TW201916670A - 曝光方法、電子裝置與主從式系統 - Google Patents

曝光方法、電子裝置與主從式系統 Download PDF

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Publication number
TW201916670A
TW201916670A TW107126454A TW107126454A TW201916670A TW 201916670 A TW201916670 A TW 201916670A TW 107126454 A TW107126454 A TW 107126454A TW 107126454 A TW107126454 A TW 107126454A TW 201916670 A TW201916670 A TW 201916670A
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Taiwan
Prior art keywords
image
exposure
processor
circuit
images
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Application number
TW107126454A
Other languages
English (en)
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TWI719332B (zh
Inventor
張耕力
Original Assignee
香港商印芯科技股份有限公司
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Priority to US16/264,706 priority Critical patent/US10990781B2/en
Publication of TW201916670A publication Critical patent/TW201916670A/zh
Application granted granted Critical
Publication of TWI719332B publication Critical patent/TWI719332B/zh

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Classifications

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Abstract

曝光方法、電子裝置與主從式系統。電子裝置包括影像擷取電路以及耦接至影像擷取電路的處理器。處理器取得曝光指令以及第一數量。處理器根據曝光指令,控制影像擷取電路進行曝光以擷取一影像。所述處理器判斷所述影像的數量是否達到第一數量。當所述影像的數量未達到第一數量時,所述處理器再次執行控制影像擷取電路進行曝光以擷取所述影像的運作。當所述影像的數量達到第一數量時,處理器停止控制影像擷取電路進行曝光。

Description

曝光方法、電子裝置與主從式系統
本發明是有關於一種曝光方法、電子裝置與主從式系統。
一般來說,傳統的影像感測器(或影像擷取電路)應用在相機中時,若使用者要即時觀看到相機捕捉到的影像,相機中的影像感測器需連續地曝光並維持一定的幀率(frame per second,fps)。然而在非人眼觀看的應用(例如:指紋辨識,指紋偵測等)中,持續且穩定的幀率並非必要的條件。在此情況下,若影像感測器持續地進行曝光,會造成裝置不必要的耗電。
本發明提供一種曝光方法、電子裝置與主從式系統,可以有效地控制影像擷取電路曝光的時間,藉此避免不必要的曝光而擷取過多的影像,並有效地降低裝置的耗電量。
本發明提出一種電子裝置,所述電子裝置包括影像擷取電路以及耦接至影像擷取電路的處理器。所述處理器取得曝光指令以及第一數量。所述處理器根據所述曝光指令,控制所述影像擷取電路進行曝光以擷取影像。所述處理器判斷所述影像的數量是否達到所述第一數量。當所述影像的數量未達到所述第一數量時,所述處理器再次執行控制所述影像擷取電路進行曝光以擷取所述影像的運作。當所述影像的數量達到所述第一數量時,所述處理器停止控制所述影像擷取電路進行曝光。
本發明提出一種曝光方法,用於電子裝置,所述電子裝置包括影像擷取電路以及處理器,所述方法包括:藉由所述處理器取得曝光指令以及第一數量;藉由所述處理器根據所述曝光指令,控制所述影像擷取電路進行曝光以擷取影像;藉由所述處理器判斷所述影像的數量是否達到所述第一數量;當所述影像的數量未達到所述第一數量時,藉由所述處理器再次執行控制所述影像擷取電路進行曝光以擷取所述影像的步驟;以及當所述影像的數量達到所述第一數量時,藉由所述處理器停止控制所述影像擷取電路進行曝光。
本發明提出一種主從式系統,包括:主裝置與從裝置。主裝置具有第一介面。從裝置具有第二介面以及影像擷取電路。第二介面電性連接至第一介面。所述從裝置控制所述影像擷取電路進行曝光以擷取多個影像。所述主裝置提供讀取指令以及選擇訊號至所述從裝置。所述從裝置根據所述讀取指令以及所述選擇訊號,提供所述多個影像中的至少一第一影像至所述主裝置。在提供所述多個影像中的所述第一影像至所述主裝置的運作中,當所述從裝置停止接收到所述選擇訊號時,所述從裝置停止執行控制所述影像擷取電路進行曝光以擷取所述多個影像的運作以及停止執行提供所述多個影像中的所述第一影像至所述主裝置的運作。
本發明提出一種曝光方法,用於主從式系統,所述主從式系統包括主裝置以及從裝置,所述主裝置具有第一介面,所述從裝置具有第二介面以及影像擷取電路,所述第二介面電性連接至所述第一介面,所述方法包括:藉由所述從裝置控制所述影像擷取電路進行曝光以擷取多個影像;藉由所述主裝置提供讀取指令以及選擇訊號至所述從裝置;藉由所述從裝置根據所述讀取指令以及所述選擇訊號,提供所述多個影像中的至少一第一影像至所述主裝置藉;以及在提供所述多個影像中的所述第一影像至所述主裝置的步驟中,當所述從裝置停止接收到所述選擇訊號時,藉由所述從裝置停止執行控制所述影像擷取電路進行曝光以擷取所述多個影像的步驟以及停止執行提供所述多個影像中的所述第一影像至所述主裝置的步驟。
基於上述,本發明的曝光方法、電子裝置與主從式系統,可以有效地控制影像擷取電路曝光的時間,藉此避免不必要的曝光而擷取過多的影像,並有效地降低裝置的耗電量。
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。
現將詳細參考本發明之示範性實施例,在附圖中說明所述示範性實施例之實例。另外,凡可能之處,在圖式及實施方式中使用相同標號的元件/構件代表相同或類似部分。
以下以多個實施例來描述本發明的曝光方法。
[第一實施例]
圖1是依照本發明的一實施例所繪示的電子裝置的示意圖。
請參照圖1,電子裝置100包括處理器20、影像擷取電路22、暫存器24以及輸出電路26。其中,影像擷取電路22、暫存器24以及輸出電路26分別耦接至處理器20。電子裝置100例如是手機、平板電腦、筆記型電腦等電子裝置,在此不設限。
