SG10201706765QA - Substrate holding apparatus and substrate polishing apparatus - Google Patents
Substrate holding apparatus and substrate polishing apparatusInfo
- Publication number
- SG10201706765QA SG10201706765QA SG10201706765QA SG10201706765QA SG10201706765QA SG 10201706765Q A SG10201706765Q A SG 10201706765QA SG 10201706765Q A SG10201706765Q A SG 10201706765QA SG 10201706765Q A SG10201706765Q A SG 10201706765QA SG 10201706765Q A SG10201706765Q A SG 10201706765QA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- substrate holding
- polishing apparatus
- holding apparatus
- substrate polishing
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 2
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000231892 | 2000-07-31 | ||
JP2000280216A JP3856634B2 (en) | 2000-09-14 | 2000-09-14 | Substrate holding device and polishing apparatus provided with the substrate holding device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201706765QA true SG10201706765QA (en) | 2017-09-28 |
Family
ID=26597077
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200104611-9A SG129989A1 (en) | 2000-07-31 | 2001-07-31 | Substrate holding apparatus and substrate polishing apparatus |
SG200501205A SG125152A1 (en) | 2000-07-31 | 2001-07-31 | Substrate holding apparatus and substrate polishing apparatus |
SG200804145-1A SG157258A1 (en) | 2000-07-31 | 2001-07-31 | Substrate holding apparatus and substrate polishing apparatus |
SG10201706765QA SG10201706765QA (en) | 2000-07-31 | 2014-07-31 | Substrate holding apparatus and substrate polishing apparatus |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200104611-9A SG129989A1 (en) | 2000-07-31 | 2001-07-31 | Substrate holding apparatus and substrate polishing apparatus |
SG200501205A SG125152A1 (en) | 2000-07-31 | 2001-07-31 | Substrate holding apparatus and substrate polishing apparatus |
SG200804145-1A SG157258A1 (en) | 2000-07-31 | 2001-07-31 | Substrate holding apparatus and substrate polishing apparatus |
Country Status (6)
Country | Link |
---|---|
US (5) | US6890402B2 (en) |
EP (2) | EP2085181A1 (en) |
KR (1) | KR100876381B1 (en) |
DE (1) | DE60138343D1 (en) |
SG (4) | SG129989A1 (en) |
TW (1) | TW516991B (en) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PT1098972E (en) * | 1998-07-22 | 2010-12-14 | Smithkline Beecham Ltd | Protein similar to neuroendocrine-specific protein, and encoding cdna |
CN101524826A (en) * | 2001-05-29 | 2009-09-09 | 株式会社荏原制作所 | Substrate carrier system, and method of polishing substrate |
JP2005515904A (en) | 2002-01-22 | 2005-06-02 | マルチ プレイナー テクノロジーズ インコーポレイテッド | Chemical mechanical polishing apparatus and method having a retaining ring with a shaped surface for slurry distribution |
AU2003300375A1 (en) * | 2002-10-11 | 2004-05-04 | Semplastics, L.L.C. | Retaining ring for use on a carrier of a polishing apparatus |
US20040102140A1 (en) * | 2002-11-21 | 2004-05-27 | Wood Jeffrey H. | Contour following end effectors for lapping/polishing |
KR101063432B1 (en) * | 2003-02-10 | 2011-09-07 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate Holding Device and Polishing Device |
WO2005005101A1 (en) * | 2003-07-09 | 2005-01-20 | Peter Wolters Surface Technologies Gmbh & Co. Kg | Holder for flat workpieces, in particular semiconductor wafers for mechanochemical polishing |
