TW201915542A - 光學裝置 - Google Patents

光學裝置 Download PDF

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Publication number
TW201915542A
TW201915542A TW107124245A TW107124245A TW201915542A TW 201915542 A TW201915542 A TW 201915542A TW 107124245 A TW107124245 A TW 107124245A TW 107124245 A TW107124245 A TW 107124245A TW 201915542 A TW201915542 A TW 201915542A
Authority
TW
Taiwan
Prior art keywords
transparent
substrate
optical element
optical
emitting module
Prior art date
Application number
TW107124245A
Other languages
English (en)
Inventor
傅旭文
Original Assignee
香港商印芯科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 香港商印芯科技股份有限公司 filed Critical 香港商印芯科技股份有限公司
Priority to US16/364,197 priority Critical patent/US20200018986A1/en
Publication of TW201915542A publication Critical patent/TW201915542A/zh

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Classifications

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    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078—Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
    • G11C7/1096—Write circuits, e.g. I/O line write drivers
    • G—PHYSICS
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    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
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    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
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    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
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    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
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Abstract

一種光學裝置，包括基底、發光模組、透明光學元件以及連接單元。發光模組設置於基底上，且電性連接於基底。透明光學元件設置於發光模組上。透明光學元件包括透明基底以及光學結構。光學結構設置於透明基底上，光學結構與透明基底為一體成型且由相同材料製成。連接單元設置於發光模組旁，且用以將透明光學元件連接至基底。

