DE60013921D1 - Polieraufschlämmung - Google Patents

Polieraufschlämmung

Info

Publication number
DE60013921D1
DE60013921D1 DE60013921T DE60013921T DE60013921D1 DE 60013921 D1 DE60013921 D1 DE 60013921D1 DE 60013921 T DE60013921 T DE 60013921T DE 60013921 T DE60013921 T DE 60013921T DE 60013921 D1 DE60013921 D1 DE 60013921D1
Authority
DE
Germany
Prior art keywords
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60013921T
Other languages
English (en)
Other versions
DE60013921T2 (de
Inventor
Yoshikuni Tateyama
Katsumi Yamamoto
Hiroshi Kato
Kazuhiko Hayashi
Hiroyuki Kono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuyama Corp
Original Assignee
Tokuyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuyama Corp filed Critical Tokuyama Corp
Publication of DE60013921D1 publication Critical patent/DE60013921D1/de
Application granted granted Critical
Publication of DE60013921T2 publication Critical patent/DE60013921T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
DE60013921T 1999-01-11 2000-01-11 Polieraufschlämmung Expired - Lifetime DE60013921T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP388999 1999-01-11
JP388999A JP4257687B2 (ja) 1999-01-11 1999-01-11 研磨剤および研磨方法

Publications (2)

Publication Number Publication Date
DE60013921D1 true DE60013921D1 (de) 2004-10-28
DE60013921T2 DE60013921T2 (de) 2005-01-27

Family

ID=11569761

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60013921T Expired - Lifetime DE60013921T2 (de) 1999-01-11 2000-01-11 Polieraufschlämmung

Country Status (6)

Country Link
US (1) US6338744B1 (de)
EP (1) EP1020500B1 (de)
JP (1) JP4257687B2 (de)
KR (1) KR100634105B1 (de)
DE (1) DE60013921T2 (de)
TW (1) TW444053B (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003522424A (ja) * 2000-02-02 2003-07-22 ロデール ホールディングス インコーポレイテッド 研磨組成物
DE10152993A1 (de) * 2001-10-26 2003-05-08 Bayer Ag Zusammensetzung für das chemisch-mechanische Polieren von Metall- und Metall/Dielektrikastrukturen mit hoher Selektivität
KR100449611B1 (ko) * 2001-12-28 2004-09-22 제일모직주식회사 금속배선 연마용 슬러리 조성물
US20040014399A1 (en) * 2002-07-19 2004-01-22 Yuchun Wang Selective barrier removal slurry
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
US6830504B1 (en) 2003-07-25 2004-12-14 Taiwan Semiconductor Manufacturing Company Barrier-slurry-free copper CMP process
US20050279733A1 (en) * 2004-06-18 2005-12-22 Cabot Microelectronics Corporation CMP composition for improved oxide removal rate
US6979252B1 (en) 2004-08-10 2005-12-27 Dupont Air Products Nanomaterials Llc Low defectivity product slurry for CMP and associated production method
US7153191B2 (en) * 2004-08-20 2006-12-26 Micron Technology, Inc. Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
US20080148652A1 (en) * 2006-12-21 2008-06-26 Junaid Ahmed Siddiqui Compositions for chemical mechanical planarization of copper
US7763517B2 (en) * 2007-02-12 2010-07-27 Macronix International Co., Ltd. Method of forming non-volatile memory cell
KR101563023B1 (ko) * 2008-02-18 2015-10-23 제이에스알 가부시끼가이샤 화학 기계 연마용 수계 분산체 및 화학 기계 연마 방법
TWI520812B (zh) 2009-01-05 2016-02-11 音諾帕德股份有限公司 化學機械平面化墊體及其製造方法、以及拋光一基板之方法
KR101285120B1 (ko) * 2009-06-05 2013-07-17 가부시키가이샤 사무코 실리콘 웨이퍼의 연마방법 및 실리콘 웨이퍼
KR101750741B1 (ko) 2013-07-24 2017-06-27 가부시끼가이샤 도꾸야마 Cmp용 실리카, 수성 분산액 및 cmp용 실리카의 제조 방법
JP2015143332A (ja) * 2013-12-24 2015-08-06 旭硝子株式会社 研磨剤、研磨方法および半導体集積回路装置の製造方法
JP6480139B2 (ja) * 2014-09-30 2019-03-06 株式会社フジミインコーポレーテッド 研磨用組成物
US10319605B2 (en) 2016-05-10 2019-06-11 Jsr Corporation Semiconductor treatment composition and treatment method
EP3929155A4 (de) * 2019-02-21 2022-04-06 Mitsubishi Chemical Corporation Silica-partikel und herstellungsverfahren dafür, silica-sol, polierzusammensetzung, polierverfahren, verfahren zur herstellung von halbleiterwafern und verfahren zur herstellung von halbleiterbauelementen
TW202229478A (zh) * 2020-09-29 2022-08-01 日商福吉米股份有限公司 研磨用組成物及其製造方法、研磨方法以及基板的製造方法
WO2023248951A1 (ja) * 2022-06-20 2023-12-28 三菱ケミカル株式会社 シリカ粒子とその製造方法、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法
WO2023248949A1 (ja) * 2022-06-20 2023-12-28 三菱ケミカル株式会社 シリカ粒子とその製造方法、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3170273A (en) 1963-01-10 1965-02-23 Monsanto Co Process for polishing semiconductor materials
US4011099A (en) 1975-11-07 1977-03-08 Monsanto Company Preparation of damage-free surface on alpha-alumina
US4343717A (en) * 1980-02-08 1982-08-10 Union Carbide Corporation Process for the preparation of stable silica sol
US5221497A (en) * 1988-03-16 1993-06-22 Nissan Chemical Industries, Ltd. Elongated-shaped silica sol and method for preparing the same
JP2545282B2 (ja) * 1989-04-17 1996-10-16 日東化学工業株式会社 球状シリカ粒子の製造方法
JP3290189B2 (ja) 1991-04-11 2002-06-10 旭電化工業株式会社 シリコンウェハーの研磨方法
US5252313A (en) * 1991-12-20 1993-10-12 Colgate-Palmolive Company Visually clear gel dentifrice
US5264010A (en) 1992-04-27 1993-11-23 Rodel, Inc. Compositions and methods for polishing and planarizing surfaces
US5571373A (en) * 1994-05-18 1996-11-05 Memc Electronic Materials, Inc. Method of rough polishing semiconductor wafers to reduce surface roughness
JPH0812319A (ja) * 1994-06-21 1996-01-16 Lion Corp 低屈折率無機粉体、その製造方法、それを用いた液状洗浄剤組成物及び透明歯磨組成物
KR960041316A (ko) 1995-05-22 1996-12-19 고사이 아키오 연마용 입상체, 이의 제조방법 및 이의 용도
US5582816A (en) 1995-06-01 1996-12-10 Colgate Palmolive Company Preparation of a visually clear gel dentifrice
JPH09142827A (ja) 1995-09-12 1997-06-03 Tokuyama Corp シリカ分散液及びその製造方法
US5904159A (en) 1995-11-10 1999-05-18 Tokuyama Corporation Polishing slurries and a process for the production thereof

Also Published As

Publication number Publication date
JP4257687B2 (ja) 2009-04-22
US6338744B1 (en) 2002-01-15
TW444053B (en) 2001-07-01
KR20000057110A (ko) 2000-09-15
JP2000208451A (ja) 2000-07-28
DE60013921T2 (de) 2005-01-27
KR100634105B1 (ko) 2006-10-17
EP1020500A1 (de) 2000-07-19
EP1020500B1 (de) 2004-09-22

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Legal Events

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