JP2005034959A (en) * | 2003-07-16 | 2005-02-10 | Ebara Corp | Polishing device and retainer ring |
US20050126708A1 (en) * | 2003-12-10 | 2005-06-16 | Applied Materials, Inc. | Retaining ring with slurry transport grooves |
US7118452B2 (en) * | 2004-02-12 | 2006-10-10 | The Boeing Company | Pneumatically actuated flexible coupling end effectors for lapping/polishing |
US7429410B2 (en) * | 2004-09-20 | 2008-09-30 | Applied Materials, Inc. | Diffuser gravity support |
EP3043377A1 (en) | 2004-11-01 | 2016-07-13 | Ebara Corporation | Polishing apparatus |
DE102005016411B4 (en) * | 2005-04-08 | 2007-03-29 | IGAM Ingenieurgesellschaft für angewandte Mechanik mbH | Device for high-precision surface processing of a workpiece |
US7326105B2 (en) * | 2005-08-31 | 2008-02-05 | Micron Technology, Inc. | Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces |
KR100898793B1 (en) * | 2005-12-29 | 2009-05-20 | 엘지디스플레이 주식회사 | Substrates bonding device for manufacturing of liquid crystal display |
WO2007143566A2 (en) * | 2006-06-02 | 2007-12-13 | Applied Materials, Inc. | Fast substrate loading on polishing head without membrane inflation step |
US7575504B2 (en) * | 2006-11-22 | 2009-08-18 | Applied Materials, Inc. | Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
JP2008177248A (en) * | 2007-01-16 | 2008-07-31 | Tokyo Seimitsu Co Ltd | Retainer ring for polishing head |
DE102007026292A1 (en) * | 2007-06-06 | 2008-12-11 | Siltronic Ag | Process for one-sided polishing of unstructured semiconductor wafers |
KR100864943B1 (en) * | 2007-08-09 | 2008-10-23 | 세메스 주식회사 | Apparatus for cleaning substrate |
JP5042778B2 (en) * | 2007-10-31 | 2012-10-03 | 信越半導体株式会社 | Work polishing head and polishing apparatus equipped with the polishing head |
JP5464843B2 (en) * | 2007-12-03 | 2014-04-09 | 株式会社半導体エネルギー研究所 | Method for manufacturing SOI substrate |
US20090311945A1 (en) * | 2008-06-17 | 2009-12-17 | Roland Strasser | Planarization System |
JP5390807B2 (en) * | 2008-08-21 | 2014-01-15 | 株式会社荏原製作所 | Polishing method and apparatus |
US8460067B2 (en) * | 2009-05-14 | 2013-06-11 | Applied Materials, Inc. | Polishing head zone boundary smoothing |
CA2693676C (en) | 2010-02-18 | 2011-11-01 | Ncs Oilfield Services Canada Inc. | Downhole tool assembly with debris relief, and method for using same |
JP5648954B2 (en) * | 2010-08-31 | 2015-01-07 | 不二越機械工業株式会社 | Polishing equipment |
CA2766026C (en) | 2010-10-18 | 2015-12-29 | Ncs Oilfield Services Canada Inc. | Tools and methods for use in completion of a wellbore |
KR101775464B1 (en) * | 2011-05-31 | 2017-09-07 | 삼성전자주식회사 | Retainer ring in Chemical Mechanical Polishing machine |
DE102011082777A1 (en) * | 2011-09-15 | 2012-02-09 | Siltronic Ag | Method for double-sided polishing of semiconductor wafer e.g. silicon wafer, involves forming channel-shaped recesses in surface of polishing cloth of semiconductor wafer |
US20130078812A1 (en) * | 2011-09-23 | 2013-03-28 | Strasbaugh | Wafer Carrier with Flexible Pressure Plate |
US9176173B2 (en) * | 2011-11-28 | 2015-11-03 | Texas Instruments Incorporated | Method for detecting imperfect mounting of a rod-shaped metallic object in a metallic hollow shaft and a device |
