DE60033811D1 - Wafer-Reinigungsvorrichtung - Google Patents

Wafer-Reinigungsvorrichtung

Info

Publication number
DE60033811D1
DE60033811D1 DE60033811T DE60033811T DE60033811D1 DE 60033811 D1 DE60033811 D1 DE 60033811D1 DE 60033811 T DE60033811 T DE 60033811T DE 60033811 T DE60033811 T DE 60033811T DE 60033811 D1 DE60033811 D1 DE 60033811D1
Authority
DE
Germany
Prior art keywords
cleaning device
wafer cleaning
wafer
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60033811T
Other languages
English (en)
Other versions
DE60033811T2 (de
Inventor
Lutz Teichgraeber
Walter Glashauser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qimonda Dresden GmbH and Co OHG
Original Assignee
Qimonda Dresden GmbH and Co OHG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qimonda Dresden GmbH and Co OHG filed Critical Qimonda Dresden GmbH and Co OHG
Application granted granted Critical
Publication of DE60033811D1 publication Critical patent/DE60033811D1/de
Publication of DE60033811T2 publication Critical patent/DE60033811T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning In General (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE60033811T 2000-09-08 2000-09-08 Wafer-Reinigungsvorrichtung Expired - Lifetime DE60033811T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00119660A EP1189260B1 (de) 2000-09-08 2000-09-08 Wafer-Reinigungsvorrichtung

Publications (2)

Publication Number Publication Date
DE60033811D1 true DE60033811D1 (de) 2007-04-19
DE60033811T2 DE60033811T2 (de) 2007-11-15

Family

ID=8169791

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60033811T Expired - Lifetime DE60033811T2 (de) 2000-09-08 2000-09-08 Wafer-Reinigungsvorrichtung

Country Status (4)

Country Link
US (1) US6739013B2 (de)
EP (1) EP1189260B1 (de)
JP (1) JP3615724B2 (de)
DE (1) DE60033811T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020187133A1 (en) 1999-10-01 2002-12-12 Hiroshi Kubota Methods of isolating bipotent hepatic progenitor cells
US7456017B2 (en) * 1999-10-01 2008-11-25 University Of North Carolina At Chapel Hill Processes for clonal growth of hepatic progenitor cells
CA2338668C (en) * 2000-02-29 2005-02-15 Canon Kabushiki Kaisha Polluted soil remediation apparatus, polluted soil remediation method, pollutant degrading apparatus and pollutant degrading method
US6986185B2 (en) 2001-10-30 2006-01-17 Applied Materials Inc. Methods and apparatus for determining scrubber brush pressure
US7377002B2 (en) * 2003-10-28 2008-05-27 Applied Materials, Inc. Scrubber box
US20070006405A1 (en) * 2005-07-07 2007-01-11 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for wafer cleaning
US20070212983A1 (en) * 2006-03-13 2007-09-13 Applied Materials, Inc. Apparatus and methods for conditioning a polishing pad
US8551253B2 (en) 2010-06-29 2013-10-08 WD Media, LLC Post polish disk cleaning process
NL2022059B1 (en) * 2018-11-23 2020-06-09 Gerald Jg Belemans Cleaning device for a pair of spectacles having bar-shaped cleaning elements.

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4382308A (en) * 1981-02-18 1983-05-10 Chemcut Corporation Scrubbing torque monitoring and control system
JPS58182234A (ja) * 1982-04-17 1983-10-25 Dainippon Screen Mfg Co Ltd 複数種のブラシ使用可能な洗浄装置
US6079073A (en) * 1997-04-01 2000-06-27 Ebara Corporation Washing installation including plural washers
JPH1119609A (ja) 1997-07-08 1999-01-26 Syst Seiko Kk 回転ディスクの表面処理方法および装置
US5933902A (en) * 1997-11-18 1999-08-10 Frey; Bernhard M. Wafer cleaning system
JPH11195631A (ja) 1997-12-26 1999-07-21 Mitsubishi Materials Corp 半導体ウェーハ洗浄装置及び半導体ウェーハの製造方法
US6070284A (en) * 1998-02-04 2000-06-06 Silikinetic Technology, Inc. Wafer cleaning method and system
US6247197B1 (en) * 1998-07-09 2001-06-19 Lam Research Corporation Brush interflow distributor
DE19904548C2 (de) * 1999-02-04 2001-07-05 Steag Micro Tech Gmbh Verfahren und Vorrichtung zum Reinigen von Substraten
US6446296B1 (en) * 2000-03-06 2002-09-10 Rite Track Equipment Services, Inc. Substrate cleaning apparatus with brush force control and method
US6438781B1 (en) * 2000-04-21 2002-08-27 Toda Citron Technologies, Inc. Washer for cleaning substrates
JP3953716B2 (ja) * 2000-08-01 2007-08-08 株式会社荏原製作所 基板洗浄装置
US6678911B2 (en) * 2000-12-11 2004-01-20 Speedfam-Ipec Corporation Multiple vertical wafer cleaner
US6986185B2 (en) * 2001-10-30 2006-01-17 Applied Materials Inc. Methods and apparatus for determining scrubber brush pressure

Also Published As

Publication number Publication date
US6739013B2 (en) 2004-05-25
US20020088069A1 (en) 2002-07-11
EP1189260B1 (de) 2007-03-07
DE60033811T2 (de) 2007-11-15
JP2002141323A (ja) 2002-05-17
EP1189260A1 (de) 2002-03-20
JP3615724B2 (ja) 2005-02-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition