DE60041671D1 - Poliervorrichtung - Google Patents
PoliervorrichtungInfo
- Publication number
- DE60041671D1 DE60041671D1 DE60041671T DE60041671T DE60041671D1 DE 60041671 D1 DE60041671 D1 DE 60041671D1 DE 60041671 T DE60041671 T DE 60041671T DE 60041671 T DE60041671 T DE 60041671T DE 60041671 D1 DE60041671 D1 DE 60041671D1
- Authority
- DE
- Germany
- Prior art keywords
- polisher
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5952299 | 1999-03-05 | ||
JP23398399 | 1999-08-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60041671D1 true DE60041671D1 (de) | 2009-04-09 |
Family
ID=26400572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60041671T Expired - Lifetime DE60041671D1 (de) | 1999-03-05 | 2000-03-06 | Poliervorrichtung |
Country Status (3)
Country | Link |
---|---|
EP (2) | EP1034887A3 (de) |
DE (1) | DE60041671D1 (de) |
SG (1) | SG97860A1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001326201A (ja) * | 2000-05-16 | 2001-11-22 | Ebara Corp | ポリッシング装置 |
US6358126B1 (en) * | 2000-05-23 | 2002-03-19 | Ebara Corporation | Polishing apparatus |
CN100513076C (zh) * | 2001-05-29 | 2009-07-15 | 株式会社荏原制作所 | 抛光装置与抛光方法 |
DE10131668B4 (de) * | 2001-06-29 | 2006-05-18 | Infineon Technologies Ag | Verfahren zur abrasiven Bearbeitung von Oberflächen, auf Halbleiter-Wafern |
JP2005123485A (ja) * | 2003-10-17 | 2005-05-12 | Ebara Corp | 研磨装置 |
CN102513920B (zh) | 2004-11-01 | 2016-04-27 | 株式会社荏原制作所 | 抛光设备 |
JP5219569B2 (ja) * | 2008-03-21 | 2013-06-26 | 株式会社東京精密 | ウェーハ研削装置における加工良否判定方法およびウェーハ研削装置 |
US8795032B2 (en) | 2008-06-04 | 2014-08-05 | Ebara Corporation | Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method |
JP5422143B2 (ja) * | 2008-06-04 | 2014-02-19 | 株式会社荏原製作所 | 基板把持機構 |
US9700988B2 (en) | 2014-08-26 | 2017-07-11 | Ebara Corporation | Substrate processing apparatus |
CN111037444A (zh) * | 2019-12-23 | 2020-04-21 | 北京迪蒙吉意超硬材料技术有限公司 | 一种温度和压力自适应的聚晶金刚石复合片表面抛光机 |
CN113059453B (zh) * | 2019-12-31 | 2024-06-18 | 浙江芯晖装备技术有限公司 | 一种抛光设备 |
US11705354B2 (en) | 2020-07-10 | 2023-07-18 | Applied Materials, Inc. | Substrate handling systems |
CN114226351B (zh) * | 2021-08-16 | 2024-01-30 | 重庆大学 | 一种复合材料干切加工复杂多工况自适应除尘装置 |
CN113695920B (zh) * | 2021-10-15 | 2022-07-01 | 潍坊华正电器设备股份有限公司 | 一种cnc铣削砂光机 |
CN118123681B (zh) * | 2024-04-03 | 2024-08-16 | 无锡市大华精密陶瓷制造有限公司 | 一种陶瓷片用抛光清洗装置 |
CN118162405B (zh) * | 2024-05-16 | 2024-07-16 | 山西工程技术学院 | 一种探针清洗装置及其使用方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4141180A (en) * | 1977-09-21 | 1979-02-27 | Kayex Corporation | Polishing apparatus |
JPS58196984A (ja) * | 1982-05-12 | 1983-11-16 | 松下電器産業株式会社 | 工業用ロボツト |
US5329732A (en) * | 1992-06-15 | 1994-07-19 | Speedfam Corporation | Wafer polishing method and apparatus |
US5498199A (en) * | 1992-06-15 | 1996-03-12 | Speedfam Corporation | Wafer polishing method and apparatus |
US5827110A (en) * | 1994-12-28 | 1998-10-27 | Kabushiki Kaisha Toshiba | Polishing facility |
US5649854A (en) * | 1994-05-04 | 1997-07-22 | Gill, Jr.; Gerald L. | Polishing apparatus with indexing wafer processing stations |
DE19544328B4 (de) * | 1994-11-29 | 2014-03-20 | Ebara Corp. | Poliervorrichtung |
US5655954A (en) * | 1994-11-29 | 1997-08-12 | Toshiba Kikai Kabushiki Kaisha | Polishing apparatus |
KR100487590B1 (ko) * | 1995-08-21 | 2005-08-04 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱장치 |
US5738574A (en) * | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
EP1498934A3 (de) * | 1996-02-28 | 2005-12-21 | Ebara Corporation | Wafer-Transportroboter |
EP1281476A3 (de) * | 1996-05-16 | 2003-08-13 | Ebara Corporation | Verfahren und Vorrichtung zum Polieren von Werkstücken |
US5893795A (en) * | 1997-07-11 | 1999-04-13 | Applied Materials, Inc. | Apparatus for moving a cassette |
JPH11204468A (ja) * | 1998-01-09 | 1999-07-30 | Speedfam Co Ltd | 半導体ウエハの表面平坦化装置 |
-
2000
- 2000-03-04 SG SG200001194A patent/SG97860A1/en unknown
- 2000-03-06 EP EP00104438A patent/EP1034887A3/de not_active Ceased
- 2000-03-06 EP EP06020326A patent/EP1738871B1/de not_active Expired - Lifetime
- 2000-03-06 DE DE60041671T patent/DE60041671D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1738871A1 (de) | 2007-01-03 |
SG97860A1 (en) | 2003-08-20 |
EP1738871B1 (de) | 2009-02-25 |
EP1034887A3 (de) | 2003-07-16 |
EP1034887A2 (de) | 2000-09-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |