CN109634063B - 曝光方法、电子装置与主从式系统 - Google Patents

曝光方法、电子装置与主从式系统 Download PDF

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CN109634063B
CN109634063B CN201810901250.0A CN201810901250A CN109634063B CN 109634063 B CN109634063 B CN 109634063B CN 201810901250 A CN201810901250 A CN 201810901250A CN 109634063 B CN109634063 B CN 109634063B
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processor
exposure
image acquisition
acquisition circuit
image
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CN109634063A (zh
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张耕力
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Guangzhou Tyrafos Semiconductor Technologies Co Ltd
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Guangzhou Tyrafos Semiconductor Technologies Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/14—Handling requests for interconnection or transfer
    • G06F13/20—Handling requests for interconnection or transfer for access to input/output bus
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition
    • G06V10/12—Details of acquisition arrangements; Constructional details thereof
    • G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/147—Details of sensors, e.g. sensor lenses
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078—Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
    • G11C7/1096—Write circuits, e.g. I/O line write drivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/70—Circuitry for compensating brightness variation in the scene
    • H04N23/73—Circuitry for compensating brightness variation in the scene by influencing the exposure time
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/041—Lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/0944—Diffractive optical elements, e.g. gratings, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/30—Collimators
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/4233—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
    • G02B3/0068—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between arranged in a single integral body or plate, e.g. laminates or hybrid structures with other optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/382—Information transfer, e.g. on bus using universal interface adapter
    • G06F13/385—Information transfer, e.g. on bus using universal interface adapter for adaptation of a particular data processing system to different peripheral devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
    • G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
    • G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
    • G06F13/4291—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus using a clocked protocol
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
    • G11C11/412—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger using field-effect transistors only
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
    • G11C11/413—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction
    • G11C11/417—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction for memory cells of the field-effect type
    • G11C11/419—Read-write [R-W] circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/24—Memory cell safety or protection circuits, e.g. arrangements for preventing inadvertent reading or writing; Status cells; Test cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/00127—Connection or combination of a still picture apparatus with another apparatus, e.g. for storage, processing or transmission of still picture signals or of information associated with a still picture
    • H04N1/00204—Connection or combination of a still picture apparatus with another apparatus, e.g. for storage, processing or transmission of still picture signals or of information associated with a still picture with a digital computer or a digital computer system, e.g. an internet server
    • H04N1/00209—Transmitting or receiving image data, e.g. facsimile data, via a computer, e.g. using e-mail, a computer network, the internet, I-fax
    • H04N1/00214—Transmitting or receiving image data, e.g. facsimile data, via a computer, e.g. using e-mail, a computer network, the internet, I-fax details of transmission
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/21—Intermediate information storage
    • H04N1/2104—Intermediate information storage for one or a few pictures
    • H04N1/2112—Intermediate information storage for one or a few pictures using still video cameras
    • H04N1/2137—Intermediate information storage for one or a few pictures using still video cameras with temporary storage before final recording, e.g. in a frame buffer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/66—Remote control of cameras or camera parts, e.g. by remote control devices
    • H04N23/661—Transmitting camera control signals through networks, e.g. control via the Internet
    • H04N23/662—Transmitting camera control signals through networks, e.g. control via the Internet by using master/slave camera arrangements for affecting the control of camera image capture, e.g. placing the camera in a desirable condition to capture a desired image
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/70—Circuitry for compensating brightness variation in the scene
    • H04N23/71—Circuitry for evaluating the brightness variation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/70—Circuitry for compensating brightness variation in the scene
    • H04N23/72—Combination of two or more compensation controls
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/70—Circuitry for compensating brightness variation in the scene
    • H04N23/743—Bracketing, i.e. taking a series of images with varying exposure conditions
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50—Control of the SSIS exposure
    • H04N25/53—Control of the integration time
    • H04N25/533—Control of the integration time by using differing integration times for different sensor regions
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50—Control of the SSIS exposure
    • H04N25/57—Control of the dynamic range
    • H04N25/571—Control of the dynamic range involving a non-linear response
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50—Control of the SSIS exposure
    • H04N25/57—Control of the dynamic range
    • H04N25/58—Control of the dynamic range involving two or more exposures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50—Control of the SSIS exposure
    • H04N25/57—Control of the dynamic range
    • H04N25/58—Control of the dynamic range involving two or more exposures
    • H04N25/581—Control of the dynamic range involving two or more exposures acquired simultaneously
    • H04N25/583—Control of the dynamic range involving two or more exposures acquired simultaneously with different integration times
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50—Control of the SSIS exposure
    • H04N25/57—Control of the dynamic range
    • H04N25/58—Control of the dynamic range involving two or more exposures
    • H04N25/587—Control of the dynamic range involving two or more exposures acquired sequentially, e.g. using the combination of odd and even image fields
    • H04N25/589—Control of the dynamic range involving two or more exposures acquired sequentially, e.g. using the combination of odd and even image fields with different integration times, e.g. short and long exposures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/771—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/772—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B10/00—Static random access memory [SRAM] devices
