TW379380B - A carrier head with a flexible membrane for a chemical mechanical polishing system - Google Patents
A carrier head with a flexible membrane for a chemical mechanical polishing system Download PDFInfo
- Publication number
- TW379380B TW379380B TW087107768A TW87107768A TW379380B TW 379380 B TW379380 B TW 379380B TW 087107768 A TW087107768 A TW 087107768A TW 87107768 A TW87107768 A TW 87107768A TW 379380 B TW379380 B TW 379380B
- Authority
- TW
- Taiwan
- Prior art keywords
- drive shaft
- carrying head
- scope
- patent application
- ring
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims description 59
- 239000000126 substance Substances 0.000 title claims description 19
- 239000012528 membrane Substances 0.000 title description 32
- 239000000758 substrate Substances 0.000 claims abstract description 105
- 238000000227 grinding Methods 0.000 claims description 36
- 230000002079 cooperative effect Effects 0.000 claims description 9
- 238000011049 filling Methods 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 2
- 239000002023 wood Substances 0.000 claims description 2
- 239000012530 fluid Substances 0.000 description 11
- 239000010410 layer Substances 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 11
- 239000002002 slurry Substances 0.000 description 9
- 238000011068 loading method Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000005406 washing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000005086 pumping Methods 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011440 grout Substances 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 241000218691 Cupressaceae Species 0.000 description 1
- 241000406668 Loxodonta cyclotis Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001409 amidines Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 210000002808 connective tissue Anatomy 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000796 flavoring agent Substances 0.000 description 1
- 235000019634 flavors Nutrition 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/891,548 US5964653A (en) | 1997-07-11 | 1997-07-11 | Carrier head with a flexible membrane for a chemical mechanical polishing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW379380B true TW379380B (en) | 2000-01-11 |
Family
ID=25398390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW087107768A TW379380B (en) | 1997-07-11 | 1998-05-19 | A carrier head with a flexible membrane for a chemical mechanical polishing system |
Country Status (5)
| Country | Link |
|---|---|
| US (7) | US5964653A (enExample) |
| JP (2) | JP4413421B2 (enExample) |
| KR (1) | KR100513573B1 (enExample) |
| TW (1) | TW379380B (enExample) |
| WO (1) | WO1999002304A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI393209B (zh) * | 2003-02-10 | 2013-04-11 | Ebara Corp | 研磨基板之方法 |
| TWI727056B (zh) * | 2016-07-22 | 2021-05-11 | 日商迪思科股份有限公司 | 研磨裝置 |
Families Citing this family (164)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| FR2778129B1 (fr) * | 1998-05-04 | 2000-07-21 | St Microelectronics Sa | Disque support de membrane d'une machine de polissage et procede de fonctionnement d'une telle machine |
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- 1998-07-10 JP JP2000501870A patent/JP4413421B2/ja not_active Expired - Lifetime
- 1998-07-10 WO PCT/US1998/014032 patent/WO1999002304A1/en not_active Ceased
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2002
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2003
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI393209B (zh) * | 2003-02-10 | 2013-04-11 | Ebara Corp | 研磨基板之方法 |
| TWI727056B (zh) * | 2016-07-22 | 2021-05-11 | 日商迪思科股份有限公司 | 研磨裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001509440A (ja) | 2001-07-24 |
| US20040063385A1 (en) | 2004-04-01 |
| WO1999002304A1 (en) | 1999-01-21 |
| KR100513573B1 (ko) | 2005-09-09 |
| KR20010021732A (ko) | 2001-03-15 |
| US20010041526A1 (en) | 2001-11-15 |
| US20030022609A1 (en) | 2003-01-30 |
| US20050142995A1 (en) | 2005-06-30 |
| JP4413421B2 (ja) | 2010-02-10 |
| US6648740B2 (en) | 2003-11-18 |
| US6277010B1 (en) | 2001-08-21 |
| US6896584B2 (en) | 2005-05-24 |
| US5964653A (en) | 1999-10-12 |
| US6106378A (en) | 2000-08-22 |
| US6506104B2 (en) | 2003-01-14 |
| JP2009255289A (ja) | 2009-11-05 |
| JP5073714B2 (ja) | 2012-11-14 |
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