JP5073714B2 - 可撓膜を有するケミカルメカニカルポリシングシステム用キャリアヘット - Google Patents
可撓膜を有するケミカルメカニカルポリシングシステム用キャリアヘット Download PDFInfo
- Publication number
- JP5073714B2 JP5073714B2 JP2009145693A JP2009145693A JP5073714B2 JP 5073714 B2 JP5073714 B2 JP 5073714B2 JP 2009145693 A JP2009145693 A JP 2009145693A JP 2009145693 A JP2009145693 A JP 2009145693A JP 5073714 B2 JP5073714 B2 JP 5073714B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- chamber
- carrier head
- flexible
- annular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
Claims (13)
- ケミカルメカニカルポリシングシステムで使用するキャリヤヘッドであって、
ベースと、
前記ベースに結合されて第1チャンバ、第2チャンバ及び第3チャンバを画成する可撓部材であって、その下面が、前記第1チャンバに関連する内側部分と、前記内側部分を囲むとともに前記第2チャンバに関連する実質的に環状の中間部分と、前記中間部分を囲むとともに前記第3チャンバに関連する実質的に環状の外側部分とを有する基板受け面を提供し、それによって前記可撓部材の前記内側、中間、または外側部分のいずれかに対する圧力を独立して制御できるようにした、前記可撓部材と
を備え、
前記外側部分の幅が前記中間部分の幅よりも十分に小さいキャリヤヘッド。 - 前記外側部分が、100mmにほぼ等しいかそれより大きい外径を有し、前記外側部分の幅が約4mm〜20mmである請求項1に記載のキャリヤヘッド。
- 前記可撓部材の外側部分の幅が約10mmである請求項2に記載のキャリヤヘッド。
- 前記可撓部材が、内側環状フラップ、中間環状フラップ、および外側環状フラップを有し、各前記フラップは前記ベースの下面に固定されて前記第1、第2、および第3チャンバを画成する請求項1に記載のキャリヤヘッド。
- ケミカルメカニカルポリシングシステムで使用されるキャリヤヘッドセンブリであって、
ボアと、前記ボア内に配置されて、中央通路および前記中央通路を囲む少なくとも一つの環状通路を画成する少なくとも一つの円筒チューブとを有する駆動軸と、
前記駆動軸の下端に結合されたキャリヤヘッドであって、複数のチャンバを含み、各チャンバは前記通路の一つに結合されるようにした前記キャリヤヘッドと
を備えるキャリヤヘッドアセンブリ。 - 前記駆動軸が、前記ボア内に配置されて3本の同心通路を画成する2本の同心チューブを有し、前記各通路が前記チャンバの一つに結合される請求項5に記載のキャリヤヘッドセンブリ。
- 前記キャリヤヘッドが、ベースに結合されて第1チャンバ、第2チャンバ、および第3チャンバを画成する可撓部材を含む請求項5に記載のキャリヤヘッドセンブリ。
- 更に、複数の圧力源と、前記駆動軸の上端に結合された回転ユニオンとを備え、前記回転ユニオンが複数の圧力源を前記複数の通路のそれぞれ一つに連結する請求項5に記載のキャリヤヘッドセンブリ。
- ケミカルメカニカルポリシングシステムで使用されるキャリヤヘッドであって、
第1、第2、および第3の独立加圧式チャンバと、
前記第1チャンバに関連して第1圧力を基板の中央部分に加える可撓内側部材と、
前記第2チャンバに関連するとともに前記内側部材を囲み、第2圧力を前記基板の中間部分に加える実質的に環状の可撓中間部材と、
前記第3チャンバに関連するとともに前記中間部材を囲み、第3圧力を前記基板の外側部分へ加える実質的に環状の可撓外側部材であって、前記中間部材よりも実質的に幅が狭い、前記可撓外側部材と
を備え、
前記内側部材、前記中間部材、および前記外側部材が可撓膜の一部である、
キャリヤヘッド。 - ケミカルメカニカルポリシングシステムに使用されるキャリヤヘッド用の可撓膜であって、
円形のシートであって、基板受け外側面を有し、該シートの前記外側面と反対側に内側面を有する、該シートと、
前記シートに結合され、且つ、前記シートの前記外側面と反対側に設けられた複数の同心の環状フラップであって、前記シートの外側エッジから延びる外側フラップ、内側フラップ、及び、前記外側フラップと内側フラップの間に設けられた中間フラップを含む、該複数の同心の環状フラップと、
を備え、
前記円形のシートは、
前記内側フラップの内側の内側部分であって、基板の内側部分に第1圧力を加える、該内側部分と、
前記内側フラップと前記中間フラップの間の環状中間部分であって、前記基板の中間部分に第2圧力を加える、該環状中間部分と、
前記中間フラップと前記外側フラップの間の実質的に環状の外側部分であって、前記基板の外側部分に第3圧力を加える、該外側部分と、
を含み、
前記円形のシートの前記外側部分は、前記円形のシートの前記中間部分より狭い、
可撓膜。 - 前記円形のシートの前記内側部分は、円形である、請求項10に記載の可撓膜。
- 前記可撓膜は、シリコーンゴムで構成されている、請求項10に記載の可撓膜。
- 前記外側部分は、約4mm〜約20mmの幅を有する、請求項10に記載の可撓膜。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/891,548 | 1997-07-11 | ||
US08/891,548 US5964653A (en) | 1997-07-11 | 1997-07-11 | Carrier head with a flexible membrane for a chemical mechanical polishing system |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000501870A Division JP4413421B2 (ja) | 1997-07-11 | 1998-07-10 | 可撓膜を有するケミカルメカニカルポリシングシステム用キャリヤヘッド |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009255289A JP2009255289A (ja) | 2009-11-05 |
JP2009255289A5 JP2009255289A5 (ja) | 2010-01-07 |
JP5073714B2 true JP5073714B2 (ja) | 2012-11-14 |
Family
ID=25398390
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000501870A Expired - Lifetime JP4413421B2 (ja) | 1997-07-11 | 1998-07-10 | 可撓膜を有するケミカルメカニカルポリシングシステム用キャリヤヘッド |
JP2009145693A Expired - Lifetime JP5073714B2 (ja) | 1997-07-11 | 2009-06-18 | 可撓膜を有するケミカルメカニカルポリシングシステム用キャリアヘット |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000501870A Expired - Lifetime JP4413421B2 (ja) | 1997-07-11 | 1998-07-10 | 可撓膜を有するケミカルメカニカルポリシングシステム用キャリヤヘッド |
Country Status (5)
Country | Link |
---|---|
US (7) | US5964653A (ja) |
JP (2) | JP4413421B2 (ja) |
KR (1) | KR100513573B1 (ja) |
TW (1) | TW379380B (ja) |
WO (1) | WO1999002304A1 (ja) |
Families Citing this family (159)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6183354B1 (en) * | 1996-11-08 | 2001-02-06 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US5964653A (en) * | 1997-07-11 | 1999-10-12 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
