TW461847B - Mechanical gripper for wafer handling robots - Google Patents

Mechanical gripper for wafer handling robots Download PDF

Info

Publication number
TW461847B
TW461847B TW089105023A TW89105023A TW461847B TW 461847 B TW461847 B TW 461847B TW 089105023 A TW089105023 A TW 089105023A TW 89105023 A TW89105023 A TW 89105023A TW 461847 B TW461847 B TW 461847B
Authority
TW
Taiwan
Prior art keywords
clamp
workpiece
finger
robot
wafer
Prior art date
Application number
TW089105023A
Other languages
English (en)
Inventor
Satish Sundar
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of TW461847B publication Critical patent/TW461847B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00Gripping heads and other end effectors
    • B25J15/02Gripping heads and other end effectors servo-actuated
    • B25J15/0206Gripping heads and other end effectors servo-actuated comprising articulated grippers

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Description

461847
8 8 8 8 A B CD 六 經濟部智慧財產局員工消費合作社印製 申請專利範圍 - (請先閲讀背面之注意事項再填寫本頁) 5 .如申請專利範圍第4項所述之夾具腕,其中更包含: 兩夾具手指,彼此間以相互隔開之關係支撐著,並 連接至該彈簧。 6. 如申請專利範圍第1項所述之夾具腕,其中更包含: 一彎曲組件,以可移動的方式連接至該至少一夹具 孓 4匕 · 丁孑曰, 該接觸墊,耦合至該彎曲組件,該接觸墊的位置用 以在該機械臂伸出至一定程度時接附至該至少一夹具 手指,並用以將該至少一夾具手指移離該工部。 7. 如申請專利範圍第6項所述之夾具腕,其中更包含: 兩夾具手指,彼此以間隔關係支撐著,且其中該弯 曲組件被接附至該夾具手指,並經過調整使該夾具手 指在該轉移甩組件與該接觸墊接附時移離該工部。 8 .如申請專利範圍第7項所述之夾具腕,其中更包含: 一槓桿,以樞軸方式支撐至該腕殼,該槓桿的位置 能在由轉移用組件而與該槓桿接附時與該彎曲組件之 接觸墊相接附。 9.如申請專利範圍第1項所述之夾具腕,其中該至少一 夾具手指包含一第一夾具手指及一第二夹具手指,其 39 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 461847
甲孩夾具手指大約 !〇·—種夾具機械裝置,用以將一工部固 〜芝一 丁 組件,該工部處理組件耦合至一機械管、 巧 < 尽端 少包含一晶圓處理承載盤,該晶圓處理 部處理 ’並至 承載盤具有一 工部接收區,並在該末端處有一固定組 '' * 該 械装置至少包含: 至少一失具手指,與該工部之邊緣相接觸; —抵住組件,耦合至該至少一夾且$ , ~ 丁指,能 部位於該工部接收區之上時迫使該至,!、 Γ 、' 王〆一夾具 任該工部,以將該工部夾在該至少一 ^ 灰具手指 疋組件之間;及 夹具機 —槓桿設置,該槓桿設置耦合至該至 指,並在該工部處理組件及該機械臂 移離該工部。 伸出時將 在該 手指 及該 夹具 該手 (請先閱讀背面之注意事項再填寫本頁) -*νά 經濟部智慧財產局員工消費合作社印製 1K如申請專利範圍第1〇項所述之夾具機械裝置,其中 該積桿設置被調整成能因該機械臂及該工部處理組件 之相對角旋轉而呈接附狀態。 1 2 .如申請專利範圍第1 1項所述之夾具機械裝置,其中 孩至少一夾具手指以樞軸方式支撐至該工部處理組 件;並更包含一轉移用組件,該轉移用組件接附至該 機械臂,該機械臂的位置則能使當該機械臂伸出至一 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公釐) ___〆 综· 461847 A8 B8 C8 ._D8 六、申請專利範圍 .定程度時接附至該至少一夾具手指,並將該至少一炎 具手指移離該工部。 1 3 .