處理器20可以是中央處理器(Central Processing Unit,CPU),或是其他可程式化之一般用途或特殊用途的微處理器(Microprocessor)、數位信號處理器(Digital Signal Processor,DSP)、可程式化控制器、特殊應用積體電路(Application Specific Integrated Circuit,ASIC)或其他類似元件或上述元件的組合。
影像擷取電路22是用以擷取一或多張影像。舉例來說,影像擷取電路22可以配備有電荷耦合元件(Charge Coupled Device,CCD)、互補性氧化金屬半導體(Complementary Metal-Oxide Semiconductor,CMOS)元件或其他種類的感光元件的攝像鏡頭,並且可以用以曝光並擷取至少一影像。
暫存器24可以是任何型態的固定或可移動隨機存取記憶體(random access memory,RAM)、唯讀記憶體(read-only memory,ROM)、快閃記憶體(flash memory)或類似元件或上述元件的組合。
輸出電路26主要用於輸出影像擷取電路22所擷取的影像。輸出電路26例如是用於將資料傳輸給其他電子裝置的傳輸介面,或者是用於顯示影像擷取電路22所擷取的影像的顯示裝置,在此並不做限制。
在本範例實施例中,電子裝置100的還包括儲存電路(未繪示)。電子裝置100的儲存電路中儲存有多個程式碼片段,在上述程式碼片段被安裝後,會由處理器20來執行。例如,電子裝置100的儲存電路中包括多個模組,藉由這些模組來分別執行電子裝置100的各個運作,其中各模組是由一或多個程式碼片段所組成。然而本發明不限於此,電子裝置100的各個運作也可以是使用其他硬體形式的方式來實現。
圖2是依照本發明的第一實施例所繪示的曝光方法的流程圖。
請同時參照圖1與圖2,在本實施例中,處理器20可以取得使用者輸入(或下達)的曝光指令以及第一數量(步驟S201)。其中,第一數量是指欲擷取的影像的數量。在一實施例中,第一數量是被包括在曝光指令中。然而在另一實施例中,暫存器24可以預先取得使用者輸入的第一數量,並且將此第一數量預先儲存在暫存器24中以供處理器20進行存取。
在處理器20接收到曝光指令後,會根據此曝光指令控制影像擷取電路22進行曝光以擷取影像(步驟S203)。接著,處理器20會暫存所擷取到的影像於暫存器24,並且停止控制影像擷取電路22進行曝光(即,停止控制影像擷取電路22擷取影像)(步驟S205)。之後,處理器20會判斷是否透過輸出電路26輸出暫存於暫存器24中的影像(步驟S207)。
當處理器20接收到使用者下達的輸出指令或從外部接收到輸出指令時,處理器20會根據此輸出指令,透過輸出電路26輸出暫存於暫存器24中的影像(步驟S209)。例如,可以透過輸出電路26輸出暫存於暫存器24中的影像以將該影像顯示在螢幕,或者是透過輸出電路26輸出暫存於暫存器24中的影像至另一裝置。此外,前述步驟S207中,當處理器20沒有接收到前述的輸出指令時,處理器20不會透過輸出電路26輸出暫存於暫存器24中的影像,並且當暫存器24剩餘可用容量不足以儲存下一張影像時會讓影像擷取電路22維持在停止曝光的狀態(即,返回步驟S205)。
而在處理器20會根據輸出指令透過輸出電路26輸出暫存於暫存器24中的影像(即,步驟S209)之後,處理器20會判斷影像擷取電路22進行曝光後所擷取到的影像的數量是否達到前述的第一數量(步驟S211)。若影像擷取電路22進行曝光後所擷取到的影像的數量尚未達到前述的第一數量,則圖2的流程會返回步驟S203以讓處理器20控制影像擷取電路22再次進行曝光以擷取影像,並且可以再執行前述的步驟S205至步驟S211。然而,在步驟S211中,若處理器20判斷影像擷取電路22進行曝光後所擷取到的影像的數量已達到前述的第一數量,則處理器20會停止控制影像擷取電路22進行曝光(步驟S213)。
藉由上述方式,本發明的第一實施例可以設定影像擷取電路22所欲取得影像的數量,避免影像擷取電路22擷取過多的影像。此外,本發明的第一實施例在影像擷取電路22擷取到影像後會直接停止曝光且不會立即地再擷取下一張影像,而是在輸出前述已擷取到的影像後,影像擷取電路22才會再擷取下一張影像,藉此可以避免影像擷取電路22一直曝光(或一直擷取影像)造成電子裝置電力的消耗。
[第二實施例]
圖3是依照本發明的一實施例所繪示的主從式系統的示意圖。
請參照圖3,主從式系統1000包括主裝置200以及從裝置300。主裝置200以及從裝置300例如可以分別包括處理器(未繪示)以及儲存電路(未繪示)。在主裝置200以及從裝置300中,儲存電路可以耦接至處理器。其中,主裝置200以及從裝置300例如是手機、平板電腦、筆記型電腦等電子裝置,在此不設限。此外,在其他實施例中,主裝置200以及從裝置300也可以包括其他更多的元件。特別是,在其他實施例中,主裝置200以及從裝置300也可以被配置在同一個裝置中。需說明的示,雖然圖3僅繪示一個主裝置200連接至一個從裝置300,但本發明不限於此。在其他實施例中,一個主裝置200可以連接至多個從裝置300。
處理器可以是與第一實施例中處理器20相類似的元件,在此不再贅述。儲存電路可以是與第一實施例中電子裝置100的儲存電路相類似的元件,在此不再贅述。此外,在本範例實施例中,從裝置300還包括耦接至從裝置300的處理器的影像擷取電路30。而影像擷取電路30可以是與第一實施例中影像擷取電路22相類似的元件,在此不再贅述。
在本實施例中,主裝置200具有介面50(亦稱為,第一介面),從裝置300具有介面60(亦稱為,第二介面)。其中,第一介面與第二介面彼此電性連接使得主裝置200可以與從裝置300進行資料的傳輸。在本範例實施例中,介面50與介面60分別是串列週邊介面(Serial Peripheral Interface,SPI)。其中,一個串列週邊介面會具有從選擇(Select Slave,SS)接腳、串列時脈(Serial Clock,SCLK)接腳、主輸出從輸入(Master Output Slave Input,MOSI)接腳以及主輸入從輸出(Master Input Slave Output,MISO)接腳。而當介面50電性連接介面60時,主裝置200的SS接腳會電性連接至從裝置300的SS接腳,主裝置200的SCLK接腳會電性連接至從裝置300的SCLK接腳,主裝置200的MOSI接腳會電性連接至從裝置300的MOSI接腳,且主裝置200的MISO接腳會電性連接至從裝置300的MISO接腳。
在本範例實施例中,主裝置200與從裝置300的儲存電路中儲存有多個程式碼片段,在上述程式碼片段被安裝後,會由主裝置200與從裝置300的處理器來執行。例如,主裝置200與從裝置300的儲存電路中包括多個模組,藉由這些模組來分別執行主從式系統1000的各個運作,其中各模組是由一或多個程式碼片段所組成。然而本發明不限於此,上述的各個運作也可以是使用其他硬體形式的方式來實現。此外,主裝置200與從裝置300的處理器也可以用於控制主裝置200與從裝置300之間資料的傳輸。
圖4是依照本發明的第二實施例所繪示的曝光方法的流程圖。圖5是依照本發明的一實施例所繪示的SPI的訊號傳輸的示意圖。
請同時參照圖4與圖5,首先,如圖5所示,主裝置200會藉由SS接腳提供選擇訊號、藉由SCLK接腳提供時脈訊號以及藉由MOSI接腳提供曝光指令cmd1至從裝置300(步驟S401)。如圖5所示,所述選擇訊號例如是將原本SS接腳中處於高電位的訊號調整為低電位的訊號,藉此讓從裝置300得知其已被主裝置200所選擇。在圖5中,低電位訊號是位於時間點T1與時間點T2之間。此外,步驟S401的時脈訊號包括一時脈週期C1。
