driving device 48, the rod 70, the concave spherical portion 82, and the holding member 86 maintain the position before peeling in the left-right direction in the drawing. On the other hand, the reinforcing plate 3A, the peeling unit 42, the movable body 44, and the casing 84 connected to the movable body 44 as a whole move in the direction of the arrow E. That is, compared to FIG. 10, in FIG. 11, the housing 84 is moved to the left side until it is in contact with the holding member 86.

Fig. 12 is an enlarged view of a main part of the joint mechanism 80 at the center of the upper side in Fig. 6(B). As shown in Fig. 12, since the concave spherical portion 82 and the convex spherical portion 88 of the coupling mechanism 80 are slidably positioned, the movable body 44 can be tilted following the flexural deformation of the peeling unit 42. Further, similarly to Fig. 11, the reinforcing plate 3A, the peeling unit 42, the movable body 44, and the casing 84 connected to the movable body 44 are movable in the direction of the arrow F as a whole. That is, the reinforcing plate 3A is slid in the direction of the arrow F.

As shown in FIG. 11 and FIG. 12, by the sliding function of the connection mechanism 80, the reinforcing plate 3A is slid in parallel with the interface in at least a part of the substrate 2A and the reinforcing plate 3A. The load on the substrate 2A due to the staggering can be released. Here, at least a part means that, as shown in FIG. 6(B), not all of the three connection mechanisms 80 shown here function as a sliding function, that is, in FIG. 6(B), the connection mechanism 80 on the left side is the same as that before peeling. The state does not exert the sliding function, and the right and center connection mechanism 80 assumes the sliding function.

Then, as shown in FIG. 7(A), the peeling unit 42 is flexibly deformed so that the peeling unit 42 is peeled off from the one end side to the other end side in the interface between the substrate 2A and the reinforcing plate 3A, and the substrate 2A is reinforced. The plate 3A was completely peeled off. As shown in Fig. 7(A), the peeling reinforcing plate 3A is vacuum-sucked by the upper peeling unit 42, and the laminated body 6 other than the reinforcing plate 3A is vacuum-sucked and held by the lower peeling unit 42.

Further, the lower peeling unit 42 and the upper peeling unit 42 are relatively moved to a position sufficiently retracted between the upper and lower peeling units 42 so as to be inserted into a conveying device (not shown).

As shown in the figure, in the state where the substrate 2A and the reinforcing plate 3A are completely peeled off, the upper peeling unit 42 and the lower peeling unit 42 do not coincide with each other on the right side and the left side. Therefore, in all the connection mechanisms 80, the reinforcing plate 3A, the peeling unit 42, the movable body 44, and the casing 84 are moved so that the reinforcing plate 3A is slid in the left direction in accordance with the displacement of the reinforcing plate 3A and the reinforcing plate 3A. To the left. That is, all the connection mechanisms 80 of FIG. 7(A) are as shown in FIG. State.

Then, as shown in FIG. 7(B), the upper positioning device 94 and the lower positioning device 94 are operated, and the positions of the upper peeling unit 42 and the lower peeling unit 42 are adjusted, and the position of the end portion is adjusted. Consistent.

Thereafter, first, the vacuum adsorption of the upper peeling unit 42 is released. Then, the reinforcing plate 3A is carried out from the peeling device 40 by a conveying device (not shown).

The laminated body 6 other than the reinforcing plate 3A is vacuum-sucked and held by the upper peeling unit 42 and the lower peeling unit 42. That is, the upper peeling unit 42 and the lower peeling unit 42 move in the relatively close direction, and the upper peeling unit 42 vacuum-sucks and holds the substrate 2A (support step).

