TWI716142B - Optical identification module - Google Patents

Abstract

An optical identification module including a sensor and a collimator is provided. The sensor has a plurality of sensing regions. The collimator is disposed on the plurality of sensing regions, and the collimator includes a transparent substrate, a first light shielding layer and a plurality of micro-lenses. The first light shielding layer includes a plurality of first openings. The plurality of micro-lenses are disposed on a first surface of the transparent substrate and the plurality of micro-lenses correspond to the plurality of first openings, respectively.

Description

Optical recognition module

The invention relates to an optical module, and more particularly to an optical identification module capable of recognizing biological characteristics.

With the vigorous development of the Internet of Things technology, the application and demand for biometrics technology is expanding rapidly. At present, the common biometric identification technologies on the market mainly use optical, capacitive, or ultrasonic methods to identify biological features such as fingerprints, palm prints, vein distribution, iris, retina, or facial features, so as to achieve the purpose of identification or authentication. Compared with the recognition module that recognizes biological characteristics by capacitance or ultrasonic wave, the optical recognition module that recognizes biological characteristics optically receives the light beam reflected by the object to be detected by the sensor to recognize the biological characteristics. It has the advantages of high durability and low cost. However, the light beam reflected by the object to be measured is easily transmitted to the sensor in a scattered manner, resulting in poor image quality and affecting the recognition result.

The present invention provides an optical identification module, which has good identification capabilities.

An optical identification module of the present invention includes a sensor and a collimator. The sensor has a sensing surface and a plurality of sensing areas, and the plurality of sensing areas are located on the sensing surface. The collimator is arranged on a plurality of sensing areas, and the collimator includes a light-transmitting substrate, a first light shielding layer and a plurality of micro lenses. The first light shielding layer is disposed on the sensing surface, wherein the first light shielding layer includes a plurality of first openings, and the plurality of first openings expose at least a partial area of each of the plurality of sensing regions. A plurality of microlenses are arranged on the first surface of the light-transmissive substrate, wherein the first light shielding layer is located between the plurality of microlenses and the plurality of sensing regions, and the plurality of microlenses respectively correspond to the plurality of first openings.

An optical identification module of the present invention includes a sensor and a collimator. The sensor has a sensing surface and multiple sensing areas, and the multiple sensing areas are located on the sensing surface. The collimator is arranged on a plurality of sensing areas, and the collimator includes a light-transmitting substrate, a first light shielding layer and a plurality of micro lenses. A plurality of microlenses are arranged on the first surface of the light-transmitting substrate. The first light shielding layer is disposed on the panel and located between the plurality of microlenses and the panel. The first light shielding layer includes a plurality of first openings, and the plurality of first openings are connected to the plurality of microlenses and At least part of each of the regions corresponds to each other.

In an embodiment of the present invention, the aforementioned optical identification module further includes an infrared cut-off sheet and an absorption layer. The infrared cut-off sheet is arranged on the second surface of the transparent substrate, and the second surface is opposite to the first surface. The absorption layer is arranged on the second surface of the light-transmitting substrate, and the absorption layer is located between the second surface of the light-transmitting substrate and the infrared cut-off sheet.

In an embodiment of the present invention, there is a distance between adjacent two of the aforementioned multiple sensing regions, and the diameter of each microlens is less than or equal to the distance.

In an embodiment of the present invention, the ratio of the aforementioned pitch to the width of each sensing area is greater than the positive square root of 2.

In an embodiment of the present invention, the ratio of the thickness of the first light shielding layer to the width of each first opening is greater than the positive square root of 2.

Based on the above, in the optical identification module of the present invention, the collimator is used to collimate the light beam transmitted to the sensor, so as to effectively improve the optical interference (crosstalk), achieve optical noise reduction, and improve image resolution, and it is easy to Production, and can reduce production costs. Therefore, the optical identification module of the present invention can have good identification ability and is easy to manufacture, which is beneficial to industry competition and development.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

In the drawings, each drawing illustrates the general characteristics of the methods, structures, and/or materials used in specific exemplary embodiments. However, the drawings are not limited to the structures or features of the following embodiments, and these drawings should not be construed as defining or limiting the scope or properties covered by these exemplary embodiments. For example, for clarity, the relative thickness and position of each layer, region, and/or structure may be reduced or enlarged.

The use of similar or identical element symbols in various drawings tends to indicate the existence of similar or identical elements or features. Similar component symbols in the drawings indicate similar components and will not be repeated.

The optical identification module listed in the following embodiments is suitable for capturing the biological characteristics of the test object. The test object can be a finger or a palm. Correspondingly, the biological characteristics can be fingerprints, veins or palm prints, but not limited to this.

1 to 7 are schematic cross-sectional views of the optical identification module according to the first to seventh embodiments of the present invention. Please refer to FIG. 1, the optical recognition module 100 of the first embodiment includes a sensor 110 and a collimator 120.

The sensor 110 is adapted to receive a light beam (that is, a light beam with biometric information, not shown) reflected by an object (not shown). For example, the sensor 110 may include a Charge Coupled Device (CCD), a Complementary Metal-Oxide Semiconductor (CMOS) or other appropriate types of optical sensing devices.

The sensor 110 has a plurality of sensing regions R. The multiple sensing regions R are multiple light receiving regions in the sensor 110. When the sensor 110 uses a plurality of charge-coupled elements to receive light, the plurality of sensing regions R are respectively the areas where the plurality of charge-coupled elements are located. On the other hand, when the sensor 110 uses a complementary metal oxide semiconductor device to receive light, the plurality of sensing regions R are multiple pixel regions in the complementary metal oxide semiconductor device.

The collimator 120 is disposed on the plurality of sensing regions R. Specifically, the collimator 120 is arranged between the object to be measured and the sensor 110 to collimate the light beam reflected by the object to be measured and transmitted to the sensor 110, thereby improving optical interference and achieving optical noise reduction And improve the image resolution.

Furthermore, the collimator 120 includes a transparent substrate 122 and a first light shielding layer 124. The light-transmitting substrate 122 can be any carrier that can pass light beams. For example, the transparent substrate 122 may include a glass substrate or a plastic substrate, but is not limited to this.

The transparent substrate 122 has a first surface S1 and a second surface S2 opposite to the first surface S1. The first light shielding layer 124 is disposed on the first surface S1 of the light-transmitting substrate 122. In this embodiment, the first surface S1 is located between the second surface S2 and the sensor 110, that is, the first surface S1 is the surface of the transparent substrate 122 facing the sensor 110, and the second surface S2 is transparent The optical substrate 122 faces away from the surface of the sensor 110. Therefore, the first light shielding layer 124 is located between the transparent substrate 122 and the sensor 110. In another embodiment, the collimator 120 can be inverted so that the first surface S1 provided with the first light shielding layer 124 faces away from the sensor 110, and the second surface S2 faces the sensor 110, so that the transparent The optical substrate 122 is located between the first light shielding layer 124 and the sensor 110.

The first light shielding layer 124 is suitable for shielding stray light, and the first light shielding layer 124 can be formed of any material capable of shielding light. For example, the light-shielding material may include a light-absorbing material, but is not limited to this. For example, the material of the first light shielding layer 124 may include black ink or black photoresist. In addition, the first light shielding layer 124 may be formed on the first surface S1 by printing. However, the material and color of the first light shielding layer 124 and the manner in which it is formed on the first surface S1 can be changed according to requirements, and are not limited to the above.

Since the collimator 120 is arranged between the object to be measured and the sensor 110, in order for the sensor 110 to receive the light beam reflected by the object to be measured (that is, the beam with biometric information), the collimator 120 The first light shielding layer 124 includes a plurality of first openings O1 corresponding to the plurality of sensing regions R of the sensor 110. In this way, the light beam reflected by the object to be measured can be transmitted to the sensor 110 through the plurality of first openings O1.

The size of each first opening O1 (such as the width WO1 of each first opening O1) is less than or equal to the size of each sensing area R (the width WR of each sensing area R), so that the light beam in each first opening O1 is transmitted To the corresponding sensing area R. The aforementioned width (such as the width WO1 of the first opening O1 and the width WR of the sensing region R) can be the diameter of the opening/area (when the shape of the opening/area is circular) or the diagonal length of the opening/area ( When the shape of the opening/area is square).