之後,從裝置300會根據前述步驟S401的曝光指令cmd1、選擇訊號以及時脈訊號,控制影像擷取電路30進行曝光以擷取多個影像(步驟S403)。例如,在時間點T3,從裝置300會根據前述的曝光指令cmd1、選擇訊號以及時脈訊號,將影像擷取電路30的一曝光狀態ES從低電位調整為高電位,藉此致能影像擷取電路30的曝光功能以讓影像擷取電路30開始曝光並擷取影像。而擷取到的影像可以儲存在從裝置300的一暫存器(未繪示)中。
之後,主裝置200還會再藉由SS接腳提供選擇訊號、藉由SCLK接腳提供時脈訊號以及藉由MOSI接腳提供讀取指令cmd2至從裝置300(步驟S405)。如圖5所示,所述選擇訊號例如是將原本SS接腳中處於高電位的訊號在時間點T4調整為低電位的訊號,藉此讓從裝置300得知其已被主裝置200所選擇。在圖5中,低電位訊號是位於時間點T4與時間點T5之間。此外,主裝置200會持續地提供包括時脈週期C2~C10的時脈訊號給從裝置300。
之後,從裝置300會根據讀取指令cmd2、前述的選擇訊號以及時脈訊號,藉由MISO接腳提供影像擷取單元30擷取的多個影像中的影像D1~D6(統稱為,第一影像)至主裝置200(步驟S407)。並且在提供前述的第一影像的過程中,從裝置300會判斷是否停止接收到選擇訊號(步驟S409)。換句話說,從裝置300會判斷SS接腳中處於低電位的訊號是否被恢復(或調整)為高電位。
假設從裝置300判斷SS接腳中的訊號一直處於低電位,則從裝置300會判斷從裝置300持續地接收到選擇訊號。此時,從裝置300會根據前述的曝光指令cmd1、選擇訊號以及時脈訊號,控制影像擷取電路30持續地進行曝光以擷取多個影像(步驟S411),並將擷取到的影像持續地提供給主裝置200(即,返回步驟S407)。
然而,在提供前述的第一影像的過程中,當從裝置300判斷SS接腳中的訊號從低電位被調整為高電位時(例如,在時間點T5),則從裝置300會判斷從裝置300停止接收到接收到選擇訊號。此時,從裝置300會停止執行控制影像擷取電路30進行曝光的步驟以及停止執行提供前述第一影像至主裝置200的步驟(步驟S413)。其中,停止執行控制影像擷取電路30進行曝光以擷取影像的步驟例如是在時間點T6將影像擷取電路30的曝光狀態ES從高電位調整為低電位,藉此關閉影像擷取電路30的曝光功能以讓影像擷取電路30停止曝光與停止擷取影像。此外,停止執行提供前述第一影像至主裝置200的步驟例如是從裝置300不藉由MISO接腳提供影像至主裝置200。
藉由上述方式,本發明的第二實施例可以讓從裝置300根據主裝置200下達的選擇訊號來判斷何時需開啟影像擷取電路30進行曝光的功能或者關閉影像擷取電路30進行曝光的功能,藉此避免從裝置300的影像擷取電路30執行無謂的曝光而造成電力的損耗。
綜上所述,本發明的曝光方法、電子裝置與主從式系統,可以有效地控制影像擷取電路曝光的時間,藉此避免不必要的曝光而擷取過多的影像,並有效地降低裝置的耗電量。
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。
100‧‧‧電子裝置
20‧‧‧處理器
22‧‧‧影像擷取電路
24‧‧‧暫存器
26‧‧‧輸出電路
S201‧‧‧處理器取得曝光指令以及第一數量的步驟
S203‧‧‧處理器根據曝光指令,控制影像擷取電路進行曝光以擷取影像的步驟
S205‧‧‧處理器暫存前述影像於暫存器並且停止控制影像擷取電路進行曝光的步驟
S207‧‧‧處理器判斷是否透過輸出電路輸出暫存於暫存器中的影像的步驟
S209‧‧‧當處理器接收到輸出指令時,處理器根據輸出指令透過輸出電路輸出暫存於暫存器中的影像的步驟
S211‧‧‧處理器判斷前述影像的數量是否達到第一數量的步驟
S213‧‧‧處理器停止控制影像擷取電路進行曝光的步驟
1000‧‧‧主從式系統
200‧‧‧主裝置
300‧‧‧從裝置
30‧‧‧影像擷取電路
50、60‧‧‧介面
SS、SCLK、MOSI、MISO‧‧‧接腳
S401‧‧‧主裝置提供曝光指令、選擇訊號以及時脈訊號至從裝置的步驟
S403‧‧‧從裝置根據曝光指令、選擇訊號以及時脈訊號,控制影像擷取電路進行曝光以擷取多個影像的步驟
S405‧‧‧主裝置提供讀取指令、選擇訊號以及時脈訊號至從裝置的步驟
S407‧‧‧從裝置根據讀取指令、選擇訊號以及時脈訊號,提供前述多個影像中的至少一第一影像至主裝置的步驟
S409‧‧‧從裝置判斷是否停止接收到選擇訊號的步驟
S411‧‧‧從裝置根據曝光指令、選擇訊號以及時脈訊號,控制影像擷取電路進行曝光以擷取多個影像的步驟
S413‧‧‧從裝置停止執行控制影像擷取電路進行曝光以擷取影像以及停止執行提供第一影像至主裝置的步驟
T1~T6‧‧‧時間點
C1~C10‧‧‧時脈週期
cmd1、cmd2‧‧‧指令
D1~D6‧‧‧影像
ES‧‧‧曝光狀態
圖1是依照本發明的一實施例所繪示的電子裝置的示意圖。 圖2是依照本發明的第一實施例所繪示的曝光方法的流程圖。 圖3是依照本發明的一實施例所繪示的主從式系統的示意圖。 圖4是依照本發明的第二實施例所繪示的曝光方法的流程圖。 圖5是依照本發明的一實施例所繪示的SPI的訊號傳輸的示意圖。

Claims (16)

  1. 一種電子裝置,包括: 一影像擷取電路;以及 一處理器,耦接至所述影像擷取電路,其中 所述處理器取得一曝光指令以及一第一數量, 所述處理器根據所述曝光指令,控制所述影像擷取電路進行曝光以擷取一影像, 所述處理器判斷所述影像的數量是否達到所述第一數量, 當所述影像的數量未達到所述第一數量時,所述處理器再次執行控制所述影像擷取電路進行曝光以擷取所述影像的運作,以及 當所述影像的數量達到所述第一數量時,所述處理器停止控制所述影像擷取電路進行曝光。
  2. 如申請專利範圍第1項所述的電子裝置,其中所述曝光指令包括所述第一數量。
  3. 如申請專利範圍第1項所述的電子裝置,其中所述電子裝置還包括: 一暫存器,耦接至所述處理器,其中在取得所述曝光指令以及所述第一數量的運作之前, 所述暫存器取得所述第一數量並且儲存所述第一數量。
  4. 如申請專利範圍第1項所述的電子裝置,其中所述電子裝置還包括: 一輸出電路,耦接至所述處理器;以及 一暫存器,耦接至所述處理器,其中在控制所述影像擷取電路進行曝光以擷取所述影像的運作之後, 所述處理器暫存所述影像於所述暫存器並且停止控制所述影像擷取電路進行曝光, 所述處理器判斷是否透過所述輸出電路輸出暫存於所述暫存器中的所述影像, 當所述處理器接收到一輸出指令且所述影像的數量未達到所述第一數量時,所述處理器根據所述輸出指令透過所述輸出電路輸出暫存於所述暫存器中的所述影像,並且再次執行控制所述影像擷取電路進行曝光以擷取所述影像的運作,以及 當所述處理器接收到所述輸出指令且所述影像的數量達到所述第一數量時,所述處理器根據所述輸出指令透過所述輸出電路輸出暫存於所述暫存器中的所述影像,並且不控制所述影像擷取電路再次進行曝光。
