CN102672551A - Ultrasonic atomization type polishing machine - Google Patents
Ultrasonic atomization type polishing machine Download PDFInfo
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- CN102672551A CN102672551A CN2012101598333A CN201210159833A CN102672551A CN 102672551 A CN102672551 A CN 102672551A CN 2012101598333 A CN2012101598333 A CN 2012101598333A CN 201210159833 A CN201210159833 A CN 201210159833A CN 102672551 A CN102672551 A CN 102672551A
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- ultrasonic atomization
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Abstract
The invention relates to an ultrasonic atomization type polishing machine which comprises a base, wherein a concave structure is formed in the middle of the base; a polishing pad is mounted on the concave structure through a fastening part; exhaust pipes are arranged at two ends of the bottom of the polishing pad; a liquid-guiding pressurizing device for machining products is mounted on the upper part of the polishing pad; atomized polishing liquid is input into the liquid-guiding pressurizing device through a pipeline; and a housing is hermetically mounted at the top of the base. The ultrasonic atomization type polishing machine is simple in structure and convenient in manufacturing and mounting; a negative pressure working principle is adopted by the polishing machine; the polishing liquid is atomized by an ultrasonic atomizer; the atomized polishing liquid is input into the liquid-guiding pressurizing device through the pipeline; the surface polishing machining of products is conveniently realized; the usage of the polishing liquid is reduced; a sealing space is adopted; the use ratio of the polishing liquid is increased; and the production cost is lowered.
Description
Technical field
The present invention relates to the polishing technology field, especially a kind of ultrasonic atomization type polishing machine.
Background technology
Integrated circuit is a kind of microelectronic device or parts, has become the core technology of information industry and new high-tech industry.Its chip volume is little, from the micron to the nanoscale, reduces gradually, to satisfy the requirement that integrated circuit high speed, highly integrated, densification and high performance direction develop.Chip surface requires the process technology of overall situation and partial situation's flatness usually.In the prior art; Usually adopt chemically mechanical polishing (chemical mechanical polishing; CMP) be also referred to as the cmp technology; Be to utilize the slurry and the surface of the work that mix by minute abrasive and chemical solution that the chemical bond that serial chemical reaction changes surface of the work takes place, generate the low shear strength product of removing easily, pass through the mechanism of macromolecule polishing pad again; Remove layer of material as thin as a wafer from surface of the work, thereby obtain high accuracy low roughness not damaged smooth surface.Equipment and running stores that chemical Mechanical Polishing Technique adopted comprise: CMP equipment, polishing fluid, polishing pad, back cleaning equipment, polishing end point checkout equipment etc.The precision of material surface planarization depends on polishing fluid, thereby polishing fluid is the deciding factor that influences CMP global planarization quality, and it had both influenced the chemical action process, influenced the mechanism process again.
Polishing machine of the prior art adopts following structure: comprise a workbench; Said workbench supports rotation through rotating shaft; On the said workbench polishing pad is installed; Said polishing pad top is provided with the clamping head of processing chip, and said clamping head supports rotation through axle, and the head of said clamping head is equipped with notacoria; Being positioned at polishing pad top one side has polishing fluid through transport output, and said polishing fluid flows on the polishing pad.It is simple in structure, and is easy to operate, but also has following shortcoming:
(1) its polishing fluid is the form entering polishing interface with fluid; Usually polishing pad is to have certain flexible organic fabric; The selectivity of during polishing the product surface material being removed is not high, and long-term use is prone to defectives such as excessive polishing, depression, nitride abrasion;
(2) its workbench becomes open type, and polishing fluid is the polishing spray film that strong basicity, polishing spray film have strong adsorptivity and participate in reaction and can not be recovered fully, and use cost is high;
(3) its pressue device and drainage set are distributed in two positions of workbench respectively, during work, work alone respectively, need to pass through two starting drives simultaneously with two covering devices, and not only device is complicated, has improved cost.
Summary of the invention
The applicant is low to polishing fluid utilization rate in the above-mentioned existing production technology; Shortcomings such as burnishing device complicacy; Ultrasonic atomization type polishing machine a kind of rational in infrastructure, easy to operate is provided, polishing fluid is carried out ultrasonic finer atomization; Adopt the drain pressue device will polish spray film importing polishing interface and polish, form the ultra smart nanoscale of smooth not damaged surface at last.