In this embodiment, the arrangement relationship between the plurality of first openings O1 and the plurality of sensing regions R is one-to-one, that is, each sensing region R is provided with a first opening O1. However, in another embodiment, the arrangement relationship between the plurality of first openings O1 and the plurality of sensing regions R may be many-to-one, that is, each sensing region R is provided with a plurality of first openings O1.

Each first opening O1 can be filled with or not filled with light-transmitting material according to requirements. In this embodiment, each first opening O1 is not filled with any material. That is, the light transmission medium in each first opening O1 is air. However, in another embodiment, each first opening O1 may be filled with a light-transmitting material. In other words, the light transmission medium in each first opening O1 is a light-transmitting material. The refractive index of the light-transmitting material is preferably equal to or close to the refractive index of the light-transmitting substrate 122, so as to reduce the light loss caused by interface reflection or the change of the beam transmission path.

According to different design requirements, the corner between the extending direction DE1 of each first opening O1 and the thickness direction DT of the light-transmitting substrate 122 is in the range of 0° to 45°. In this embodiment, the angle (not shown) between the extension direction DE1 and the thickness direction DT is 0 degrees. In other words, each first opening O1 extends in the thickness direction DT of the transparent substrate 122, but the invention is not limited to this.

The collimation effect of the light beam transmitted to the sensing region R is related to the thickness T124 of the first light shielding layer 124 and the width WO1 of each first opening O1. The thicker the first light shielding layer 124 and/or the narrower each first opening O1 is, the more significant the collimation effect of the light beam is. Conversely, the thinner the first light shielding layer 124 and/or the wider each first opening O1, the less significant the collimation effect of the light beam is. In order to effectively collimate the light beam (for example, the first light shielding layer 124 shields/absorbs the large-angle light beam in the light beam transmitted to the sensing area R), the thickness T124 of the first light shielding layer 124 and each first opening O1 The ratio of the width of WO1 (T124/WO1) is greater than 1. With the above design, optical interference can be effectively improved, optical noise reduction can be achieved, and image resolution can be improved, so that the optical identification module 100 has good identification capabilities.

According to different requirements, the optical identification module 100 may further include other components. For example, the optical recognition module 100 may further include a light source, but is not limited to this.

Please refer to FIG. 2. The main differences between the optical identification module 200 of the second embodiment and the optical identification module 100 of FIG. 1 are as follows. In the optical identification module 200, the angle θ between the extending direction DE1 of each first opening O1 and the thickness direction DT of the transparent substrate 122 is greater than 0 degrees and less than or equal to 45 degrees.

Referring to FIG. 3, the main differences between the optical identification module 100A of the third embodiment and the optical identification module 100 in FIG. 1 are as follows. In the optical recognition module 100A, the arrangement relationship between the plurality of first openings O1 and the plurality of sensing regions R is many-to-one, that is, each sensing region R is provided with a plurality of first openings O1.

Referring to FIG. 4, the main differences between the optical identification module 200A of the fourth embodiment and the optical identification module 200 in FIG. 2 are as follows. In the optical identification module 200A, the arrangement relationship between the plurality of first openings O1 and the plurality of sensing regions R is many-to-one, that is, each sensing region R is provided with a plurality of first openings O1.

5, the main differences between the optical identification module 300 of the fifth embodiment and the optical identification module 100 in FIG. 1 are as follows. In the optical identification module 300, the collimator 120A includes a second light shielding layer 126 and a plurality of microlenses 128 in addition to the light-transmitting substrate 122 and the first light shielding layer 124.

The second light shielding layer 126 is disposed on the second surface S2 of the light-transmitting substrate 122. In other words, the second light shielding layer 126 and the first light shielding layer 124 are located on opposite sides of the transparent substrate 122, respectively.

The second light shielding layer 126 is also suitable for shielding stray light, and the second light shielding layer 126 can be formed of any material capable of shielding light. For example, the light-shielding material may include a light-absorbing material, but is not limited to this. For example, the material of the second light shielding layer 126 may include black ink or black photoresist. In addition, the second light shielding layer 126 may be formed on the second surface S2 by printing. However, the material and color of the second light shielding layer 126 and the manner in which it is formed on the second surface S2 can be changed according to requirements, and are not limited to the above.