  5. 一種曝光方法,用於一電子裝置,所述電子裝置包括一影像擷取電路以及一處理器,所述方法包括: 藉由所述處理器取得一曝光指令以及一第一數量; 藉由所述處理器根據所述曝光指令,控制所述影像擷取電路進行曝光以擷取一影像; 藉由所述處理器判斷所述影像的數量是否達到所述第一數量; 當所述影像的數量未達到所述第一數量時,藉由所述處理器再次執行控制所述影像擷取電路進行曝光以擷取所述影像的步驟;以及 當所述影像的數量達到所述第一數量時,藉由所述處理器停止控制所述影像擷取電路進行曝光。
  6. 如申請專利範圍第5項所述的曝光方法,其中所述曝光指令包括所述第一數量。
  7. 如申請專利範圍第5項所述的曝光方法,其中所述電子裝置還包括一暫存器,其中在取得所述曝光指令以及所述第一數量的步驟之前,所述方法還包括: 藉由所述暫存器取得所述第一數量並且儲存所述第一數量。
  8. 如申請專利範圍第5項所述的曝光方法,其中所述電子裝置還包括一輸出電路以及一暫存器,其中在控制所述影像擷取電路進行曝光以擷取所述影像的步驟之後,所述方法還包括: 藉由所述處理器暫存所述影像於所述暫存器並且停止控制所述影像擷取電路進行曝光; 藉由所述處理器判斷是否透過所述輸出電路輸出暫存於所述暫存器中的所述影像; 當所述處理器接收到一輸出指令且所述影像的數量未達到所述第一數量時,藉由所述處理器根據所述輸出指令透過所述輸出電路輸出暫存於所述暫存器中的所述影像,並且再次執行控制所述影像擷取電路進行曝光以擷取所述影像的步驟;以及 當所述處理器接收到所述輸出指令且所述影像的數量達到所述第一數量時,藉由所述處理器根據所述輸出指令透過所述輸出電路輸出暫存於所述暫存器中的所述影像,並且不控制所述影像擷取電路再次進行曝光。
  9. 一種主從式系統,包括: 一主裝置,具有一第一介面;以及 一從裝置,具有一第二介面以及一影像擷取電路,所述第二介面電性連接至所述第一介面,其中 所述從裝置控制所述影像擷取電路進行曝光以擷取多個影像, 所述主裝置提供一讀取指令以及一選擇訊號至所述從裝置, 所述從裝置根據所述讀取指令以及所述選擇訊號,提供所述多個影像中的至少一第一影像至所述主裝置,以及 在提供所述多個影像中的所述第一影像至所述主裝置的運作中,當所述從裝置停止接收到所述選擇訊號時,所述從裝置停止執行控制所述影像擷取電路進行曝光以擷取所述多個影像的運作以及停止執行提供所述多個影像中的所述第一影像至所述主裝置的運作。
  10. 如申請專利範圍第9項所述的主從式系統,其中在控制所述影像擷取電路進行曝光以擷取所述多個影像的運作之前, 所述主裝置提供一曝光指令以及所述選擇訊號至所述從裝置,以及 所述從裝置根據所述曝光指令以及所述選擇訊號,執行控制所述影像擷取電路進行曝光以擷取所述多個影像的運作。
  11. 如申請專利範圍第10項所述的主從式系統,其中在提供所述曝光指令以及所述選擇訊號至所述從裝置的運作中以及在提供所述讀取指令以及所述選擇訊號至所述從裝置的運作中, 所述主裝置提供一時脈訊號至所述從裝置,所述從裝置根據所述時脈訊號執行控制所述影像擷取電路進行曝光以擷取所述多個影像的運作以及提供所述多個影像中的所述第一影像至所述主裝置的運作。
  12. 如申請專利範圍第11項所述的主從式系統,其中所述第一介面與所述第二介面是串列週邊介面(Serial Peripheral Interface,SPI)。
  13. 一種曝光方法,用於一主從式系統,所述主從式系統包括一主裝置以及一從裝置,所述主裝置具有一第一介面,所述從裝置具有一第二介面以及一影像擷取電路,所述第二介面電性連接至所述第一介面,所述方法包括: 藉由所述從裝置控制所述影像擷取電路進行曝光以擷取多個影像; 藉由所述主裝置提供一讀取指令以及一選擇訊號至所述從裝置; 藉由所述從裝置根據所述讀取指令以及所述選擇訊號,提供所述多個影像中的至少一第一影像至所述主裝置藉;以及 在提供所述多個影像中的所述第一影像至所述主裝置的步驟中,當所述從裝置停止接收到所述選擇訊號時,藉由所述從裝置停止執行控制所述影像擷取電路進行曝光以擷取所述多個影像的步驟以及停止執行提供所述多個影像中的所述第一影像至所述主裝置的步驟。
  14. 如申請專利範圍第13項所述的曝光方法,其中在控制所述影像擷取電路進行曝光以擷取所述多個影像的步驟之前,所述方法還包括: 藉由所述主裝置提供一曝光指令以及所述選擇訊號至所述從裝置;以及 藉由所述從裝置根據所述曝光指令以及所述選擇訊號,執行控制所述影像擷取電路進行曝光以擷取所述多個影像的步驟。
  15. 如申請專利範圍第14項所述的曝光方法,其中在提供所述曝光指令以及所述選擇訊號至所述從裝置的步驟中以及在提供所述讀取指令以及所述選擇訊號至所述從裝置的步驟中,所述方法還包括: 藉由所述主裝置提供一時脈訊號至所述從裝置;以及 藉由所述從裝置根據所述時脈訊號執行控制所述影像擷取電路進行曝光以擷取所述多個影像的步驟以及提供所述多個影像中的所述第一影像至所述主裝置的步驟。
  16. 如申請專利範圍第15項所述的曝光方法,其中所述第一介面與所述第二介面是串列週邊介面(Serial Peripheral Interface,SPI)。
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Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI716142B (zh) * 2019-10-08 2021-01-11 大陸商廣州印芯半導體技術有限公司 光學識別模組
CN110503044A (zh) * 2018-12-03 2019-11-26 神盾股份有限公司 指纹传感器及其指纹感测方法
EP3796208B1 (en) * 2018-12-14 2023-03-15 Shenzhen Goodix Technology Co., Ltd. Fingerprint recognition apparatus and electronic device
US11682230B2 (en) * 2019-03-07 2023-06-20 Novatek Microelectronics Corp. Fingerprint signal processing circuit and method for signal compensation in analog front-end
EP3944628A4 (en) * 2019-03-18 2023-02-22 Hanwha Techwin Co., Ltd. CAMERA FOR ANALYZING IMAGES BASED ON ARTIFICIAL INTELLIGENCE AND OPERATING METHODS THEREOF
WO2020227986A1 (zh) * 2019-05-15 2020-11-19 深圳市汇顶科技股份有限公司 图像采集的装置、方法和电子设备
CN110164307B (zh) * 2019-05-23 2021-01-26 厦门天马微电子有限公司 一种内置有指纹识别感应器的显示装置
KR20200137079A (ko) 2019-05-28 2020-12-09 삼성디스플레이 주식회사 지문 센서 및 이를 포함하는 표시 장치
JP7405826B2 (ja) * 2019-06-12 2023-12-26 京東方科技集團股▲ふん▼有限公司 紋様画像取得方法、紋様画像取得回路及び表示パネル
