CN109634063B - Exposure method, electronic device and master-slave system - Google Patents
Exposure method, electronic device and master-slave system Download PDFInfo
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- CN109634063B CN109634063B CN201810901250.0A CN201810901250A CN109634063B CN 109634063 B CN109634063 B CN 109634063B CN 201810901250 A CN201810901250 A CN 201810901250A CN 109634063 B CN109634063 B CN 109634063B
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- processor
- exposure
- image acquisition
- acquisition circuit
- image
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000010586 diagram Methods 0.000 description 6
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- 230000006870 function Effects 0.000 description 4
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- 230000000295 complement effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The invention provides an exposure method, an electronic device and a master-slave system. The electronic device includes an image acquisition circuit and a processor coupled to the image acquisition circuit. The processor obtains an exposure instruction and a first number. The processor controls the image acquisition circuit to perform exposure according to the exposure instruction so as to acquire an image. The processor determines whether the number of images reaches a first number. And when the number of the images does not reach the first number, the processor performs the operation of controlling the image acquisition circuit to perform exposure again so as to acquire the images. When the number of images reaches a first number, the processor stops controlling the image acquisition circuit to perform exposure.
Description
Technical Field
The invention relates to an exposure method, an electronic device and a master-slave system.
Background
Generally, when a conventional image sensor (or image capturing circuit) is applied in a camera, if a user wants to view an image captured by the camera in real time, the image sensor in the camera needs to be continuously exposed and maintain a certain frame rate (fps). However, in applications that are not viewed by the human eye (e.g., fingerprint recognition, fingerprint detection, etc.), a constant and stable frame rate is not a necessary condition. In this case, if the image sensor continues to be exposed, unnecessary power consumption of the apparatus is caused.
Disclosure of Invention
The invention provides an exposure method, an electronic device and a master-slave system, which can effectively control the exposure time of an image acquisition circuit, thereby avoiding unnecessary exposure to acquire excessive images and effectively reducing the power consumption of the device.
The invention provides an electronic device, which includes an image acquisition circuit and a processor coupled to the image acquisition circuit. The processor obtains an exposure instruction and a first number. And the processor controls the image acquisition circuit to perform exposure according to the exposure instruction so as to acquire an image. The processor determines whether the number of images reaches the first number. And when the number of the images does not reach the first number, the processor executes the operation of controlling the image acquisition circuit to carry out exposure again so as to acquire the images. And when the number of the images reaches the first number, the processor stops controlling the image acquisition circuit to perform exposure.
The invention provides an exposure method, which is used for an electronic device, wherein the electronic device comprises an image acquisition circuit and a processor, and the method comprises the following steps: obtaining, by the processor, an exposure instruction and a first quantity; controlling the image acquisition circuit to perform exposure to acquire an image according to the exposure instruction through the processor; determining, by the processor, whether the number of images reaches the first number; when the number of the images does not reach the first number, controlling the image acquisition circuit to perform exposure again through the processor to acquire the images; and stopping controlling, by the processor, the image acquisition circuit to expose when the number of images reaches the first number.
The invention provides a master-slave system, comprising: a master device and a slave device. The master device has a first interface. The slave device has a second interface and an image acquisition circuit. The second interface is electrically connected to the first interface. The slave device controls the image acquisition circuit to perform exposure to acquire a plurality of images. The master device provides a read command and a selection signal to the slave device. The slave device provides at least one first image in the plurality of images to the master device according to the reading instruction and the selection signal. In the operation of providing the first image of the plurality of images to the master device, when the slave device stops receiving the selection signal, the slave device stops performing the operation of controlling the image capturing circuit to perform exposure to capture the plurality of images and the operation of providing the first image of the plurality of images to the master device.
The invention provides an exposure method, which is used for a master-slave system, wherein the master-slave system comprises a master device and a slave device, the master device is provided with a first interface, the slave device is provided with a second interface and an image acquisition circuit, the second interface is electrically connected to the first interface, and the method comprises the following steps: controlling, by the slave device, the image acquisition circuit to perform exposure to acquire a plurality of images; providing, by the master device, a read instruction and a selection signal to the slave device; providing, by the slave device, at least a first image of the plurality of images to the master device according to the reading instruction and the selection signal; and in the step of providing the first image of the plurality of images to the master device, when the slave device stops receiving the selection signal, stopping performing, by the slave device, the step of controlling the image acquisition circuit to perform exposure to acquire the plurality of images and the step of providing the first image of the plurality of images to the master device.
Based on the above, the exposure method, the electronic device and the master-slave system of the invention can effectively control the exposure time of the image acquisition circuit, thereby avoiding unnecessary exposure to acquire excessive images and effectively reducing the power consumption of the device.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic diagram of an electronic device according to an embodiment of the invention.
Fig. 2 is a flowchart illustrating an exposure method according to a first embodiment of the present invention.
Fig. 3 is a schematic diagram of a master-slave system according to an embodiment of the present invention.
Fig. 4 is a flowchart illustrating an exposure method according to a second embodiment of the present invention.
FIG. 5 is a schematic diagram illustrating the signaling of the SPI in accordance with one embodiment of the present invention.
Description of the reference numerals
100: electronic device
20: processor with a memory having a plurality of memory cells
22: image acquisition circuit
24: register with a plurality of registers
26: output circuit
S201: the processor obtains an exposure instruction and a first number of steps
S203: the processor controls the image acquisition circuit to carry out exposure to acquire an image according to the exposure instruction
S205: the processor temporarily stores the image in the register and stops controlling the image acquisition circuit to perform exposure
S207: step for judging whether the processor outputs the image temporarily stored in the register through the output circuit
S209: when the processor receives the output instruction, the processor outputs the image temporarily stored in the register through the output circuit according to the output instruction
S211: step for judging whether the number of the images reaches a first number by a processor
S213: step of stopping controlling image acquisition circuit to expose by processor
1000: master-slave system
200: master device
300: slave device
30: image acquisition circuit
50. 60: interface
SS, SCLK, MOSI, MISO: pin
S401: the master device provides the exposure command, the selection signal and the clock signal to the slave device
S403: the slave device controls the image acquisition circuit to perform exposure to acquire a plurality of images according to the exposure instruction, the selection signal and the clock signal
S405: the master device provides read command, selection signal and clock signal to the slave device
S407: the slave device provides at least one first image in the plurality of images to the master device according to the reading instruction, the selection signal and the clock signal
S409: step of judging whether to stop receiving selection signal from slave device
S411: the slave device controls the image acquisition circuit to perform exposure to acquire a plurality of images according to the exposure instruction, the selection signal and the clock signal
S413: the slave device stops executing the steps of controlling the image acquisition circuit to perform exposure to acquire an image and stopping executing the step of providing the first image to the master device
T1-T6: point in time
C1-C10: clock period
cmd1, cmd 2: instructions
D1-D6: image of a person
ES: state of exposure
Detailed Description
Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Further, wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.