如中請專利範圍第1 2項所述之夾具機械裝置,其中 該槓桿設置更包含: 一弩曲組件,以可移動方式連接至該至少一夾具手 指;及 一接觸墊,耦合至該彎曲組件,以選擇性與該轉移 用組件相接附,該接觸墊的位置並能在該機械臂伸出 至一定程度時與該至少一夾具手指相接附,並將該至 少一夾具手指移離該工部。 1 4 .如申請專利範圍第1 3項所述之夾具機械裝置,其中 該槓桿設置更包含: 一槓桿,以樞軸方式支撐至該工部處理組件; 該槓桿,具有一端部份; 一接觸墊,耦合至該槓桿之大約端部份,以選擇性 ;« .........-r-L裝——-——:訂---------综 (請先閲讀背面之注意事項再填寫本頁) , 置 件 位組 的用 墊移 觸轉 接該 之由 件得 組使 曲, f配 該匹 ;地 配性 匹擇 相選 件桿 組槓 用該 移與 轉其 該使 與可 經濟部智慧財產局員工消費合作社印製 附 接 之 至 開 開 臂 械 桿機。 槓該部 該在工 與以該 成,離 形附移 第 圍 範 利 專 土 GC 二r 中 如 少 至 該 成 形 時 度 程 定 接指 之 手 指具 手夾 具該 夾將 中 其 置 裝 械 機 具 夾 之 述 所 項 41 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 461847
8 8 8 8 A B CD 六、申請專利範圍 更包含: (請先閱讀背面之注意事項再填寫本頁) 兩夹具手指,彼此以間隔關係支撐著;且其中該彎 曲組件接附至該夾具手指,並能在該轉移用組件與該 接觸墊相接附時使該夾具手指移開。 1 6 .如申請專利範圍第1 3項所述之夾具機械裝置,其中 更包含一阻擋組件,接附至該工部處理組件,該阻擋 組件的位置能限制該至少一夹具手指移離該工部。 1 7. —種機械臂組件,其至少包含: 一對蛙腿型機械臂,其中該機械臂的每一者都具有 一末端,該末端則接附有一夾具腕,該夾具腕至少包 含: 一腕機殼,以樞軸方式耦合至該機械臂; 至少一夾具手指,位於該腕機殼之内;及 一抵住組件,耦合至該至少一夾具手指,以迫 使該至少一夾具手指靠住一工部; 經濟部智慧財產局員工消費合作社印製 一轉移用組件,接附至該機械臂之末端;及 一槓桿設置,連接至該至少一夹具手指,該槓桿設 置的位置能與該轉移用組件相接附,以使該至少一夾 具手指在該機械臂於伸出一定程度時移離該工部。 1 8 .如申請專利範圍第1 7項所述之機械臂組件,其中更 包含: 42 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐)
8 8 8 8 A B c D 461847 六、申請專利範圍 _ 一阻擋組件,接附至該腕機殼,該阻擋組件的位置 能限制該至少一夾具手指移離該工部。 (請先閲讀背面之注意事項再填寫本頁) 19. 一種機械人,其至少包含: 一對第一輪轂組件,可繞一第一軸旋轉; 一對磁性驅動裝置,用以驅動該輪轂組件之每一 者; 一對機械臂,該機械臂之每一者都至少包含一第一 支架及一第二支架,其中該第一支架支撐至一輪轂組 件; 一轉移用組件,位於該第二支架之每一者之内; 一工部處理組件,以樞軸方式接附至該對機械臂, 該工部處理組件至少包含: 至少一夾具手指; 一抵住組件,耦合至該至少一夾具手指,該夾具手 指則能迫使該至少一夾具手指靠住一工部; 一槓桿設置,該槓桿設置的位置能在該機械臂組件 伸出至一定程度時,使該槓桿設置為轉移用組件所接 經濟部智慧財產局員工消費合作社印製 至 出 及伸 • ’ 件 。 指組部 手臂工 具械該 夬機離 一 該拉 少在指1.置 + 該 i 具 設 、 至桿夾 W槓一 接該少 時至 附 該 將 時 度 •程 定 如 ο 2 人 械 機 之 述 所 項 9 ο 11 簧 第彈 圍 一 範為 利可 專少 請至 中 件 43 住 抵 該 中 其 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 461847 A8 B8 C8 _D8 六、申請專利範圍 21. 如申請專利範圍第 20項所述之機械人,其中更包含 一槓桿,該槓桿以樞軸方式支撐至該腕機殼。 22. 如_請專利範圍第 21項所述之機械人,其中更包 含: 一阻擋組件,接附該腕機殼,該阻擋組件的位置能 限制該至少一夹具手指移離該工部。 2 3 .如申請專利範圍第2 2項所述之機械人,其中該第一 機械臂及該第二機械臂以一相同方向旋轉時會造成兩 種獨立移動的其中一者,而該第一機械臂及該第二機 械臂以相反方向旋轉時會造成兩種獨立移動中的另一 者0 ---J---------ί、,」裝 I I (請先閲讀背面之注意事項再填寫本頁) 综 經濟部智慧財產局員工消費合作社印製 44 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐)
TW089105023A 1999-03-18 2000-03-23 Mechanical gripper for wafer handling robots TW461847B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/272,658 US6322312B1 (en) 1999-03-18 1999-03-18 Mechanical gripper for wafer handling robots

Publications (1)

Publication Number Publication Date
TW461847B true TW461847B (en) 2001-11-01

Family

ID=23040724

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089105023A TW461847B (en) 1999-03-18 2000-03-23 Mechanical gripper for wafer handling robots

Country Status (6)

Country Link
US (4) US6322312B1 (zh)
EP (1) EP1037264B1 (zh)
JP (1) JP4808299B2 (zh)
KR (1) KR100696027B1 (zh)
DE (1) DE60041217D1 (zh)
TW (1) TW461847B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI610397B (zh) * 2016-06-20 2018-01-01 上海新昇半導體科技有限公司 機械手臂及基板的抓取方法
CN108604563A (zh) * 2015-12-14 2018-09-28 川崎重工业株式会社 衬底搬送机器人及其运转方法
CN109585349A (zh) * 2018-11-23 2019-04-05 中国电子科技集团公司第五十五研究所 一种晶圆传输平台、高压剥离机及其工作方法
CN111941396A (zh) * 2020-08-17 2020-11-17 广东万合新材料科技有限公司 一种旋转式的机械手
CN114433444A (zh) * 2022-04-11 2022-05-06 四川上特科技有限公司 用于晶圆涂覆玻璃粉的盛料转移装置

Families Citing this family (134)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6322312B1 (en) * 1999-03-18 2001-11-27 Applied Materials, Inc. Mechanical gripper for wafer handling robots
DE60034619T2 (de) * 1999-04-01 2007-12-27 Applied Materials, Inc., Santa Clara Pneumatischer betätigbarer Biegungsgreifer für Scheibenhandhabungsroboter
US6491330B1 (en) * 1999-05-04 2002-12-10 Ade Corporation Edge gripping end effector wafer handling apparatus
US6986636B2 (en) * 2000-06-09 2006-01-17 Brooks Automation, Inc. Device for positioning disk-shaped objects
US6828772B1 (en) * 2000-06-14 2004-12-07 Micron Technology, Inc. Rotating gripper wafer flipper
US6913302B2 (en) * 2001-04-11 2005-07-05 Pri Automation, Inc. Robot arm edge gripping device for handling substrates
GB2380602B (en) * 2001-05-19 2005-03-02 Wentworth Lab Ltd Wafer alignment device
US6752585B2 (en) * 2001-06-13 2004-06-22 Applied Materials Inc Method and apparatus for transferring a semiconductor substrate
US6817640B2 (en) * 2001-06-28 2004-11-16 Applied Materials, Inc. Four-bar linkage wafer clamping mechanism
US7281741B2 (en) * 2001-07-13 2007-10-16 Semitool, Inc. End-effectors for handling microelectronic workpieces
US7334826B2 (en) * 2001-07-13 2008-02-26 Semitool, Inc. End-effectors for handling microelectronic wafers
AU2002332417A1 (en) * 2001-07-14 2003-03-03 Brooks Automation, Inc. Centering double side edge grip end effector with integrated mapping sensor
US8796589B2 (en) * 2001-07-15 2014-08-05 Applied Materials, Inc. Processing system with the dual end-effector handling
US6543988B2 (en) * 2001-07-18 2003-04-08 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus for clamping and transporting a semiconductor wafer
US6682113B2 (en) * 2001-11-16 2004-01-27 Applied Materials, Inc. Wafer clamping mechanism
KR100814338B1 (ko) * 2001-12-31 2008-03-18 엘지.필립스 엘시디 주식회사 로봇용 가이드핀
FR2835337B1 (fr) * 2002-01-29 2004-08-20 Recif Sa Procede et dispositif d'identification de caracteres inscrits sur une plaque de semi-conducteur comportant au moins une marque d'orientation
JP2003303876A (ja) * 2002-04-10 2003-10-24 Seiko Instruments Inc 試料ステージにおける半導体ウエハ保持機構
US20030217693A1 (en) * 2002-05-22 2003-11-27 Applied Materials, Inc. Substrate support assembly having an edge protector
US20070014656A1 (en) * 2002-07-11 2007-01-18 Harris Randy A End-effectors and associated control and guidance systems and methods
US20060043750A1 (en) * 2004-07-09 2006-03-02 Paul Wirth End-effectors for handling microfeature workpieces
US20040013503A1 (en) * 2002-07-22 2004-01-22 Jaswant Sandhu Robotic hand with multi-wafer end effector
US7641247B2 (en) * 2002-12-17 2010-01-05 Applied Materials, Inc. End effector assembly for supporting a substrate
US7677394B2 (en) * 2003-01-09 2010-03-16 Brooks Automation, Inc. Wafer shipping container
US20040197179A1 (en) * 2003-04-03 2004-10-07 Applied Materials, Inc. Method and apparatus for vertical transfer of semiconductor substrates between cleaning modules
US6889818B2 (en) 2003-04-09 2005-05-10 Lsi Logic Corporation Wafer blade contact monitor
US7077973B2 (en) * 2003-04-18 2006-07-18 Applied Materials, Inc. Methods for substrate orientation
CN101383318B (zh) * 2003-06-27 2010-09-08 马特森技术公司 用于装卸半导体晶片的末端执行器
US7654596B2 (en) * 2003-06-27 2010-02-02 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
US7300082B2 (en) * 2003-07-21 2007-11-27 Asyst Technologies, Inc. Active edge gripping and effector
JP2005101584A (ja) * 2003-08-28 2005-04-14 Suss Microtec Test Systems Gmbh 基板を検査する装置
US8606602B2 (en) * 2003-09-12 2013-12-10 Swiss Reinsurance Company Ltd. Systems and methods for automated transactions processing
US7226269B2 (en) * 2004-01-15 2007-06-05 Applied Materials, Inc. Substrate edge grip apparatus
US20070020080A1 (en) * 2004-07-09 2007-01-25 Paul Wirth Transfer devices and methods for handling microfeature workpieces within an environment of a processing machine
JP4533697B2 (ja) * 2004-08-05 2010-09-01 株式会社ジェーイーエル 基板搬送装置
KR100576150B1 (ko) * 2004-08-12 2006-05-03 세메스 주식회사 기판 이송 장치