TWI748460B (zh) * 2019-06-21 2021-12-01 大陸商廣州印芯半導體技術有限公司 飛時測距裝置及飛時測距方法
WO2021035451A1 (zh) * 2019-08-23 2021-03-04 深圳市汇顶科技股份有限公司 指纹检测装置、方法和电子设备
CN110445012A (zh) * 2019-08-01 2019-11-12 浙江舜宇光学有限公司 发光模块、其制备方法以及具有其的深度探测装置
CN211653679U (zh) * 2019-09-22 2020-10-09 神盾股份有限公司 指纹感测模块及电子装置
US11301708B2 (en) * 2019-10-01 2022-04-12 Novatek Microelectronics Corp. Image sensing circuit and method
CN112766017A (zh) * 2019-10-21 2021-05-07 广州印芯半导体技术有限公司 光学识别模块
CN110944125B (zh) * 2019-11-06 2022-02-22 西安理工大学 一种提高cmos图像传感器对比度的非线性列级adc及方法
CN110970454B (zh) * 2019-11-28 2022-03-15 苏州晶方半导体科技股份有限公司 生物特征识别芯片的封装结构
CN110867165B (zh) * 2019-11-29 2021-10-15 厦门天马微电子有限公司 一种显示面板及显示装置
KR20220097967A (ko) * 2019-11-29 2022-07-08 엘지전자 주식회사 방사선 디텍터 및 이를 이용한 방사선 촬영 방법
US11062110B2 (en) * 2019-12-13 2021-07-13 Novatek Microelectronics Corp. Fingerprint detection device, method and non-transitory computer-readable medium for operating the same
TWI727550B (zh) * 2019-12-13 2021-05-11 大陸商廣州印芯半導體技術有限公司 光學識別模組
CN111064073A (zh) * 2019-12-26 2020-04-24 常州纵慧芯光半导体科技有限公司 一种激光器及其制备方法及其应用
CN211857087U (zh) * 2020-02-24 2020-11-03 宁波激智科技股份有限公司 一种减干涉准直膜
CN113796853A (zh) * 2020-06-16 2021-12-17 广州印芯半导体技术有限公司 光学影像比较系统及其比较方法
US11327907B2 (en) * 2020-07-08 2022-05-10 Macronix International Co., Ltd. Methods and apparatus for improving SPI continuous read
US11687472B2 (en) 2020-08-20 2023-06-27 Global Unichip Corporation Interface for semiconductor device and interfacing method thereof
US11699683B2 (en) 2020-08-20 2023-07-11 Global Unichip Corporation Semiconductor device in 3D stack with communication interface and managing method thereof
US11031923B1 (en) * 2020-08-20 2021-06-08 Global Unichip Corporation Interface device and interface method for 3D semiconductor device
US11675731B2 (en) 2020-08-20 2023-06-13 Global Unichip Corporation Data protection system and method thereof for 3D semiconductor device
US11144485B1 (en) 2020-08-20 2021-10-12 Global Unichip Corporation Interface for semiconductor device with symmetric bond pattern and method for arranging interface thereof
CN112104802B (zh) * 2020-08-21 2021-07-20 深圳市睿联技术股份有限公司 一种摄像电路及摄像装置
US20220067323A1 (en) * 2020-08-27 2022-03-03 Au Optronics Corporation Sensing device substrate and display apparatus having the same
CN114328328B (zh) * 2020-09-30 2023-11-10 创意电子股份有限公司 用于三维半导体器件的接口器件及接口方法
CN112511772A (zh) * 2020-10-28 2021-03-16 深圳奥辰光电科技有限公司 一种图像传感器、增强图像传感器线性的方法及深度相机
CN114826811A (zh) * 2021-01-28 2022-07-29 南宁富桂精密工业有限公司 数据传输方法及其系统
US11398102B1 (en) * 2021-03-29 2022-07-26 Innolux Corporation Method for recognizing fingerprint
US11798309B2 (en) * 2021-04-15 2023-10-24 Novatek Microelectronics Corp. Fingerprint identification method for panel, electronic device, and control circuit
CN115529828A (zh) * 2021-04-26 2022-12-27 泉州三安半导体科技有限公司 一种发光装置
CN114359985A (zh) * 2021-12-31 2022-04-15 深圳市汇顶科技股份有限公司 指纹识别的方法、装置和电子设备
TWI818536B (zh) * 2022-05-06 2023-10-11 圓展科技股份有限公司 無線攝影機的通訊方法及可插拔裝置

Family Cites Families (131)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1249616B (it) * 1991-05-30 1995-03-09 Sgs Thomson Microelectronics Circuito di precarica di bit line per la lettura di una cella di memoria eprom.
US5805496A (en) * 1996-12-27 1998-09-08 International Business Machines Corporation Four device SRAM cell with single bitline
FR2775091B1 (fr) * 1998-02-16 2000-04-28 Matra Communication Procede de transfert de donnees en serie, et interface de bus serie synchrone mettant en oeuvre un tel procede
JP3326560B2 (ja) * 2000-03-21 2002-09-24 日本テキサス・インスツルメンツ株式会社 半導体メモリ装置
ATE506807T1 (de) * 2001-06-18 2011-05-15 Casio Computer Co Ltd Photosensorsystem und ansteuerungsverfahren dafür
US7233350B2 (en) * 2002-01-05 2007-06-19 Candela Microsystems, Inc. Image sensor with interleaved image output
US7265784B1 (en) * 2002-08-19 2007-09-04 Pixim, Inc. Image processor with noise reduction circuit
TW562991B (en) * 2002-11-20 2003-11-21 Novatek Microelectronics Corp Fast convergence method for the appropriate exposure value
JP4219663B2 (ja) * 2002-11-29 2009-02-04 株式会社ルネサステクノロジ 半導体記憶装置及び半導体集積回路
CN100337156C (zh) * 2002-12-05 2007-09-12 联咏科技股份有限公司 适当曝光值的快速收敛方法
CN2609064Y (zh) * 2003-02-28 2004-03-31 光宝科技股份有限公司 名片扫描仪及其传输模块
US7157745B2 (en) * 2004-04-09 2007-01-02 Blonder Greg E Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them
JP4136793B2 (ja) * 2003-05-29 2008-08-20 キヤノン株式会社 撮像装置および撮像装置の制御方法
US7483058B1 (en) * 2003-08-04 2009-01-27 Pixim, Inc. Video imaging system including a digital image sensor and a digital signal processor
US7446812B2 (en) * 2004-01-13 2008-11-04 Micron Technology, Inc. Wide dynamic range operations for imaging
US7292232B2 (en) * 2004-04-30 2007-11-06 Microsoft Corporation Data input devices and methods for detecting movement of a tracking surface by a laser speckle pattern
US7084667B2 (en) * 2004-07-13 2006-08-01 International Business Machines Corporation Low leakage monotonic CMOS logic
US7342256B2 (en) * 2004-07-16 2008-03-11 Semiconductor Energy Laboratory Co., Ltd. Display device mounted with read function and electric appliance
JP4498270B2 (ja) * 2005-11-30 2010-07-07 株式会社バンダイナムコゲームス プログラム、情報記憶媒体、写真印刷装置及び写真印刷方法
KR100665853B1 (ko) * 2005-12-26 2007-01-09 삼성전자주식회사 고집적 스태이틱 랜덤 억세스 메모리에 채용하기 적합한적층 메모리 셀
JP5168837B2 (ja) * 2006-07-27 2013-03-27 ソニー株式会社 画像処理装置、画像処理方法およびプログラム
CN200986927Y (zh) * 2006-09-15 2007-12-05 林三宝 具有微光学结构的发光二极管
JP4843461B2 (ja) * 2006-11-13 2011-12-21 株式会社東芝 固体撮像装置
CN100573491C (zh) * 2006-12-15 2009-12-23 凌阳科技股份有限公司 串行传输控制器与串行传输解码器及其串行传输方法
CN100480830C (zh) * 2007-01-30 2009-04-22 北京中星微电子有限公司 一种逆光检测方法、逆光补偿终止检测方法及相应装置
CN100498749C (zh) * 2007-04-12 2009-06-10 威盛电子股份有限公司 串行外围接口数据传输方法及串行外围接口数据传输系统
JP4470957B2 (ja) * 2007-04-26 2010-06-02 ブラザー工業株式会社 画像処理システム及び画像読取装置
DE102007024737A1 (de) * 2007-05-25 2008-11-27 Robert Bosch Gmbh Datenübertragungsverfahren zwischen Master- und Slave-Einrichtungen
US7920409B1 (en) * 2007-06-05 2011-04-05 Arizona Board Of Regents For And On Behalf Of Arizona State University SRAM cell with intrinsically high stability and low leakage
TWI334547B (en) * 2007-06-07 2010-12-11 Via Tech Inc System and method for serial peripheral interface data transmission
US20090006911A1 (en) * 2007-06-28 2009-01-01 Mediatek Inc. Data replacement processing method
US8103936B2 (en) * 2007-10-17 2012-01-24 Micron Technology, Inc. System and method for data read of a synchronous serial interface NAND
US8429329B2 (en) * 2007-10-17 2013-04-23 Micron Technology, Inc. Serial interface NAND
US9584710B2 (en) * 2008-02-28 2017-02-28 Avigilon Analytics Corporation Intelligent high resolution video system
US20100118153A1 (en) * 2008-11-12 2010-05-13 Xiaoguang Yu Apparatus and methods for controlling image sensors
US7849229B2 (en) * 2008-11-25 2010-12-07 Spansion Llc SPI addressing beyond 24-bits
US8156274B2 (en) * 2009-02-02 2012-04-10 Standard Microsystems Corporation Direct slave-to-slave data transfer on a master-slave bus
JP2010263305A (ja) * 2009-04-30 2010-11-18 Fujifilm Corp 撮像装置及びその駆動方法
CN102023945B (zh) * 2009-09-22 2012-03-28 鸿富锦精密工业(深圳)有限公司 基于串行外围设备接口总线的设备及其数据传输方法
CN101950280B (zh) * 2009-09-30 2012-11-14 威盛电子股份有限公司 产生多个串行总线芯片选择的方法
US20110078350A1 (en) * 2009-09-30 2011-03-31 Via Technologies, Inc. Method for generating multiple serial bus chip selects using single chip select signal and modulation of clock signal frequency