Then, the peeling unit 42 of the lower side is bent and deformed downward from the one end side of the laminated body 6 toward the other end side, and the reinforcing plate is formed at the interface of the laminated body 6 with the peeling start portion 26 (see FIG. 4) as a starting point. 3B (including the resin layer 4B) was peeled off. In other words, in the plurality of movable bodies 44 of the lower peeling unit 42, the movable body 44 located on one end side of the laminated body 6 and the movable body 44 located on the other end side are sequentially moved downward to peel off the interface (peeling step) ). Further, in conjunction with the operation, the movable body 44 located on one end side of the laminated body 6 and the movable body 44 located on the other end side may be sequentially moved up and moved in the plurality of movable bodies 44 of the upper peeling unit 42. And the interface is peeled off. Thereby, the peeling force can be reduced as compared with the form in which only the reinforcing plate 3B is bent.

When the reinforcing plate 3B is peeled off from the laminated body 6, similarly to the reinforcing plate 3A being peeled off from the laminated body 6, the sliding function of the connecting mechanism 80 is shifted with respect to the substrate 2B and the reinforcing plate 3B, and at least a part of the reinforcing plate 3B is reinforced. The plate 3B slides in a direction parallel to the interface, whereby the load on the substrate 2B due to the staggering can be released. The above is a method of peeling off the laminated body 6 of the peeling start portions 26 and 30 at the corner portion 6A.

In the embodiment, the reinforcing plate 3A is peeled off, and then the method of peeling the reinforcing plate 3B is described. However, the reinforcing plate 3B may be peeled off, and then the reinforcing plate 3A may be peeled off.

Further, a method of sequentially bending the reinforcing plates 3A and 3B by sequentially bending the peeling unit 42 will be described. However, the peeling method of the laminated body 6 is not limited to this, and instead of the peeling unit 42, the adsorption pad may be used instead of the movable body 44. When the adsorption pad is used, the reinforcing plates 3A and 3B can be directly adsorbed by the adsorption pad, and the adsorption pad can be sequentially raised or lowered from the one end side to the other end side, whereby the reinforcing plates 3A and 3B are sequentially bent.

[Separation device of the second embodiment]

Fig. 13 is a plan view showing an example of the peeling device 100 of the second embodiment. Further, Fig. 14 is a side view of the peeling device 100 shown in Fig. 13.

Here, a case where the laminated body 1 shown in FIG. 1 , in particular, the laminated body 1 having a square outer shape is peeled off will be described. In addition, the layered body 1 shown in FIG. 14 is formed by, for example, a peeling start portion in the corner portion 1C by the peeling start portion forming apparatus 10 shown in FIG.

The peeling device 100 is a device that deflects the reinforcing plate 3 with respect to the substrate 2 and peels the reinforcing plate 3 (including the resin layer 4) from the substrate 2. At this time, the reinforcing portion 3 is gradually flexed and deformed by the corner portion 1C on one end side of the laminated body 1 toward the corner portion 1D on the other end side of the diagonal line, and the reinforcing plate 3 is self-contained from the substrate 2 with the peeling start portion as a starting point. Stripped. Therefore, the peeling is performed from the corner portion 1C on one end side of the laminated body 1 to the corner portion 1D on the other end side. Further, in this case, the boundary between the region where the peeling is completed and the region where the peeling is not performed is expressed as a straight line, and the straight line is referred to as the peeling front line G. The peeling front line G travels in a direction indicated by an arrow H of FIG. By the peeling device 100, the reinforcing plate 3 and the substrate 2 may be separated from each other at the peeling start portion, and then the liquid (intermediate) obtained by the peeling start portion may be suctioned and removed. By suction removal, it is possible to reduce the adhesion of liquid to the device and cause contamination. The suction removal can be carried out by arranging the suction nozzle on the side of the peeling start portion.

The peeling apparatus 100 is provided with the rubber 114 which inserts the rubber elastic sheet 112, and the board|substrate 2 is adsorbed and hold|maintained by the board|substrate 2, and the rubber elastic sheet 116 isolate|separated, and the reinforcement board 3 can be s Board 118. The elastic sheet 112 and the platform 114 serve as a support portion Further, the elastic sheet 116 and the flexible sheet 118 function as an adsorption portion having an adsorption surface.

The stage 114 is held by the elastic sheet 112 to vacuum-adsorb the first surface of the substrate 2. The platform 114 is horizontally disposed on the upper surface of the pedestal 120. The platform 114 is sufficiently larger than the area of the substrate 2 and has a shape that follows the outer shape of the substrate 2. The pedestal 120 functions as a holding portion that holds the support portion including the elastic sheet 112 and the stage 114.

The flexible sheet 118 is held by the elastic sheet 116 to vacuum-adsorb the second surface of the reinforcing sheet 3. The flexible plate 118 is provided with a body portion 118A that is flexibly deformable. The main body portion 118A is sufficiently larger than the reinforcing plate 3 and has a shape similar to that of the reinforcing plate 3.

One end of the main body portion 118A is provided with a rectangular protruding portion 118B that protrudes in the horizontal direction from the corner portion 1C of the laminated body 1. Further, at the other end of the main body portion 118A, a rectangular projecting portion 118C that protrudes in the horizontal direction from the corner portion 1D of the laminated body 1 is provided. The protruding portions 118B and 118C are arranged along the traveling direction of the peeling front line G (the direction of the arrow H).

The bending rigidity per unit width (1 mm) of the flexible plate 118 is preferably 1000 to 40,000 N. Mm ² /mm. For example, in the portion of the flexible plate 118 having a width of 100 mm, the bending rigidity is 100000~4000000N. Mm ² . By setting the bending rigidity per unit width (1 mm) of the flexible plate 118 to 1000 N. When the mm ² /mm or more, the bending of the reinforcing plate 3 which is held by the flexible plate 118 can be prevented. Moreover, the bending rigidity per unit width (1 mm) of the flexible plate 118 is set to 40,000 N. Below mm ² /mm, the reinforcing plate 3 which is held and held by the flexible plate 118 can be flexibly deformed moderately.

As the flexible plate 118, a metal plate other than a resin plate such as a polyvinyl chloride (PVC) resin, a polycarbonate resin, an acrylic resin, or a polyacetal (POM) resin can be used.

A shaft 122 is provided in the horizontal direction at the end of the protruding portion 118C of the flexible plate 118. The shaft 122 is rotatably supported by bearings 124, 124 fixed to the upper surface of the pedestal 120. Therefore, the flexible plate 118 is centered on the shaft 122 and tilts relative to the pedestal 120. Ground setting. Further, a servo cylinder 126 is mounted on the flexible plate 118.

The servo cylinder 126 includes a cylinder body 126A and a piston 126B. The servo cylinder 126 is disposed in a plan view of FIG. 13 such that the axis of the piston 126B is located on a line connecting the corner portion 1C of the laminated body 1 to the corner portion 1D. In other words, the servo cylinder 126 is disposed such that the piston 126B expands and contracts in the traveling direction (arrow H direction) of the peeling front line G.

A shaft 128 is provided in the horizontal direction at the base end portion of the cylinder body 126A. The shaft 128 is rotatably supported by bearings 130, 130 fixed to the upper surface of the projection 118C of the flexible plate 118.

Further, a shaft 132 is provided in the horizontal direction at the front end of the piston 126B. The shaft 132 is rotatably supported by bearings 134, 134 fixed to the upper surface of the projection 118B of the flexible plate 118.

On the upper surface of the pedestal 120, a stopper 140 is provided on the corner 1D side. The stopper 140 is fixed to the pedestal 120. Further, on the upper surface of the pedestal 120, a spring 142 as a pressing member is provided on the corner portion 1C side. The platform 114 is pressed in the direction of the arrow I by the spring 142. Since the platform 114 is not fixed to the upper surface of the pedestal 120 and is horizontally disposed, the platform 114 can be moved left and right on the upper surface of the pedestal 120. Therefore, in the state before peeling, the platform 114 is pressed against the stopper 140 by the pressing force of the spring 142.

Further, in the present embodiment, the servo cylinder 126 is used as the driving means, but a linear motion device including a rotary servo motor, a feed screw mechanism, and a hydraulic cylinder may be used as the driving means. Moreover, the overall operation of the peeling device 100 is comprehensively controlled by a control unit (not shown).

Next, a peeling method using the reinforcing plate 3 of the peeling device 100 will be described with reference to FIGS. 15(A) and 15(B). 15(A) and 15(B) are explanatory views of the operation of the peeling device 100. Further, Fig. 15(A) shows the state of the peeling device 100 after a certain period of time has elapsed from the start of peeling, and Fig. 15(B) shows the state of the peeling device 100 after a certain period of time has elapsed from the start of peeling.

Regarding the laminated body 1 provided in the peeling device 100, the first surface of the substrate 2 is interposed with the elastic sheet The material 112 is adsorbed and held on the platform 114. Further, the second surface of the reinforcing plate 3 is adsorbed and held by the flexible plate 118 via the elastic sheet 116.

In the initial state, the piston 126B of the servo cylinder 126 is in an extended state (see Fig. 14).

When the piston 126B of the servo cylinder 126 is contracted from the extended state, the force that is pulled by the protruding portion 118B toward the protruding portion 118C acts on the protruding portion 118B. With this force, the flexible plate 118 starts to bend as shown in Fig. 15(A). As a result, the reinforcing plate 3 that has been adsorbed and held by the flexible plate 118 is also bent. Therefore, in the laminated body 1, peeling is started from the peeling start portion where the corner portion 1C is formed.

When the piston 126B of the servo cylinder 126 is further contracted, the flexible plate 118 is further flexed and deformed in conjunction with this operation. Further, since the servo cylinder 126 is rotatably supported around the shaft 128 and the shaft 132, the servo shaft 126 is tilted about the shaft 128 following the flexural deformation of the flexible plate 118. In this manner, the servo cylinder 126 is tilted slowly, and the flexible plate 118 is slowly flexed and deformed from the side of the protruding portion 118B toward the side of the protruding portion 118C, and as a result, from the corner portion 1C of one side to the corner portion 1D of the other side, The reinforcing plate 3 is slowly peeled off.

At this time, as shown in FIG. 15(A), the peeling start side (corner portion 1C side) of the reinforcing plate 3 is pulled in the elastic sheet 116 as the adsorption surface as indicated by the arrow J in the first half of the peeling. The way the central department is staggered. As a result, the load generated by the displacement of the reinforcing plate 3 and the substrate 2 is released. In particular, in the first half of the peeling, the contact area of the substrate 2 and the reinforcing plate 3 sandwiched by the stage 114 and the flexible plate 118 on the peeling end side (corner 1D side) is larger than the substrate 2 and the reinforcing side at the peeling start side. The area of the plate 3 separated. As a result, the reinforcing plate 3 can be easily shifted on the peeled side of the elastic sheet 116, and the load on the substrate 2 can be released.

Further, in the half after the peeling of the reinforcing plate 3, as shown in Fig. 15(B), the peeling end side (the corner portion 1D side) of the reinforcing plate 3 is as shown by the arrow K on the elastic sheet 116 as the adsorption surface. The way to pull into the center is staggered. In particular, in the second half after peeling, on the corner 1D side, the area of the substrate 2 and the reinforcing plate 3 sandwiched by the stage 114 and the flexible plate 118 is smaller than the area where the substrate 2 and the reinforcing plate 3 are separated at the peeling start side, and The reinforcing plate 3 is adsorbed by the elastic sheet 116 The area becomes larger. As a result, the peeling end side of the reinforcing plate 3 is easily staggered on the elastic sheet 116. Due to the staggering of the reinforcing plate 3, a load is applied to shift the substrate 2 parallel to the interface. In the present embodiment, since the pedestal 120 and the stage 114 are not fixed, following the displacement of the reinforcing plate 3, the platform 114 slides on the pedestal 120, and the load on the substrate 2 is released by the sliding. As shown in Fig. 15(B), the platform 114 is slid in the direction of the arrow K against the pressing force of the spring 142.