The exposure method of the present invention is described below in a plurality of embodiments.
[ first embodiment ]
Fig. 1 is a schematic diagram of an electronic device according to an embodiment of the invention.
Referring to fig. 1, the electronic device 100 includes a processor 20, an image capturing circuit 22, a register 24, and an output circuit 26. The image capturing circuit 22, the register 24 and the output circuit 26 are respectively coupled to the processor 20. The electronic device 100 is, for example, an electronic device such as a mobile phone, a tablet computer, a notebook computer, etc., and is not limited herein.
The Processor 20 may be a Central Processing Unit (CPU), or other programmable general purpose or special purpose Microprocessor (Microprocessor), Digital Signal Processor (DSP), programmable controller, Application Specific Integrated Circuit (ASIC), or other similar components or combinations thereof.
The image capturing circuit 22 is used to capture one or more images. For example, the image capturing circuit 22 may be equipped with a camera lens of a Charge Coupled Device (CCD), a Complementary Metal-Oxide Semiconductor (CMOS) Device or other types of photosensitive devices, and may be used to expose and capture at least one image.
The register 24 may be any type of fixed or removable Random Access Memory (RAM), read-only memory (ROM), flash memory (flash memory), or the like, or any combination thereof.
The output circuit 26 is mainly used for outputting the image acquired by the image acquisition circuit 22. The output circuit 26 is, for example, a transmission interface for transmitting data to other electronic devices, or a display device for displaying an image acquired by the image acquisition circuit 22, and is not limited herein.
In the present exemplary embodiment, the electronic device 100 further includes a storage circuit (not shown). The memory circuit of the electronic device 100 stores a plurality of program code segments, which are executed by the processor 20 after they are installed. For example, the memory circuit of the electronic device 100 includes a plurality of modules, and each of the modules is composed of one or more program code segments, and is used for performing each operation of the electronic device 100. However, the invention is not limited thereto, and the operations of the electronic device 100 may also be implemented by using other hardware forms.
Fig. 2 is a flowchart illustrating an exposure method according to a first embodiment of the present invention.
Referring to fig. 1 and fig. 2, in the present embodiment, the processor 20 may obtain an exposure command and a first quantity input (or issued) by a user (step S201). The first number refers to the number of images to be acquired. In one embodiment, the first number is included in the exposure instruction. However, in another embodiment, the register 24 may pre-fetch a first amount input by the user and pre-store the first amount in the register 24 for access by the processor 20.
After the processor 20 receives the exposure command, it controls the image capturing circuit 22 to perform exposure according to the exposure command to capture an image (step S203). Next, the processor 20 temporarily stores the acquired image in the register 24, and stops controlling the image acquiring circuit 22 to perform exposure (i.e. stops controlling the image acquiring circuit 22 to acquire the image) (step S205). Thereafter, the processor 20 determines whether the image temporarily stored in the register 24 is output through the output circuit 26 (step S207).
When the processor 20 receives an output command issued by the user or receives an output command from the outside, the processor 20 outputs the image temporarily stored in the register 24 through the output circuit 26 according to the output command (step S209). For example, the image buffered in the register 24 may be output through the output circuit 26 to be displayed on a screen, or the image buffered in the register 24 may be output to another device through the output circuit 26. Further, in the aforementioned step S207, when the processor 20 does not receive the aforementioned output instruction, the processor 20 does not output the image temporarily stored in the register 24 through the output circuit 26, and causes the image acquisition circuit 22 to be maintained in the state of stopping exposure when the remaining available capacity of the register 24 is insufficient to store the next image (i.e., returns to step S205).
After the processor 20 outputs the images temporarily stored in the register 24 through the output circuit 26 according to the output instruction (i.e., step S209), the processor 20 determines whether the number of the images acquired after the exposure by the image acquisition circuit 22 reaches the first number (step S211). If the number of the acquired images after the image acquisition circuit 22 performs the exposure does not reach the first number, the flow of fig. 2 returns to step S203 to allow the processor 20 to control the image acquisition circuit 22 to perform the exposure again to acquire the images, and the aforementioned steps S205 to S211 may be performed again. However, in step S211, if the processor 20 determines that the number of images acquired after the exposure by the image acquisition circuit 22 reaches the first number, the processor 20 stops controlling the image acquisition circuit 22 to perform the exposure (step S213).
In this way, the first embodiment of the present invention can set the number of images to be acquired by the image acquisition circuit 22, so as to avoid the image acquisition circuit 22 acquiring too many images. In addition, the first embodiment of the present invention directly stops the exposure after the image acquisition circuit 22 acquires the image and does not immediately acquire the next image, but the image acquisition circuit 22 acquires the next image after outputting the acquired image, so as to avoid the power consumption of the electronic device caused by the exposure (or image acquisition) of the image acquisition circuit 22.
[ second embodiment ]
Fig. 3 is a schematic diagram of a master-slave system according to an embodiment of the present invention.
Referring to fig. 3, the master-slave system 1000 includes a master device 200 and a slave device 300. The master device 200 and the slave device 300 may include, for example, a processor (not shown) and a memory circuit (not shown), respectively. In the master device 200 and the slave device 300, a memory circuit may be coupled to the processor. The master device 200 and the slave device 300 are, for example, electronic devices such as a mobile phone, a tablet computer, and a notebook computer, and are not limited herein. In addition, in other embodiments, the master device 200 and the slave device 300 may include other more elements. In particular, in other embodiments, the master device 200 and the slave device 300 may be configured in the same device. It should be noted that although fig. 3 shows only one master device 200 connected to one slave device 300, the present invention is not limited thereto. In other embodiments, one master device 200 may be connected to multiple slave devices 300.