US8176209B2 (en) * 2009-11-05 2012-05-08 Electronics And Telecommunications Research Institute Data communication system
CN102097050B (zh) * 2009-12-11 2016-03-09 康佳集团股份有限公司 一种实现显示信号无缝切换的装置和方法
KR20110076729A (ko) * 2009-12-18 2011-07-06 삼성전자주식회사 전자 셔터를 이용한 다단계 노출 이미지 획득 방법 및 이를 이용한 촬영 장치
CN102104641A (zh) * 2009-12-18 2011-06-22 深圳富泰宏精密工业有限公司 手机及其实现360度拍照的方法
US8327052B2 (en) * 2009-12-23 2012-12-04 Spansion Llc Variable read latency on a serial memory bus
TWI406135B (zh) * 2010-03-09 2013-08-21 Nuvoton Technology Corp 資料傳輸系統與可編程序列周邊介面控制器
CN102200864B (zh) * 2010-03-26 2013-08-14 原相科技股份有限公司 光学式触控装置
US8310584B2 (en) * 2010-04-29 2012-11-13 Victory Gain Group Corporation Image sensing device having thin thickness
CN101841624A (zh) * 2010-05-17 2010-09-22 北京思比科微电子技术股份有限公司 图像传感器数据传输方法
US8325890B2 (en) * 2010-06-06 2012-12-04 Apple Inc. Auto exposure techniques for variable lighting conditions
JP2012008385A (ja) * 2010-06-25 2012-01-12 Ricoh Co Ltd 画像形成装置および画像形成方法
US8422272B2 (en) * 2010-08-06 2013-04-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
US8433838B2 (en) * 2010-09-17 2013-04-30 International Business Machines Corporation Remote multiplexing devices on a serial peripheral interface bus
CN102035530A (zh) * 2010-10-15 2011-04-27 北京工业大学 用于高性能vlsi的最优保持管多米诺电路
TWI507031B (zh) * 2010-10-15 2015-11-01 Altek Corp 影像處理方法
US20120097985A1 (en) * 2010-10-21 2012-04-26 Wen-Huang Liu Light Emitting Diode (LED) Package And Method Of Fabrication
KR101705045B1 (ko) * 2010-11-09 2017-02-10 삼성전자주식회사 아날로그 투 디지털 컨버터, 이를 포함하는 이미지 센서 및 아날로그 투 디지털 변환 방법
CN102469248B (zh) * 2010-11-12 2016-03-02 华晶科技股份有限公司 影像拍摄装置及其影像合成方法
US9047178B2 (en) * 2010-12-13 2015-06-02 SanDisk Technologies, Inc. Auto-commit memory synchronization
CN102098441B (zh) * 2010-12-16 2016-09-07 深圳市经纬科技有限公司 基于spi接口的图像数据传输方法及照相设备
CN102117342A (zh) * 2011-01-21 2011-07-06 中国科学院上海技术物理研究所 基于PCI Express总线的多波段红外图像实时采集系统及方法
JP5655626B2 (ja) * 2011-02-24 2015-01-21 ソニー株式会社 画像処理装置、および画像処理方法、並びにプログラム
CN202049481U (zh) * 2011-03-17 2011-11-23 冠捷投资有限公司 具有主从关系的感测结构
JP5713752B2 (ja) * 2011-03-28 2015-05-07 キヤノン株式会社 画像処理装置、及びその制御方法
US9077917B2 (en) * 2011-06-09 2015-07-07 Apple Inc. Image sensor having HDR capture capability
US8576653B2 (en) * 2011-07-01 2013-11-05 United Microelectronics Corp. Hidden refresh method and operating method for pseudo SRAM
JP5907176B2 (ja) * 2011-12-28 2016-04-26 株式会社ニコン 撮像装置
TWI450159B (zh) * 2012-03-02 2014-08-21 Pixart Imaging Inc Optical touch device, passive touch system and its input detection method
US9208826B2 (en) * 2012-03-30 2015-12-08 Sharp Kabushiki Kaisha Semiconductor storage device with two control lines
US9274997B2 (en) * 2012-05-02 2016-03-01 Smsc Holdings S.A.R.L. Point-to-point serial peripheral interface for data communication between devices configured in a daisy-chain
US8943250B2 (en) * 2012-08-20 2015-01-27 General Electric Systems and methods for concatenating multiple devices
US9003091B2 (en) * 2012-10-18 2015-04-07 Hewlett-Packard Development Company, L.P. Flow control for a Serial Peripheral Interface bus
TW201418992A (zh) * 2012-11-06 2014-05-16 Megawin Technology Co Ltd 序列周邊介面主裝置之資料傳輸控制方法及裝置
CN103092806A (zh) * 2013-01-18 2013-05-08 青岛海信宽带多媒体技术有限公司 基于spi数据传输时序的数据传输方法和系统
KR101444063B1 (ko) * 2013-03-22 2014-09-26 주식회사 슈프리마 다중 노출을 이용한 광학식 지문 인식 방법 및 장치
CN104253188A (zh) * 2013-06-27 2014-12-31 展晶科技(深圳)有限公司 发光二极管元件的制造方法
JP6372488B2 (ja) * 2013-07-04 2018-08-15 株式会社ニコン 電子機器
TWI631854B (zh) * 2013-08-05 2018-08-01 日商新力股份有限公司 Conversion device, imaging device, electronic device, conversion method
CN103595503B (zh) * 2013-10-25 2016-08-17 福建升腾资讯有限公司 一种基于串口装置的频率编解码通讯系统
CN104714908B (zh) * 2013-12-13 2017-12-19 上海华虹集成电路有限责任公司 支持主从模式的spi接口
JP6519095B2 (ja) * 2013-12-19 2019-05-29 カシオ計算機株式会社 コンテンツ出力システム、コンテンツ出力装置、コンテンツ出力方法及びプログラム
US9402039B2 (en) * 2014-01-10 2016-07-26 Omnivision Technologies, Inc. Dual conversion gain high dynamic range sensor
CN103838700A (zh) * 2014-02-20 2014-06-04 江苏理工学院 电平复用控制串行通信装置及其通信方法
KR102149187B1 (ko) * 2014-02-21 2020-08-28 삼성전자주식회사 전자 장치와, 그의 제어 방법
CN103888693B (zh) * 2014-03-31 2017-06-13 广东威创视讯科技股份有限公司 图像传输装置
EP2938064B1 (en) * 2014-04-24 2016-10-12 Axis AB Method and apparatus for determining exposure setting
