TW202142661A - 光硬化性片狀黏著劑 - Google Patents
光硬化性片狀黏著劑 Download PDFInfo
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- TW202142661A TW202142661A TW110111056A TW110111056A TW202142661A TW 202142661 A TW202142661 A TW 202142661A TW 110111056 A TW110111056 A TW 110111056A TW 110111056 A TW110111056 A TW 110111056A TW 202142661 A TW202142661 A TW 202142661A
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Classifications
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
- C08L29/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
- C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Epoxy Resins (AREA)
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| CN116802220A (zh) * | 2022-01-13 | 2023-09-22 | 古河电气工业株式会社 | 柔性器件用树脂组合物、柔性器件用膜状粘接剂、柔性器件用粘接片及柔性器件的制造方法 |
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| JPS59159820A (ja) * | 1983-03-02 | 1984-09-10 | Mitsui Toatsu Chem Inc | 紫外線硬化性組成物 |
| JP2002146319A (ja) * | 2000-11-13 | 2002-05-22 | Three M Innovative Properties Co | 熱硬化性接着剤及びそれを用いた接着剤フィルム |
| KR100827756B1 (ko) * | 2002-03-13 | 2008-05-07 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 열경화성 접착제 및 이것을 사용한 접착체 필름 |
| JP5448024B2 (ja) * | 2007-03-15 | 2014-03-19 | 住友化学株式会社 | 光硬化性接着剤、該光硬化性接着剤を用いた偏光板およびその製造方法、光学部材および液晶表示装置 |
| JP5487634B2 (ja) * | 2009-02-10 | 2014-05-07 | 東亞合成株式会社 | フレキシブル印刷配線板用難燃性接着剤組成物及びそれを用いたフレキシブル印刷配線板 |
| JP5465453B2 (ja) * | 2009-03-26 | 2014-04-09 | パナソニック株式会社 | 光導波路形成用エポキシ樹脂組成物、光導波路形成用硬化性フィルム、光伝送用フレキシブルプリント配線板、及び電子情報機器 |
| JP2010275373A (ja) * | 2009-05-26 | 2010-12-09 | Toagosei Co Ltd | 光学フィルム又はシート用活性エネルギー線硬化型組成物及び活性エネルギー線硬化型粘接着フィルム又はシート |
| CN102449093B (zh) | 2009-06-01 | 2014-08-20 | 日东电工株式会社 | 光固化型粘合粘接剂组合物、光固化型粘合粘接剂层、和光固化型粘合粘接片 |
| JP5555532B2 (ja) * | 2010-04-22 | 2014-07-23 | 積水化学工業株式会社 | 有機ｅｌ素子用封止剤及び有機ｅｌ素子 |
| JP5651421B2 (ja) | 2010-10-07 | 2015-01-14 | 三井化学株式会社 | 封止用組成物及びそれを用いた封止用シート |
| JP5948784B2 (ja) | 2011-10-13 | 2016-07-06 | 三菱レイヨン株式会社 | エポキシ樹脂組成物 |
| JP6053810B2 (ja) * | 2011-11-18 | 2016-12-27 | エルジー・ケム・リミテッド | 有機電子装置封止用光硬化型粘接着フィルム、有機電子装置及びその封止方法 |
| US20130224425A1 (en) * | 2012-02-23 | 2013-08-29 | Hitachi Chemical Company, Ltd. | Pressure-sensitive adhesive sheet for image display device, method for producing image display device and image display device |
| JP2014043546A (ja) * | 2012-07-31 | 2014-03-13 | Nitto Denko Corp | 放射線硬化型粘着剤層及び放射線硬化型粘着シート |
| JP6067405B2 (ja) * | 2012-07-31 | 2017-01-25 | 日東電工株式会社 | 放射線硬化型粘着剤、放射線硬化型粘着剤層、放射線硬化型粘着シートおよび積層体 |
| JP6306679B2 (ja) * | 2012-07-31 | 2018-04-04 | 日東電工株式会社 | 放射線硬化型粘着剤、放射線硬化型粘着剤層、放射線硬化型粘着シートおよび積層体 |
| KR101832522B1 (ko) | 2013-11-29 | 2018-04-04 | 주식회사 엘지화학 | 접착 필름 형성용 조성물, 광경화전 가공용 점착 필름, 접착 필름 및 전자종이 표시장치 |
| JP2017110128A (ja) | 2015-12-17 | 2017-06-22 | Dic株式会社 | 熱硬化性接着シート、物品及び物品の製造方法 |
| JP6690356B2 (ja) * | 2016-03-29 | 2020-04-28 | 味の素株式会社 | 熱硬化性樹脂組成物 |
| WO2018047919A1 (ja) | 2016-09-07 | 2018-03-15 | リンテック株式会社 | 接着剤組成物、封止シート、及び封止体 |
| CN109963920B (zh) * | 2016-11-18 | 2021-09-14 | 三键有限公司 | 相机模组用阳离子固化性胶粘剂组合物、固化物以及接合体 |
| US20200040131A1 (en) * | 2017-03-22 | 2020-02-06 | Panasonic Intellectual Property Management Co., Ltd. | Photocurable resin composition, adhesive, stacked structure, method for fabricating the stacked structure, and display device |
| JP2018168305A (ja) * | 2017-03-30 | 2018-11-01 | リンテック株式会社 | 粘着シート、積層体、及びデバイス |
| JP7287274B2 (ja) * | 2017-04-19 | 2023-06-06 | 味の素株式会社 | 樹脂組成物 |
| KR102660240B1 (ko) * | 2017-12-06 | 2024-04-23 | 닛뽄 가야쿠 가부시키가이샤 | 감광성 수지 조성물, 드라이 필름 레지스트 및 그들의 경화물 |
| TWI799557B (zh) * | 2018-03-28 | 2023-04-21 | 日商琳得科股份有限公司 | 樹脂組合物、密封片及密封體 |
| CN111918943B (zh) * | 2018-03-29 | 2023-05-02 | 三菱化学株式会社 | 粘合片、层叠片及使用其的图像显示装置 |
| WO2020196240A1 (ja) * | 2019-03-28 | 2020-10-01 | リンテック株式会社 | シート状接着剤、封止シート、電子デバイスの封止体、及び、電子デバイスの封止体の製造方法 |
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2021
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- 2021-03-26 WO PCT/JP2021/013142 patent/WO2021200758A1/ja not_active Ceased
- 2021-03-26 KR KR1020227028055A patent/KR102910126B1/ko active Active
- 2021-03-26 KR KR1020227017521A patent/KR102910124B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220161545A (ko) | 2022-12-06 |
| CN115279854A (zh) | 2022-11-01 |
| JP7631316B2 (ja) | 2025-02-18 |
| TW202140734A (zh) | 2021-11-01 |
| CN115427526B (zh) | 2025-02-25 |
| TWI868337B (zh) | 2025-01-01 |
| KR102910126B1 (ko) | 2026-01-08 |
| KR20220161547A (ko) | 2022-12-06 |
| CN115427526A (zh) | 2022-12-02 |
| JP7709956B2 (ja) | 2025-07-17 |
| WO2021200758A1 (ja) | 2021-10-07 |
| KR102910124B1 (ko) | 2026-01-08 |
| WO2021200757A1 (ja) | 2021-10-07 |
| JPWO2021200758A1 (https=) | 2021-10-07 |
| JPWO2021200757A1 (https=) | 2021-10-07 |
| CN115279854B (zh) | 2024-12-13 |
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