The processor may be similar to the processor 20 in the first embodiment and will not be described herein. The memory circuit may be similar to the memory circuit of the electronic device 100 in the first embodiment, and is not described herein again. Furthermore, in the present exemplary embodiment, the slave device 300 further includes an image acquisition circuit 30 coupled to the processor of the slave device 300. The image capturing circuit 30 may be similar to the image capturing circuit 22 in the first embodiment, and will not be described herein.
In the present embodiment, the master device 200 has an interface 50 (also referred to as a first interface), and the slave device 300 has an interface 60 (also referred to as a second interface). The first interface and the second interface are electrically connected to each other so that the master device 200 can perform data transmission with the slave device 300. In the present exemplary embodiment, the interfaces 50 and 60 are Serial Peripheral Interface (SPI) interfaces, respectively. One of the Serial peripheral interfaces has a Select Slave (SS) pin, a Serial Clock (SCLK) pin, a Master Output Slave Input (MOSI) pin, and a Master Input Slave Output (MISO) pin. When the interface 50 is electrically connected to the interface 60, the SS pin of the master device 200 is electrically connected to the SS pin of the slave device 300, the SCLK pin of the master device 200 is electrically connected to the SCLK pin of the slave device 300, the MOSI pin of the master device 200 is electrically connected to the MOSI pin of the slave device 300, and the MISO pin of the master device 200 is electrically connected to the MISO pin of the slave device 300.
In the present exemplary embodiment, a plurality of program code segments are stored in the memory circuits of the master device 200 and the slave device 300, and are executed by the processors of the master device 200 and the slave device 300 after being installed. For example, the memory circuits of the master device 200 and the slave device 300 include a plurality of modules, and the modules are used to perform the operations of the master-slave system 1000, wherein each module is composed of one or more program code segments. However, the present invention is not limited thereto, and the operations described above may also be implemented by using other hardware forms. In addition, the processors of the master device 200 and the slave device 300 may also be used to control the transmission of data between the master device 200 and the slave device 300.
Fig. 4 is a flowchart illustrating an exposure method according to a second embodiment of the present invention. FIG. 5 is a schematic diagram illustrating the signaling of the SPI in accordance with one embodiment of the present invention.
Referring to fig. 4 and 5, first, as shown in fig. 5, the master device 200 provides a selection signal through the SS pin, a clock signal through the SCLK pin, and an exposure command cmd1 to the slave device 300 through the MOSI pin (step S401). As shown in fig. 5, the selection signal is, for example, a signal that adjusts a high level of the SS pin to a low level, so that the slave device 300 knows that it has been selected by the master device 200. In fig. 5, the low potential signal is between the time point T1 and the time point T2. In addition, the clock signal of step S401 includes a clock cycle C1.
Then, the slave device 300 controls the image obtaining circuit 30 to perform exposure to obtain a plurality of images according to the exposure command cmd1, the selection signal and the clock signal in step S401 (step S403). For example, at the time point T3, the slave device 300 adjusts an exposure state ES of the image capturing circuit 30 from a low level to a high level according to the exposure command cmd1, the selection signal and the clock signal, thereby enabling the exposure function of the image capturing circuit 30 to start the exposure of the image capturing circuit 30 and capture the image. And the acquired image may be stored in a register (not shown) of the slave device 300.
The master device 200 then provides a select signal through the SS pin, a clock signal through the SCLK pin, and a read command cmd2 through the MOSI pin to the slave device 300 (step S405). As shown in fig. 5, the selection signal is, for example, a signal that adjusts the high level of the original SS pin to a low level at a time point T4, so that the slave device 300 knows that it has been selected by the master device 200. In fig. 5, the low potential signal is between the time point T4 and the time point T5. In addition, the master device 200 continuously provides clock signals including clock cycles C2-C10 to the slave device 300.
Then, the slave device 300 provides the images D1-D6 (collectively referred to as the first image) of the images acquired by the image acquisition unit 30 to the master device 200 through the MISO pin according to the read command cmd2, the selection signal, and the clock signal (step S407). And in the process of providing the first image, the slave device 300 determines whether to stop receiving the selection signal (step S409). In other words, the slave device 300 determines whether the signal at the low voltage level in the SS pin is restored (or adjusted) to the high voltage level.
If the slave device 300 determines that the signal at the SS pin is always low, the slave device 300 determines that the slave device 300 continuously receives the selection signal. At this time, the slave device 300 controls the image capturing circuit 30 to continuously perform exposure to capture a plurality of images according to the exposure command cmd1, the selection signal, and the clock signal (step S411), and continuously provides the captured images to the master device 200 (i.e., returning to step S407).
However, in the process of providing the first image, when the slave device 300 determines that the signal at the SS pin is adjusted from the low level to the high level (e.g., at the time point T5), the slave device 300 determines that the slave device 300 stops receiving the selection signal. At this time, the slave device 300 stops performing the step of controlling the image capturing circuit 30 to perform the exposure and the step of providing the first image to the master device 200 (step S413). The step of stopping performing the exposure to control the image acquiring circuit 30 to acquire the image is, for example, adjusting the exposure state ES of the image acquiring circuit 30 from a high potential to a low potential at a time point T6, thereby turning off the exposure function of the image acquiring circuit 30 to stop the exposure of the image acquiring circuit 30 and stop acquiring the image. In addition, the step of stopping the execution of the providing of the first image to the master device 200 is, for example, the slave device 300 does not provide the image to the master device 200 through the MISO pin.
In this way, the second embodiment of the present invention can enable the slave device 300 to determine when to turn on the function of exposing the image capturing circuit 30 or turn off the function of exposing the image capturing circuit 30 according to the selection signal issued by the master device 200, thereby avoiding the power loss caused by the unnecessary exposure performed by the image capturing circuit 30 of the slave device 300.
In summary, the exposure method, the electronic device and the master-slave system of the invention can effectively control the exposure time of the image acquisition circuit, thereby avoiding unnecessary exposure to acquire excessive images and effectively reducing the power consumption of the device.
Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited to the embodiments, and various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the invention.
Claims (6)
1. An electronic device, wherein the electronic device is a slave device and is adapted to electrically connect to a master device, comprising:
an image acquisition circuit; and
a processor coupled to the image acquisition circuitry;
an output circuit coupled to the processor; and
a register coupled to the processor, wherein
The processor obtains an exposure instruction provided by the master device and a first number,
the processor controls the image acquisition circuit to perform exposure to acquire a plurality of images according to the exposure instruction,
wherein the processor determines whether the number of acquired images reaches the first number,
when the number of the acquired images does not reach the first number, the processor executes control of the image acquisition circuit to perform exposure again, and
the processor stops controlling the image acquisition circuit to perform exposure when the number of acquired images reaches the first number,
wherein the processor temporarily stores the acquired image in the register and stops controlling the image acquisition circuit to perform exposure after controlling the image acquisition circuit to perform exposure, and the processor determines whether the acquired image temporarily stored in the register is output through the output circuit,
when the processor does not receive an output instruction and the remaining available capacity of the register is insufficient to store the next image, the image acquisition circuit maintains a stop exposure,
when the processor receives the output instruction provided by the host device and the number of the acquired images does not reach the first number, the processor outputs the acquired images temporarily stored in the register through the output circuit according to the output instruction, and executes control of the image acquisition circuit to perform exposure again to acquire the next image, and
when the processor receives the output instruction and the number of the acquired images reaches the first number, the processor outputs the acquired images temporarily stored in the register through the output circuit according to the output instruction, and does not control the image acquisition circuit to perform exposure again.
2. The electronic device of claim 1, wherein the exposure instruction comprises the first number.
3. The electronic device of claim 1, wherein the register fetches the first number and stores the first number prior to fetching the exposure instruction and the first number of operations.
4. An exposure method for an electronic device, wherein the electronic device is a slave device and is adapted to be electrically connected to a master device, wherein the electronic device includes an image acquisition circuit, a processor, an output circuit, and a register, the method comprising:
obtaining, by the processor, an exposure instruction and a first number provided by the master device;
controlling the image acquisition circuit to perform exposure to acquire a plurality of images according to the exposure instruction through the processor;
determining, by the processor, whether the number of acquired images reaches the first number;
when the number of the acquired images does not reach the first number, controlling the image acquisition circuit to perform exposure again through the processor; and
stopping, by the processor, controlling the image acquisition circuit to expose when the number of acquired images reaches the first number,
wherein after controlling the image acquisition circuitry to perform the exposure, the method further comprises:
temporarily storing the acquired image in the register and stopping controlling the image acquisition circuit to perform exposure through the processor;
judging, by the processor, whether to output, by the output circuit, the acquired image temporarily stored in the register;
maintaining, by the image acquisition circuit, a stopped exposure when the processor does not receive an output instruction and the remaining available capacity of the register is insufficient to store a next image;
when the processor receives the output instruction provided by the main device and the number of the acquired images does not reach the first number, outputting the acquired images temporarily stored in the register through the output circuit according to the output instruction through the processor, and controlling the image acquisition circuit to perform exposure again to acquire the next image; and
when the processor receives the output instruction and the number of the acquired images reaches the first number, the acquired images temporarily stored in the register are output through the output circuit by the processor according to the output instruction, and the image acquisition circuit is not controlled to perform exposure again.
5. The exposure method according to claim 4, wherein the exposure instruction includes the first number.
6. The exposure method of claim 4, wherein prior to the steps of fetching the exposure instruction and the first number, the method further comprises:
retrieving the first quantity through the register and storing the first quantity.
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Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI716142B (en) * | 2019-10-08 | 2021-01-11 | 大陸商廣州印芯半導體技術有限公司 | Optical identification module |
CN110503044A (en) * | 2018-12-03 | 2019-11-26 | 神盾股份有限公司 | Fingerprint sensor and its finger sensing method |