US20060046376A1 (en) * 2004-08-31 2006-03-02 Hofer Willard L Rotating gripper wafer flipper
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7255747B2 (en) 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
CN1824592B (zh) * 2005-02-25 2012-02-29 细美事有限公司 晶片传送装置
US20060207508A1 (en) * 2005-03-16 2006-09-21 Applied Materials, Inc. Film deposition using a spring loaded contact finger type shadow frame
US20060236941A1 (en) * 2005-04-20 2006-10-26 Applied Materials, Inc. Passive wafer support for particle free wafer acceleration
WO2006115745A1 (en) * 2005-04-22 2006-11-02 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7374391B2 (en) * 2005-12-22 2008-05-20 Applied Materials, Inc. Substrate gripper for a substrate handling robot
WO2006124472A2 (en) * 2005-05-12 2006-11-23 Applied Materials, Inc. Method and apparatus for vertical transfer of semiconductor substrates in a cleaning module
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
US9339900B2 (en) * 2005-08-18 2016-05-17 Futrfab, Inc. Apparatus to support a cleanspace fabricator
KR20070004230A (ko) * 2005-07-04 2007-01-09 삼성전자주식회사 반도체 웨이퍼 이송용 로봇
US7712808B2 (en) * 2005-09-29 2010-05-11 Brooks Automation, Inc. End effector with centering grip
DE102006028057B4 (de) * 2005-10-17 2017-07-20 Dynamic Microsystems Semiconductor Equipment Gmbh Vorrichtung zum Lagern von kontaminationsempfindlichen, plattenförmigen Gegenständen, insbesondere zum Lagern von Halbleiterwafern
JP4865352B2 (ja) * 2006-02-17 2012-02-01 三菱重工業株式会社 プラズマ処理装置及びプラズマ処理方法
JP4769105B2 (ja) * 2006-03-24 2011-09-07 株式会社日立ハイテクノロジーズ ディスクの表面欠陥検査方法および検査装置
US7896602B2 (en) 2006-06-09 2011-03-01 Lutz Rebstock Workpiece stocker with circular configuration
US20080105201A1 (en) * 2006-11-03 2008-05-08 Applied Materials, Inc. Substrate support components having quartz contact tips
US20080112787A1 (en) 2006-11-15 2008-05-15 Dynamic Micro Systems Removable compartments for workpiece stocker
KR100777201B1 (ko) * 2006-12-20 2007-11-16 주식회사 실트론 엔드 이펙터
US20080166210A1 (en) * 2007-01-05 2008-07-10 Applied Materials, Inc. Supinating cartesian robot blade
US7717481B2 (en) * 2007-01-11 2010-05-18 Applied Materials, Inc. High temperature robot end effector
US20080213076A1 (en) * 2007-03-02 2008-09-04 Stephen Hanson Edge grip end effector
JP4959427B2 (ja) * 2007-06-05 2012-06-20 日本電産サンキョー株式会社 産業用ロボット
JP4938560B2 (ja) * 2007-06-22 2012-05-23 日本電産サンキョー株式会社 産業用ロボット
TWI441719B (zh) * 2007-06-05 2014-06-21 Nidec Sankyo Corp Industrial robotic arm
FR2921194B1 (fr) * 2007-09-18 2010-03-12 Acome Soc Coop Production Cable autoregulant a comportement ctp et a puissance electrique modulable, son connecteur, un dispositif les comprenant et utilisation de ce dernier
JP4979530B2 (ja) * 2007-09-28 2012-07-18 日本電産サンキョー株式会社 産業用ロボット
US8382180B2 (en) * 2007-10-31 2013-02-26 Applied Material, Inc. Advanced FI blade for high temperature extraction
US20090196724A1 (en) * 2008-02-05 2009-08-06 Chen Hui Fred Edge contact gripper
KR100951932B1 (ko) * 2008-02-28 2010-04-09 로체 시스템즈(주) 진공 로봇의 웨이퍼 클램프 장치
JP4770856B2 (ja) * 2008-03-21 2011-09-14 トヨタ自動車株式会社 移送用ロボット
JP2011526843A (ja) * 2008-07-01 2011-10-20 アプライド マテリアルズ インコーポレイテッド モジュール式ベースプレート半導体研磨機アーキテクチャ
US20100028109A1 (en) * 2008-07-30 2010-02-04 Fabworx Solutions, Inc. Edge grip end effector
TW201013835A (en) * 2008-09-26 2010-04-01 Gudeng Prec Industral Co Ltd Sheet clamping apparatus
JP2010098130A (ja) * 2008-10-16 2010-04-30 Hirata Corp エンドイフェクタ
WO2010044440A1 (ja) * 2008-10-17 2010-04-22 株式会社アルバック 搬送装置及び真空装置
US8752872B2 (en) * 2009-09-14 2014-06-17 Fabworx Solutions, Inc. Edge grip end effector
US8801069B2 (en) 2010-02-26 2014-08-12 Brooks Automation, Inc. Robot edge contact gripper
TWM389927U (en) * 2010-05-04 2010-10-01 Rexchip Electronics Corp Robot arm for delivering a wafer, wafer-operating machine and member thereof
JP5823742B2 (ja) * 2010-07-02 2015-11-25 芝浦メカトロニクス株式会社 把持装置、搬送装置、処理装置、および電子デバイスの製造方法
DE102010052348A1 (de) * 2010-11-25 2012-05-31 Khs Gmbh PET-Flaschen-Greifvorrichtung
US9314921B2 (en) 2011-03-17 2016-04-19 Sarcos Lc Robotic lift device with human interface operation
US8657352B2 (en) 2011-04-11 2014-02-25 International Business Machines Corporation Robotic device for substrate transfer applications
US8942846B2 (en) 2011-04-29 2015-01-27 Raytheon Company System and method for controlling a teleoperated robotic agile lift system
US9789603B2 (en) 2011-04-29 2017-10-17 Sarcos Lc Teleoperated robotic system
US20120306139A1 (en) 2011-06-03 2012-12-06 Arthur Keigler Parallel single substrate processing system holder
CN102709222A (zh) * 2011-06-28 2012-10-03 清华大学 一种利用线绳弹簧拉伸的晶圆夹持装置
JP5549655B2 (ja) * 2011-09-26 2014-07-16 株式会社安川電機 ハンドおよびロボット
US9401296B2 (en) 2011-11-29 2016-07-26 Persimmon Technologies Corporation Vacuum robot adapted to grip and transport a substrate and method thereof with passive bias
US8936293B2 (en) 2011-12-21 2015-01-20 International Business Machines Corporation Robotic device for substrate transfer applications