FR2778129B1 (fr) * | 1998-05-04 | 2000-07-21 | St Microelectronics Sa | Disque support de membrane d'une machine de polissage et procede de fonctionnement d'une telle machine |
US6210255B1 (en) | 1998-09-08 | 2001-04-03 | Applied Materials, Inc. | Carrier head for chemical mechanical polishing a substrate |
US6159079A (en) | 1998-09-08 | 2000-12-12 | Applied Materials, Inc. | Carrier head for chemical mechanical polishing a substrate |
US6277014B1 (en) * | 1998-10-09 | 2001-08-21 | Applied Materials, Inc. | Carrier head with a flexible membrane for chemical mechanical polishing |
US6244942B1 (en) * | 1998-10-09 | 2001-06-12 | Applied Materials, Inc. | Carrier head with a flexible membrane and adjustable edge pressure |
US6145849A (en) * | 1998-11-18 | 2000-11-14 | Komag, Incorporated | Disk processing chuck |
US6165058A (en) * | 1998-12-09 | 2000-12-26 | Applied Materials, Inc. | Carrier head for chemical mechanical polishing |
US6422927B1 (en) | 1998-12-30 | 2002-07-23 | Applied Materials, Inc. | Carrier head with controllable pressure and loading area for chemical mechanical polishing |
US6272902B1 (en) * | 1999-01-04 | 2001-08-14 | Taiwan Semiconductor Manufactoring Company, Ltd. | Method and apparatus for off-line testing a polishing head |
US6162116A (en) * | 1999-01-23 | 2000-12-19 | Applied Materials, Inc. | Carrier head for chemical mechanical polishing |
JP4033632B2 (ja) * | 1999-02-02 | 2008-01-16 | 株式会社荏原製作所 | 基板把持装置及び研磨装置 |
US6431968B1 (en) | 1999-04-22 | 2002-08-13 | Applied Materials, Inc. | Carrier head with a compressible film |
US6776692B1 (en) * | 1999-07-09 | 2004-08-17 | Applied Materials Inc. | Closed-loop control of wafer polishing in a chemical mechanical polishing system |
US6241593B1 (en) * | 1999-07-09 | 2001-06-05 | Applied Materials, Inc. | Carrier head with pressurizable bladder |
US6855043B1 (en) | 1999-07-09 | 2005-02-15 | Applied Materials, Inc. | Carrier head with a modified flexible membrane |
US6494774B1 (en) | 1999-07-09 | 2002-12-17 | Applied Materials, Inc. | Carrier head with pressure transfer mechanism |
US6358121B1 (en) | 1999-07-09 | 2002-03-19 | Applied Materials, Inc. | Carrier head with a flexible membrane and an edge load ring |
JP3270428B2 (ja) | 1999-07-28 | 2002-04-02 | 東芝機械株式会社 | 電動式射出成形機の旋回装置 |
JP4485643B2 (ja) * | 1999-08-30 | 2010-06-23 | 三菱マテリアル株式会社 | 研磨装置及び被研磨材の研磨方法 |
EP1092504B1 (en) | 1999-10-15 | 2005-12-07 | Ebara Corporation | Apparatus and method for polishing workpiece |
US6663466B2 (en) | 1999-11-17 | 2003-12-16 | Applied Materials, Inc. | Carrier head with a substrate detector |
JP3683149B2 (ja) * | 2000-02-01 | 2005-08-17 | 株式会社東京精密 | 研磨装置の研磨ヘッドの構造 |
US6450868B1 (en) | 2000-03-27 | 2002-09-17 | Applied Materials, Inc. | Carrier head with multi-part flexible membrane |
US6361419B1 (en) | 2000-03-27 | 2002-03-26 | Applied Materials, Inc. | Carrier head with controllable edge pressure |
US6264532B1 (en) | 2000-03-28 | 2001-07-24 | Speedfam-Ipec Corporation | Ultrasonic methods and apparatus for the in-situ detection of workpiece loss |
US6390905B1 (en) | 2000-03-31 | 2002-05-21 | Speedfam-Ipec Corporation | Workpiece carrier with adjustable pressure zones and barriers |
US6336853B1 (en) | 2000-03-31 | 2002-01-08 | Speedfam-Ipec Corporation | Carrier having pistons for distributing a pressing force on the back surface of a workpiece |
US7140956B1 (en) | 2000-03-31 | 2006-11-28 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
US6447379B1 (en) * | 2000-03-31 | 2002-09-10 | Speedfam-Ipec Corporation | Carrier including a multi-volume diaphragm for polishing a semiconductor wafer and a method therefor |
US6368968B1 (en) * | 2000-04-11 | 2002-04-09 | Vanguard International Semiconductor Corporation | Ditch type floating ring for chemical mechanical polishing |