The second light shielding layer 126 includes a plurality of second openings O2 corresponding to the plurality of first openings O1 of the first light shielding layer 124, and the size of each second opening O2 (such as the width WO2 of each second opening O2) can be It is greater than or equal to the size of each first opening O1 (for example, the width WO1 of each first opening O1).

A plurality of microlenses 128 are arranged on the second surface S2 and are respectively located in the plurality of second openings O2. Furthermore, the plurality of microlenses 128 are suitable for condensing light beams, which helps the sensor 110 to receive more light beams reflected by the object to be measured. In this embodiment, a plurality of microlenses 128 are arrayed on the second surface S2, and the arrangement relationship between the plurality of microlenses 128 and the plurality of sensing regions R is one to one. However, in another embodiment, the arrangement relationship between the plurality of microlenses 128 and the plurality of sensing regions R may also be many-to-one.

The refractive index of the plurality of microlenses 128 is preferably equal to or close to the refractive index of the light-transmitting substrate 122, so as to reduce the light loss caused by interface reflection or the change of the beam transmission path. For example, the absolute value of the refractive index difference between the plurality of microlenses 128 and the transparent substrate 122 is preferably less than 0.1. In addition, the radius of curvature of each microlens 128 is smaller than the ratio (T122/WR) of the thickness T122 of the transparent substrate 122 to the width WR of each sensing area R, so as to achieve a better convergence effect.

In this embodiment, each first opening O1 can be filled with or not filled with light-transmitting material as required. In addition, the collimator 120A can omit the arrangement of a plurality of microlenses 128. Under this structure, each second opening O2 can also be filled with or not filled with light-transmitting materials as required. In addition, the optical identification module 300 may further include other components according to different requirements. For related instructions, please refer to the foregoing, and will not repeat them here.

Please refer to FIG. 6. The main differences between the optical identification module 400 of the sixth embodiment and the optical identification module 300 of FIG. 5 are as follows. In the optical recognition module 400, the first surface S1 provided with the first light shielding layer 124 faces away from the sensor 110, and the second surface S2 provided with the second light shielding layer 126 faces the sensor 110 so as to be transparent The optical substrate 122 is located between the first light shielding layer 124 and the sensor 110.

In addition, the size of each second opening O2 (such as the width WO2 of each second opening O2) is less than or equal to the size of each sensing area R (the width WR of each sensing area R), and the size of each first opening (such as The width WO1 of each first opening O1) is greater than or equal to the size of each second opening O2 (such as the width WO2 of each second opening O2).

The plurality of micro lenses 128 are disposed on the first surface S1 and are respectively located in the plurality of first openings O1. In this embodiment, a plurality of microlens arrays 128 are arranged on the first surface S1, and the arrangement relationship between the plurality of microlenses 128 and the plurality of sensing regions R is one to one. However, in another embodiment, the arrangement relationship between the plurality of microlenses 128 and the plurality of sensing regions R may be many-to-one. The related design of the micro lens 128 please refer to the foregoing, and will not be repeated here.

In this embodiment, each second opening O2 can be filled with or not filled with light-transmitting material as required. In addition, the collimator 120B can omit the arrangement of a plurality of microlenses 128. Under this structure, each first opening O1 can also be filled with or not filled with light-transmitting materials as required. In addition, the optical identification module 400 may further include other components according to different requirements. For related instructions, please refer to the foregoing, and will not repeat them here.

Please refer to FIG. 7. The main differences between the optical identification module 500 of the seventh embodiment and the optical identification module 400 of FIG. 6 are as follows. In the optical recognition module 500, the first light shielding layer 124C of the collimator 120C is thinner than the first light shielding layer 124 of the collimator 120B in FIG. 6, that is, the thickness T124C is smaller than the thickness T124, and the first light shielding The ratio of the thickness T124C of the layer 124C to the width WO1 of each first opening O1 (T124C/WO1) may not be greater than one. Therefore, the optical identification module 500 can have a thinner thickness.