US9616580B2 (en) 2012-05-14 2017-04-11 Sarcos Lc End effector for a robotic arm
US9370865B1 (en) * 2012-05-23 2016-06-21 Western Digital Technologies, Inc. Flexure based compliance device for use with an assembly device
JP5989416B2 (ja) * 2012-06-20 2016-09-07 株式会社ディスコ ロボットハンド
JP5930196B2 (ja) * 2012-06-25 2016-06-08 株式会社ディスコ 研削装置
US9236216B2 (en) * 2012-08-03 2016-01-12 Axcelis Technologies, Inc. In-vacuum high speed pre-chill and post-heat stations
US9373534B2 (en) 2012-09-05 2016-06-21 Industrial Technology Research Institute Rotary positioning apparatus with dome carrier, automatic pick-and-place system, and operating method thereof
JP2014086472A (ja) * 2012-10-19 2014-05-12 Sinfonia Technology Co Ltd クランプ装置及びワーク搬送ロボット
CN103094173B (zh) * 2012-12-21 2016-06-01 东莞市中镓半导体科技有限公司 一种多夹头晶片夹具
CN103144112B (zh) * 2013-02-25 2016-05-25 天津市环欧半导体材料技术有限公司 一种硅片自动化学腐蚀机的控制系统
US9099510B2 (en) * 2013-03-15 2015-08-04 Genmark Automation, Inc. Workpiece flipping mechanism for space-constrained environment
US10550918B2 (en) 2013-08-15 2020-02-04 Intuitive Surgical Operations, Inc. Lever actuated gimbal plate
US9202738B2 (en) 2013-09-26 2015-12-01 Applied Materials, Inc. Pneumatic end effector apparatus and substrate transportation systems with annular flow channel
CN104685604B (zh) * 2013-10-02 2017-11-10 艾克塞利斯科技公司 真空中高速预冷站和后热站
US10766133B2 (en) 2014-05-06 2020-09-08 Sarcos Lc Legged robotic device utilizing modifiable linkage mechanism
US10279470B2 (en) * 2014-06-12 2019-05-07 Play-i, Inc. System and method for facilitating program sharing
US9352471B1 (en) 2015-01-21 2016-05-31 Applied Materials, Inc. Substrate gripper apparatus and methods
US9536764B2 (en) 2015-01-27 2017-01-03 Lam Research Corporation End effector for wafer transfer system and method of transferring wafers
EP3093879B1 (de) * 2015-05-13 2021-07-07 Integrated Dynamics Engineering GmbH Endeffector eines waferhandlingsystems sowie waferhandlingsystem
WO2017189272A1 (en) 2016-04-29 2017-11-02 Intuitive Surgical Operations, Inc. Compliant mechanisms having inverted tool members
USD803283S1 (en) 2016-05-16 2017-11-21 Veeco Instruments Inc. Wafer handling assembly
US10821614B2 (en) 2016-11-11 2020-11-03 Sarcos Corp. Clutched joint modules having a quasi-passive elastic actuator for a robotic assembly
US10828767B2 (en) 2016-11-11 2020-11-10 Sarcos Corp. Tunable actuator joint modules having energy recovering quasi-passive elastic actuators with internal valve arrangements
US10919161B2 (en) 2016-11-11 2021-02-16 Sarcos Corp. Clutched joint modules for a robotic system
US10765537B2 (en) 2016-11-11 2020-09-08 Sarcos Corp. Tunable actuator joint modules having energy recovering quasi-passive elastic actuators for use within a robotic system
TWI641457B (zh) * 2017-03-06 2018-11-21 微芯科技有限公司 Carrier disk assembly and robot arm having the same
US11020852B2 (en) 2017-10-05 2021-06-01 Brooks Automation, Inc. Substrate transport apparatus with independent accessory feedthrough
US10843330B2 (en) 2017-12-07 2020-11-24 Sarcos Corp. Resistance-based joint constraint for a master robotic system
US11331809B2 (en) 2017-12-18 2022-05-17 Sarcos Corp. Dynamically controlled robotic stiffening element
JP2019209415A (ja) * 2018-06-04 2019-12-12 株式会社ミツバ 搬送装置
JP7205966B2 (ja) * 2018-06-29 2023-01-17 川崎重工業株式会社 基板搬送装置及びその運転方法
US20210293840A1 (en) * 2018-08-23 2021-09-23 Shimadzu Corporation Plate transport device and plate changer
US11241801B2 (en) 2018-12-31 2022-02-08 Sarcos Corp. Robotic end effector with dorsally supported actuation mechanism
US10906191B2 (en) 2018-12-31 2021-02-02 Sarcos Corp. Hybrid robotic end effector
US11351675B2 (en) 2018-12-31 2022-06-07 Sarcos Corp. Robotic end-effector having dynamic stiffening elements for conforming object interaction
KR102458234B1 (ko) * 2019-01-16 2022-10-24 카와사키 주코교 카부시키 카이샤 로봇 핸드 및 이를 구비하는 로봇
JP7284034B2 (ja) * 2019-08-16 2023-05-30 株式会社ディスコ 搬出機構、及び、加工装置
US20220068690A1 (en) * 2020-09-01 2022-03-03 Applied Materials, Inc. Substrate transfer devices
US11833676B2 (en) 2020-12-07 2023-12-05 Sarcos Corp. Combining sensor output data to prevent unsafe operation of an exoskeleton
CN112558456B (zh) * 2020-12-16 2021-12-24 珠海保税区派西泰克精密五金制造有限公司 一种便于手表后壳定位夹装的抛光辅助设备
US11794345B2 (en) 2020-12-31 2023-10-24 Sarcos Corp. Unified robotic vehicle systems and methods of control
CN112693514B (zh) * 2021-03-18 2021-06-18 新乡职业技术学院 一种机械设备维修用吊装装置
GB202208951D0 (en) * 2022-06-17 2022-08-10 Lam Res Ag System for processing wafer-shaped articles
US11826907B1 (en) 2022-08-17 2023-11-28 Sarcos Corp. Robotic joint system with length adapter
US11717956B1 (en) 2022-08-29 2023-08-08 Sarcos Corp. Robotic joint system with integrated safety
US11897132B1 (en) 2022-11-17 2024-02-13 Sarcos Corp. Systems and methods for redundant network communication in a robot
US11924023B1 (en) 2022-11-17 2024-03-05 Sarcos Corp. Systems and methods for redundant network communication in a robot

