TW461847B - Mechanical gripper for wafer handling robots - Google Patents
Mechanical gripper for wafer handling robots Download PDFInfo
- Publication number
- TW461847B TW461847B TW089105023A TW89105023A TW461847B TW 461847 B TW461847 B TW 461847B TW 089105023 A TW089105023 A TW 089105023A TW 89105023 A TW89105023 A TW 89105023A TW 461847 B TW461847 B TW 461847B
- Authority
- TW
- Taiwan
- Prior art keywords
- clamp
- workpiece
- finger
- robot
- wafer
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/02—Gripping heads and other end effectors servo-actuated
- B25J15/0206—Gripping heads and other end effectors servo-actuated comprising articulated grippers
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
461847
8 8 8 8 A B CD 六 經濟部智慧財產局員工消費合作社印製 申請專利範圍 - (請先閲讀背面之注意事項再填寫本頁) 5 .如申請專利範圍第4項所述之夾具腕,其中更包含: 兩夾具手指,彼此間以相互隔開之關係支撐著,並 連接至該彈簧。 6. 如申請專利範圍第1項所述之夾具腕,其中更包含: 一彎曲組件,以可移動的方式連接至該至少一夹具 孓 4匕 · 丁孑曰, 該接觸墊,耦合至該彎曲組件,該接觸墊的位置用 以在該機械臂伸出至一定程度時接附至該至少一夹具 手指,並用以將該至少一夾具手指移離該工部。 7. 如申請專利範圍第6項所述之夾具腕,其中更包含: 兩夾具手指,彼此以間隔關係支撐著,且其中該弯 曲組件被接附至該夾具手指,並經過調整使該夾具手 指在該轉移甩組件與該接觸墊接附時移離該工部。 8 .如申請專利範圍第7項所述之夾具腕,其中更包含: 一槓桿,以樞軸方式支撐至該腕殼,該槓桿的位置 能在由轉移用組件而與該槓桿接附時與該彎曲組件之 接觸墊相接附。 9.如申請專利範圍第1項所述之夾具腕,其中該至少一 夾具手指包含一第一夾具手指及一第二夹具手指,其 39 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 461847
甲孩夾具手指大約 !〇·—種夾具機械裝置,用以將一工部固 〜芝一 丁 組件,該工部處理組件耦合至一機械管、 巧 < 尽端 少包含一晶圓處理承載盤,該晶圓處理 部處理 ’並至 承載盤具有一 工部接收區,並在該末端處有一固定組 '' * 該 械装置至少包含: 至少一失具手指,與該工部之邊緣相接觸; —抵住組件,耦合至該至少一夾且$ , ~ 丁指,能 部位於該工部接收區之上時迫使該至,!、 Γ 、' 王〆一夾具 任該工部,以將該工部夾在該至少一 ^ 灰具手指 疋組件之間;及 夹具機 —槓桿設置,該槓桿設置耦合至該至 指,並在該工部處理組件及該機械臂 移離該工部。 伸出時將 在該 手指 及該 夹具 該手 (請先閱讀背面之注意事項再填寫本頁) -*νά 經濟部智慧財產局員工消費合作社印製 1K如申請專利範圍第1〇項所述之夾具機械裝置,其中 該積桿設置被調整成能因該機械臂及該工部處理組件 之相對角旋轉而呈接附狀態。 1 2 .如申請專利範圍第1 1項所述之夾具機械裝置,其中 孩至少一夾具手指以樞軸方式支撐至該工部處理組 件;並更包含一轉移用組件,該轉移用組件接附至該 機械臂,該機械臂的位置則能使當該機械臂伸出至一 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公釐) ___〆 综· 461847 A8 B8 C8 ._D8 六、申請專利範圍 .定程度時接附至該至少一夾具手指,並將該至少一炎 具手指移離該工部。 1 3 .如中請專利範圍第1 2項所述之夾具機械裝置,其中 該槓桿設置更包含: 一弩曲組件,以可移動方式連接至該至少一夾具手 指;及 一接觸墊,耦合至該彎曲組件,以選擇性與該轉移 用組件相接附,該接觸墊的位置並能在該機械臂伸出 至一定程度時與該至少一夾具手指相接附,並將該至 少一夾具手指移離該工部。 1 4 .如申請專利範圍第1 3項所述之夾具機械裝置,其中 該槓桿設置更包含: 一槓桿,以樞軸方式支撐至該工部處理組件; 該槓桿,具有一端部份; 一接觸墊,耦合至該槓桿之大約端部份,以選擇性 ;« .........-r-L裝——-——:訂---------综 (請先閲讀背面之注意事項再填寫本頁) , 置 件 位組 的用 墊移 觸轉 接該 之由 件得 組使 曲, f配 該匹 ;地 配性 匹擇 相選 件桿 組槓 用該 移與 轉其 該使 與可 經濟部智慧財產局員工消費合作社印製 附 接 之 至 開 開 臂 械 桿機。 槓該部 該在工 與以該 成,離 形附移 第 圍 範 利 專 土 GC 二r 中 如 少 至 該 成 形 時 度 程 定 接指 之 手 指具 手夾 具該 夾將 中 其 置 裝 械 機 具 夾 之 述 所 項 41 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 461847