KR101902049B1 (en) * | 2012-01-25 | 2018-09-27 | 어플라이드 머티어리얼스, 인코포레이티드 | Retaining ring monitoring and control of pressure |
US9050700B2 (en) * | 2012-01-27 | 2015-06-09 | Applied Materials, Inc. | Methods and apparatus for an improved polishing head retaining ring |
CA2798343C (en) | 2012-03-23 | 2017-02-28 | Ncs Oilfield Services Canada Inc. | Downhole isolation and depressurization tool |
CN102672551A (en) * | 2012-05-22 | 2012-09-19 | 江南大学 | Ultrasonic atomization type polishing machine |
US10702972B2 (en) | 2012-05-31 | 2020-07-07 | Ebara Corporation | Polishing apparatus |
JP5976522B2 (en) * | 2012-05-31 | 2016-08-23 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
US9016675B2 (en) * | 2012-07-06 | 2015-04-28 | Asm Technology Singapore Pte Ltd | Apparatus and method for supporting a workpiece during processing |
KR20150070163A (en) * | 2012-10-19 | 2015-06-24 | 다우 글로벌 테크놀로지스 엘엘씨 | Device, system, and method for lifting and moving formable and/or collapsible parts |
US8998676B2 (en) * | 2012-10-26 | 2015-04-07 | Applied Materials, Inc. | Retaining ring with selected stiffness and thickness |
JP5538601B1 (en) * | 2013-08-22 | 2014-07-02 | ミクロ技研株式会社 | Polishing head and polishing processing apparatus |
KR101568177B1 (en) * | 2014-01-21 | 2015-11-11 | 주식회사 케이씨텍 | Retainer ring of carrier head of chemical mechanical apparatus and membrane used therein |
JP6336893B2 (en) * | 2014-11-11 | 2018-06-06 | 株式会社荏原製作所 | Polishing equipment |
KR102173323B1 (en) | 2014-06-23 | 2020-11-04 | 삼성전자주식회사 | Carrier head, chemical mechanical polishing apparatus and wafer polishing method |
DE102014212176A1 (en) * | 2014-06-25 | 2015-12-31 | Siemens Aktiengesellschaft | Powder bed-based additive manufacturing process and apparatus for carrying out this process |
US10510563B2 (en) * | 2016-04-15 | 2019-12-17 | Taiwan Semiconductor Manufacturing Company Ltd. | Wafer carrier assembly |
JP6447575B2 (en) | 2016-05-23 | 2019-01-09 | トヨタ自動車株式会社 | Metal film forming method and film forming apparatus |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
CN108818294A (en) * | 2018-06-26 | 2018-11-16 | 长江存储科技有限责任公司 | grinding head, grinding system and grinding method |
KR20200070825A (en) * | 2018-12-10 | 2020-06-18 | 삼성전자주식회사 | chemical mechanical polishing apparatus for controlling polishing uniformity |
CN110948385B (en) * | 2019-01-08 | 2020-08-14 | 华海清科股份有限公司 | Elastic membrane for chemical mechanical polishing |
CN110497545B (en) * | 2019-08-13 | 2021-06-08 | 安徽晶天新能源科技有限责任公司 | Production and processing technology of solar silicon wafer |
US11325223B2 (en) * | 2019-08-23 | 2022-05-10 | Applied Materials, Inc. | Carrier head with segmented substrate chuck |
Family Cites Families (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5146259A (en) * | 1988-06-30 | 1992-09-08 | Asahi Kogaku Kogyo Kabushiki Kaisha | Electronically controlled camera including automatic shutter speed changing apparatus |
JPH0569310A (en) | 1991-04-23 | 1993-03-23 | Mitsubishi Materials Corp | Device for grinding mirror surface of wafer |
US5643053A (en) * | 1993-12-27 | 1997-07-01 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved polishing control |
JP3257304B2 (en) | 1994-11-24 | 2002-02-18 | 三菱マテリアル株式会社 | Polishing equipment |
JP3158934B2 (en) | 1995-02-28 | 2001-04-23 | 三菱マテリアル株式会社 | Wafer polishing equipment |