Family Cites Families (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4473455A (en) 1981-12-21 1984-09-25 At&T Bell Laboratories Wafer holding apparatus and method
US5374147A (en) 1982-07-29 1994-12-20 Tokyo Electron Limited Transfer device for transferring a substrate
JPH05100199A (ja) * 1991-10-08 1993-04-23 Tokyo Electron Yamanashi Kk 搬送アーム
US4516318A (en) 1983-04-26 1985-05-14 At&T Technologies, Inc. Methods of processing substrates
CA1276710C (en) 1983-11-30 1990-11-20 Kazuo Asakawa Robot force controlling system
US4586743A (en) 1984-09-24 1986-05-06 Intelledex Incorporated Robotic gripper for disk-shaped objects
US4639028A (en) * 1984-11-13 1987-01-27 Economic Development Corporation High temperature and acid resistant wafer pick up device
US5280983A (en) 1985-01-22 1994-01-25 Applied Materials, Inc. Semiconductor processing system with robotic autoloader and load lock
US4813732A (en) 1985-03-07 1989-03-21 Epsilon Technology, Inc. Apparatus and method for automated wafer handling
US4733632A (en) 1985-09-25 1988-03-29 Tokyo Electron Limited Wafer feeding apparatus
US4705951A (en) 1986-04-17 1987-11-10 Varian Associates, Inc. Wafer processing system
US4806057A (en) 1986-04-22 1989-02-21 Motion Manufacturing, Inc. Automatic wafer loading method and apparatus
US5080549A (en) 1987-05-11 1992-01-14 Epsilon Technology, Inc. Wafer handling system with Bernoulli pick-up
JP2508540B2 (ja) * 1987-11-02 1996-06-19 三菱マテリアル株式会社 ウェ―ハの位置検出装置
US4900214A (en) * 1988-05-25 1990-02-13 American Telephone And Telegraph Company Method and apparatus for transporting semiconductor wafers
US5501498A (en) 1988-08-31 1996-03-26 The Trustees Of The University Of Pennsylvania Methods and apparatus for mechanically intelligent grasping
US5022695A (en) 1989-01-30 1991-06-11 Texas Instruments Incorporated Semiconductor slice holder
US5046909A (en) 1989-06-29 1991-09-10 Applied Materials, Inc. Method and apparatus for handling semiconductor wafers
US5447409A (en) 1989-10-20 1995-09-05 Applied Materials, Inc. Robot assembly
DE69027273T2 (de) 1989-10-20 1997-01-23 Applied Materials Inc Biaxialer Roboter mit magnetischer Kupplung
CH680275A5 (zh) 1990-03-05 1992-07-31 Tet Techno Investment Trust
JPH0485727U (zh) * 1990-11-30 1992-07-24
JPH081922B2 (ja) 1991-01-25 1996-01-10 株式会社東芝 ウェハ−保持装置
JP2606970B2 (ja) * 1991-01-29 1997-05-07 富士通株式会社 搬送装置及びそれを用いた搬送方法
US5180276A (en) 1991-04-18 1993-01-19 Brooks Automation, Inc. Articulated arm transfer device
US5513948A (en) 1991-05-17 1996-05-07 Kensington Laboratories, Inc. Universal specimen prealigner
US5511934A (en) 1991-05-17 1996-04-30 Kensington Laboratories, Inc. Noncentering specimen prealigner having improved specimen edge detection and tracking
JP3200468B2 (ja) 1992-05-21 2001-08-20 日本エレクトロプレイテイング・エンジニヤース株式会社 ウエーハ用めっき装置
KR940006241A (ko) 1992-06-05 1994-03-23 이노우에 아키라 기판이재장치 및 이재방법
CN1046654C (zh) 1993-04-16 1999-11-24 布鲁克斯自动化公司 传送装置
US5697748A (en) 1993-07-15 1997-12-16 Applied Materials, Inc. Wafer tray and ceramic blade for semiconductor processing apparatus
EP0634787B1 (en) 1993-07-15 1997-05-02 Applied Materials, Inc. Subsrate tray and ceramic blade for semiconductor processing apparatus
US5513594A (en) 1993-10-20 1996-05-07 Mcclanahan; Adolphus E. Clamp with wafer release for semiconductor wafer processing equipment
JPH07201947A (ja) * 1993-12-28 1995-08-04 Mitsubishi Electric Corp ウェハー搬送用のロボットハンドおよびこのロボットハンドによるウェハーの保持方法
US5511005A (en) 1994-02-16 1996-04-23 Ade Corporation Wafer handling and processing system
US5570920A (en) 1994-02-16 1996-11-05 Northeastern University Robot arm end effector
US5563798A (en) 1994-04-05 1996-10-08 Applied Materials, Inc. Wafer positioning system
US5504345A (en) 1994-04-14 1996-04-02 Hama Laboratories, Inc. Dual beam sensor and edge detection system and method
US5538385A (en) 1994-06-24 1996-07-23 Kensington Laboratories, Inc. Specimen carrier holder and method of operating it
US5569014A (en) 1994-08-08 1996-10-29 Brooks Automation, Inc. Frog-leg robot having walking-beams
JP3143770B2 (ja) 1994-10-07 2001-03-07 東京エレクトロン株式会社 基板搬送装置
US5711647A (en) 1994-10-17 1998-01-27 Aesop, Inc. Method of and apparatus for locating and orientating a part on a gripper and transferring it to a tool while maintaining location and orientation on the tool
JPH08130207A (ja) 1994-10-31 1996-05-21 Matsushita Electric Ind Co Ltd プラズマ処理装置
KR0152324B1 (ko) * 1994-12-06 1998-12-01 양승택 웨이퍼 측면파지 이송 반도체 제조장치
TW297910B (zh) 1995-02-02 1997-02-11 Tokyo Electron Co Ltd
US5637200A (en) 1995-02-08 1997-06-10 Nobler Technologies, Inc. Compact disk locking apparatus
US5613821A (en) 1995-07-06 1997-03-25 Brooks Automation, Inc. Cluster tool batchloader of substrate carrier
US5664925A (en) 1995-07-06 1997-09-09 Brooks Automation, Inc. Batchloader for load lock
US5588789A (en) 1995-07-06 1996-12-31 Brooks Automation Load arm for load lock
US5609459A (en) 1995-07-06 1997-03-11 Brooks Automation, Inc. Door drive mechanisms for substrate carrier and load lock
US5607276A (en) 1995-07-06 1997-03-04 Brooks Automation, Inc. Batchloader for substrate carrier on load lock