EP3796208B1 (en) * | 2018-12-14 | 2023-03-15 | Shenzhen Goodix Technology Co., Ltd. | Fingerprint recognition apparatus and electronic device |
US11682230B2 (en) * | 2019-03-07 | 2023-06-20 | Novatek Microelectronics Corp. | Fingerprint signal processing circuit and method for signal compensation in analog front-end |
EP3944628A4 (en) * | 2019-03-18 | 2023-02-22 | Hanwha Techwin Co., Ltd. | Camera analyzing images on basis of artificial intelligence, and operating method therefor |
WO2020227986A1 (en) * | 2019-05-15 | 2020-11-19 | 深圳市汇顶科技股份有限公司 | Image collection apparatus and method, and electronic device |
CN110164307B (en) * | 2019-05-23 | 2021-01-26 | 厦门天马微电子有限公司 | Display device with built-in fingerprint identification inductor |
KR20200137079A (en) | 2019-05-28 | 2020-12-09 | 삼성디스플레이 주식회사 | Fingerprint sensor and display device including the same |
US11314961B2 (en) * | 2019-06-12 | 2022-04-26 | Beijing Boe Display Technology Co., Ltd. | Texture image acquisition method, texture image acquisition circuit and display panel |
TWI748460B (en) * | 2019-06-21 | 2021-12-01 | 大陸商廣州印芯半導體技術有限公司 | Time of flight device and time of flight method |
CN110445012A (en) * | 2019-08-01 | 2019-11-12 | 浙江舜宇光学有限公司 | Light emitting module, preparation method and the depth finding device with it |
KR102494086B1 (en) * | 2019-08-23 | 2023-01-30 | 선전 구딕스 테크놀로지 컴퍼니, 리미티드 | Fingerprint detection device, method and electronic device |
WO2021051820A1 (en) * | 2019-09-22 | 2021-03-25 | 神盾股份有限公司 | Fingerprint sensing module and electronic device |
US11301708B2 (en) * | 2019-10-01 | 2022-04-12 | Novatek Microelectronics Corp. | Image sensing circuit and method |
CN112766017A (en) * | 2019-10-21 | 2021-05-07 | 广州印芯半导体技术有限公司 | Optical identification module |
CN110944125B (en) * | 2019-11-06 | 2022-02-22 | 西安理工大学 | Nonlinear column-level ADC (analog to digital converter) and method for improving contrast ratio of CMOS (complementary metal oxide semiconductor) image sensor |
CN110970454B (en) * | 2019-11-28 | 2022-03-15 | 苏州晶方半导体科技股份有限公司 | Packaging structure of biological characteristic recognition chip |
CN110867165B (en) * | 2019-11-29 | 2021-10-15 | 厦门天马微电子有限公司 | Display panel and display device |
WO2021107217A1 (en) * | 2019-11-29 | 2021-06-03 | 엘지전자 주식회사 | Radiation detector and radiographic method using same |
US11062110B2 (en) * | 2019-12-13 | 2021-07-13 | Novatek Microelectronics Corp. | Fingerprint detection device, method and non-transitory computer-readable medium for operating the same |
TWI727550B (en) * | 2019-12-13 | 2021-05-11 | 大陸商廣州印芯半導體技術有限公司 | Optical identification module |
CN111064073A (en) * | 2019-12-26 | 2020-04-24 | 常州纵慧芯光半导体科技有限公司 | Laser device and preparation method and application thereof |
CN113296277A (en) * | 2020-02-24 | 2021-08-24 | 宁波激智科技股份有限公司 | Collimation film, interference reduction collimation film and preparation method thereof |
CN113796853A (en) * | 2020-06-16 | 2021-12-17 | 广州印芯半导体技术有限公司 | Optical image comparison system and comparison method thereof |
US11327907B2 (en) | 2020-07-08 | 2022-05-10 | Macronix International Co., Ltd. | Methods and apparatus for improving SPI continuous read |
US11675731B2 (en) | 2020-08-20 | 2023-06-13 | Global Unichip Corporation | Data protection system and method thereof for 3D semiconductor device |
US11031923B1 (en) * | 2020-08-20 | 2021-06-08 | Global Unichip Corporation | Interface device and interface method for 3D semiconductor device |
US11699683B2 (en) | 2020-08-20 | 2023-07-11 | Global Unichip Corporation | Semiconductor device in 3D stack with communication interface and managing method thereof |
US11687472B2 (en) * | 2020-08-20 | 2023-06-27 | Global Unichip Corporation | Interface for semiconductor device and interfacing method thereof |
US11144485B1 (en) | 2020-08-20 | 2021-10-12 | Global Unichip Corporation | Interface for semiconductor device with symmetric bond pattern and method for arranging interface thereof |
CN112104802B (en) * | 2020-08-21 | 2021-07-20 | 深圳市睿联技术股份有限公司 | Camera circuit and camera device |
US20220067323A1 (en) * | 2020-08-27 | 2022-03-03 | Au Optronics Corporation | Sensing device substrate and display apparatus having the same |
TWI744113B (en) * | 2020-09-30 | 2021-10-21 | 創意電子股份有限公司 | Interface device and interface method for 3d semiconductor device |
CN112511772A (en) * | 2020-10-28 | 2021-03-16 | 深圳奥辰光电科技有限公司 | Image sensor, method for enhancing linearity of image sensor and depth camera |
CN114826811A (en) * | 2021-01-28 | 2022-07-29 | 南宁富桂精密工业有限公司 | Data transmission method and system |
US11398102B1 (en) * | 2021-03-29 | 2022-07-26 | Innolux Corporation | Method for recognizing fingerprint |
US11798309B2 (en) * | 2021-04-15 | 2023-10-24 | Novatek Microelectronics Corp. | Fingerprint identification method for panel, electronic device, and control circuit |
CN115529828A (en) * | 2021-04-26 | 2022-12-27 | 泉州三安半导体科技有限公司 | Light emitting device |
CN114359985A (en) * | 2021-12-31 | 2022-04-15 | 深圳市汇顶科技股份有限公司 | Fingerprint identification method and device and electronic equipment |
TWI818536B (en) * | 2022-05-06 | 2023-10-11 | 圓展科技股份有限公司 | Communication method of wireless camera and pluggable device |
Family Cites Families (131)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1249616B (en) * | 1991-05-30 | 1995-03-09 | Sgs Thomson Microelectronics | BIT LINE PRELOAD CIRCUIT FOR READING AN EPROM MEMORY CELL. |
US5805496A (en) * | 1996-12-27 | 1998-09-08 | International Business Machines Corporation | Four device SRAM cell with single bitline |
FR2775091B1 (en) * | 1998-02-16 | 2000-04-28 | Matra Communication | METHOD FOR TRANSFERRING DATA IN SERIES, AND SYNCHRONOUS SERIAL BUS INTERFACE IMPLEMENTING SUCH A METHOD |
JP3326560B2 (en) * | 2000-03-21 | 2002-09-24 | 日本テキサス・インスツルメンツ株式会社 | Semiconductor memory device |
ATE506807T1 (en) * | 2001-06-18 | 2011-05-15 | Casio Computer Co Ltd | PHOTOSENSOR SYSTEM AND CONTROL METHOD THEREOF |
US7233350B2 (en) * | 2002-01-05 | 2007-06-19 | Candela Microsystems, Inc. | Image sensor with interleaved image output |
US7265784B1 (en) * | 2002-08-19 | 2007-09-04 | Pixim, Inc. | Image processor with noise reduction circuit |
TW562991B (en) * | 2002-11-20 | 2003-11-21 | Novatek Microelectronics Corp | Fast convergence method for the appropriate exposure value |
JP4219663B2 (en) * | 2002-11-29 | 2009-02-04 | 株式会社ルネサステクノロジ | Semiconductor memory device and semiconductor integrated circuit |
CN100337156C (en) * | 2002-12-05 | 2007-09-12 | 联咏科技股份有限公司 | Rapid convergence method for correct exposure value |
CN2609064Y (en) * | 2003-02-28 | 2004-03-31 | 光宝科技股份有限公司 | Name card scanner and transmission module |
US7157745B2 (en) * | 2004-04-09 | 2007-01-02 | Blonder Greg E | Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them |
JP4136793B2 (en) * | 2003-05-29 | 2008-08-20 | キヤノン株式会社 | IMAGING DEVICE AND IMAGING DEVICE CONTROL METHOD |
US7483058B1 (en) * | 2003-08-04 | 2009-01-27 | Pixim, Inc. | Video imaging system including a digital image sensor and a digital signal processor |
US7446812B2 (en) * | 2004-01-13 | 2008-11-04 | Micron Technology, Inc. | Wide dynamic range operations for imaging |
US7292232B2 (en) * | 2004-04-30 | 2007-11-06 | Microsoft Corporation | Data input devices and methods for detecting movement of a tracking surface by a laser speckle pattern |
US7084667B2 (en) * | 2004-07-13 | 2006-08-01 | International Business Machines Corporation | Low leakage monotonic CMOS logic |
US7342256B2 (en) * | 2004-07-16 | 2008-03-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device mounted with read function and electric appliance |
JP4498270B2 (en) * | 2005-11-30 | 2010-07-07 | 株式会社バンダイナムコゲームス | Program, information storage medium, photo printing apparatus and photo printing method |
KR100665853B1 (en) * | 2005-12-26 | 2007-01-09 | 삼성전자주식회사 | Stacked memory cell for use in high-density cmos sram |
JP5168837B2 (en) * | 2006-07-27 | 2013-03-27 | ソニー株式会社 | Image processing apparatus, image processing method, and program |
CN200986927Y (en) * | 2006-09-15 | 2007-12-05 | 林三宝 | LED with micro-optical structure |
JP4843461B2 (en) * | 2006-11-13 | 2011-12-21 | 株式会社東芝 | Solid-state imaging device |
CN100573491C (en) * | 2006-12-15 | 2009-12-23 | 凌阳科技股份有限公司 | Serial transmission controller and serial transmission demoder and serial transmission method thereof |
CN100480830C (en) * | 2007-01-30 | 2009-04-22 | 北京中星微电子有限公司 | Method and device for backlighting detecting and stooping of backlighting compensation detecting |
CN100498749C (en) * | 2007-04-12 | 2009-06-10 | 威盛电子股份有限公司 | Serial peripheral interface data transmission method and serial peripheral interface data transmission system |
JP4470957B2 (en) * | 2007-04-26 | 2010-06-02 | ブラザー工業株式会社 | Image processing system and image reading apparatus |
DE102007024737A1 (en) * | 2007-05-25 | 2008-11-27 | Robert Bosch Gmbh | Data transfer method between master and slave devices |
US7920409B1 (en) * | 2007-06-05 | 2011-04-05 | Arizona Board Of Regents For And On Behalf Of Arizona State University | SRAM cell with intrinsically high stability and low leakage |
TWI334547B (en) * | 2007-06-07 | 2010-12-11 | Via Tech Inc | System and method for serial peripheral interface data transmission |
US20090006911A1 (en) * | 2007-06-28 | 2009-01-01 | Mediatek Inc. | Data replacement processing method |
US8429329B2 (en) * | 2007-10-17 | 2013-04-23 | Micron Technology, Inc. | Serial interface NAND |
US8103936B2 (en) * | 2007-10-17 | 2012-01-24 | Micron Technology, Inc. | System and method for data read of a synchronous serial interface NAND |
US9584710B2 (en) * | 2008-02-28 | 2017-02-28 | Avigilon Analytics Corporation | Intelligent high resolution video system |
US20100118153A1 (en) * | 2008-11-12 | 2010-05-13 | Xiaoguang Yu | Apparatus and methods for controlling image sensors |
US7849229B2 (en) * | 2008-11-25 | 2010-12-07 | Spansion Llc | SPI addressing beyond 24-bits |
US8156274B2 (en) * | 2009-02-02 | 2012-04-10 | Standard Microsystems Corporation | Direct slave-to-slave data transfer on a master-slave bus |
JP2010263305A (en) * | 2009-04-30 | 2010-11-18 | Fujifilm Corp | Imaging apparatus and method of driving the same |
CN102023945B (en) * | 2009-09-22 | 2012-03-28 | 鸿富锦精密工业(深圳)有限公司 | Serial peripheral interface bus-based equipment and data transmission method thereof |
CN101950280B (en) * | 2009-09-30 | 2012-11-14 | 威盛电子股份有限公司 | Chip selection method for generating a plurality of serial buses |
US20110078350A1 (en) * | 2009-09-30 | 2011-03-31 | Via Technologies, Inc. | Method for generating multiple serial bus chip selects using single chip select signal and modulation of clock signal frequency |
US8176209B2 (en) * | 2009-11-05 | 2012-05-08 | Electronics And Telecommunications Research Institute | Data communication system |
CN102097050B (en) * | 2009-12-11 | 2016-03-09 | 康佳集团股份有限公司 | A kind of apparatus and method realizing display seamless switching |
CN102104641A (en) * | 2009-12-18 | 2011-06-22 | 深圳富泰宏精密工业有限公司 | Mobile phone and method for realizing 360DEG photographing |
KR20110076729A (en) * | 2009-12-18 | 2011-07-06 | 삼성전자주식회사 | Multi-step exposed image acquisition method by electronic shutter and apparatus using the same |
US8327052B2 (en) * | 2009-12-23 | 2012-12-04 | Spansion Llc | Variable read latency on a serial memory bus |
