FR2778129B1 - Disque support de membrane d'une machine de polissage et procede de fonctionnement d'une telle machine - Google Patents

Disque support de membrane d'une machine de polissage et procede de fonctionnement d'une telle machine

Info

Publication number
FR2778129B1
FR2778129B1 FR9805615A FR9805615A FR2778129B1 FR 2778129 B1 FR2778129 B1 FR 2778129B1 FR 9805615 A FR9805615 A FR 9805615A FR 9805615 A FR9805615 A FR 9805615A FR 2778129 B1 FR2778129 B1 FR 2778129B1
Authority
FR
France
Prior art keywords
disc
front face
diaphragm
radial front
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9805615A
Other languages
English (en)
Other versions
FR2778129A1 (fr
Inventor
Luc Liauzu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR9805615A priority Critical patent/FR2778129B1/fr
Priority to US09/304,314 priority patent/US6283834B1/en
Publication of FR2778129A1 publication Critical patent/FR2778129A1/fr
Application granted granted Critical
Publication of FR2778129B1 publication Critical patent/FR2778129B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
FR9805615A 1998-05-04 1998-05-04 Disque support de membrane d'une machine de polissage et procede de fonctionnement d'une telle machine Expired - Fee Related FR2778129B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9805615A FR2778129B1 (fr) 1998-05-04 1998-05-04 Disque support de membrane d'une machine de polissage et procede de fonctionnement d'une telle machine
US09/304,314 US6283834B1 (en) 1998-05-04 1999-05-03 Diaphragm-support disc for a polishing machine and method of operating a polishing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9805615A FR2778129B1 (fr) 1998-05-04 1998-05-04 Disque support de membrane d'une machine de polissage et procede de fonctionnement d'une telle machine

Publications (2)

Publication Number Publication Date
FR2778129A1 FR2778129A1 (fr) 1999-11-05
FR2778129B1 true FR2778129B1 (fr) 2000-07-21

Family

ID=9525994

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9805615A Expired - Fee Related FR2778129B1 (fr) 1998-05-04 1998-05-04 Disque support de membrane d'une machine de polissage et procede de fonctionnement d'une telle machine

Country Status (2)

Country Link
US (1) US6283834B1 (fr)
FR (1) FR2778129B1 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5964653A (en) 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6162116A (en) * 1999-01-23 2000-12-19 Applied Materials, Inc. Carrier head for chemical mechanical polishing
JP3068086B1 (ja) * 1999-05-07 2000-07-24 株式会社東京精密 ウェ―ハ研磨装置
US6361419B1 (en) * 2000-03-27 2002-03-26 Applied Materials, Inc. Carrier head with controllable edge pressure
US6558232B1 (en) 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
AU2001259745A1 (en) * 2000-05-12 2001-11-26 Multi-Planar Technologies, Inc. System and method for pneumatic diaphragm cmp head having separate retaining ring and multi-region wafer pressure control
US6506105B1 (en) 2000-05-12 2003-01-14 Multi-Planar Technologies, Inc. System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control
US6623343B2 (en) 2000-05-12 2003-09-23 Multi Planar Technologies, Inc. System and method for CMP head having multi-pressure annular zone subcarrier material removal control
JP2001345297A (ja) * 2000-05-30 2001-12-14 Hitachi Ltd 半導体集積回路装置の製造方法及び研磨装置
US20040005842A1 (en) * 2000-07-25 2004-01-08 Chen Hung Chih Carrier head with flexible membrane
US6910949B1 (en) * 2001-04-25 2005-06-28 Lam Research Corporation Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers
US7189313B2 (en) * 2002-05-09 2007-03-13 Applied Materials, Inc. Substrate support with fluid retention band
TWI238754B (en) * 2002-11-07 2005-09-01 Ebara Tech Inc Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof
DE112007003710T5 (de) * 2007-11-20 2010-12-02 Shin-Etsu Handotai Co., Ltd. Polierkopf und Poliervorrichtung
JP5648954B2 (ja) * 2010-08-31 2015-01-07 不二越機械工業株式会社 研磨装置
JP6380333B2 (ja) * 2015-10-30 2018-08-29 株式会社Sumco ウェーハ研磨装置およびこれに用いる研磨ヘッド

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5635083A (en) * 1993-08-06 1997-06-03 Intel Corporation Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate
US5584746A (en) * 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
US5624299A (en) * 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
US5423716A (en) * 1994-01-05 1995-06-13 Strasbaugh; Alan Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied
JP3663767B2 (ja) * 1996-09-04 2005-06-22 信越半導体株式会社 薄板の鏡面研磨装置
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US5957751A (en) * 1997-05-23 1999-09-28 Applied Materials, Inc. Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system

Also Published As

Publication number Publication date
FR2778129A1 (fr) 1999-11-05
US6283834B1 (en) 2001-09-04

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Legal Events

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Effective date: 20100129