In this embodiment, each second opening O2 can be filled with or not filled with light-transmitting material as required. In addition, the collimator 120C can omit the arrangement of a plurality of microlenses 128. Under this structure, each first opening O1 can also be filled with or not filled with light-transmitting materials as required. In addition, the optical identification module 500 may further include other components according to different requirements. For related instructions, please refer to the foregoing, and will not repeat them here.

8A is a schematic cross-sectional view of an optical identification module according to an eighth embodiment of the invention. 8B and 8C are schematic diagrams of the optical path of the optical identification module of FIG. 8A. Referring to FIG. 8A, the main differences between the optical identification module 600 of the eighth embodiment and the optical identification module 300 of FIG. 5 are as follows. In the optical recognition module 600, the first light shielding layer 124D of the collimator 120D is disposed on the sensing surface SR of the sensor 110, so that the first light shielding layer 124D is located on the multiple of the microlens 128 and the sensor 110. Between two sensing regions R. Moreover, as shown in FIG. 8A, in this embodiment, a plurality of microlenses are disposed on the first surface S1 of the light-transmitting substrate 122, and the plurality of microlenses 128 respectively correspond to the plurality of first openings O1.

As mentioned above, in this embodiment, the collimation effect of the beam transmitted toward the sensing area R is related to the thickness T124D of the first light shielding layer 124D and the width WO1 of each first opening O1. The thicker the first light shielding layer 124D and/or the narrower each first opening O1 is, the more significant the collimation effect of the light beam is. Conversely, the thinner the first light shielding layer 124D and/or the wider each first opening O1, the less significant the collimation effect of the light beam is. In order to effectively collimate the light beam (for example, the first light shielding layer 124D shields/absorbs the large-angle light beam in the light beam transmitted to the sensing area R), the thickness T124D of the first light shielding layer 124D and each first opening O1 The ratio of the width of WO1 (T124D/WO1) will adjust its demand value according to the situation. However, as the ratio of the thickness T124D of the first light shielding layer 124D to the width WO1 of each first opening O1 (T124D/WO1) increases, the difficulty of the manufacturing process increases.

Accordingly, as shown in FIG. 8A, in the present embodiment, by disposing the first light shielding layer 124D on the sensing surface SR of the sensor 110, the sensor 110 can be more effectively shielded/absorbed. Most of the light beams transmitted by the region R are large-angle light beams, which can reduce the required value of the ratio of the thickness T124D of the first light shielding layer 124D to the width WO1 of each first opening O1 (T124D/WO1), and is easy to Make. Specifically, as shown in FIGS. 8A to 8C, in this embodiment, the plurality of first openings O1 of the first light shielding layer 124D expose at least a part of each of the plurality of sensing regions R, and more Each microlens 128 corresponds to the plurality of first openings O1. In this way, as shown in FIGS. 8B and 8C, since the microlens 128 is suitable for converging the light beam, the small-angle light beam L1 among the light beams transmitted toward the sensing area R can still be transmitted to the corresponding sensing area through the first opening O1. District R. The large-angle light beams L2 and L3 transmitted to the sensing area R are transmitted to the first light shielding layer 124D provided on the sensing surface SR of the sensor 110 after being refracted by the microlens 128, and It is shielded/absorbed by the upper surface or side surface of the first light shielding layer 124D, and is prevented from being transferred to the sensing region R of the sensor 110.

For example, as shown in FIGS. 8B and 8C, in this embodiment, there is a pitch P between adjacent two of the plurality of sensing regions R, and the diameter D of each microlens 128 is less than or equal to the pitch P . The ratio of the pitch P to the width WR of each sensing area R is greater than or equal to the positive square root of 2. The ratio of the thickness T124D of the first light shielding layer 124D to the width WO1 of each first opening O1 is greater than or equal to the positive square root of 2. In this way, the required value of the ratio (T124D/WO1) between the thickness T124D of the first light shielding layer 124D and the width WO1 of each first opening O1 (T124D/WO1) can be reduced, which can be easily manufactured, and can simultaneously enable the optical identification module 600 to have Good recognition ability. For example, in this embodiment, the ratio of the thickness T124D of the first light shielding layer 124D to the width WO1 of each first opening O1 (T124D/WO1) may be between the positive square root of 2 and 12.