Description

光學裝置
本發明是有關於一種裝置，且特別是有關於一種光學裝置。
一般的光學元件常採用壓印(imprinting)的方式，在透明基底上壓印出特定的圖案，以作為光學結構。這種方式常使用例如為樹酯(epoxy)等有機材料來做為這些圖案化光學結構的材料。
然而，當上述的光學元件遭到碰撞時，以有機材料製成的光學結構較容易造成磨損或刮傷。此外，當上述的光學元件應用在高強度的發光元件時，在長時間的使用下，以有機材料製成的光學結構容易因持續的光源照射而產生裂化或裂解，進而影響到光學元件的光學性質或是光學行為。
本發明的實施例提供一種光學裝置，具有穩定的光學性質。
本發明的一實施例提出一種光學裝置，包括基底、發光模組、透明光學元件以及連接單元。發光模組設置於基底上，且電性連接於基底。透明光學元件設置於發光模組上。透明光學元件包括透明基底以及光學結構。光學結構設置於透明基底上，光學結構與透明基底為一體成型且由相同材料製成。連接單元設置於發光模組旁，且用以將透明光學元件連接至基底。
在本發明的一實施例中，上述的透明光學元件的材料包括晶體。
在本發明的一實施例中，上述的晶體包括藍寶石或尖晶石。
在本發明的一實施例中，上述的透明光學元件的材料包括玻璃。
在本發明的一實施例中，上述的光學結構設置於透明基底的第一表面以及與第一表面相對的第二表面的至少其中一者上。
在本發明的一實施例中，上述的透明光學元件包括繞射光學元件或透鏡陣列。
在本發明的一實施例中，上述的連接單元圍繞發光模組，並使發光模組與透明光學元件保持間距。
在本發明的一實施例中，上述的透明光學元件在基底的正投影面積小於基底的面積。
在本發明的一實施例中，上述的發光模組包括雷射二極體或發光二極體。
在本發明的一實施例中，上述的連接單元為環狀膠框。
基於上述，在本發明的實施例的光學裝置中，由於透明光學元件的光學結構與透明基底為一體成型且由相同材料製成，相較於由有機材料製成的光學結構來說，本發明的實施例的光學結構不易產生裂化或裂解，因此可具有穩定的光學性質。
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。
圖1為本發明一實施例的光學裝置的剖面示意圖。請參照圖1，本實施例的光學裝置100包括基底110、發光模組120、透明光學元件130以及連接單元140。發光模組120設置於基底110上，且電性連接於基底110。透明光學元件130設置於發光模組120上。透明光學元件130包括透明基底132以及光學結構134。光學結構134設置於透明基底132上，光學結構134與透明基底132為一體成型且由相同材料製成。連接單元140設置於發光模組120旁，且用以將透明光學元件130連接至基底110。
由於透明光學元件130的光學結構134與透明基底132為一體成型且由相同材料製成，相較於由有機材料製成的光學結構來說，本發明的實施例的光學結構134不易產生裂化或裂解，因此透明光學元件130可具有穩定的光學性質。
在本實施例中，發光模組120例如是可發出多道光束的垂直共振腔面射型雷射(vertical-cavity surface-emitting laser，VCSEL)模組。在其他實施例中，發光模組120也可以是可發出單一光束的邊射型雷射二極體(edge-emitting laser diode)模組、發光二極體(light-emitting diode，LED)模組或是其他適當的光源，且光源的數量可以是一個，也可以是多個，本發明不以此為限。
在本實施例中，光學結構134設置於透明基底132的第一表面S1以及與第一表面S1相對的第二表面S2的至少其中一者上。具體來說，如圖1所示，光學結構134設置於透明基底132中遠離發光模組120的第一表面S1。然而，在其他實施例中，光學結構134也可以設置於透明基底132中靠近發光元件120的第二表面S2。或者，透明基底132的第一表面S1與第二表面S2也可以同時設置有光學結構134。
需說明的是，圖1中所示的透明光學元件130是以透鏡陣列(lens array)為例，也就是光學結構134是以多個微透鏡(microlens)結構為例。然而，透明光學元件130也可以是繞射光學元件(diffraction optical element，DOE)，而光學結構134是多個繞射微結構。或者，在其他實施例中，光學結構134也可以是單一透鏡結構、菲涅耳透鏡(fresnel lens)的微結構或是其他光學結構，本發明不以此為限。
在本實施例中，透明光學元件130的材料包括晶體，例如為藍寶石(sapphire)。具體來說，藍寶石具有高硬度、高熔點以及高折射率等特性。藍寶石的莫氏硬度為9，屬於硬度高且耐磨的材料，因此可使透明光學元件130的光學結構134更不易受損。再者，藍寶石的熔點大於攝氏2000度且導熱性佳，因此即使長時間受到光源照射，也不易產生形變，有助於透明光學元件130保持穩定的光學性質。此外，藍寶石的折射率大約為1.74，屬於高折射率的材料，可達到較佳的光束擴散效果，有利於透明光學元件130的應用。舉例來說，當應用在光偵測技術時，即使待側物在近距離的情況下，由於光束擴散效果較佳，因此較能夠涵蓋到待側物的整體面積。另一方面，由於光束擴散效果較佳，因此可採用尺寸較小的光學元件，亦能達到相同的擴光效果，有利於節省光學元件的尺寸。
值得一提的是，由於晶體內部的原子或分子呈現規則性排列，因此可直接透過非等向性(anisotropic)的蝕刻方式，使光學結構134的形狀呈現類似於微透鏡結構的形狀，而無須透過複雜的製程。
在其他實施例中，透明光學元件130的材料也可以是使用其他種具有高透明度、耐磨或不易受到光源溫度影響的晶體。舉例來說，透明光學元件130的材料也可以是尖晶石(spinel)，尖晶石的莫氏硬度為8、折射率大於1.7且熔點高，因此可具有與藍寶石相似的優點。然而，在一些實施例中，透明光學元件130的材料也可以是玻璃或者是其他適當的透明材料，本發明不以此為限。
需說明的是，本實施例是以單層透明光學元件為例，然而在其他實施例中，透明光學元件也可以是多層光學元件堆疊而成的複合結構。
在本實施例中，連接單元140圍繞發光模組120，並使發光模組120與透明光學元件130保持間距。舉例來說，連接單元140例如為環狀膠框。連接單元140圍繞並包圍發光模組120，並使透明光學元件130與設置有發光模組120的基底110對接。此外，透明光學元件130在基底110的正投影面積小於基底110的面積，也就是說，部分的基底110是暴露於透明光學元件130之外，使發光模組120的外接線路(例如是電極接線)可透過暴露出的基底而外接出來。
圖2A至圖2C為本發明一實施例的透明光學元件的製作流程示意圖。請參照圖2A至圖2C，首先，如圖2A，提供透明基材132’。接著，如圖2B，在透明基材132’上形成圖案化罩幕PM。在本實施例中，圖案化罩幕PM可以是透過壓印製程而壓印至透明基材132’上，或者，圖案化罩幕PM也可以是透過黃光製程所形成的圖案化光阻(photoresist)。最後，如圖2C，對形成有圖案化罩幕PM的透明基材132’進行蝕刻製程以形成光學結構134a，並移除圖案化罩幕PM。因此，製作完成的透明光學元件130a的透明基底132a與光學結構134a為一體成型且由相同材料製成。在本實施例中，蝕刻製程可以是乾式蝕刻(dry etching)，也可以是溼式蝕刻(wet etching)。
需說明的是，上述的透明光學元件130a的外型以及製作方法僅為說明性實例，而非用以限制本發明，任何透明基底132a與光學結構134a為一體成型且由相同材料製成之透明光學元件130a及其製作方法皆包含在本發明欲保護的範圍。
圖3為本發明一實施例的光學裝置的製造流程的方塊圖。本實施例的方法200可採用晶圓級(wafer level)的製作方法將透明光學元件接合至設置有發光模組的基底。此種製作方式無須如同晶片級(chip level)的製作方式得透過較複雜的對準(alignment)製程來將各自獨立的光學元件一一接合至設置有發光模組的各別基底，因此可具有較簡易的製作方式以及較低的成本。
請參照圖3，本實施例的方法200例如是製造如圖1的光學裝置100，在執行單體切割製程之前，多個光學裝置100彼此相連接，且例如是以陣列形式排列。在步驟202中，提供基底。在步驟204中，將發光模組設置於基底。在步驟206中，提供透明基材，例如是圖2A中的透明基材132’。在步驟208中，形成透明光學元件，其方法例如為前述圖2A至圖2C所繪示的方法。在步驟210中，透過連接單元將透明光學元件接合至設置有發光模組的基底。在步驟212中，執行單體切割，以分離出多個各自獨立的光學裝置100。
在本實施例中，可執行兩道切割製程，第一道可由靠近透明光學元件的一側(如圖1中的上方) 來進行透明光學元件的切割，第二道可由靠近基底的一側(如圖1中的下方) 來進行基底的切割，使切割後的光學裝置的透明光學元件的面積小於基底的面積。或者，也可由同一側來執行切割，並控制不同深度時的切割能量(例如為雷射的能量)，使切割後的光學裝置的透明光學元件的面積小於基底的面積，以利於外接發光模組的線路。
值得一提的是，本實施例的透明光學元件的光學結構可採用均勻分布的形式來形成於透明基材上，因此無須透過額外的對準製程將透明光學元件的光學結構一一與對應的發光模組對準，其製作方法較為簡易。然而，在其他實施例中，光學結構也可以只對應於發光模組上方的位置，本發明不以此為限。
綜上所述，在本發明的實施例的光學裝置中，由於透明光學元件的光學結構與透明基底為一體成型且由相同材料製成，相較於由有機材料製成的光學結構來說，本發明的實施例的光學結構不易產生裂化或裂解，因此可具有穩定的光學性質。此外，當採用例如是藍寶石或尖晶石來做為透明光學元件的材料時，由於此類晶體具有高折射率、高硬度以及耐高溫等特性，因此以此類晶體所製成的透明光學元件可具有更佳的光束擴散效果、更耐磨且更不易產生形變等優點。
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。
100‧‧‧光學裝置
110‧‧‧基底
120‧‧‧發光模組
130、130a‧‧‧透明光學元件
132、132a‧‧‧透明基底
132’‧‧‧透明基材
S1‧‧‧第一表面
S2‧‧‧第二表面
134、134a‧‧‧光學結構
140‧‧‧連接單元
200‧‧‧方法
202、204、206、208、210、212‧‧‧步驟
PM‧‧‧圖案化罩幕
圖1為本發明一實施例的光學裝置的剖面示意圖。 圖2A至圖2C為本發明一實施例的透明光學元件的製作流程示意圖。 圖3為本發明一實施例的光學裝置的製造流程的方塊圖。