TWI406135B (en) * | 2010-03-09 | 2013-08-21 | Nuvoton Technology Corp | Data transmission systems and programmable serial peripheral interface controller |
CN102200864B (en) * | 2010-03-26 | 2013-08-14 | 原相科技股份有限公司 | Optical touch device |
US8310584B2 (en) * | 2010-04-29 | 2012-11-13 | Victory Gain Group Corporation | Image sensing device having thin thickness |
CN101841624A (en) * | 2010-05-17 | 2010-09-22 | 北京思比科微电子技术股份有限公司 | Image sensor data transmission method |
US8325890B2 (en) * | 2010-06-06 | 2012-12-04 | Apple Inc. | Auto exposure techniques for variable lighting conditions |
JP2012008385A (en) * | 2010-06-25 | 2012-01-12 | Ricoh Co Ltd | Image forming device and image forming method |
US8422272B2 (en) * | 2010-08-06 | 2013-04-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
US8433838B2 (en) * | 2010-09-17 | 2013-04-30 | International Business Machines Corporation | Remote multiplexing devices on a serial peripheral interface bus |
TWI507031B (en) * | 2010-10-15 | 2015-11-01 | Altek Corp | Image processing method |
CN102035530A (en) * | 2010-10-15 | 2011-04-27 | 北京工业大学 | Optimal maintaining pipe domino circuit used for high-performance VLSI (Very Large Scale Integrated Circuit) |
US20120097985A1 (en) * | 2010-10-21 | 2012-04-26 | Wen-Huang Liu | Light Emitting Diode (LED) Package And Method Of Fabrication |
KR101705045B1 (en) * | 2010-11-09 | 2017-02-10 | 삼성전자주식회사 | Analog to digital converter, image sensor having the same, and method of converting analog to digital |
CN102469248B (en) * | 2010-11-12 | 2016-03-02 | 华晶科技股份有限公司 | Device for filming image and image synthesis method thereof |
US9047178B2 (en) * | 2010-12-13 | 2015-06-02 | SanDisk Technologies, Inc. | Auto-commit memory synchronization |
CN102098441B (en) * | 2010-12-16 | 2016-09-07 | 深圳市经纬科技有限公司 | Image data transfer method based on SPI interface and camera installation |
CN102117342A (en) * | 2011-01-21 | 2011-07-06 | 中国科学院上海技术物理研究所 | Peripheral component interconnect (PCI) Express bus-based multiband infrared image real-time acquisition system and method |
JP5655626B2 (en) * | 2011-02-24 | 2015-01-21 | ソニー株式会社 | Image processing apparatus, image processing method, and program |
CN202049481U (en) * | 2011-03-17 | 2011-11-23 | 冠捷投资有限公司 | Sensing structure with master and slave relation |
JP5713752B2 (en) * | 2011-03-28 | 2015-05-07 | キヤノン株式会社 | Image processing apparatus and control method thereof |
US9077917B2 (en) * | 2011-06-09 | 2015-07-07 | Apple Inc. | Image sensor having HDR capture capability |
US8576653B2 (en) * | 2011-07-01 | 2013-11-05 | United Microelectronics Corp. | Hidden refresh method and operating method for pseudo SRAM |
CN107770462B (en) * | 2011-12-28 | 2020-09-22 | 株式会社尼康 | Imaging element and imaging device |
TWI450159B (en) * | 2012-03-02 | 2014-08-21 | Pixart Imaging Inc | Optical touch device, passive touch system and its input detection method |
WO2013146039A1 (en) * | 2012-03-30 | 2013-10-03 | シャープ株式会社 | Semiconductor storage device |
US9274997B2 (en) * | 2012-05-02 | 2016-03-01 | Smsc Holdings S.A.R.L. | Point-to-point serial peripheral interface for data communication between devices configured in a daisy-chain |
US8943250B2 (en) * | 2012-08-20 | 2015-01-27 | General Electric | Systems and methods for concatenating multiple devices |
US9003091B2 (en) * | 2012-10-18 | 2015-04-07 | Hewlett-Packard Development Company, L.P. | Flow control for a Serial Peripheral Interface bus |
TW201418992A (en) * | 2012-11-06 | 2014-05-16 | Megawin Technology Co Ltd | Data transmission control method and device of serial peripheral interface master device |
CN103092806A (en) * | 2013-01-18 | 2013-05-08 | 青岛海信宽带多媒体技术有限公司 | Data transmission method and data transmission system based on serial peripheral interface (SPI) data transmission timing sequences |
KR101444063B1 (en) * | 2013-03-22 | 2014-09-26 | 주식회사 슈프리마 | Method and apparatus for fingerprint recognition by using multi exposure |
CN104253188A (en) * | 2013-06-27 | 2014-12-31 | 展晶科技(深圳)有限公司 | Manufacturing method of light emitting diode element |
CN105324985B (en) * | 2013-07-04 | 2018-11-23 | 株式会社尼康 | Electronic equipment and photographing element |
TWI631854B (en) * | 2013-08-05 | 2018-08-01 | 日商新力股份有限公司 | Conversion device, imaging device, electronic device, conversion method |
CN103595503B (en) * | 2013-10-25 | 2016-08-17 | 福建升腾资讯有限公司 | A kind of frequency encoding and decoding communication system based on serial port device |
CN104714908B (en) * | 2013-12-13 | 2017-12-19 | 上海华虹集成电路有限责任公司 | Support the SPI interface of master slave mode |
JP6519095B2 (en) * | 2013-12-19 | 2019-05-29 | カシオ計算機株式会社 | CONTENT OUTPUT SYSTEM, CONTENT OUTPUT DEVICE, CONTENT OUTPUT METHOD, AND PROGRAM |
US9402039B2 (en) * | 2014-01-10 | 2016-07-26 | Omnivision Technologies, Inc. | Dual conversion gain high dynamic range sensor |
CN103838700A (en) * | 2014-02-20 | 2014-06-04 | 江苏理工学院 | Level multiplexing control serial communication device and method |
KR102149187B1 (en) * | 2014-02-21 | 2020-08-28 | 삼성전자주식회사 | Electronic device and control method of the same |
CN103888693B (en) * | 2014-03-31 | 2017-06-13 | 广东威创视讯科技股份有限公司 | Image transmission |
EP2938064B1 (en) * | 2014-04-24 | 2016-10-12 | Axis AB | Method and apparatus for determining exposure setting |
JP6478488B2 (en) * | 2014-06-18 | 2019-03-06 | キヤノン株式会社 | AD converter and solid-state imaging device |
CN105208294A (en) * | 2014-06-20 | 2015-12-30 | 中兴通讯股份有限公司 | Method and device for taking picture |
JP6454490B2 (en) * | 2014-07-17 | 2019-01-16 | ルネサスエレクトロニクス株式会社 | Semiconductor device and ramp signal control method |