US7195696B2 (en) * | 2000-05-11 | 2007-03-27 | Novellus Systems, Inc. | Electrode assembly for electrochemical processing of workpiece |
US6478936B1 (en) | 2000-05-11 | 2002-11-12 | Nutool Inc. | Anode assembly for plating and planarizing a conductive layer |
US6695962B2 (en) | 2001-05-01 | 2004-02-24 | Nutool Inc. | Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs |
US6506105B1 (en) * | 2000-05-12 | 2003-01-14 | Multi-Planar Technologies, Inc. | System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control |
US6558232B1 (en) * | 2000-05-12 | 2003-05-06 | Multi-Planar Technologies, Inc. | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
US6602114B1 (en) * | 2000-05-19 | 2003-08-05 | Applied Materials Inc. | Multilayer retaining ring for chemical mechanical polishing |
US6540592B1 (en) | 2000-06-29 | 2003-04-01 | Speedfam-Ipec Corporation | Carrier head with reduced moment wear ring |
US6722965B2 (en) * | 2000-07-11 | 2004-04-20 | Applied Materials Inc. | Carrier head with flexible membranes to provide controllable pressure and loading area |
US7198561B2 (en) * | 2000-07-25 | 2007-04-03 | Applied Materials, Inc. | Flexible membrane for multi-chamber carrier head |
US20040005842A1 (en) * | 2000-07-25 | 2004-01-08 | Chen Hung Chih | Carrier head with flexible membrane |
US6857945B1 (en) * | 2000-07-25 | 2005-02-22 | Applied Materials, Inc. | Multi-chamber carrier head with a flexible membrane |
US7101273B2 (en) * | 2000-07-25 | 2006-09-05 | Applied Materials, Inc. | Carrier head with gimbal mechanism |
WO2002010729A1 (en) * | 2000-07-31 | 2002-02-07 | Asml Us, Inc. | In-situ method and apparatus for end point detection in chemical mechanical polishing |
DE60138343D1 (de) * | 2000-07-31 | 2009-05-28 | Ebara Corp | Substrathalter und Poliervorrichtung |
US7029381B2 (en) * | 2000-07-31 | 2006-04-18 | Aviza Technology, Inc. | Apparatus and method for chemical mechanical polishing of substrates |
US6572446B1 (en) | 2000-09-18 | 2003-06-03 | Applied Materials Inc. | Chemical mechanical polishing pad conditioning element with discrete points and compliant membrane |
JP2002187060A (ja) * | 2000-10-11 | 2002-07-02 | Ebara Corp | 基板保持装置、ポリッシング装置、及び研磨方法 |
US6805613B1 (en) | 2000-10-17 | 2004-10-19 | Speedfam-Ipec Corporation | Multiprobe detection system for chemical-mechanical planarization tool |
US6923711B2 (en) | 2000-10-17 | 2005-08-02 | Speedfam-Ipec Corporation | Multizone carrier with process monitoring system for chemical-mechanical planarization tool |
JP3627143B2 (ja) * | 2000-10-23 | 2005-03-09 | 株式会社東京精密 | ウェーハ研磨装置 |
US6447368B1 (en) | 2000-11-20 | 2002-09-10 | Speedfam-Ipec Corporation | Carriers with concentric balloons supporting a diaphragm |
WO2002042033A1 (en) * | 2000-11-21 | 2002-05-30 | Memc Electronic Materials, S.P.A. | Semiconductor wafer, polishing apparatus and method |
KR100423909B1 (ko) * | 2000-11-23 | 2004-03-24 | 삼성전자주식회사 | 화학적 기계적 평탄화 기계의 폴리싱 헤드 및 그것을이용한 폴리싱방법 |
US6652362B2 (en) * | 2000-11-23 | 2003-11-25 | Samsung Electronics Co., Ltd. | Apparatus for polishing a semiconductor wafer and method therefor |
US6468131B1 (en) | 2000-11-28 | 2002-10-22 | Speedfam-Ipec Corporation | Method to mathematically characterize a multizone carrier |
US6790763B2 (en) * | 2000-12-04 | 2004-09-14 | Ebara Corporation | Substrate processing method |
JP3969069B2 (ja) * | 2000-12-04 | 2007-08-29 | 株式会社東京精密 | ウェーハ研磨装置 |
DE10062496B4 (de) * | 2000-12-14 | 2005-03-17 | Peter Wolters Cmp - Systeme Gmbh & Co. Kg | Halter für flache Werkstücke, insbesondere Halbleiterwafer |
US6582277B2 (en) | 2001-05-01 | 2003-06-24 | Speedfam-Ipec Corporation | Method for controlling a process in a multi-zonal apparatus |
KR100437456B1 (ko) * | 2001-05-31 | 2004-06-23 | 삼성전자주식회사 | 화학적 기계적 평탄화 기계의 폴리싱 헤드 및 그것을이용한 폴리싱방법 |
KR100470227B1 (ko) * | 2001-06-07 | 2005-02-05 | 두산디앤디 주식회사 | 화학기계적 연마장치의 캐리어 헤드 |
US6712673B2 (en) | 2001-10-04 | 2004-03-30 | Memc Electronic Materials, Inc. | Polishing apparatus, polishing head and method |