8 8 8 8 A B CD 六、申請專利範圍 更包含: (請先閱讀背面之注意事項再填寫本頁) 兩夹具手指,彼此以間隔關係支撐著;且其中該彎 曲組件接附至該夾具手指,並能在該轉移用組件與該 接觸墊相接附時使該夾具手指移開。 1 6 .如申請專利範圍第1 3項所述之夾具機械裝置,其中 更包含一阻擋組件,接附至該工部處理組件,該阻擋 組件的位置能限制該至少一夹具手指移離該工部。 1 7. —種機械臂組件,其至少包含: 一對蛙腿型機械臂,其中該機械臂的每一者都具有 一末端,該末端則接附有一夾具腕,該夾具腕至少包 含: 一腕機殼,以樞軸方式耦合至該機械臂; 至少一夾具手指,位於該腕機殼之内;及 一抵住組件,耦合至該至少一夾具手指,以迫 使該至少一夾具手指靠住一工部; 經濟部智慧財產局員工消費合作社印製 一轉移用組件,接附至該機械臂之末端;及 一槓桿設置,連接至該至少一夹具手指,該槓桿設 置的位置能與該轉移用組件相接附,以使該至少一夾 具手指在該機械臂於伸出一定程度時移離該工部。 1 8 .如申請專利範圍第1 7項所述之機械臂組件,其中更 包含: 42 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐)
8 8 8 8 A B c D 461847 六、申請專利範圍 _ 一阻擋組件,接附至該腕機殼,該阻擋組件的位置 能限制該至少一夾具手指移離該工部。 (請先閲讀背面之注意事項再填寫本頁) 19. 一種機械人,其至少包含: 一對第一輪轂組件,可繞一第一軸旋轉; 一對磁性驅動裝置,用以驅動該輪轂組件之每一 者; 一對機械臂,該機械臂之每一者都至少包含一第一 支架及一第二支架,其中該第一支架支撐至一輪轂組 件; 一轉移用組件,位於該第二支架之每一者之内; 一工部處理組件,以樞軸方式接附至該對機械臂, 該工部處理組件至少包含: 至少一夾具手指; 一抵住組件,耦合至該至少一夾具手指,該夾具手 指則能迫使該至少一夾具手指靠住一工部; 一槓桿設置,該槓桿設置的位置能在該機械臂組件 伸出至一定程度時,使該槓桿設置為轉移用組件所接 經濟部智慧財產局員工消費合作社印製 至 出 及伸 • ’ 件 。 指組部 手臂工 具械該 夬機離 一 該拉 少在指1.置 + 該 i 具 設 、 至桿夾 W槓一 接該少 時至 附 該 將 時 度 •程 定 如 ο 2 人 械 機 之 述 所 項 9 ο 11 簧 第彈 圍 一 範為 利可 專少 請至 中 件 43 住 抵 該 中 其 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 461847 A8 B8 C8 _D8 六、申請專利範圍 21. 如申請專利範圍第 20項所述之機械人,其中更包含 一槓桿,該槓桿以樞軸方式支撐至該腕機殼。 22. 如_請專利範圍第 21項所述之機械人,其中更包 含: 一阻擋組件,接附該腕機殼,該阻擋組件的位置能 限制該至少一夹具手指移離該工部。 2 3 .如申請專利範圍第2 2項所述之機械人,其中該第一 機械臂及該第二機械臂以一相同方向旋轉時會造成兩 種獨立移動的其中一者,而該第一機械臂及該第二機 械臂以相反方向旋轉時會造成兩種獨立移動中的另一 者0 ---J---------ί、,」裝 I I (請先閲讀背面之注意事項再填寫本頁) 综 經濟部智慧財產局員工消費合作社印製 44 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/272,658 US6322312B1 (en) | 1999-03-18 | 1999-03-18 | Mechanical gripper for wafer handling robots |
Publications (1)
Publication Number | Publication Date |
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TW461847B true TW461847B (en) | 2001-11-01 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW089105023A TW461847B (en) | 1999-03-18 | 2000-03-23 | Mechanical gripper for wafer handling robots |
Country Status (6)
Country | Link |
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US (4) | US6322312B1 (zh) |
EP (1) | EP1037264B1 (zh) |
JP (1) | JP4808299B2 (zh) |
KR (1) | KR100696027B1 (zh) |
DE (1) | DE60041217D1 (zh) |
TW (1) | TW461847B (zh) |
Cited By (5)
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TWI610397B (zh) * | 2016-06-20 | 2018-01-01 | 上海新昇半導體科技有限公司 | 機械手臂及基板的抓取方法 |
CN108604563A (zh) * | 2015-12-14 | 2018-09-28 | 川崎重工业株式会社 | 衬底搬送机器人及其运转方法 |
CN109585349A (zh) * | 2018-11-23 | 2019-04-05 | 中国电子科技集团公司第五十五研究所 | 一种晶圆传输平台、高压剥离机及其工作方法 |