The technical scheme that the present invention adopted is following:
A kind of ultrasonic atomization type polishing machine; Comprise base; Said base middle part concavity structure is equipped with polishing pad through securing member on the said concave structure, and two ends, said polishing pad bottom are provided with exhaust tube; Said polishing pad top is equipped with the drain pressue device of converted products, the polishing fluid that said drain pressue device has atomized through the pipeline input; Said base top is sealed and installed with case;
The structure of said drain pressue device is: comprise a cylinder-shaped thin wall outer cover, and the inner formation of said cylinder-shaped thin wall outer cover supporting region, bulge-structure is arranged in said outer cover bottom, and said bulge-structure bottom has to place carries kind circular groove of dish; A newel is extended at said bulge-structure middle part in outer cover, be nested with a plurality of pressure blocks on the said newel; Be equipped with division board on the bulge-structure of said outer cover bottom; Have uniform through hole on the said division board, one grade of cover is installed in said division board bottom, has groove on the cylindrical wall of said shelves cover; The bottom waviness structure of shelves cover; Through sealing ring case is installed on the said outer cover outer circumference surface, the circumferential periphery flanging of said case covers institute's recessing with shelves and matches, and forms confined space; Cylindrical side Monday of outer cover also is provided with an introducing port.
Its further technical scheme is:
Said case becomes rectangular structure, and the front end and the side that are positioned at case are respectively arranged with glass door (7), and said glass door passes through bolted;
Said cylinder-shaped thin wall outer cover top is provided with openable seal cover.
Beneficial effect of the present invention is following:
The present invention is simple in structure; Make with easy for installation, polishing machine adopts negative pressure duty principle, through ultrasonic atomizer polishing fluid is atomized; The polishing fluid that will atomize through pipeline is input to the introducing port of drain pressue device, can realize product surface polishing processing easily.The present invention has reduced the use amount of polishing fluid, adopts seal cavity, has improved the utilization rate of polishing fluid, reduces manufacturing cost.
Description of drawings
Fig. 1 is the structural representation of polishing system of the present invention.
Fig. 2 is the full sectional view of polishing machine of the present invention.
Fig. 3 is the full sectional view of drain pressue device in the polishing machine of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described.
Ultrasonic atomization type polishing machine of the present invention; Be applied in the polishing system, as shown in Figure 1, comprise polishing machine 2; Polishing machine 2 passes on left pipeline and connects an air compressor 1; Polishing machine 2 right sides are useful on the tank 3 and the ultrapure water machine 5 that deionized water is provided of cooling through pipeline output, ultrapure water machine 5 can also be in order to filter and to reclaim polishing fluid, and the rear side that is positioned at polishing machine 2 is connected with ultrasonic ultrasonic delay line memory 4 through pipeline.
As shown in Figure 2; Polishing machine 2 comprises base 13, and base 13 middle part concavity structures are equipped with polishing pad 11 through bolt on the concave structure; Two ends, polishing pad 11 bottom are provided with the exhaust tube 12 that links to each other with air compressor 1; Polishing pad 11 tops are equipped with the drain pressue device 9 of converted products, and drain pressue device 9 is integral the formula structure, the polishing fluid that a side of drain pressue device 9 has atomized through pipeline 10 inputs; Base 13 top seals are equipped with case 6,6 one-tenth rectangular structure of case, and the front end and the side that are positioned at case 6 are respectively arranged with glass door 7, and glass door 7 is fastening through bolt 8, and glass door 7 is convenient to the observation of processing situation in the confined space.