US6821794B2 (en) | 2001-10-04 | 2004-11-23 | Novellus Systems, Inc. | Flexible snapshot in endpoint detection |
US6716093B2 (en) * | 2001-12-07 | 2004-04-06 | Lam Research Corporation | Low friction gimbaled substrate holder for CMP apparatus |
KR20030077802A (ko) * | 2002-03-27 | 2003-10-04 | 삼성전자주식회사 | 폴리싱 헤드를 갖는 화학기계적 연마장비 |
US6790123B2 (en) | 2002-05-16 | 2004-09-14 | Speedfam-Ipec Corporation | Method for processing a work piece in a multi-zonal processing apparatus |
US20050040049A1 (en) * | 2002-09-20 | 2005-02-24 | Rimma Volodarsky | Anode assembly for plating and planarizing a conductive layer |
KR100492330B1 (ko) * | 2002-10-30 | 2005-05-27 | 두산디앤디 주식회사 | 화학기계적 연마장치의 캐리어 헤드 |
TWI238754B (en) * | 2002-11-07 | 2005-09-01 | Ebara Tech Inc | Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof |
TWI323017B (en) * | 2003-02-10 | 2010-04-01 | Ebara Corp | Substrate holding apparatus and polishing apparatus |
US7001245B2 (en) * | 2003-03-07 | 2006-02-21 | Applied Materials Inc. | Substrate carrier with a textured membrane |
US6764387B1 (en) | 2003-03-07 | 2004-07-20 | Applied Materials Inc. | Control of a multi-chamber carrier head |
US7156946B2 (en) * | 2003-04-28 | 2007-01-02 | Strasbaugh | Wafer carrier pivot mechanism |
DE10394257D2 (de) * | 2003-07-09 | 2006-05-18 | Peter Wolters Surface Technolo | Halter für flache Werkstücke, insbesondere Halbleiterwafer zum chemisch-mechanischen Polieren |
US7406549B2 (en) * | 2003-08-01 | 2008-07-29 | Intel Corporation | Support for non-standard device containing operating system data |
US7074109B1 (en) | 2003-08-18 | 2006-07-11 | Applied Materials | Chemical mechanical polishing control system and method |
US6991516B1 (en) | 2003-08-18 | 2006-01-31 | Applied Materials Inc. | Chemical mechanical polishing with multi-stage monitoring of metal clearing |
US6986359B2 (en) * | 2004-03-09 | 2006-01-17 | Mks Instruments, Inc. | System and method for controlling pressure in remote zones |
US8037896B2 (en) | 2004-03-09 | 2011-10-18 | Mks Instruments, Inc. | Pressure regulation in remote zones |
US7255771B2 (en) * | 2004-03-26 | 2007-08-14 | Applied Materials, Inc. | Multiple zone carrier head with flexible membrane |
US6969307B2 (en) * | 2004-03-30 | 2005-11-29 | Lam Research Corporation | Polishing pad conditioning and polishing liquid dispersal system |
US6958005B1 (en) * | 2004-03-30 | 2005-10-25 | Lam Research Corporation | Polishing pad conditioning system |
KR100621629B1 (ko) * | 2004-06-04 | 2006-09-19 | 삼성전자주식회사 | 화학적 기계적 연마 장치에 사용되는 연마 헤드 및 연마방법 |
US7201642B2 (en) * | 2004-06-17 | 2007-04-10 | Systems On Silicon Manufacturing Co. Pte. Ltd. | Process for producing improved membranes |
US7081042B2 (en) * | 2004-07-22 | 2006-07-25 | Applied Materials | Substrate removal from polishing tool |
CN101934491B (zh) * | 2004-11-01 | 2012-07-25 | 株式会社荏原制作所 | 抛光设备 |
JP5112614B2 (ja) | 2004-12-10 | 2013-01-09 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
US7101272B2 (en) * | 2005-01-15 | 2006-09-05 | Applied Materials, Inc. | Carrier head for thermal drift compensation |
DE102005016411B4 (de) * | 2005-04-08 | 2007-03-29 | IGAM Ingenieurgesellschaft für angewandte Mechanik mbH | Vorrichtung zur hochgenauen Oberflächenbearbeitung eines Werkstückes |
US7984002B2 (en) | 2005-04-29 | 2011-07-19 | Charles River Analytics, Inc. | Automatic source code generation for computing probabilities of variables in belief networks |
US7074118B1 (en) * | 2005-11-01 | 2006-07-11 | Freescale Semiconductor, Inc. | Polishing carrier head with a modified pressure profile |
US8454413B2 (en) | 2005-12-29 | 2013-06-04 | Applied Materials, Inc. | Multi-chamber carrier head with a textured membrane |
US7364496B2 (en) * | 2006-03-03 | 2008-04-29 | Inopla Inc. | Polishing head for polishing semiconductor wafers |
US7115017B1 (en) | 2006-03-31 | 2006-10-03 | Novellus Systems, Inc. | Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization |
US7527271B2 (en) * | 2006-06-02 | 2009-05-05 | Applied Materials, Inc. | Fast substrate loading on polishing head without membrane inflation step |
US7402098B2 (en) * | 2006-10-27 | 2008-07-22 | Novellus Systems, Inc. | Carrier head for workpiece planarization/polishing |
US7335092B1 (en) * | 2006-10-27 | 2008-02-26 | Novellus Systems, Inc. | Carrier head for workpiece planarization/polishing |
US7597608B2 (en) * | 2006-10-30 | 2009-10-06 | Applied Materials, Inc. | Pad conditioning device with flexible media mount |
US7654888B2 (en) | 2006-11-22 | 2010-02-02 | Applied Materials, Inc. | Carrier head with retaining ring and carrier ring |
US7727055B2 (en) * | 2006-11-22 | 2010-06-01 | Applied Materials, Inc. | Flexible membrane for carrier head |
US7699688B2 (en) * | 2006-11-22 | 2010-04-20 | Applied Materials, Inc. | Carrier ring for carrier head |
US20090025807A1 (en) * | 2007-07-10 | 2009-01-29 | Visible Assets Inc. | Rubee enabled outdoor faucet and watering control system |
KR101619416B1 (ko) * | 2008-03-25 | 2016-05-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 개량된 캐리어 헤드 멤브레인 |
DE102008029931A1 (de) | 2008-06-26 | 2009-12-31 | Veikko Galazky | Vorrichtung zur Oberflächenbearbeitung eines Werkstückes |
CN102131617B (zh) * | 2008-08-29 | 2016-06-01 | 信越半导体股份有限公司 | 研磨头及研磨装置 |
US10160093B2 (en) | 2008-12-12 | 2018-12-25 | Applied Materials, Inc. | Carrier head membrane roughness to control polishing rate |
JP5392483B2 (ja) * | 2009-08-31 | 2014-01-22 | 不二越機械工業株式会社 | 研磨装置 |
JP2011079113A (ja) * | 2009-10-09 | 2011-04-21 | Tenryu Saw Mfg Co Ltd | 円板状回転工具の取付け装置 |
US8696405B2 (en) | 2010-03-12 | 2014-04-15 | Wayne O. Duescher | Pivot-balanced floating platen lapping machine |
US8602842B2 (en) * | 2010-03-12 | 2013-12-10 | Wayne O. Duescher | Three-point fixed-spindle floating-platen abrasive system |
US8740668B2 (en) * | 2010-03-12 | 2014-06-03 | Wayne O. Duescher | Three-point spindle-supported floating abrasive platen |
US8500515B2 (en) | 2010-03-12 | 2013-08-06 | Wayne O. Duescher | Fixed-spindle and floating-platen abrasive system using spherical mounts |
US8758088B2 (en) | 2011-10-06 | 2014-06-24 | Wayne O. Duescher | Floating abrading platen configuration |
US8647171B2 (en) * | 2010-03-12 | 2014-02-11 | Wayne O. Duescher | Fixed-spindle floating-platen workpiece loader apparatus |
US8641476B2 (en) | 2011-10-06 | 2014-02-04 | Wayne O. Duescher | Coplanar alignment apparatus for rotary spindles |
US8647172B2 (en) | 2010-03-12 | 2014-02-11 | Wayne O. Duescher | Wafer pads for fixed-spindle floating-platen lapping |
US8647170B2 (en) | 2011-10-06 | 2014-02-11 | Wayne O. Duescher | Laser alignment apparatus for rotary spindles |
KR101110268B1 (ko) * | 2010-04-30 | 2012-02-16 | 삼성전자주식회사 | 로터리 유니온을 구동하는 공압 공급관의 꼬임을 방지하는 화학 기계식 연마시스템 |
US8337280B2 (en) | 2010-09-14 | 2012-12-25 | Duescher Wayne O | High speed platen abrading wire-driven rotary workholder |
US8430717B2 (en) | 2010-10-12 | 2013-04-30 | Wayne O. Duescher | Dynamic action abrasive lapping workholder |
US9393669B2 (en) | 2011-10-21 | 2016-07-19 | Strasbaugh | Systems and methods of processing substrates |
US8968052B2 (en) * | 2011-10-21 | 2015-03-03 | Strasbaugh | Systems and methods of wafer grinding |
US20130217306A1 (en) * | 2012-02-16 | 2013-08-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | CMP Groove Depth and Conditioning Disk Monitoring |
WO2013134075A1 (en) | 2012-03-08 | 2013-09-12 | Applied Materials, Inc. | Detecting membrane breakage in a carrier head |
US9393668B2 (en) * | 2012-07-12 | 2016-07-19 | Taiwan Semiconductor Manufacturing Company Limited | Polishing head with alignment gear |
US9457446B2 (en) | 2012-10-01 | 2016-10-04 | Strasbaugh | Methods and systems for use in grind shape control adaptation |
US9610669B2 (en) | 2012-10-01 | 2017-04-04 | Strasbaugh | Methods and systems for use in grind spindle alignment |
US8845394B2 (en) | 2012-10-29 | 2014-09-30 | Wayne O. Duescher | Bellows driven air floatation abrading workholder |
US9604339B2 (en) | 2012-10-29 | 2017-03-28 | Wayne O. Duescher | Vacuum-grooved membrane wafer polishing workholder |
US8998677B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Bellows driven floatation-type abrading workholder |
US8998678B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Spider arm driven flexible chamber abrading workholder |
US9039488B2 (en) | 2012-10-29 | 2015-05-26 | Wayne O. Duescher | Pin driven flexible chamber abrading workholder |
US9233452B2 (en) * | 2012-10-29 | 2016-01-12 | Wayne O. Duescher | Vacuum-grooved membrane abrasive polishing wafer workholder |
US9199354B2 (en) | 2012-10-29 | 2015-12-01 | Wayne O. Duescher | Flexible diaphragm post-type floating and rigid abrading workholder |
US9011207B2 (en) | 2012-10-29 | 2015-04-21 | Wayne O. Duescher | Flexible diaphragm combination floating and rigid abrading workholder |
US10532441B2 (en) * | 2012-11-30 | 2020-01-14 | Applied Materials, Inc. | Three-zone carrier head and flexible membrane |
CN103203683B (zh) * | 2013-03-13 | 2015-02-18 | 大连理工大学 | 一种浮动抛光头 |
WO2014163735A1 (en) * | 2013-03-13 | 2014-10-09 | Applied Materials, Inc. | Reinforcement ring for carrier head |
JP6266493B2 (ja) * | 2014-03-20 | 2018-01-24 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
US9878421B2 (en) * | 2014-06-16 | 2018-01-30 | Applied Materials, Inc. | Chemical mechanical polishing retaining ring with integrated sensor |
TWI692385B (zh) * | 2014-07-17 | 2020-05-01 | 美商應用材料股份有限公司 | 化學機械硏磨所用的方法、系統與硏磨墊 |
US9566687B2 (en) | 2014-10-13 | 2017-02-14 | Sunedison Semiconductor Limited (Uen201334164H) | Center flex single side polishing head having recess and cap |
EP3954816B1 (en) * | 2015-04-16 | 2023-10-25 | NIKE Innovate C.V. | Article of footwear incorporating a knitted component having floated portions |
US10160091B2 (en) | 2015-11-16 | 2018-12-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | CMP polishing head design for improving removal rate uniformity |
JP6721967B2 (ja) * | 2015-11-17 | 2020-07-15 | 株式会社荏原製作所 | バフ処理装置および基板処理装置 |
US10315286B2 (en) * | 2016-06-14 | 2019-06-11 | Axus Technologi, Llc | Chemical mechanical planarization carrier system |
JP6792363B2 (ja) * | 2016-07-22 | 2020-11-25 | 株式会社ディスコ | 研削装置 |
JP6765930B2 (ja) * | 2016-10-19 | 2020-10-07 | 株式会社ディスコ | 加工装置 |
CN113714934B (zh) * | 2016-10-21 | 2024-04-26 | 应用材料公司 | 用于原位电磁感应监测系统的芯配置 |
US10926378B2 (en) | 2017-07-08 | 2021-02-23 | Wayne O. Duescher | Abrasive coated disk islands using magnetic font sheet |
US11691241B1 (en) * | 2019-08-05 | 2023-07-04 | Keltech Engineering, Inc. | Abrasive lapping head with floating and rigid workpiece carrier |
US11945073B2 (en) | 2019-08-22 | 2024-04-02 | Applied Materials, Inc. | Dual membrane carrier head for chemical mechanical polishing |
US11325223B2 (en) * | 2019-08-23 | 2022-05-10 | Applied Materials, Inc. | Carrier head with segmented substrate chuck |
US11320843B2 (en) * | 2019-10-17 | 2022-05-03 | Dongguan Hesheng Machinery & Electric Co., Ltd. | Air compression system with pressure detection |
US20210402549A1 (en) * | 2020-06-29 | 2021-12-30 | Applied Materials, Inc. | Polishing carrier head with multiple angular pressurizable zones |
EP4301550A1 (en) * | 2021-03-04 | 2024-01-10 | Applied Materials, Inc. | Polishing carrier head with floating edge control |
CN115816298A (zh) * | 2022-12-29 | 2023-03-21 | 西安奕斯伟材料科技有限公司 | 定盘、抛光设备和抛光方法 |
Family Cites Families (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2762544A (en) * | 1952-11-26 | 1956-09-11 | Wheeling Stamping Co | Machine for applying screw closures to collapsible tubes |
US4194324A (en) * | 1978-01-16 | 1980-03-25 | Siltec Corporation | Semiconductor wafer polishing machine and wafer carrier therefor |