Claims (10)

  1. 一種光學裝置，包括： 基底； 發光模組，設置於所述基底上，且電性連接於所述基底； 透明光學元件，設置於所述發光模組上，其中所述透明光學元件包括： 透明基底；以及 光學結構，設置於所述透明基底上，所述光學結構與所述透明基底為一體成型且由相同材料製成；以及 連接單元，設置於所述發光模組旁，且用以將所述透明光學元件連接至所述基底。
  2. 如申請專利範圍第1項所述的光學裝置，其中所述透明光學元件的材料包括晶體。
  3. 如申請專利範圍第2項所述的光學裝置，其中所述晶體包括藍寶石或尖晶石。
  4. 如申請專利範圍第1項所述的光學裝置，其中所述透明光學元件的材料包括玻璃。
  5. 如申請專利範圍第1項所述的光學裝置，其中所述光學結構設置於所述透明基底的第一表面以及與所述第一表面相對的第二表面的至少其中一者上。
  6. 如申請專利範圍第1項所述的光學裝置，其中所述透明光學元件包括繞射光學元件或透鏡陣列。
  7. 如申請專利範圍第1項所述的光學裝置，其中所述連接單元圍繞所述發光模組，並使所述發光模組與所述透明光學元件保持間距。
  8. 如申請專利範圍第1項所述的光學裝置，其中所述透明光學元件在所述基底的正投影面積小於所述基底的面積。
  9. 如申請專利範圍第1項所述的光學裝置，其中所述發光模組包括雷射二極體或發光二極體。
  10. 如申請專利範圍第1項所述的光學裝置，其中所述連接單元為環狀膠框。
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