That is, in the present embodiment, the stage 114 functions as a sliding portion by being slidable on the pedestal 120. The interface between the platform 114 and the pedestal 120 constitutes a connecting portion, and the platform 114 can be easily slid on the pedestal 120 by reducing the friction of the interface (connecting portion). Therefore, in order to reduce friction, it is preferable to arrange a resin sheet or the like between the stage 114 and the pedestal 120. As the resin sheet, a sheet made of a fluororesin or a sheet made of a polyethylene resin can be used.

Further, when the reinforcing plate 3 is completely peeled off from the substrate 2, the pressing platform 114 of the spring 142 abuts against the stopper 140. In the present embodiment, the stopper 140 and the spring 142 function as positioning means. In order to limit the moving direction of the sliding of the platform 114, a guide mechanism such as a LM guide (Linear Motion Guide) may be disposed on the pedestal 120.

In the peeling device 40 of the first embodiment and the peeling device 100 of the second embodiment, the state in which the reinforcing plates 3, 3A, and 3B are followed, and the sliding function is passively described will be described. However, the present invention is not limited to this, and the sliding function can be actively performed. For example, the positional change of the bending state can be detected by providing a sensor or the like, and based on the result, the sliding function can be actively exerted by an actuator or the like.

Further, as long as the load can be released by the sliding function, the mechanism, the place of the installation mechanism, and the like are not limited.

The present application is based on Japanese Patent Application No. 2015-023854, filed on Feb. 10, 2015, and the entire contents of

2A‧‧‧Substrate

2B‧‧‧Substrate

3A‧‧‧ reinforcing plate

3B‧‧‧ reinforcing plate

6‧‧‧Layer

7‧‧‧ functional layer

8‧‧‧Main seals

40‧‧‧ peeling device

42‧‧‧ peeling unit

44‧‧‧ movable body

46‧‧‧ movable device

48‧‧‧ drive

70‧‧‧ pole

80‧‧‧Linked institutions

94‧‧‧ Positioning device

Claims (7)

A laminate device for a laminate comprising a first substrate, a second substrate, and a laminate of an adhesive layer that bonds the first substrate and the second substrate, and the first substrate is peeled off from the adhesive layer Further, the driving unit has a driving unit that flexes and deforms one of the first substrate or the second substrate, and a sliding portion that is parallel to the first substrate and the first substrate and the second substrate. Or the direction of the second substrate is relatively slid. The peeling device for a laminate according to claim 1, comprising: a support portion that supports the first substrate of the laminate; and an adsorption portion that adsorbs the second substrate of the laminate by an adsorption surface; The driving unit is attached to the surface of the adsorption unit opposite to the adsorption surface, and is independently moved relative to the support portion to flexibly deform the second substrate to the first substrate and the second substrate. The interface is peeled off in sequence. A peeling device for a laminate according to claim 2, wherein the adsorption portion comprises a flexible plate. The peeling device of the laminated body according to claim 3, wherein the connecting portion that connects the flexible plate to the driving portion is provided with the sliding portion. The peeling device for a laminated body according to claim 2, wherein the sliding portion is provided at a connecting portion that connects the support portion and the holding portion that holds the support portion. A method for peeling a laminated body, comprising: a first substrate, a second substrate, and a laminate of a bonding layer that bonds the first substrate and the second substrate, wherein the first substrate and the first substrate are The second substrate is peeled off, and the peeling step is performed by flexing and deforming one of the first substrate or the second substrate by a driving portion, and the first substrate and the first substrate are separated by a sliding portion The second substrate is peeled off while sliding in a direction parallel to the first substrate or the second substrate. A method of manufacturing an electronic device, comprising: a functional layer forming step of forming a laminate including a first substrate, a second substrate, and an adhesive layer that bonds the first substrate and the second substrate; a step of forming a functional layer on the exposed surface of the substrate; and a separating step of separating the second substrate from the first substrate on which the functional layer is formed; and the separating step has a peeling step of causing the first portion by using a driving portion One of the substrate or the second substrate is flexibly deformed, and the first substrate and the second substrate are detached while being slid in a direction parallel to the first substrate or the second substrate by a sliding portion.