DE60138343D1 - Substrathalter und Poliervorrichtung - Google Patents

Substrathalter und Poliervorrichtung

Info

Publication number
DE60138343D1
DE60138343D1 DE60138343T DE60138343T DE60138343D1 DE 60138343 D1 DE60138343 D1 DE 60138343D1 DE 60138343 T DE60138343 T DE 60138343T DE 60138343 T DE60138343 T DE 60138343T DE 60138343 D1 DE60138343 D1 DE 60138343D1
Authority
DE
Germany
Prior art keywords
substrate holder
polishing device
polishing
holder
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60138343T
Other languages
English (en)
Inventor
Yoshihiro Gunji
Hozumi Yasuda
Keisuke Namiki
Hiroshi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000280216A external-priority patent/JP3856634B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE60138343D1 publication Critical patent/DE60138343D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60138343T 2000-07-31 2001-07-30 Substrathalter und Poliervorrichtung Expired - Lifetime DE60138343D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000231892 2000-07-31
JP2000280216A JP3856634B2 (ja) 2000-09-14 2000-09-14 基板保持装置及び該基板保持装置を備えたポリッシング装置

Publications (1)

Publication Number Publication Date
DE60138343D1 true DE60138343D1 (de) 2009-05-28

Family

ID=26597077

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60138343T Expired - Lifetime DE60138343D1 (de) 2000-07-31 2001-07-30 Substrathalter und Poliervorrichtung

Country Status (6)

Country Link
US (5) US6890402B2 (de)
EP (2) EP2085181A1 (de)
KR (1) KR100876381B1 (de)
DE (1) DE60138343D1 (de)
SG (4) SG129989A1 (de)
TW (1) TW516991B (de)

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US7118452B2 (en) * 2004-02-12 2006-10-10 The Boeing Company Pneumatically actuated flexible coupling end effectors for lapping/polishing
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US7326105B2 (en) * 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
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JP5464843B2 (ja) * 2007-12-03 2014-04-09 株式会社半導体エネルギー研究所 Ｓｏｉ基板の作製方法
US20090311945A1 (en) * 2008-06-17 2009-12-17 Roland Strasser Planarization System
JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
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US9050700B2 (en) * 2012-01-27 2015-06-09 Applied Materials, Inc. Methods and apparatus for an improved polishing head retaining ring
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CN104870341B (zh) * 2012-10-19 2018-02-06 陶氏环球技术有限责任公司 用于提升和移动可成形的和/或可崩塌的零件的装置、系统和方法
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JP5538601B1 (ja) * 2013-08-22 2014-07-02 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
KR101568177B1 (ko) * 2014-01-21 2015-11-11 주식회사 케이씨텍 화학 기계적 연마 장치용 캐리어 헤드 및 이에 사용되는 리테이너 링
JP6336893B2 (ja) * 2014-11-11 2018-06-06 株式会社荏原製作所 研磨装置
KR102173323B1 (ko) 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
DE102014212176A1 (de) * 2014-06-25 2015-12-31 Siemens Aktiengesellschaft Pulverbettbasiertes additives Fertigungsverfahren und Anlage zur Durchführung dieses Verfahrens
US10510563B2 (en) * 2016-04-15 2019-12-17 Taiwan Semiconductor Manufacturing Company Ltd. Wafer carrier assembly
JP6447575B2 (ja) 2016-05-23 2019-01-09 トヨタ自動車株式会社 金属皮膜の成膜方法およびその成膜装置
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
CN108818294A (zh) * 2018-06-26 2018-11-16 长江存储科技有限责任公司 研磨头、研磨系统及研磨方法
KR20200070825A (ko) * 2018-12-10 2020-06-18 삼성전자주식회사 연마 균일도를 제어할 수 있는 화학 기계적 연마 장치
CN110948385B (zh) * 2019-01-08 2020-08-14 华海清科股份有限公司 一种用于化学机械抛光的弹性膜
CN110497545B (zh) * 2019-08-13 2021-06-08 安徽晶天新能源科技有限责任公司 一种太阳能硅片生产加工工艺
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Also Published As

Publication number Publication date
SG10201706765QA (en) 2017-09-28
SG129989A1 (en) 2007-03-20
KR20020010881A (ko) 2002-02-06
US20080047667A1 (en) 2008-02-28
US20080066862A1 (en) 2008-03-20
US20080299880A1 (en) 2008-12-04
EP2085181A1 (de) 2009-08-05
EP1177859A3 (de) 2003-10-15
EP1177859A2 (de) 2002-02-06
US20050072527A1 (en) 2005-04-07
KR100876381B1 (ko) 2008-12-29
EP1177859B1 (de) 2009-04-15
SG157258A1 (en) 2009-12-29
SG125152A1 (en) 2006-09-29
US7897007B2 (en) 2011-03-01
TW516991B (en) 2003-01-11
US20020017365A1 (en) 2002-02-14
US6890402B2 (en) 2005-05-10

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