US6098484A (en) 1995-07-10 2000-08-08 Kensington Laboratories, Inc. High torque, low hysteresis, multiple link robot arm mechanism
US5765444A (en) 1995-07-10 1998-06-16 Kensington Laboratories, Inc. Dual end effector, multiple link robot arm system with corner reacharound and extended reach capabilities
US5741113A (en) 1995-07-10 1998-04-21 Kensington Laboratories, Inc. Continuously rotatable multiple link robot arm mechanism
JP2676334B2 (ja) 1995-07-31 1997-11-12 住友重機械工業株式会社 ロボットアーム
US5829811A (en) 1995-08-03 1998-11-03 Skinner, Ii; Frank Raymand Multiposition locking gripper assembly
US5700046A (en) 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
US5733096A (en) 1995-09-13 1998-03-31 Silicon Valley Group, Inc. Multi-stage telescoping structure
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5669644A (en) 1995-11-13 1997-09-23 Kokusai Electric Co., Ltd. Wafer transfer plate
US5647626A (en) 1995-12-04 1997-07-15 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer pickup system
US5746460A (en) 1995-12-08 1998-05-05 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
KR100430885B1 (ko) 1995-12-15 2004-06-16 브룩스 오토메이션 인코퍼레이티드 관절아암을 구비한 물체이송장치
KR0170485B1 (ko) * 1995-12-15 1999-03-30 양승택 웨이퍼 측면파지 이송용 집게의 구동기구
US6102164A (en) 1996-02-28 2000-08-15 Applied Materials, Inc. Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers
US5796066A (en) 1996-03-29 1998-08-18 Lam Research Corporation Cable actuated drive assembly for vacuum chamber
US5870488A (en) 1996-05-07 1999-02-09 Fortrend Engineering Corporation Method and apparatus for prealigning wafers in a wafer sorting system
US5765983A (en) 1996-05-30 1998-06-16 Brooks Automation, Inc. Robot handling apparatus
US6091498A (en) 1996-07-15 2000-07-18 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6024393A (en) 1996-11-04 2000-02-15 Applied Materials, Inc. Robot blade for handling of semiconductor substrate
US5838121A (en) * 1996-11-18 1998-11-17 Applied Materials, Inc. Dual blade robot
US5955858A (en) * 1997-02-14 1999-09-21 Applied Materials, Inc. Mechanically clamping robot wrist
US5944476A (en) 1997-03-26 1999-08-31 Kensington Laboratories, Inc. Unitary specimen prealigner and continuously rotatable multiple link robot arm mechanism
US5980187A (en) 1997-04-16 1999-11-09 Kla-Tencor Corporation Mechanism for transporting semiconductor-process masks
US6059507A (en) 1997-04-21 2000-05-09 Brooks Automation, Inc. Substrate processing apparatus with small batch load lock
US5951770A (en) 1997-06-04 1999-09-14 Applied Materials, Inc. Carousel wafer transfer system
US6139245A (en) 1997-07-11 2000-10-31 Brooks Automation Inc. Robot arm relocation system
US5837059A (en) 1997-07-11 1998-11-17 Brooks Automation, Inc. Automatic positive pressure seal access door
US5882413A (en) 1997-07-11 1999-03-16 Brooks Automation, Inc. Substrate processing apparatus having a substrate transport with a front end extension and an internal substrate buffer
US5893795A (en) 1997-07-11 1999-04-13 Applied Materials, Inc. Apparatus for moving a cassette
US6126380A (en) 1997-08-04 2000-10-03 Creative Design Corporation Robot having a centering and flat finding means
US6155773A (en) * 1997-09-22 2000-12-05 Applied Materials, Inc. Substrate clamping apparatus
US6002840A (en) 1997-09-30 1999-12-14 Brooks Automation Inc. Substrate transport apparatus
US6116848A (en) 1997-11-26 2000-09-12 Brooks Automation, Inc. Apparatus and method for high-speed transfer and centering of wafer substrates
US6257827B1 (en) 1997-12-01 2001-07-10 Brooks Automation Inc. Apparatus and method for transporting substrates
US6082951A (en) 1998-01-23 2000-07-04 Applied Materials, Inc. Wafer cassette load station
US6051845A (en) 1998-03-25 2000-04-18 Applied Materials, Inc. Method and apparatus for selectively marking a semiconductor wafer
US6056504A (en) 1998-06-05 2000-05-02 Applied Materials, Inc. Adjustable frog-leg robot
US6292708B1 (en) 1998-06-11 2001-09-18 Speedfam-Ipec Corporation Distributed control system for a semiconductor wafer processing machine
US6167322A (en) 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
US6187103B1 (en) 1998-08-27 2001-02-13 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for transporting wafers
US6113165A (en) 1998-10-02 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd. Self-sensing wafer holder and method of using
US6283692B1 (en) 1998-12-01 2001-09-04 Applied Materials, Inc. Apparatus for storing and moving a cassette
US6256555B1 (en) 1998-12-02 2001-07-03 Newport Corporation Robot arm with specimen edge gripping end effector
US6094912A (en) 1999-02-12 2000-08-01 Stirling Technology Company Apparatus and method for adaptively controlling moving members within a closed cycle thermal regenerative machine
US6322312B1 (en) * 1999-03-18 2001-11-27 Applied Materials, Inc. Mechanical gripper for wafer handling robots
US6279412B1 (en) 1999-05-19 2001-08-28 Brooks Automation, Inc. Corrosion resistant exoskeleton arm linkage assembly
US6166509A (en) 1999-07-07 2000-12-26 Applied Materials, Inc. Detection system for substrate clamp
US6195619B1 (en) 1999-07-28 2001-02-27 Brooks Automation, Inc. System for aligning rectangular wafers