    • H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F2213/0002—Serial port, e.g. RS232C
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2320/00—Control of display operating conditions
    • G09G2320/06—Adjustment of display parameters
    • G09G2320/0626—Adjustment of display parameters for control of overall brightness
    • G09G2320/064—Adjustment of display parameters for control of overall brightness by time modulation of the brightness of the illumination source
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2354/00—Aspects of interface with display user
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L67/00—Network arrangements or protocols for supporting network services or applications
    • H04L67/01—Protocols
    • H04L67/10—Protocols in which an application is distributed across nodes in the network
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2201/00—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
    • H04N2201/0077—Types of the still picture apparatus
    • H04N2201/0084—Digital still camera
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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Abstract

本发明提供一种曝光方法、电子装置与主从式系统。电子装置包括图像获取电路以及耦接至图像获取电路的处理器。处理器取得曝光指令以及第一数量。处理器根据曝光指令，控制图像获取电路进行曝光以获取一图像。所述处理器判断所述图像的数量是否达到第一数量。当所述图像的数量未达到第一数量时，所述处理器再次执行控制图像获取电路进行曝光以获取所述图像的运作。当所述图像的数量达到第一数量时，处理器停止控制图像获取电路进行曝光。

Description

曝光方法、电子装置与主从式系统
技术领域
本发明涉及一种曝光方法、电子装置与主从式系统。
背景技术
一般来说，传统的图像传感器(或图像获取电路)应用在相机中时，若使用者要即时观看到相机捕捉到的图像，相机中的图像传感器需连续地曝光并维持一定的帧率(frameper second，fps)。然而在非人眼观看的应用(例如：指纹识别，指纹检测等)中，持续且稳定的帧率并非必要的条件。在此情况下，若图像传感器持续地进行曝光，会造成装置不必要的耗电。
发明内容
本发明提供一种曝光方法、电子装置与主从式系统，可以有效地控制图像获取电路曝光的时间，藉此避免不必要的曝光而获取过多的图像，并有效地降低装置的耗电量。
本发明提出一种电子装置，所述电子装置包括图像获取电路以及耦接至图像获取电路的处理器。所述处理器取得曝光指令以及第一数量。所述处理器根据所述曝光指令，控制所述图像获取电路进行曝光以获取图像。所述处理器判断所述图像的数量是否达到所述第一数量。当所述图像的数量未达到所述第一数量时，所述处理器再次执行控制所述图像获取电路进行曝光以获取所述图像的运作。当所述图像的数量达到所述第一数量时，所述处理器停止控制所述图像获取电路进行曝光。
本发明提出一种曝光方法，用于电子装置，所述电子装置包括图像获取电路以及处理器，所述方法包括：通过所述处理器取得曝光指令以及第一数量；通过所述处理器根据所述曝光指令，控制所述图像获取电路进行曝光以获取图像；通过所述处理器判断所述图像的数量是否达到所述第一数量；当所述图像的数量未达到所述第一数量时，通过所述处理器再次执行控制所述图像获取电路进行曝光以获取所述图像的步骤；以及当所述图像的数量达到所述第一数量时，通过所述处理器停止控制所述图像获取电路进行曝光。
本发明提出一种主从式系统，包括：主装置与从装置。主装置具有第一接口。从装置具有第二接口以及图像获取电路。第二接口电性连接至第一接口。所述从装置控制所述图像获取电路进行曝光以获取多个图像。所述主装置提供读取指令以及选择信号至所述从装置。所述从装置根据所述读取指令以及所述选择信号，提供所述多个图像中的至少一第一图像至所述主装置。在提供所述多个图像中的所述第一图像至所述主装置的运作中，当所述从装置停止接收到所述选择信号时，所述从装置停止执行控制所述图像获取电路进行曝光以获取所述多个图像的运作以及停止执行提供所述多个图像中的所述第一图像至所述主装置的运作。
