DE60138343D1 - Substrate holder and polishing apparatus - Google Patents

Substrate holder and polishing apparatus

Info

Publication number
DE60138343D1
DE60138343D1 DE2001638343 DE60138343A DE60138343D1 DE 60138343 D1 DE60138343 D1 DE 60138343D1 DE 2001638343 DE2001638343 DE 2001638343 DE 60138343 A DE60138343 A DE 60138343A DE 60138343 D1 DE60138343 D1 DE 60138343D1
Authority
DE
Grant status
Grant
Patent type
Prior art keywords
substrate holder
polishing apparatus
polishing
apparatus
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE2001638343
Other languages
German (de)
Inventor
Yoshihiro Gunji
Hozumi Yasuda
Keisuke Namiki
Hiroshi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/30Work carriers for single side lapping of plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/30Work carriers for single side lapping of plane surfaces
    • B24B37/32Retaining rings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
DE2001638343 2000-07-31 2001-07-30 Substrate holder and polishing apparatus Active DE60138343D1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000231892 2000-07-31
JP2000280216A JP3856634B2 (en) 2000-09-14 2000-09-14 Polishing apparatus having a substrate holding apparatus and a substrate holding device

Publications (1)

Publication Number Publication Date
DE60138343D1 true DE60138343D1 (en) 2009-05-28

Family

ID=26597077

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2001638343 Active DE60138343D1 (en) 2000-07-31 2001-07-30 Substrate holder and polishing apparatus

Country Status (4)

Country Link
US (5) US6890402B2 (en)
EP (2) EP2085181A1 (en)
KR (1) KR100876381B1 (en)
DE (1) DE60138343D1 (en)

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US7575504B2 (en) * 2006-11-22 2009-08-18 Applied Materials, Inc. Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly
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KR100864943B1 (en) * 2007-08-09 2008-10-23 세메스 주식회사 Apparatus for cleaning substrate
JP5042778B2 (en) * 2007-10-31 2012-10-03 不二越機械工業株式会社 Polishing apparatus having a workpiece polishing head and the polishing head
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KR101775464B1 (en) * 2011-05-31 2017-09-07 삼성전자주식회사 Retainer ring in Chemical Mechanical Polishing machine
DE102011082777A1 (en) * 2011-09-15 2012-02-09 Siltronic Ag Method for double-sided polishing of semiconductor wafer e.g. silicon wafer, involves forming channel-shaped recesses in surface of polishing cloth of semiconductor wafer
US20130078812A1 (en) * 2011-09-23 2013-03-28 Strasbaugh Wafer Carrier with Flexible Pressure Plate
US9176173B2 (en) * 2011-11-28 2015-11-03 Texas Instruments Incorporated Method for detecting imperfect mounting of a rod-shaped metallic object in a metallic hollow shaft and a device
WO2013112764A1 (en) * 2012-01-25 2013-08-01 Applied Materials, Inc. Retaining ring monitoring and control of pressure
US9050700B2 (en) * 2012-01-27 2015-06-09 Applied Materials, Inc. Methods and apparatus for an improved polishing head retaining ring
US8931559B2 (en) 2012-03-23 2015-01-13 Ncs Oilfield Services Canada, Inc. Downhole isolation and depressurization tool
CN102672551A (en) * 2012-05-22 2012-09-19 江南大学 Ultrasonic atomization type polishing machine
JP5976522B2 (en) * 2012-05-31 2016-08-23 株式会社荏原製作所 Polishing apparatus and a polishing method
US9016675B2 (en) * 2012-07-06 2015-04-28 Asm Technology Singapore Pte Ltd Apparatus and method for supporting a workpiece during processing
DE112013005049T5 (en) * 2012-10-19 2015-08-06 Dow Global Technologies Llc Apparatus, system and method for lifting and moving formable and / or foldable parts
US8998676B2 (en) * 2012-10-26 2015-04-07 Applied Materials, Inc. Retaining ring with selected stiffness and thickness
JP5538601B1 (en) * 2013-08-22 2014-07-02 ミクロ技研株式会社 Polishing head and a polishing apparatus
KR101568177B1 (en) * 2014-01-21 2015-11-11 주식회사 케이씨텍 Retainer ring of carrier head of chemical mechanical apparatus and membrane used therein
KR20160000054A (en) 2014-06-23 2016-01-04 삼성전자주식회사 Carrier head, chemical mechanical polishing apparatus and wafer polishing method
JP6336893B2 (en) * 2014-11-11 2018-06-06 株式会社荏原製作所 Polishing apparatus
JP2017210634A (en) * 2016-05-23 2017-11-30 トヨタ自動車株式会社 Method for forming metallic film and film formation device therefor

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US5941758A (en) * 1996-11-13 1999-08-24 Intel Corporation Method and apparatus for chemical-mechanical polishing
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US6056632A (en) * 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
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Also Published As

Publication number Publication date Type
EP2085181A1 (en) 2009-08-05 application
EP1177859A3 (en) 2003-10-15 application
US20080047667A1 (en) 2008-02-28 application
US7897007B2 (en) 2011-03-01 grant
US20080066862A1 (en) 2008-03-20 application
EP1177859B1 (en) 2009-04-15 grant
EP1177859A2 (en) 2002-02-06 application
US20020017365A1 (en) 2002-02-14 application
KR20020010881A (en) 2002-02-06 application
US20080299880A1 (en) 2008-12-04 application
US6890402B2 (en) 2005-05-10 grant
KR100876381B1 (en) 2008-12-29 grant
US20050072527A1 (en) 2005-04-07 application

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Legal Events

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8364 No opposition during term of opposition