CN111941396A (zh) * | 2020-08-17 | 2020-11-17 | 广东万合新材料科技有限公司 | 一种旋转式的机械手 |
CN114433444A (zh) * | 2022-04-11 | 2022-05-06 | 四川上特科技有限公司 | 用于晶圆涂覆玻璃粉的盛料转移装置 |
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US6322312B1 (en) * | 1999-03-18 | 2001-11-27 | Applied Materials, Inc. | Mechanical gripper for wafer handling robots |
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US6166509A (en) | 1999-07-07 | 2000-12-26 | Applied Materials, Inc. | Detection system for substrate clamp |
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1999
- 1999-03-18 US US09/272,658 patent/US6322312B1/en not_active Expired - Lifetime
- 1999-04-01 US US09/283,995 patent/US6283701B1/en not_active Expired - Lifetime
-
2000
- 2000-03-17 DE DE60041217T patent/DE60041217D1/de not_active Expired - Fee Related
- 2000-03-17 EP EP00302196A patent/EP1037264B1/en not_active Expired - Lifetime
- 2000-03-18 KR KR1020000013813A patent/KR100696027B1/ko not_active IP Right Cessation
- 2000-03-21 JP JP2000079052A patent/JP4808299B2/ja not_active Expired - Fee Related
- 2000-03-23 TW TW089105023A patent/TW461847B/zh not_active IP Right Cessation
-
2001
- 2001-09-21 US US09/960,009 patent/US6514033B2/en not_active Expired - Fee Related
- 2001-10-23 US US10/032,663 patent/US6685422B2/en not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108604563A (zh) * | 2015-12-14 | 2018-09-28 | 川崎重工业株式会社 | 衬底搬送机器人及其运转方法 |
CN108604563B (zh) * | 2015-12-14 | 2022-12-06 | 川崎重工业株式会社 | 衬底搬送机器人及其运转方法 |
TWI610397B (zh) * | 2016-06-20 | 2018-01-01 | 上海新昇半導體科技有限公司 | 機械手臂及基板的抓取方法 |
CN109585349A (zh) * | 2018-11-23 | 2019-04-05 | 中国电子科技集团公司第五十五研究所 | 一种晶圆传输平台、高压剥离机及其工作方法 |
CN111941396A (zh) * | 2020-08-17 | 2020-11-17 | 广东万合新材料科技有限公司 | 一种旋转式的机械手 |
CN114433444A (zh) * | 2022-04-11 | 2022-05-06 | 四川上特科技有限公司 | 用于晶圆涂覆玻璃粉的盛料转移装置 |
CN114433444B (zh) * | 2022-04-11 | 2022-07-01 | 四川上特科技有限公司 | 用于晶圆涂覆玻璃粉的盛料转移装置 |
Also Published As
Publication number | Publication date |
---|---|
EP1037264A2 (en) | 2000-09-20 |
EP1037264B1 (en) | 2008-12-31 |
US6514033B2 (en) | 2003-02-04 |
US6283701B1 (en) | 2001-09-04 |
JP4808299B2 (ja) | 2011-11-02 |
US6322312B1 (en) | 2001-11-27 |
KR100696027B1 (ko) | 2007-03-15 |
KR20000076907A (ko) | 2000-12-26 |
DE60041217D1 (de) | 2009-02-12 |
US6685422B2 (en) | 2004-02-03 |
JP2000308988A (ja) | 2000-11-07 |
US20020009359A1 (en) | 2002-01-24 |
US20020051704A1 (en) | 2002-05-02 |
EP1037264A3 (en) | 2006-01-25 |
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