In addition, as shown in FIG. 8A, in this embodiment, the optical identification module 600 further includes an infrared cut-off film IR. The infrared cut-off sheet IR is disposed on the second surface S2 of the transparent substrate 122. The infrared cut-off sheet IR can be used to reflect or absorb incident light in the near-infrared waveband, so as to prevent the incident light in the infrared waveband from being transmitted to the sensing area R of the sensor 110 to affect the sensor 110. In addition, the optical recognition module 600 can optionally further include an absorption layer AL to further avoid affecting the quality of the display image of the panel PL. Specifically, as shown in FIG. 8A, in this embodiment, the absorption layer AL is disposed on the second surface S2 of the light-transmitting substrate 122, and is located between the second surface S2 of the light-transmitting substrate 122 and the infrared cut-off sheet IR. . Furthermore, in this embodiment, the absorption layer AL can be used to absorb the light reflected by the infrared cut-off sheet IR, so as to prevent the user from observing the light reflected by the infrared cut-off sheet IR, which may affect the quality of the display image of the panel PL.

In this way, through the above design, optical interference can be effectively improved, optical noise reduction can be achieved, and image resolution can be improved, so that the optical identification module 600 has good identification capabilities, is easy to manufacture, and can reduce production costs. In addition, the optical identification module 600 may further include other components according to different requirements. For related instructions, please refer to the foregoing, and will not repeat them here.

9 is a schematic cross-sectional view of an optical identification module according to a ninth embodiment of the invention. Referring to FIG. 9, the main differences between the optical identification module 700 of the ninth embodiment and the optical identification module 600 of FIG. 8A are as follows. In the optical recognition module 700, the optical recognition module further includes a panel PL, and the first light shielding layer 124E of the collimator 120E is provided on a surface of the panel PL facing the microlens 128. For example, the panel PL can be the display panel or cover glass of a mobile phone, and is suitable for passing the light beam reflected by the object to be measured (not shown) (that is, the light beam with biometric information, not shown), and It is transferred to a plurality of sensing regions R of the sensor 110.

Furthermore, as shown in FIG. 9, in this embodiment, the plurality of first openings O1 respectively correspond to at least a partial area of each of the plurality of microlenses 128 and the plurality of sensing regions R. In addition, the sensor 110 can relatively reduce the area of each sensing region R, that is, the width WR of the sensing region. In other words, in this embodiment, it is only necessary to provide the sensing region R on the partial area of the sensing surface SR corresponding to the plurality of first openings O1 and the plurality of microlenses 128.

In this way, by arranging the first light shielding layer 124E on the surface of the panel PL facing the microlens 128, the light beam can also be effectively shielded/absorbed by the first light shielding layer 124E before the light beam is transmitted to the microlens 128. Most of the large-angle beams of the beams transmitted to the sensing region R can further reduce the required value of the ratio of the thickness T124E of the first light shielding layer 124E to the width WO1 of each first opening O1 (T124E/WO1) , And easy to make. Moreover, by reducing the area of each sensing region R, the stray light being transmitted to the sensing region R of the sensor 110 can also be greatly reduced, and the microlens 128 is configured to transmit to the sensing region R. The small-angle light beams in the light beams can still be concentrated to the area on the sensing surface SR where the sensor 110 is provided with the sensing area R.

In this way, through the above design, optical interference can be effectively improved, optical noise reduction can be achieved, and image resolution can be improved, so that the optical identification module 700 has good identification capabilities, is easy to manufacture, and can reduce production costs. In addition, the optical identification module 700 may further include other components according to different requirements. For related instructions, please refer to the foregoing, and will not repeat them here.

