GB2379626A - Orbital polishing apparatus - Google Patents

Orbital polishing apparatus

Info

Publication number
GB2379626A
GB2379626A GB0227538A GB0227538A GB2379626A GB 2379626 A GB2379626 A GB 2379626A GB 0227538 A GB0227538 A GB 0227538A GB 0227538 A GB0227538 A GB 0227538A GB 2379626 A GB2379626 A GB 2379626A
Authority
GB
United Kingdom
Prior art keywords
polishing pad
orbiting
platen
polishing apparatus
orbits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0227538A
Other versions
GB0227538D0 (en
Inventor
Stephen C Schultz
John D Herb
Nikolay N Korovin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam IPEC Corp
Original Assignee
Speedfam IPEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam IPEC Corp filed Critical Speedfam IPEC Corp
Publication of GB0227538D0 publication Critical patent/GB0227538D0/en
Publication of GB2379626A publication Critical patent/GB2379626A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The present invention is an apparatus and method for planarizing a front surface of a wafer. The present invention may include a rigid platen (221), for supporting a polishing pad (207), connected to a supporting base that has means, or is connected to means, for orbiting the platen. A carrier (215), preferably a front-reference carrier with a plurality of individually controllable pressure areas (204, 228), may be used to hold and press the wafer against the polishing pad (207) while the supporting base orbits the rigid platen. The planarization process may be further optimized by orbiting the polishing pad in a radius smaller than 4 mm, orbiting the polishing pad faster than 400 orbits per minute or both.
GB0227538A 2000-06-08 2001-06-06 Orbital polishing apparatus Withdrawn GB2379626A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59031900A 2000-06-08 2000-06-08
PCT/US2001/018351 WO2001094075A1 (en) 2000-06-08 2001-06-06 Orbital polishing apparatus

Publications (2)

Publication Number Publication Date
GB0227538D0 GB0227538D0 (en) 2002-12-31
GB2379626A true GB2379626A (en) 2003-03-19

Family

ID=24361775

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0227538A Withdrawn GB2379626A (en) 2000-06-08 2001-06-06 Orbital polishing apparatus

Country Status (7)

Country Link
US (1) US20030077986A1 (en)
JP (1) JP2004505435A (en)
KR (1) KR20030007928A (en)
AU (1) AU2001266742A1 (en)
DE (1) DE10196317T1 (en)
GB (1) GB2379626A (en)
WO (1) WO2001094075A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US20100173567A1 (en) * 2006-02-06 2010-07-08 Chien-Min Sung Methods and Devices for Enhancing Chemical Mechanical Polishing Processes
TW201029807A (en) * 2009-02-06 2010-08-16 Inotera Memories Inc A pressure control system for a wafer polish machine
DE102009030294B4 (en) * 2009-06-24 2013-04-25 Siltronic Ag Process for polishing the edge of a semiconductor wafer
TWI530360B (en) * 2012-09-28 2016-04-21 荏原製作所股份有限公司 Polishing apparatus
KR102540042B1 (en) 2021-06-30 2023-06-05 (주)피엔피 Front-facing Camera Front Area of Encap Glass Polishing Device OLED Display Pannel
CN115383622B (en) * 2022-04-20 2024-08-27 北京晶亦精微科技股份有限公司 Split universal joint for polishing head and polishing device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0650806A1 (en) * 1993-10-28 1995-05-03 Kabushiki Kaisha Toshiba Polishing apparatus of semiconductor wafer
US5554064A (en) * 1993-08-06 1996-09-10 Intel Corporation Orbital motion chemical-mechanical polishing apparatus and method of fabrication
EP0803329A2 (en) * 1996-04-25 1997-10-29 Fujikoshi Kikai Kogyo Kabushiki Kaisha Polishing machine
WO1999026761A1 (en) * 1997-11-21 1999-06-03 Ebara Corporation Polishing apparatus

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5635083A (en) * 1993-08-06 1997-06-03 Intel Corporation Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate
US5582534A (en) * 1993-12-27 1996-12-10 Applied Materials, Inc. Orbital chemical mechanical polishing apparatus and method
US5449316A (en) * 1994-01-05 1995-09-12 Strasbaugh; Alan Wafer carrier for film planarization
US5423716A (en) * 1994-01-05 1995-06-13 Strasbaugh; Alan Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied
JPH07241764A (en) * 1994-03-04 1995-09-19 Fujitsu Ltd Polishing device and polishing method
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US5941758A (en) * 1996-11-13 1999-08-24 Intel Corporation Method and apparatus for chemical-mechanical polishing
DE19651761A1 (en) * 1996-12-12 1998-06-18 Wacker Siltronic Halbleitermat Method and device for polishing semiconductor wafers
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US5882243A (en) * 1997-04-24 1999-03-16 Motorola, Inc. Method for polishing a semiconductor wafer using dynamic control
JP3027551B2 (en) * 1997-07-03 2000-04-04 キヤノン株式会社 Substrate holding device, polishing method and polishing device using the substrate holding device
JPH11226865A (en) * 1997-12-11 1999-08-24 Speedfam Co Ltd Carrier and cmp device
JP2907209B1 (en) * 1998-05-29 1999-06-21 日本電気株式会社 Back pad for wafer polishing equipment
US6093089A (en) * 1999-01-25 2000-07-25 United Microelectronics Corp. Apparatus for controlling uniformity of polished material
US6050882A (en) * 1999-06-10 2000-04-18 Applied Materials, Inc. Carrier head to apply pressure to and retain a substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5554064A (en) * 1993-08-06 1996-09-10 Intel Corporation Orbital motion chemical-mechanical polishing apparatus and method of fabrication
EP0650806A1 (en) * 1993-10-28 1995-05-03 Kabushiki Kaisha Toshiba Polishing apparatus of semiconductor wafer
EP0803329A2 (en) * 1996-04-25 1997-10-29 Fujikoshi Kikai Kogyo Kabushiki Kaisha Polishing machine
WO1999026761A1 (en) * 1997-11-21 1999-06-03 Ebara Corporation Polishing apparatus

Also Published As

Publication number Publication date
US20030077986A1 (en) 2003-04-24
JP2004505435A (en) 2004-02-19
GB0227538D0 (en) 2002-12-31
AU2001266742A1 (en) 2001-12-17
WO2001094075A1 (en) 2001-12-13
KR20030007928A (en) 2003-01-23
DE10196317T1 (en) 2003-11-13

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)