DE60038861D1 - Poliermaschine - Google Patents

Poliermaschine

Info

Publication number
DE60038861D1
DE60038861D1 DE60038861T DE60038861T DE60038861D1 DE 60038861 D1 DE60038861 D1 DE 60038861D1 DE 60038861 T DE60038861 T DE 60038861T DE 60038861 T DE60038861 T DE 60038861T DE 60038861 D1 DE60038861 D1 DE 60038861D1
Authority
DE
Germany
Prior art keywords
polisher
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60038861T
Other languages
English (en)
Inventor
Yoshinobu Nishimoto
Makoto Nakajima
Yoshio Nakamura
Yasuhide Denda
Chihiro Miyagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp filed Critical Fujikoshi Machinery Corp
Application granted granted Critical
Publication of DE60038861D1 publication Critical patent/DE60038861D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE60038861T 1999-11-25 2000-11-22 Poliermaschine Expired - Lifetime DE60038861D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33463199 1999-11-25

Publications (1)

Publication Number Publication Date
DE60038861D1 true DE60038861D1 (de) 2008-06-26

Family

ID=18279549

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60038861T Expired - Lifetime DE60038861D1 (de) 1999-11-25 2000-11-22 Poliermaschine

Country Status (7)

Country Link
US (1) US6705929B1 (de)
EP (1) EP1103345B1 (de)
JP (1) JP2001212750A (de)
KR (1) KR20010051908A (de)
DE (1) DE60038861D1 (de)
MY (1) MY122616A (de)
TW (1) TW486409B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7258599B2 (en) * 2005-09-15 2007-08-21 Fujitsu Limited Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor device
JP4901301B2 (ja) * 2006-05-23 2012-03-21 株式会社東芝 研磨方法及び半導体装置の製造方法
JP2010228058A (ja) * 2009-03-27 2010-10-14 Fujikoshi Mach Corp 研磨布の洗浄装置および洗浄方法
JP2011177842A (ja) * 2010-03-02 2011-09-15 Ebara Corp 研磨装置及び研磨方法
KR101105699B1 (ko) 2010-10-08 2012-01-17 주식회사 엘지실트론 웨이퍼 연마 장치
KR20130090209A (ko) 2012-02-03 2013-08-13 삼성전자주식회사 기판처리장치 및 기판처리방법
KR102391515B1 (ko) * 2015-07-31 2022-04-27 삼성전자주식회사 와이어 클램프용 클리닝 장치 및 이를 포함하는 클리닝 시스템
CN106078498A (zh) * 2016-08-16 2016-11-09 无锡尊宝电动车有限公司 一种可回收金属碎屑的打磨机
KR102637827B1 (ko) * 2016-09-06 2024-02-19 주식회사 케이씨텍 기판 처리 시스템
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
KR102355116B1 (ko) * 2017-04-03 2022-01-26 주식회사 케이씨텍 슬러리 노즐 및 이를 구비하는 기판 연마 장치
CN107214613A (zh) * 2017-07-20 2017-09-29 石家庄聚力特机械有限公司 一种抛光机转轴及使用该转轴的抛光机
CN111421451A (zh) * 2020-05-08 2020-07-17 东莞市赛德机电设备有限公司 一种自动布轮抛光机

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2870580A (en) * 1955-04-18 1959-01-27 Pacific Valves Inc Flat lapping machine
JPS5698563U (de) * 1979-12-25 1981-08-04
JPS61166747U (de) * 1985-04-01 1986-10-16
JP2628915B2 (ja) * 1989-06-05 1997-07-09 三菱マテリアル株式会社 研磨布のドレッシング装置
JP2622069B2 (ja) * 1993-06-30 1997-06-18 三菱マテリアル株式会社 研磨布のドレッシング装置
JP2914166B2 (ja) * 1994-03-16 1999-06-28 日本電気株式会社 研磨布の表面処理方法および研磨装置
US5578529A (en) * 1995-06-02 1996-11-26 Motorola Inc. Method for using rinse spray bar in chemical mechanical polishing
JP3778594B2 (ja) * 1995-07-18 2006-05-24 株式会社荏原製作所 ドレッシング方法
US5611943A (en) * 1995-09-29 1997-03-18 Intel Corporation Method and apparatus for conditioning of chemical-mechanical polishing pads
JP2833549B2 (ja) * 1995-11-07 1998-12-09 日本電気株式会社 研磨布の表面調整方法及び機構
JP3631554B2 (ja) * 1996-02-28 2005-03-23 株式会社荏原製作所 ポリッシング装置
US5879226A (en) * 1996-05-21 1999-03-09 Micron Technology, Inc. Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
JPH09309063A (ja) * 1996-05-24 1997-12-02 Nippon Steel Corp 研磨定盤の洗浄方法およびその装置
KR100524510B1 (ko) * 1996-06-25 2006-01-12 가부시키가이샤 에바라 세이사꾸쇼 연마포를드레싱하는방법과장치
US5868608A (en) * 1996-08-13 1999-02-09 Lsi Logic Corporation Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus
JP3139616B2 (ja) * 1997-01-22 2001-03-05 旭サナック株式会社 研磨パッドのドレッシング装置
JP3643686B2 (ja) * 1997-12-25 2005-04-27 不二越機械工業株式会社 ウェーハの研磨方法
US6443810B1 (en) * 2000-04-11 2002-09-03 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing platen equipped with guard ring for chemical mechanical polishing

Also Published As

Publication number Publication date
US6705929B1 (en) 2004-03-16
TW486409B (en) 2002-05-11
EP1103345B1 (de) 2008-05-14
EP1103345A2 (de) 2001-05-30
JP2001212750A (ja) 2001-08-07
MY122616A (en) 2006-04-29
KR20010051908A (ko) 2001-06-25
EP1103345A3 (de) 2003-09-24

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Legal Events

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