As shown in Figure 3, the structure of drain pressue device 9 is: comprise a cylinder-shaped thin wall outer cover 15, and cylinder-shaped thin wall outer cover 15 inner formation supporting regions, bulge-structure is arranged in outer cover 15 bottoms, and the bulge-structure bottom has to place carries the circular groove 16 that appearance is coiled; A newel 14 is extended at the bulge-structure middle part in outer cover 15; Be nested with a plurality of pressure blocks (not drawing among the figure) on the newel 14; Outer cover 15 tops are provided with openable seal cover (not drawing among the figure), prevent the polishing fluid corrosion that pressure block (not drawing among the figure) has been atomized; Be equipped with division board 20 on the bulge-structure of outer cover 15 bottoms; Have uniform through hole on the division board 20, one grade of cover 21 is installed in division board 20 bottoms, has groove on the cylindrical wall of shelves cover 21; The bottom waviness structure of shelves cover 21; Through sealing ring 17 case 19 is installed on outer cover 15 outer circumference surfaces, 21 recessing matched in clearance of the circumferential periphery flanging of case 19 and shelves cover, and form confined space; Can move up and down when being connected between shelves cover 21 and the case 19, shelves cover 21 bottom wavy shaped configuration are contacted with polishing pad, reduce the frictional resistance of polishing pad, prolong the service life of polishing pad; The use of sealing ring 17 has prevented that effectively the polishing fluid that has atomized from getting into outer cover 15 inner supporting regions and corroding pressure block.Cylindrical side Monday of outer cover 15 also is provided with an introducing port 18.
Operation principle of the present invention is following: at first utilize air compressor 1 through the exhaust tube 12 that is attached thereto with part pumping air in the polishing machine 2, cause case 6 internal gas pressures to be lower than external pressure, make polishing machine 2 form negative pressure; Newel 14 in the outer cover 15 is used for loading and the fixation pressure piece, increases pressure block and makes it fill supporting region gradually, the polishing fluid that introducing port 18 has atomized through pipeline 10 inputs; Because action of negative pressure; The polishing fluid that has atomized gets into case 19 fast and forms in the confined space with shelves cover 21, and along with the polishing fluid that has atomized constantly imports, the pressure on the division board 20 increases gradually; The polishing fluid that has atomized passes 20 of division boards uniformly and opens the hole; Enter into a year appearance dish and bear district's (being bulge-structure bottom institute opened round groove 16), thereby be adsorbed onto on the polishing pad 11, at the polishing interface; Chemical substance in the polishing fluid that has atomized and silicon chip generation chemical reaction; And through the mechanical grinding effect of abrasive particle in the polishing fluid that has atomized reactant is removed, promptly under the alternating action of chemical reaction and mechanical grinding, form the ultra-smooth precision surface.Because polishing machine 2 has adopted the sealing of case 6 to install, the polishing fluid that has atomized can not spread significantly, the sliding friction that produces in the time of can reducing polishing pad 11 runnings simultaneously.
Air compressor 1 of the present invention, tank 3, ultrasonic ultrasonic delay line memory 4 is the commercial goods with ultrapure water machine 5.
More than describing is to explanation of the present invention, is not that institute of the present invention restricted portion within protection scope of the present invention, can be done any type of modification referring to claim to the qualification of invention.
Claims (3)
1. ultrasonic atomization type polishing machine; It is characterized in that: comprise base (13); Said base (13) middle part concavity structure is equipped with polishing pad (11) through securing member on the said concave structure, and two ends, said polishing pad (11) bottom are provided with exhaust tube (12); Said polishing pad (11) top is equipped with the drain pressue device (9) of converted products, the polishing fluid that said drain pressue device (9) has atomized through pipeline (10) input; Said base (13) top seal is equipped with case (6);
The structure of said drain pressue device (9) is: comprise a cylinder-shaped thin wall outer cover (15); The inner formation of said cylinder-shaped thin wall outer cover (15) supporting region; Bulge-structure is arranged in said outer cover (15) bottom, and said bulge-structure bottom has places the circular groove (16) that carries the appearance dish; A newel (14) is extended at said bulge-structure middle part in outer cover (15), said newel is nested with a plurality of pressure blocks on (14); Be equipped with division board (20) on the bulge-structure of said outer cover (15) bottom; Said division board has uniform through hole on (20); One grade of cover (21) is installed in said division board (20) bottom; Have groove on the cylindrical wall of said shelves covers (21), the bottom waviness structure of shelves covers (21) is installed case (19) through sealing ring (17) on said outer cover (15) outer circumference surface; The circumferential periphery flanging of said case (19) covers the recessing of (21) institute with shelves and matches, and forms confined space; Cylindrical side Monday of outer cover (15) also is provided with an introducing port (18).
2. ultrasonic atomization type polishing machine as claimed in claim 1 is characterized in that: said case (6) becomes rectangular structure, and the front end and the side that are positioned at case (6) are respectively arranged with glass door (7), and said glass door (7) is fastening through bolt (8).
3. ultrasonic atomization type polishing machine as claimed in claim 1 is characterized in that: said cylinder-shaped thin wall outer cover (15) top is provided with openable seal cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101598333A CN102672551A (en) | 2012-05-22 | 2012-05-22 | Ultrasonic atomization type polishing machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101598333A CN102672551A (en) | 2012-05-22 | 2012-05-22 | Ultrasonic atomization type polishing machine |
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| CN102672551A true CN102672551A (en) | 2012-09-19 |
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| CN2012101598333A Pending CN102672551A (en) | 2012-05-22 | 2012-05-22 | Ultrasonic atomization type polishing machine |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104017501A (en) * | 2014-06-12 | 2014-09-03 | 江南大学 | Ultrasonic atomization-type polishing solution suitable for TFT-LCD (Thin Film Transistor-Liquid Crystal Display) glass substrate |
| CN108381378A (en) * | 2018-02-01 | 2018-08-10 | 北京派克贸易有限责任公司 | A kind of atomization ultrasound polishing method based on GaAs wafers |
| CN110883699A (en) * | 2019-11-30 | 2020-03-17 | 湖南云箭集团有限公司 | Ultrasonic atomization polishing device for surface of 3D printed piece |
| CN110885980A (en) * | 2019-11-13 | 2020-03-17 | 蚌埠学院 | Metal surface polishing device and method after fuse deposition |
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| US6287192B1 (en) * | 1998-06-23 | 2001-09-11 | Samsung Electronics Co., Ltd. | Slurry supply system for chemical mechanical polishing process having sonic wave generator |
| EP1177859A2 (en) * | 2000-07-31 | 2002-02-06 | Ebara Corporation | Substrate holding apparatus and substrate polishing apparatus |
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| CN201227778Y (en) * | 2008-06-02 | 2009-04-29 | 青岛理工大学 | Grinding fluid atomizing fluidic device |
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2012
- 2012-05-22 CN CN2012101598333A patent/CN102672551A/en active Pending
Patent Citations (6)
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| CN1135397A (en) * | 1995-01-25 | 1996-11-13 | 日本电气株式会社 | Chip-polishing device |
| US5931725A (en) * | 1996-07-30 | 1999-08-03 | Tokyo Seimitsu Co., Ltd. | Wafer polishing machine |
| US6287192B1 (en) * | 1998-06-23 | 2001-09-11 | Samsung Electronics Co., Ltd. | Slurry supply system for chemical mechanical polishing process having sonic wave generator |
| EP1177859A2 (en) * | 2000-07-31 | 2002-02-06 | Ebara Corporation | Substrate holding apparatus and substrate polishing apparatus |
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| 翟靖，李庆忠: "一种使用超声波精细雾化的SiO2抛光液", 《半导体先进制造技术》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104017501A (en) * | 2014-06-12 | 2014-09-03 | 江南大学 | Ultrasonic atomization-type polishing solution suitable for TFT-LCD (Thin Film Transistor-Liquid Crystal Display) glass substrate |
| CN108381378A (en) * | 2018-02-01 | 2018-08-10 | 北京派克贸易有限责任公司 | A kind of atomization ultrasound polishing method based on GaAs wafers |
| CN110885980A (en) * | 2019-11-13 | 2020-03-17 | 蚌埠学院 | Metal surface polishing device and method after fuse deposition |
| CN110883699A (en) * | 2019-11-30 | 2020-03-17 | 湖南云箭集团有限公司 | Ultrasonic atomization polishing device for surface of 3D printed piece |
| CN110883699B (en) * | 2019-11-30 | 2021-07-23 | 湖南云箭集团有限公司 | Ultrasonic atomization polishing device for surface of 3D printed piece |
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Application publication date: 20120919 |