In summary, in the optical identification module of the present invention, the collimator is used to collimate the light beam transmitted to the sensor, so as to effectively improve optical interference, achieve optical noise reduction and improve image resolution, and is easy to manufacture , And can reduce production costs. Therefore, the optical identification module of the present invention can have good identification ability and is easy to manufacture, which is beneficial to industry competition and development.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

100, 100A, 200, 200A, 300, 400, 500, 600, 700: optical recognition module

110: Sensor

120, 120A, 120B, 120C, 120D, 120E: collimator

122: Transparent substrate

124, 124C, 124D, 124E: first light shielding layer

126: second light shielding layer

128: Micro lens

AL: Absorber layer

D: diameter

DE1: Extension direction

DT: thickness direction

IR: infrared cut-off film

L1, L2, L3: beam

O1: first opening

O2: second opening

P: pitch

PL: Panel

R: sensing area

S1: First surface

S2: second surface

SR: Sensing surface

T122, T124, T124C, T124D, T124E: thickness

WO1, WO2, WR: width

θ: included angle

1 to 7 are schematic cross-sectional views of the optical identification module according to the first to seventh embodiments of the present invention. 8A is a schematic cross-sectional view of an optical identification module according to an eighth embodiment of the invention. 8B and 8C are schematic diagrams of the optical path of the optical identification module of FIG. 8A. 9 is a schematic cross-sectional view of an optical identification module according to a ninth embodiment of the invention.

600: Optical recognition module

110: Sensor

120D: collimator

122: Transparent substrate

124D: first light shielding layer

126: second light shielding layer

128: Micro lens

AL: Absorber layer

D: diameter

IR: infrared cut-off film

O1: first opening

P: pitch

PL: Panel

R: sensing area

S1: First surface

S2: second surface

SR: Sensing surface

T124D: Thickness

WO1, WR: width

Claims (8)

An optical recognition module includes: a sensor having a sensing surface and a plurality of sensing regions, the plurality of sensing regions are located on the sensing surface; and a collimator is arranged on the A plurality of sensing areas, and the collimator includes: a light-transmitting substrate; a first light shielding layer disposed on the sensing surface, wherein the first light shielding layer includes a plurality of first openings , The plurality of first openings expose at least a partial area of each of the plurality of sensing regions; and a plurality of microlenses disposed on a first surface of the light-transmitting substrate, wherein the first The light shielding layer is located between the plurality of microlenses and the plurality of sensing regions, the plurality of microlenses respectively correspond to the plurality of first openings, and the thickness of the first light shielding layer is equal to The ratio of the width of each first opening is greater than the positive square root of 2. The optical identification module according to the first item of the scope of patent application, further includes: an infrared cut-off sheet disposed on a second surface of the transparent substrate, and the second surface is opposite to the first surface And an absorbing layer disposed on the second surface of the transparent substrate, and the absorbing layer is located between the second surface of the transparent substrate and the infrared cut-off sheet. According to the optical identification module described in the first item of the scope of patent application, there is a distance between adjacent two of the plurality of sensing regions, and the diameter of each microlens is less than or equal to the distance. According to the optical identification module described in item 3 of the scope of patent application, the ratio of the pitch to the width of each sensing area is greater than the positive square root of 2. An optical recognition module includes: a panel; a sensor with a sensing surface and a plurality of sensing areas, the plurality of sensing areas are located on the sensing surface; and a collimator, arranged On the plurality of sensing regions, and the collimator includes: a light-transmitting substrate; a plurality of microlenses arranged on a first surface of the light-transmitting substrate; and a first light shielding layer, Is disposed on the panel and located between the plurality of microlenses and the panel, wherein the first light shielding layer includes a plurality of first openings, and the plurality of first openings are connected to the plurality of At least a partial area of each of the microlens and the plurality of sensing regions corresponds, and the ratio of the thickness of the first light shielding layer to the width of each first opening is greater than the positive square root of 2. The optical identification module as described in item 5 of the scope of patent application, further comprising: an infrared cut-off sheet disposed on a second surface of the transparent substrate, and the second surface is opposite to the first surface And an absorbing layer disposed on the second surface of the transparent substrate, and The absorption layer is located between the second surface of the transparent substrate and the infrared cut-off sheet. According to the optical identification module described in item 5 of the scope of patent application, there is a distance between adjacent two of the plurality of sensing regions, and the diameter of each microlens is less than or equal to the distance. The optical identification module as described in item 7 of the scope of patent application, wherein the ratio of the pitch to the width of each sensing area is greater than the positive square root of 2.

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