JP6552336B2 (en) * | 2014-08-29 | 2019-07-31 | 株式会社半導体エネルギー研究所 | Semiconductor device |
CN104318205A (en) * | 2014-09-29 | 2015-01-28 | 上海箩箕技术有限公司 | Information detection display device, detection method and display method of information detection display device |
WO2016050750A1 (en) * | 2014-09-29 | 2016-04-07 | Biosurfit S.A. | Positioning mechanism |
US10732771B2 (en) * | 2014-11-12 | 2020-08-04 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint sensors having in-pixel optical sensors |
US10114789B2 (en) * | 2015-01-08 | 2018-10-30 | Samsung Electronics Co., Ltd. | System on chip for packetizing multiple bytes and data processing system including the same |
CN105991935B (en) * | 2015-02-15 | 2019-11-05 | 比亚迪股份有限公司 | Exposure-control device and exposal control method |
US20160246396A1 (en) * | 2015-02-20 | 2016-08-25 | Qualcomm Incorporated | Interactive touchscreen and sensor array |
JP2016161653A (en) * | 2015-02-27 | 2016-09-05 | 富士フイルム株式会社 | Photographing device and method |
EP3306864B1 (en) * | 2015-05-26 | 2019-09-25 | Hitachi Automotive Systems, Ltd. | Communication device and communication system |
CN204695305U (en) * | 2015-06-11 | 2015-10-07 | 北京海泰方圆科技有限公司 | A kind of SPI communication interface based on joint product and this joint product |
CN106663156B (en) | 2015-06-30 | 2020-08-07 | 华为技术有限公司 | Method and terminal for unlocking screen by fingerprint |
TWI576653B (en) * | 2015-07-31 | 2017-04-01 | 廣達電腦股份有限公司 | Exposure control system and method thereof |
US9819889B2 (en) * | 2015-08-07 | 2017-11-14 | Omnivision Technologies, Inc. | Method and system to implement a stacked chip high dynamic range image sensor |
CN105100631B (en) * | 2015-09-08 | 2019-03-01 | Oppo广东移动通信有限公司 | A kind of automatic continuous interval takes pictures, the method that images and mobile terminal |
US10003761B2 (en) * | 2015-09-10 | 2018-06-19 | Canon Kabushiki Kaisha | Imaging device having multiple analog-digital conversion circuits that perform multiple ad conversions for a singular one of a pixel signal |
US9990316B2 (en) * | 2015-09-21 | 2018-06-05 | Qualcomm Incorporated | Enhanced serial peripheral interface |
CN205038640U (en) * | 2015-09-25 | 2016-02-17 | 河南思维自动化设备股份有限公司 | Solve SPI bus communication delayed SPI equipment |
US10157590B1 (en) * | 2015-12-15 | 2018-12-18 | Apple Inc. | Display with localized brightness adjustment capabilities |
CN105578076A (en) * | 2015-12-18 | 2016-05-11 | 广东欧珀移动通信有限公司 | Imaging method, imaging device and electronic device |
CN106303269A (en) * | 2015-12-28 | 2017-01-04 | 北京智谷睿拓技术服务有限公司 | Image acquisition control method and device, image capture device |
US9743025B2 (en) * | 2015-12-30 | 2017-08-22 | Omnivision Technologies, Inc. | Method and system of implementing an uneven timing gap between each image capture in an image sensor |
CN106778459B (en) | 2015-12-31 | 2021-02-12 | 深圳市汇顶科技股份有限公司 | Fingerprint identification method and fingerprint identification device |
JP6885344B2 (en) * | 2016-01-20 | 2021-06-16 | ソニーグループ株式会社 | Solid-state image sensor, its driving method, and electronic devices |
KR102554495B1 (en) * | 2016-01-22 | 2023-07-12 | 에스케이하이닉스 주식회사 | Nonvolatile memory cell having lateral coupling structure and memory cell array using the nonvolatile memory cell |
US9800807B2 (en) * | 2016-02-26 | 2017-10-24 | Intel Corporation | Image sensor operation for shutter modulation and high dynamic range |
US10043051B2 (en) * | 2016-03-07 | 2018-08-07 | Microsoft Technology Licensing, Llc | Triggered image sensing with a display |
JP6747158B2 (en) * | 2016-08-09 | 2020-08-26 | ソニー株式会社 | Multi-camera system, camera, camera processing method, confirmation device, and confirmation device processing method |
CN206470775U (en) * | 2016-12-23 | 2017-09-05 | 敦捷光电股份有限公司 | Biometric recognition device.It |
CN110036627B (en) * | 2016-12-27 | 2021-03-05 | 松下知识产权经营株式会社 | Imaging device, camera, and imaging method |
CN106897701B (en) * | 2017-02-27 | 2019-08-23 | 京东方科技集团股份有限公司 | Optical finger print identifies mould group and display panel, display device |
CN107066859A (en) | 2017-03-15 | 2017-08-18 | 广东欧珀移动通信有限公司 | A kind of unlocked by fingerprint method and device |
CN107071153B (en) | 2017-03-21 | 2019-07-02 | Oppo广东移动通信有限公司 | A kind of fingerprint mould group mode switching method and device |
KR102331464B1 (en) * | 2017-04-18 | 2021-11-29 | 삼성전자주식회사 | Method for acquiring biometric information using a biometric information sensing area formed in a display area and electronic device supporting the same |
CN107135049B (en) * | 2017-04-19 | 2020-08-14 | 北京航天自动控制研究所 | Reliable asynchronous communication method facing discrete data stream |
CN107122742B (en) * | 2017-04-27 | 2019-12-03 | 上海天马微电子有限公司 | A kind of display device and its fingerprint identification method and electronic equipment |
CN107194326A (en) | 2017-04-28 | 2017-09-22 | 广东欧珀移动通信有限公司 | Fingerprint collecting method and related product |
CN107169447A (en) * | 2017-05-12 | 2017-09-15 | 贵州中信云联科技有限公司 | Hospital self-service system based on recognition of face |
EP3462731B1 (en) * | 2017-09-29 | 2021-11-10 | Canon Kabushiki Kaisha | Imaging device, imaging system, and moving body |
US10735459B2 (en) * | 2017-11-02 | 2020-08-04 | International Business Machines Corporation | Service overload attack protection based on selective packet transmission |
KR102460750B1 (en) * | 2018-02-13 | 2022-10-31 | 삼성전기주식회사 | Camera apparatus having ois function and communication method thereof |
JP6753985B2 (en) * | 2018-08-10 | 2020-09-09 | シャープ株式会社 | Analog-to-digital converter and solid-state image sensor |
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