US4373991A (en) * | 1982-01-28 | 1983-02-15 | Western Electric Company, Inc. | Methods and apparatus for polishing a semiconductor wafer |
FR2558095B1 (fr) * | 1984-03-14 | 1988-04-08 | Ribard Pierre | Perfectionnements apportes aux tetes de travail des machines de polissage et analogues |
JPS6125768A (ja) * | 1984-07-13 | 1986-02-04 | Nec Corp | 平面研摩装置の被加工物保持機構 |
JPS6294257A (ja) * | 1985-10-21 | 1987-04-30 | Fujitsu Ltd | 研磨装置 |
NL8503217A (nl) * | 1985-11-22 | 1987-06-16 | Hoogovens Groep Bv | Preparaathouder. |
JPS63300858A (ja) * | 1987-05-29 | 1988-12-08 | Hitachi Ltd | 空気軸受式ワ−クホルダ |
JPS63114870A (ja) * | 1987-10-22 | 1988-05-19 | Nippon Telegr & Teleph Corp <Ntt> | ウェハの真空吸着方法 |
US4918869A (en) * | 1987-10-28 | 1990-04-24 | Fujikoshi Machinery Corporation | Method for lapping a wafer material and an apparatus therefor |
JPH01216768A (ja) * | 1988-02-25 | 1989-08-30 | Showa Denko Kk | 半導体基板の研磨方法及びその装置 |
JPH079896B2 (ja) * | 1988-10-06 | 1995-02-01 | 信越半導体株式会社 | 研磨装置 |
JPH02224263A (ja) * | 1989-02-27 | 1990-09-06 | Hitachi Ltd | 半導体チップの冷却装置 |
JP2527232B2 (ja) | 1989-03-16 | 1996-08-21 | 株式会社日立製作所 | 研磨装置 |
US5230184A (en) * | 1991-07-05 | 1993-07-27 | Motorola, Inc. | Distributed polishing head |
US5193316A (en) * | 1991-10-29 | 1993-03-16 | Texas Instruments Incorporated | Semiconductor wafer polishing using a hydrostatic medium |
US5205082A (en) * | 1991-12-20 | 1993-04-27 | Cybeq Systems, Inc. | Wafer polisher head having floating retainer ring |
ZA93584B (en) * | 1992-05-27 | 1993-09-01 | De Beers Ind Diamond | Abrasive tools. |
US5498199A (en) * | 1992-06-15 | 1996-03-12 | Speedfam Corporation | Wafer polishing method and apparatus |
DE69333322T2 (de) * | 1992-09-24 | 2004-09-30 | Ebara Corp. | Poliergerät |
JP3370112B2 (ja) * | 1992-10-12 | 2003-01-27 | 不二越機械工業株式会社 | ウエハーの研磨装置 |
JPH071328A (ja) * | 1992-11-27 | 1995-01-06 | Toshiba Corp | ポリッシング装置及び方法 |
US5377451A (en) * | 1993-02-23 | 1995-01-03 | Memc Electronic Materials, Inc. | Wafer polishing apparatus and method |
US5443416A (en) * | 1993-09-09 | 1995-08-22 | Cybeq Systems Incorporated | Rotary union for coupling fluids in a wafer polishing apparatus |
US5584746A (en) * | 1993-10-18 | 1996-12-17 | Shin-Etsu Handotai Co., Ltd. | Method of polishing semiconductor wafers and apparatus therefor |
JP3311116B2 (ja) * | 1993-10-28 | 2002-08-05 | 株式会社東芝 | 半導体製造装置 |
US5643053A (en) * | 1993-12-27 | 1997-07-01 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved polishing control |
US5624299A (en) * | 1993-12-27 | 1997-04-29 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved carrier and method of use |
US5423716A (en) * | 1994-01-05 | 1995-06-13 | Strasbaugh; Alan | Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied |
JP3318615B2 (ja) * | 1994-02-09 | 2002-08-26 | 明治機械株式会社 | 研磨機におけるワ−クの取外し方法 |
US5423558A (en) * | 1994-03-24 | 1995-06-13 | Ipec/Westech Systems, Inc. | Semiconductor wafer carrier and method |
US5651724A (en) * | 1994-09-08 | 1997-07-29 | Ebara Corporation | Method and apparatus for polishing workpiece |
JPH08139165A (ja) * | 1994-11-02 | 1996-05-31 | Sumitomo Metal Mining Co Ltd | ウエハ貼り付け装置 |
JP3158934B2 (ja) * | 1995-02-28 | 2001-04-23 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
US5908530A (en) * | 1995-05-18 | 1999-06-01 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
US5681215A (en) * | 1995-10-27 | 1997-10-28 | Applied Materials, Inc. | Carrier head design for a chemical mechanical polishing apparatus |
US5795215A (en) * | 1995-06-09 | 1998-08-18 | Applied Materials, Inc. | Method and apparatus for using a retaining ring to control the edge effect |
JPH0911118A (ja) * | 1995-06-29 | 1997-01-14 | Hitachi Ltd | 研磨装置 |
JP3678468B2 (ja) * | 1995-07-18 | 2005-08-03 | 株式会社荏原製作所 | ポリッシング装置 |
