DE60041674D1 - Abrichtvorrichtung und Poliervorrichtung - Google Patents

Abrichtvorrichtung und Poliervorrichtung

Info

Publication number
DE60041674D1
DE60041674D1 DE60041674T DE60041674T DE60041674D1 DE 60041674 D1 DE60041674 D1 DE 60041674D1 DE 60041674 T DE60041674 T DE 60041674T DE 60041674 T DE60041674 T DE 60041674T DE 60041674 D1 DE60041674 D1 DE 60041674D1
Authority
DE
Germany
Prior art keywords
dressing
polishing
polishing device
dressing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60041674T
Other languages
English (en)
Inventor
Satoshi Wakayabashi
Kuniaki Yamaguchi
Tetsuji Togawa
Nobuyuki Takada
Osamu Nabeya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE60041674D1 publication Critical patent/DE60041674D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE60041674T 1999-05-17 2000-05-17 Abrichtvorrichtung und Poliervorrichtung Expired - Lifetime DE60041674D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13608799 1999-05-17
JP2000107011A JP4030247B2 (ja) 1999-05-17 2000-04-07 ドレッシング装置及びポリッシング装置

Publications (1)

Publication Number Publication Date
DE60041674D1 true DE60041674D1 (de) 2009-04-16

Family

ID=26469766

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60041674T Expired - Lifetime DE60041674D1 (de) 1999-05-17 2000-05-17 Abrichtvorrichtung und Poliervorrichtung

Country Status (6)

Country Link
US (1) US6609962B1 (de)
EP (1) EP1055486B8 (de)
JP (1) JP4030247B2 (de)
KR (2) KR100709766B1 (de)
DE (1) DE60041674D1 (de)
TW (1) TW467793B (de)

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JP3862911B2 (ja) * 2000-02-07 2006-12-27 株式会社荏原製作所 研磨装置
US6409580B1 (en) * 2001-03-26 2002-06-25 Speedfam-Ipec Corporation Rigid polishing pad conditioner for chemical mechanical polishing tool
DE60121292T2 (de) 2001-04-02 2007-07-05 Infineon Technologies Ag Verfahren zur Konditionierung der Oberfläche eines Polierkissens
KR100462868B1 (ko) * 2001-06-29 2004-12-17 삼성전자주식회사 반도체 폴리싱 장치의 패드 컨디셔너
US6878045B2 (en) 2001-07-24 2005-04-12 Honeywell International Incorporated Ultrasonic conditioning device cleaner for chemical mechanical polishing systems
JP2003048147A (ja) * 2001-07-31 2003-02-18 Applied Materials Inc 研磨パッドのコンディショニング装置及びこれを用いた研磨装置
US6899592B1 (en) * 2002-07-12 2005-05-31 Ebara Corporation Polishing apparatus and dressing method for polishing tool
US20040157529A1 (en) * 2003-02-07 2004-08-12 Antenen Research Co. Apparatus for maintaining constant force between a finishing tool and a workpiece
DE10324429B4 (de) * 2003-05-28 2010-08-19 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Betreiben eines chemisch-mechanischen Polier Systems mittels eines Sensorsignals eines Polierkissenkonditionierers
WO2004106000A1 (en) * 2003-05-28 2004-12-09 Advanced Micro Devices, Inc. A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
KR100536347B1 (ko) * 2003-06-12 2005-12-12 동부아남반도체 주식회사 폴리싱 패드 컨디셔너 디스크의 오작동 감지장치 및감지방법
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DE10345381B4 (de) 2003-09-30 2013-04-11 Advanced Micro Devices, Inc. Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers
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JP5927083B2 (ja) * 2012-08-28 2016-05-25 株式会社荏原製作所 ドレッシングプロセスの監視方法および研磨装置
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KR102116595B1 (ko) 2013-12-20 2020-06-05 에이비 엘렉트로룩스 먼지통
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CN114668335A (zh) 2014-12-12 2022-06-28 伊莱克斯公司 侧刷和机器人吸尘器
WO2016093963A1 (en) * 2014-12-12 2016-06-16 Applied Materials, Inc. System and process for in situ byproduct removal and platen cooling during cmp
KR102339531B1 (ko) 2014-12-16 2021-12-16 에이비 엘렉트로룩스 로봇 청소 장치를 위한 경험-기반의 로드맵
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EP3282912B1 (de) 2015-04-17 2020-06-10 Aktiebolaget Electrolux Reinigungsroboter und ein verfahren zur steuerung des reinigungsroboters
KR102443220B1 (ko) * 2015-05-22 2022-09-15 삼성전자주식회사 기판 처리 장치
JP6736831B2 (ja) 2015-09-03 2020-08-05 アクチエボラゲット エレクトロルックス ロボット清掃デバイスのシステム、清掃デバイスを制御する方法、コンピュータプログラム及びコンピュータプログラム製品
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CN111906694A (zh) * 2020-08-13 2020-11-10 蚌埠中光电科技有限公司 一种玻璃研磨垫的在线修整装置
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Also Published As

Publication number Publication date
EP1055486B8 (de) 2009-08-05
KR100824758B1 (ko) 2008-04-24
EP1055486A2 (de) 2000-11-29
JP2001030169A (ja) 2001-02-06
KR100709766B1 (ko) 2007-04-19
JP4030247B2 (ja) 2008-01-09
EP1055486A3 (de) 2003-04-09
US6609962B1 (en) 2003-08-26
KR20060107500A (ko) 2006-10-13
EP1055486B1 (de) 2009-03-04
TW467793B (en) 2001-12-11
KR20010007077A (ko) 2001-01-26

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Date Code Title Description
8381 Inventor (new situation)

Inventor name: WAKABAYASHI, SATOSHI, TOKYO, JP

Inventor name: YAMAGUCHI, KUNIAKI, TOKYO, JP

Inventor name: TOGAWA, TETSUJI, TOKYO, JP

Inventor name: TAKADA, NOBUYUKI, TOKYO, JP

Inventor name: NABEYA, OSAMU, TOKYO, JP

8364 No opposition during term of opposition