JP6478488B2 (ja) * 2014-06-18 2019-03-06 キヤノン株式会社 Ad変換装置及び固体撮像装置
CN105208294A (zh) * 2014-06-20 2015-12-30 中兴通讯股份有限公司 一种拍照的方法及装置
JP6454490B2 (ja) * 2014-07-17 2019-01-16 ルネサスエレクトロニクス株式会社 半導体装置及びランプ信号の制御方法
JP6552336B2 (ja) * 2014-08-29 2019-07-31 株式会社半導体エネルギー研究所 半導体装置
CN104318205A (zh) * 2014-09-29 2015-01-28 上海箩箕技术有限公司 信息检测显示装置及其检测方法和显示方法
JP2017534859A (ja) * 2014-09-29 2017-11-24 バイオサーフィット、 ソシエダッド アノニマ 位置決めメカニズム
US10732771B2 (en) * 2014-11-12 2020-08-04 Shenzhen GOODIX Technology Co., Ltd. Fingerprint sensors having in-pixel optical sensors
US10114789B2 (en) * 2015-01-08 2018-10-30 Samsung Electronics Co., Ltd. System on chip for packetizing multiple bytes and data processing system including the same
CN105991935B (zh) * 2015-02-15 2019-11-05 比亚迪股份有限公司 曝光控制装置及曝光控制方法
US20160246396A1 (en) * 2015-02-20 2016-08-25 Qualcomm Incorporated Interactive touchscreen and sensor array
JP2016161653A (ja) * 2015-02-27 2016-09-05 富士フイルム株式会社 撮影装置および方法
JP6530064B2 (ja) * 2015-05-26 2019-06-12 日立オートモティブシステムズ株式会社 通信装置および通信システム
CN204695305U (zh) * 2015-06-11 2015-10-07 北京海泰方圆科技有限公司 一种基于复合产品的spi通信接口及该复合产品
EP3657367B1 (en) 2015-06-30 2021-09-29 Huawei Technologies Co., Ltd. Method for unlocking screen by using fingerprint and terminal
TWI576653B (zh) * 2015-07-31 2017-04-01 廣達電腦股份有限公司 曝光控制系統及其方法
US9819889B2 (en) * 2015-08-07 2017-11-14 Omnivision Technologies, Inc. Method and system to implement a stacked chip high dynamic range image sensor
CN105100631B (zh) * 2015-09-08 2019-03-01 Oppo广东移动通信有限公司 一种自动连续间隔拍照、摄像的方法及移动终端
US10003761B2 (en) * 2015-09-10 2018-06-19 Canon Kabushiki Kaisha Imaging device having multiple analog-digital conversion circuits that perform multiple ad conversions for a singular one of a pixel signal
US9990316B2 (en) * 2015-09-21 2018-06-05 Qualcomm Incorporated Enhanced serial peripheral interface
CN205038640U (zh) * 2015-09-25 2016-02-17 河南思维自动化设备股份有限公司 一种解决spi总线通信延时的spi设备
US10157590B1 (en) * 2015-12-15 2018-12-18 Apple Inc. Display with localized brightness adjustment capabilities
CN105578076A (zh) * 2015-12-18 2016-05-11 广东欧珀移动通信有限公司 成像方法、成像装置及电子装置
CN106303269A (zh) * 2015-12-28 2017-01-04 北京智谷睿拓技术服务有限公司 图像采集控制方法和装置、图像采集设备
US9743025B2 (en) * 2015-12-30 2017-08-22 Omnivision Technologies, Inc. Method and system of implementing an uneven timing gap between each image capture in an image sensor
CN106778459B (zh) 2015-12-31 2021-02-12 深圳市汇顶科技股份有限公司 指纹识别的方法及其指纹识别装置
JP6885344B2 (ja) * 2016-01-20 2021-06-16 ソニーグループ株式会社 固体撮像装置およびその駆動方法、並びに電子機器
KR102554495B1 (ko) * 2016-01-22 2023-07-12 에스케이하이닉스 주식회사 수평적 커플링 구조를 갖는 불휘발성 메모리셀 및 이를 이용한 메모리 셀 어레이
US9800807B2 (en) * 2016-02-26 2017-10-24 Intel Corporation Image sensor operation for shutter modulation and high dynamic range
US10043051B2 (en) * 2016-03-07 2018-08-07 Microsoft Technology Licensing, Llc Triggered image sensing with a display
JP6747158B2 (ja) * 2016-08-09 2020-08-26 ソニー株式会社 マルチカメラシステム、カメラ、カメラの処理方法、確認装置および確認装置の処理方法
CN206470775U (zh) * 2016-12-23 2017-09-05 敦捷光电股份有限公司 生物特征辨识装置
EP3565234B1 (en) * 2016-12-27 2023-05-24 Panasonic Intellectual Property Management Co., Ltd. Imaging device, camera, and imaging method
CN106897701B (zh) * 2017-02-27 2019-08-23 京东方科技集团股份有限公司 光学指纹识别模组与显示面板、显示装置
CN107066859A (zh) 2017-03-15 2017-08-18 广东欧珀移动通信有限公司 一种指纹解锁方法及装置
CN107071153B (zh) 2017-03-21 2019-07-02 Oppo广东移动通信有限公司 一种指纹模组模式切换方法及装置
KR102331464B1 (ko) * 2017-04-18 2021-11-29 삼성전자주식회사 디스플레이 영역에 형성된 생체 정보 센싱 영역을 이용한 생체 정보 획득 방법 및 이를 지원하는 전자 장치
CN107135049B (zh) * 2017-04-19 2020-08-14 北京航天自动控制研究所 一种面向离散数据流的可靠异步通信方法
CN107122742B (zh) * 2017-04-27 2019-12-03 上海天马微电子有限公司 一种显示装置及其指纹识别方法、以及电子设备
CN107194326A (zh) 2017-04-28 2017-09-22 广东欧珀移动通信有限公司 指纹采集方法及相关产品
CN107169447A (zh) * 2017-05-12 2017-09-15 贵州中信云联科技有限公司 基于人脸识别的医院自助系统
EP3462731B1 (en) * 2017-09-29 2021-11-10 Canon Kabushiki Kaisha Imaging device, imaging system, and moving body
US10735459B2 (en) * 2017-11-02 2020-08-04 International Business Machines Corporation Service overload attack protection based on selective packet transmission
KR102460750B1 (ko) * 2018-02-13 2022-10-31 삼성전기주식회사 Ois 기능을 갖는 카메라 장치 및 그 통신 방법
JP6753985B2 (ja) * 2018-08-10 2020-09-09 シャープ株式会社 アナログデジタル変換器および固体撮像素子

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