US5643061A (en) * | 1995-07-20 | 1997-07-01 | Integrated Process Equipment Corporation | Pneumatic polishing head for CMP apparatus |
US5762544A (en) * | 1995-10-27 | 1998-06-09 | Applied Materials, Inc. | Carrier head design for a chemical mechanical polishing apparatus |
DE69717510T2 (de) * | 1996-01-24 | 2003-10-02 | Lam Research Corp., Fremont | Halbleiterscheiben-Polierkopf |
EP0787561B1 (en) * | 1996-02-05 | 2002-01-09 | Ebara Corporation | Polishing apparatus |
US5762539A (en) * | 1996-02-27 | 1998-06-09 | Ebara Corporation | Apparatus for and method for polishing workpiece |
JP3795128B2 (ja) * | 1996-02-27 | 2006-07-12 | 株式会社荏原製作所 | ポリッシング装置 |
JP3663728B2 (ja) * | 1996-03-28 | 2005-06-22 | 信越半導体株式会社 | 薄板の研磨機 |
JP3183388B2 (ja) * | 1996-07-12 | 2001-07-09 | 株式会社東京精密 | 半導体ウェーハ研磨装置 |
US5941758A (en) * | 1996-11-13 | 1999-08-24 | Intel Corporation | Method and apparatus for chemical-mechanical polishing |
US5716258A (en) * | 1996-11-26 | 1998-02-10 | Metcalf; Robert L. | Semiconductor wafer polishing machine and method |
US5851140A (en) * | 1997-02-13 | 1998-12-22 | Integrated Process Equipment Corp. | Semiconductor wafer polishing apparatus with a flexible carrier plate |
JP3027551B2 (ja) * | 1997-07-03 | 2000-04-04 | キヤノン株式会社 | 基板保持装置ならびに該基板保持装置を用いた研磨方法および研磨装置 |
US5964653A (en) | 1997-07-11 | 1999-10-12 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US5989104A (en) * | 1998-01-12 | 1999-11-23 | Speedfam-Ipec Corporation | Workpiece carrier with monopiece pressure plate and low gimbal point |
FR2778129B1 (fr) * | 1998-05-04 | 2000-07-21 | St Microelectronics Sa | Disque support de membrane d'une machine de polissage et procede de fonctionnement d'une telle machine |
US5985094A (en) * | 1998-05-12 | 1999-11-16 | Speedfam-Ipec Corporation | Semiconductor wafer carrier |
US6152808A (en) * | 1998-08-25 | 2000-11-28 | Micron Technology, Inc. | Microelectronic substrate polishing systems, semiconductor wafer polishing systems, methods of polishing microelectronic substrates, and methods of polishing wafers |
US6286834B1 (en) * | 1999-07-23 | 2001-09-11 | Igt | Methods and apparatus for playing wagering games |
US6390905B1 (en) * | 2000-03-31 | 2002-05-21 | Speedfam-Ipec Corporation | Workpiece carrier with adjustable pressure zones and barriers |
JP2004505435A (ja) * | 2000-06-08 | 2004-02-19 | スピードファム−アイピーイーシー コーポレイション | オービタル研磨装置 |
DE60101458T2 (de) * | 2001-05-25 | 2004-10-28 | Infineon Technologies Ag | Halbleitersubstrathalter mit bewegbarer Platte für das chemisch-mechanische Polierverfahren |
-
1997
- 1997-07-11 US US08/891,548 patent/US5964653A/en not_active Expired - Lifetime
-
1998
- 1998-05-19 TW TW087107768A patent/TW379380B/zh not_active IP Right Cessation
- 1998-07-10 KR KR10-2000-7000294A patent/KR100513573B1/ko not_active IP Right Cessation
- 1998-07-10 WO PCT/US1998/014032 patent/WO1999002304A1/en active Search and Examination
- 1998-07-10 JP JP2000501870A patent/JP4413421B2/ja not_active Expired - Lifetime
-
1999
- 1999-08-04 US US09/368,396 patent/US6106378A/en not_active Expired - Lifetime
-
2000
- 2000-07-07 US US09/611,246 patent/US6277010B1/en not_active Expired - Lifetime
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- 2001-07-18 US US09/908,868 patent/US6506104B2/en not_active Expired - Lifetime
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WO1999002304A1 (en) | 1999-01-21 |
US20010041526A1 (en) | 2001-11-15 |
JP4413421B2 (ja) | 2010-02-10 |
US6106378A (en) | 2000-08-22 |
KR20010021732A (ko) | 2001-03-15 |
US20040063385A1 (en) | 2004-04-01 |
US6648740B2 (en) | 2003-11-18 |
US6896584B2 (en) | 2005-05-24 |
KR100513573B1 (ko) | 2005-09-09 |
US6506104B2 (en) | 2003-01-14 |
JP2009255289A (ja) | 2009-11-05 |
TW379380B (en) | 2000-01-11 |
JP2001509440A (ja) | 2001-07-24 |
US6277010B1 (en) | 2001-08-21 |
US20030022609A1 (en) | 2003-01-30 |
US20050142995A1 (en) | 2005-06-30 |
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