JP3690837B2 (en) | 1995-05-02 | 2005-08-31 | 株式会社荏原製作所 | Polishing apparatus and method |
US5643061A (en) * | 1995-07-20 | 1997-07-01 | Integrated Process Equipment Corporation | Pneumatic polishing head for CMP apparatus |
US5695392A (en) * | 1995-08-09 | 1997-12-09 | Speedfam Corporation | Polishing device with improved handling of fluid polishing media |
JP3724869B2 (en) * | 1995-10-09 | 2005-12-07 | 株式会社荏原製作所 | Polishing apparatus and method |
US5762539A (en) | 1996-02-27 | 1998-06-09 | Ebara Corporation | Apparatus for and method for polishing workpiece |
US6595831B1 (en) * | 1996-05-16 | 2003-07-22 | Ebara Corporation | Method for polishing workpieces using fixed abrasives |
US6146259A (en) * | 1996-11-08 | 2000-11-14 | Applied Materials, Inc. | Carrier head with local pressure control for a chemical mechanical polishing apparatus |
US5941758A (en) * | 1996-11-13 | 1999-08-24 | Intel Corporation | Method and apparatus for chemical-mechanical polishing |
JPH10178087A (en) | 1996-12-17 | 1998-06-30 | Tokyo Seimitsu Co Ltd | Wafer suction table |
US5851140A (en) * | 1997-02-13 | 1998-12-22 | Integrated Process Equipment Corp. | Semiconductor wafer polishing apparatus with a flexible carrier plate |
US6056632A (en) * | 1997-02-13 | 2000-05-02 | Speedfam-Ipec Corp. | Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
US6077385A (en) * | 1997-04-08 | 2000-06-20 | Ebara Corporation | Polishing apparatus |
JP3724911B2 (en) * | 1997-04-08 | 2005-12-07 | 株式会社荏原製作所 | Polishing equipment |
US5957751A (en) * | 1997-05-23 | 1999-09-28 | Applied Materials, Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
US5891791A (en) * | 1997-05-27 | 1999-04-06 | Micron Technology, Inc. | Contamination free source for shallow low energy junction implants |
US5964653A (en) | 1997-07-11 | 1999-10-12 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
KR19990030719A (en) * | 1997-10-04 | 1999-05-06 | 로버트 에이치. 씨. 챠오 | Retainer Ring for Polishing Head of CMP Equipment |
US5967885A (en) * | 1997-12-01 | 1999-10-19 | Lucent Technologies Inc. | Method of manufacturing an integrated circuit using chemical mechanical polishing |
KR100495717B1 (en) * | 1997-12-01 | 2005-09-30 | 루센트 테크놀러지스 인크 | A method of manufacturing an integtated circuit using chemical mechanical polishing and a chemical mechanical polishing system |
US5951382A (en) * | 1997-12-01 | 1999-09-14 | Lucent Technologies Inc. | Chemical mechanical polishing carrier fixture and system |
JP3006568B2 (en) * | 1997-12-04 | 2000-02-07 | 日本電気株式会社 | Wafer polishing apparatus and polishing method |
US6116992A (en) * | 1997-12-30 | 2000-09-12 | Applied Materials, Inc. | Substrate retaining ring |
JPH11267857A (en) | 1998-03-18 | 1999-10-05 | Daido Steel Co Ltd | Friction joining method |
US6436228B1 (en) * | 1998-05-15 | 2002-08-20 | Applied Materials, Inc. | Substrate retainer |
JPH11333712A (en) * | 1998-05-21 | 1999-12-07 | Nikon Corp | Polishing head and polishing device using it |
US6146260A (en) * | 1998-08-03 | 2000-11-14 | Promos Technology, Inc. | Polishing machine |
JP2000124173A (en) | 1998-10-16 | 2000-04-28 | Hitachi Ltd | Manufacture for semiconductor device |
US6159073A (en) * | 1998-11-02 | 2000-12-12 | Applied Materials, Inc. | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
US6422927B1 (en) * | 1998-12-30 | 2002-07-23 | Applied Materials, Inc. | Carrier head with controllable pressure and loading area for chemical mechanical polishing |
JP2000223447A (en) | 1999-02-01 | 2000-08-11 | Nikon Corp | Polishing head, polishing device, and polishing method |
TW467795B (en) * | 1999-03-15 | 2001-12-11 | Mitsubishi Materials Corp | Wafer transporting device, wafer polishing device and method for making wafers |
US6227955B1 (en) * | 1999-04-20 | 2001-05-08 | Micron Technology, Inc. | Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
US6450868B1 (en) * | 2000-03-27 | 2002-09-17 | Applied Materials, Inc. | Carrier head with multi-part flexible membrane |
US6722965B2 (en) * | 2000-07-11 | 2004-04-20 | Applied Materials Inc. | Carrier head with flexible membranes to provide controllable pressure and loading area |
US6857945B1 (en) * | 2000-07-25 | 2005-02-22 | Applied Materials, Inc. | Multi-chamber carrier head with a flexible membrane |
US6419567B1 (en) * | 2000-08-14 | 2002-07-16 | Semiconductor 300 Gmbh & Co. Kg | Retaining ring for chemical-mechanical polishing (CMP) head, polishing apparatus, slurry cycle system, and method |
US6527625B1 (en) * | 2000-08-31 | 2003-03-04 | Multi-Planar Technologies, Inc. | Chemical mechanical polishing apparatus and method having a soft backed polishing head |
CN103945881B (en) * | 2011-09-27 | 2016-05-18 | Shl集团有限责任公司 | There is initial lock state, the centre note medical delivery device to state and drug delivery state |
-
2001
- 2001-07-30 EP EP09005308A patent/EP2085181A1/en not_active Withdrawn
- 2001-07-30 DE DE60138343T patent/DE60138343D1/en not_active Expired - Lifetime
- 2001-07-30 EP EP01117745A patent/EP1177859B1/en not_active Expired - Lifetime
- 2001-07-31 US US09/917,732 patent/US6890402B2/en not_active Expired - Lifetime
- 2001-07-31 KR KR1020010046378A patent/KR100876381B1/en active IP Right Grant
- 2001-07-31 SG SG200104611-9A patent/SG129989A1/en unknown
- 2001-07-31 SG SG200501205A patent/SG125152A1/en unknown
- 2001-07-31 SG SG200804145-1A patent/SG157258A1/en unknown
- 2001-07-31 TW TW090118572A patent/TW516991B/en not_active IP Right Cessation
-
2004
- 2004-10-26 US US10/972,579 patent/US20050072527A1/en not_active Abandoned
-
2007
- 2007-10-15 US US11/907,590 patent/US20080047667A1/en not_active Abandoned
- 2007-10-30 US US11/979,019 patent/US20080066862A1/en not_active Abandoned
-
2008
- 2008-06-10 US US12/136,424 patent/US7897007B2/en not_active Expired - Fee Related
-
2014
- 2014-07-31 SG SG10201706765QA patent/SG10201706765QA/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20080047667A1 (en) | 2008-02-28 |
US20080299880A1 (en) | 2008-12-04 |
SG129989A1 (en) | 2007-03-20 |
US7897007B2 (en) | 2011-03-01 |
SG125152A1 (en) | 2006-09-29 |
TW516991B (en) | 2003-01-11 |
US20050072527A1 (en) | 2005-04-07 |
US20020017365A1 (en) | 2002-02-14 |
US20080066862A1 (en) | 2008-03-20 |
EP2085181A1 (en) | 2009-08-05 |
EP1177859B1 (en) | 2009-04-15 |
EP1177859A2 (en) | 2002-02-06 |
EP1177859A3 (en) | 2003-10-15 |
SG157258A1 (en) | 2009-12-29 |
KR100876381B1 (en) | 2008-12-29 |
DE60138343D1 (en) | 2009-05-28 |
KR20020010881A (en) | 2002-02-06 |
US6890402B2 (en) | 2005-05-10 |
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