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108604563A (zh) * 2015-12-14 2018-09-28 川崎重工业株式会社 衬底搬送机器人及其运转方法
CN108604563B (zh) * 2015-12-14 2022-12-06 川崎重工业株式会社 衬底搬送机器人及其运转方法
TWI610397B (zh) * 2016-06-20 2018-01-01 上海新昇半導體科技有限公司 機械手臂及基板的抓取方法
CN109585349A (zh) * 2018-11-23 2019-04-05 中国电子科技集团公司第五十五研究所 一种晶圆传输平台、高压剥离机及其工作方法
CN111941396A (zh) * 2020-08-17 2020-11-17 广东万合新材料科技有限公司 一种旋转式的机械手
CN114433444A (zh) * 2022-04-11 2022-05-06 四川上特科技有限公司 用于晶圆涂覆玻璃粉的盛料转移装置
CN114433444B (zh) * 2022-04-11 2022-07-01 四川上特科技有限公司 用于晶圆涂覆玻璃粉的盛料转移装置

Also Published As

Publication number Publication date
EP1037264A2 (en) 2000-09-20
EP1037264B1 (en) 2008-12-31
US6514033B2 (en) 2003-02-04
US6283701B1 (en) 2001-09-04
JP4808299B2 (ja) 2011-11-02
US6322312B1 (en) 2001-11-27
KR100696027B1 (ko) 2007-03-15
KR20000076907A (ko) 2000-12-26
DE60041217D1 (de) 2009-02-12
US6685422B2 (en) 2004-02-03
JP2000308988A (ja) 2000-11-07
US20020009359A1 (en) 2002-01-24
US20020051704A1 (en) 2002-05-02
EP1037264A3 (en) 2006-01-25

Similar Documents

Publication Publication Date Title
TW461847B (en) Mechanical gripper for wafer handling robots
JP4287589B2 (ja) 装置、クランプ機構、アーム組立体及び方法
EP1041604A3 (en) Pneumatically actuated flexure gripper for wafer handling robots
JP2013030787A5 (zh)
CN207616601U (zh) 一种新型气动夹爪
TW436395B (en) The chuck and suction disk of the plate shaped material
TWI696532B (zh) 把持裝置
TW201522193A (zh) 翻面系統及其所採用之工作臺
CN209774704U (zh) 一种搬运机械手的缓冲装置
CN112276979A (zh) 一种用于工业机器人的抓取装置
US7712808B2 (en) End effector with centering grip
JP2020536633A5 (zh)
CN110239945B (zh) 抓取机构及工件转移装置
JPS61214991A (ja) 産業用ロボツトのハンド装置
CN111656881B (zh) 把持装置和安装装置
JP4147358B2 (ja) ワーク把持装置
JP3089157B2 (ja) ワーク保持装置
CN217345103U (zh) 弹簧加载夹具及应用该夹具的转盘和集成电路操作机
JP2017164866A (ja) 面合わせ機能を備えたロボットハンド及びロボット
CN216152373U (zh) 一种双向自动化机械手气缸
JPH06254627A (ja) 板材加工機のロボットハンド
CN217096278U (zh) 一种栖装件抓取用多功能机械抓手
JP3263462B2 (ja) ワイヤボンディング用ワイヤの把持装置
CN219563162U (zh) 一种输送机械手臂
CN211491571U (zh) 一种用于机械手的末端执行器及取料机械手

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MK4A Expiration of patent term of an invention patent