本发明提出一种曝光方法，用于主从式系统，所述主从式系统包括主装置以及从装置，所述主装置具有第一接口，所述从装置具有第二接口以及图像获取电路，所述第二接口电性连接至所述第一接口，所述方法包括：通过所述从装置控制所述图像获取电路进行曝光以获取多个图像；通过所述主装置提供读取指令以及选择信号至所述从装置；通过所述从装置根据所述读取指令以及所述选择信号，提供所述多个图像中的至少一第一图像至所述主装置藉；以及在提供所述多个图像中的所述第一图像至所述主装置的步骤中，当所述从装置停止接收到所述选择信号时，通过所述从装置停止执行控制所述图像获取电路进行曝光以获取所述多个图像的步骤以及停止执行提供所述多个图像中的所述第一图像至所述主装置的步骤。
基于上述，本发明的曝光方法、电子装置与主从式系统，可以有效地控制图像获取电路曝光的时间，藉此避免不必要的曝光而获取过多的图像，并有效地降低装置的耗电量。
为让本发明的上述特征和优点能更明显易懂，下文特举实施例，并配合附图作详细说明如下。
附图说明
图1是依照本发明的一实施例所示出的电子装置的示意图。
图2是依照本发明的第一实施例所示出的曝光方法的流程图。
图3是依照本发明的一实施例所示出的主从式系统的示意图。
图4是依照本发明的第二实施例所示出的曝光方法的流程图。
图5是依照本发明的一实施例所示出的SPI的信号传输的示意图。
附图标记说明
100：电子装置
20：处理器
22：图像获取电路
24：寄存器
26：输出电路
S201：处理器取得曝光指令以及第一数量的步骤
S203：处理器根据曝光指令，控制图像获取电路进行曝光以获取图像的步骤
S205：处理器暂存前述图像于寄存器并且停止控制图像获取电路进行曝光的步骤
S207：处理器判断是否通过输出电路输出暂存于寄存器中的图像的步骤
S209：当处理器接收到输出指令时，处理器根据输出指令通过输出电路输出暂存于寄存器中的图像的步骤
S211：处理器判断前述图像的数量是否达到第一数量的步骤
S213：处理器停止控制图像获取电路进行曝光的步骤
1000：主从式系统
200：主装置
300：从装置
30：图像获取电路
50、60：接口
SS、SCLK、MOSI、MISO：接脚
S401：主装置提供曝光指令、选择信号以及时脉信号至从装置的步骤
S403：从装置根据曝光指令、选择信号以及时脉信号，控制图像获取电路进行曝光以获取多个图像的步骤
S405：主装置提供读取指令、选择信号以及时脉信号至从装置的步骤
S407：从装置根据读取指令、选择信号以及时脉信号，提供前述多个图像中的至少一第一图像至主装置的步骤
S409：从装置判断是否停止接收到选择信号的步骤
S411：从装置根据曝光指令、选择信号以及时脉信号，控制图像获取电路进行曝光以获取多个图像的步骤
S413：从装置停止执行控制图像获取电路进行曝光以获取图像以及停止执行提供第一图像至主装置的步骤
T1～T6：时间点
C1～C10：时脉周期
cmd1、cmd2：指令
D1～D6：图像
ES：曝光状态
具体实施方式
现将详细参考本发明的示范性实施例，在附图中说明所述示范性实施例的实例。另外，凡可能之处，在附图及实施方式中使用相同标号的元件/构件代表相同或类似部分。
以下以多个实施例来描述本发明的曝光方法。
[第一实施例]
图1是依照本发明的一实施例所示出的电子装置的示意图。
请参照图1，电子装置100包括处理器20、图像获取电路22、寄存器24以及输出电路26。其中，图像获取电路22、寄存器24以及输出电路26分别耦接至处理器20。电子装置100例如是手机、平板电脑、笔记本电脑等电子装置，在此不设限。
处理器20可以是中央处理器(Central Processing Unit，CPU)，或是其他可程序化的一般用途或特殊用途的微处理器(Microprocessor)、数字信号处理器(DigitalSignal Processor，DSP)、可程序化控制器、特殊应用集成电路(Application SpecificIntegrated Circuit，ASIC)或其他类似元件或上述元件的组合。
图像获取电路22是用以获取一或多张图像。举例来说，图像获取电路22可以配备有电荷耦合元件(Charge Coupled Device，CCD)、互补性氧化金属半导体(ComplementaryMetal-Oxide Semiconductor，CMOS)元件或其他种类的感光元件的摄像镜头，并且可以用以曝光并获取至少一图像。
寄存器24可以是任何型态的固定或可移动随机存取存储器(random accessmemory，RAM)、只读存储器(read-only memory，ROM)、快闪存储器(flash memory)或类似元件或上述元件的组合。
输出电路26主要用于输出图像获取电路22所获取的图像。输出电路26例如是用于将数据传输给其他电子装置的传输接口，或者是用于显示图像获取电路22所获取的图像的显示装置，在此并不做限制。
在本范例实施例中，电子装置100的还包括存储电路(未示出)。电子装置100的存储电路中存储有多个程序码片段，在上述程序码片段被安装后，会由处理器20来执行。例如，电子装置100的存储电路中包括多个模块，通过这些模块来分别执行电子装置100的各个运作，其中各模块是由一或多个程序码片段所组成。然而本发明不限于此，电子装置100的各个运作也可以是使用其他硬件形式的方式来实现。
图2是依照本发明的第一实施例所示出的曝光方法的流程图。
请同时参照图1与图2，在本实施例中，处理器20可以取得使用者输入(或下达)的曝光指令以及第一数量(步骤S201)。其中，第一数量是指欲获取的图像的数量。在一实施例中，第一数量是被包括在曝光指令中。然而在另一实施例中，寄存器24可以预先取得使用者输入的第一数量，并且将此第一数量预先存储在寄存器24中以供处理器20进行存取。
在处理器20接收到曝光指令后，会根据此曝光指令控制图像获取电路22进行曝光以获取图像(步骤S203)。接着，处理器20会暂存所获取到的图像于寄存器24，并且停止控制图像获取电路22进行曝光(即，停止控制图像获取电路22获取图像)(步骤S205)。之后，处理器20会判断是否通过输出电路26输出暂存于寄存器24中的图像(步骤S207)。
当处理器20接收到使用者下达的输出指令或从外部接收到输出指令时，处理器20会根据此输出指令，通过输出电路26输出暂存于寄存器24中的图像(步骤S209)。例如，可以通过输出电路26输出暂存于寄存器24中的图像以将该图像显示在屏幕，或者是通过输出电路26输出暂存于寄存器24中的图像至另一装置。此外，前述步骤S207中，当处理器20没有接收到前述的输出指令时，处理器20不会通过输出电路26输出暂存于寄存器24中的图像，并且当寄存器24剩余可用容量不足以存储下一张图像时会让图像获取电路22维持在停止曝光的状态(即，返回步骤S205)。
而在处理器20会根据输出指令通过输出电路26输出暂存于寄存器24中的图像(即，步骤S209)之后，处理器20会判断图像获取电路22进行曝光后所获取到的图像的数量是否达到前述的第一数量(步骤S211)。若图像获取电路22进行曝光后所获取到的图像的数量尚未达到前述的第一数量，则图2的流程会返回步骤S203以让处理器20控制图像获取电路22再次进行曝光以获取图像，并且可以再执行前述的步骤S205至步骤S211。然而，在步骤S211中，若处理器20判断图像获取电路22进行曝光后所获取到的图像的数量已达到前述的第一数量，则处理器20会停止控制图像获取电路22进行曝光(步骤S213)。
通过上述方式，本发明的第一实施例可以设定图像获取电路22所欲取得图像的数量，避免图像获取电路22获取过多的图像。此外，本发明的第一实施例在图像获取电路22获取到图像后会直接停止曝光且不会立即地再获取下一张图像，而是在输出前述已获取到的图像后，图像获取电路22才会再获取下一张图像，藉此可以避免图像获取电路22一直曝光(或一直获取图像)造成电子装置电力的消耗。
[第二实施例]
图3是依照本发明的一实施例所示出的主从式系统的示意图。
请参照图3，主从式系统1000包括主装置200以及从装置300。主装置200以及从装置300例如可以分别包括处理器(未示出)以及存储电路(未示出)。在主装置200以及从装置300中，存储电路可以耦接至处理器。其中，主装置200以及从装置300例如是手机、平板电脑、笔记本电脑等电子装置，在此不设限。此外，在其他实施例中，主装置200以及从装置300也可以包括其他更多的元件。特别是，在其他实施例中，主装置200以及从装置300也可以被配置在同一个装置中。需说明的示，虽然图3仅示出一个主装置200连接至一个从装置300，但本发明不限于此。在其他实施例中，一个主装置200可以连接至多个从装置300。
处理器可以是与第一实施例中处理器20相类似的元件，在此不再赘述。存储电路可以是与第一实施例中电子装置100的存储电路相类似的元件，在此不再赘述。此外，在本范例实施例中，从装置300还包括耦接至从装置300的处理器的图像获取电路30。而图像获取电路30可以是与第一实施例中图像获取电路22相类似的元件，在此不再赘述。
在本实施例中，主装置200具有接口50(也称为，第一接口)，从装置300具有接口60(也称为，第二接口)。其中，第一接口与第二接口彼此电性连接使得主装置200可以与从装置300进行数据的传输。在本范例实施例中，接口50与接口60分别是串列周边接口(SerialPeripheral Interface，SPI)。其中，一个串列周边接口会具有从选择(Select Slave，SS)接脚、串列时脉(Serial Clock，SCLK)接脚、主输出从输入(Master Output Slave Input，MOSI)接脚以及主输入从输出(Master Input Slave Output，MISO)接脚。而当接口50电性连接接口60时，主装置200的SS接脚会电性连接至从装置300的SS接脚，主装置200的SCLK接脚会电性连接至从装置300的SCLK接脚，主装置200的MOSI接脚会电性连接至从装置300的MOSI接脚，且主装置200的MISO接脚会电性连接至从装置300的MISO接脚。
在本范例实施例中，主装置200与从装置300的存储电路中存储有多个程序码片段，在上述程序码片段被安装后，会由主装置200与从装置300的处理器来执行。例如，主装置200与从装置300的存储电路中包括多个模块，通过这些模块来分别执行主从式系统1000的各个运作，其中各模块是由一或多个程序码片段所组成。然而本发明不限于此，上述的各个运作也可以是使用其他硬件形式的方式来实现。此外，主装置200与从装置300的处理器也可以用于控制主装置200与从装置300之间数据的传输。
图4是依照本发明的第二实施例所示出的曝光方法的流程图。图5是依照本发明的一实施例所示出的SPI的信号传输的示意图。
请同时参照图4与图5，首先，如图5所示，主装置200会通过SS接脚提供选择信号、通过SCLK接脚提供时脉信号以及通过MOSI接脚提供曝光指令cmd1至从装置300(步骤S401)。如图5所示，所述选择信号例如是将原本SS接脚中处于高电位的信号调整为低电位的信号，藉此让从装置300得知其已被主装置200所选择。在图5中，低电位信号是位于时间点T1与时间点T2之间。此外，步骤S401的时脉信号包括一时脉周期C1。
之后，从装置300会根据前述步骤S401的曝光指令cmd1、选择信号以及时脉信号，控制图像获取电路30进行曝光以获取多个图像(步骤S403)。例如，在时间点T3，从装置300会根据前述的曝光指令cmd1、选择信号以及时脉信号，将图像获取电路30的一曝光状态ES从低电位调整为高电位，藉此致能图像获取电路30的曝光功能以让图像获取电路30开始曝光并获取图像。而获取到的图像可以存储在从装置300的一寄存器(未示出)中。
之后，主装置200还会再通过SS接脚提供选择信号、通过SCLK接脚提供时脉信号以及通过MOSI接脚提供读取指令cmd2至从装置300(步骤S405)。如图5所示，所述选择信号例如是将原本SS接脚中处于高电位的信号在时间点T4调整为低电位的信号，藉此让从装置300得知其已被主装置200所选择。在图5中，低电位信号是位于时间点T4与时间点T5之间。此外，主装置200会持续地提供包括时脉周期C2～C10的时脉信号给从装置300。
之后，从装置300会根据读取指令cmd2、前述的选择信号以及时脉信号，通过MISO接脚提供图像获取单元30获取的多个图像中的图像D1～D6(统称为，第一图像)至主装置200(步骤S407)。并且在提供前述的第一图像的过程中，从装置300会判断是否停止接收到选择信号(步骤S409)。换句话说，从装置300会判断SS接脚中处于低电位的信号是否被恢复(或调整)为高电位。
假设从装置300判断SS接脚中的信号一直处于低电位，则从装置300会判断从装置300持续地接收到选择信号。此时，从装置300会根据前述的曝光指令cmd1、选择信号以及时脉信号，控制图像获取电路30持续地进行曝光以获取多个图像(步骤S411)，并将获取到的图像持续地提供给主装置200(即，返回步骤S407)。
然而，在提供前述的第一图像的过程中，当从装置300判断SS接脚中的信号从低电位被调整为高电位时(例如，在时间点T5)，则从装置300会判断从装置300停止接收到选择信号。此时，从装置300会停止执行控制图像获取电路30进行曝光的步骤以及停止执行提供前述第一图像至主装置200的步骤(步骤S413)。其中，停止执行控制图像获取电路30进行曝光以获取图像的步骤例如是在时间点T6将图像获取电路30的曝光状态ES从高电位调整为低电位，藉此关闭图像获取电路30的曝光功能以让图像获取电路30停止曝光与停止获取图像。此外，停止执行提供前述第一图像至主装置200的步骤例如是从装置300不通过MISO接脚提供图像至主装置200。
通过上述方式，本发明的第二实施例可以让从装置300根据主装置200下达的选择信号来判断何时需开启图像获取电路30进行曝光的功能或者关闭图像获取电路30进行曝光的功能，藉此避免从装置300的图像获取电路30执行无谓的曝光而造成电力的损耗。
综上所述，本发明的曝光方法、电子装置与主从式系统，可以有效地控制图像获取电路曝光的时间，藉此避免不必要的曝光而获取过多的图像，并有效地降低装置的耗电量。
虽然本发明已以实施例揭示如上，然其并非用以限定本发明，任何所属技术领域中技术人员，在不脱离本发明的精神和范围内，当可作些许的更改与润饰，故本发明的保护范围当视权利要求所界定者为准。

Claims (6)

1.一种电子装置，其中所述电子装置为从装置，并且适于电性连接主装置，包括：
图像获取电路；以及
处理器，耦接至所述图像获取电路；
输出电路，耦接至所述处理器；以及
寄存器，耦接至所述处理器，其中
所述处理器取得由所述主装置提供的曝光指令以及第一数量，
所述处理器根据所述曝光指令，控制所述图像获取电路进行曝光以获取多张图像，
其中所述处理器判断获取的图像的数量是否达到所述第一数量，
当所述获取的图像的数量未达到所述第一数量时，所述处理器再次执行控制所述图像获取电路进行曝光，以及
当所述获取的图像的数量达到所述第一数量时，所述处理器停止控制所述图像获取电路进行曝光，
其中在控制所述图像获取电路进行曝光之后，所述处理器暂存所述获取的图像于所述寄存器并且停止控制所述图像获取电路进行曝光，并且所述处理器判断是否通过所述输出电路输出暂存于所述寄存器中的所述获取的图像，
当所述处理器未接收到输出指令且所述寄存器剩余可用容量不足以存储下一张图像时，所述图像获取电路维持停止曝光，
当所述处理器接收到由所述主装置提供的所述输出指令且所述获取的图像的数量未达到所述第一数量时，所述处理器根据所述输出指令通过所述输出电路输出暂存于所述寄存器中的所述获取的图像，并且再次执行控制所述图像获取电路进行曝光以获取所述下一张图像，以及
当所述处理器接收到所述输出指令且所述获取的图像的数量达到所述第一数量时，所述处理器根据所述输出指令通过所述输出电路输出暂存于所述寄存器中的所述获取的图像，并且不控制所述图像获取电路再次进行曝光。
2.根据权利要求1所述的电子装置，其中所述曝光指令包括所述第一数量。
3.根据权利要求1所述的电子装置，其中在取得所述曝光指令以及所述第一数量的运作之前，所述寄存器取得所述第一数量并且存储所述第一数量。
4.一种曝光方法，用于电子装置，其中所述电子装置为从装置，并且适于电性连接主装置，其中所述电子装置包括图像获取电路、处理器、输出电路以及寄存器，所述方法包括：
通过所述处理器取得由所述主装置提供的曝光指令以及第一数量；
通过所述处理器根据所述曝光指令，控制所述图像获取电路进行曝光以获取多张图像；
通过所述处理器判断获取的图像的数量是否达到所述第一数量；
当所述获取的图像的数量未达到所述第一数量时，通过所述处理器再次执行控制所述图像获取电路进行曝光；以及
当所述获取的图像的数量达到所述第一数量时，通过所述处理器停止控制所述图像获取电路进行曝光，
其中在控制所述图像获取电路进行曝光之后，所述方法还包括：
通过所述处理器暂存所述获取的图像于所述寄存器并且停止控制所述图像获取电路进行曝光；
通过所述处理器判断是否通过所述输出电路输出暂存于所述寄存器中的所述获取的图像；
当所述处理器未接收到输出指令且所述寄存器剩余可用容量不足以存储下一张图像时，通过所述图像获取电路维持停止曝光；
当所述处理器接收到由所述主装置提供的所述输出指令且所述获取的图像的数量未达到所述第一数量时，通过所述处理器根据所述输出指令通过所述输出电路输出暂存于所述寄存器中的所述获取的图像，并且再次执行控制所述图像获取电路进行曝光以获取所述下一张图像；以及
当所述处理器接收到所述输出指令且所述获取的图像的数量达到所述第一数量时，通过所述处理器根据所述输出指令通过所述输出电路输出暂存于所述寄存器中的所述获取的图像，并且不控制所述图像获取电路再次进行曝光。
5.根据权利要求4所述的曝光方法，其中所述曝光指令包括所述第一数量。
6.根据权利要求4所述的曝光方法，其中在取得所述曝光指令以及所述第一数量的步骤之前，所述方法还包括：
通过所述寄存器取得所述第一数量并且存储所述第一数量。
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