TWM592604U - Sensing module and image capturing apparatus - Google Patents

Abstract

A sensing module including a sensing array, a first shielding layer, a second shielding layer, and a reflective layer is provided. The sensing array includes a plurality of light passing regions and a light receiving surface facing away from an object, and the sensing array is located between the first shielding layer having a plurality of first openings and the second shielding layer having a plurality of second openings. The second shielding layer is located between the sensing array and the reflective layer. The light beams reflected by the object sequentially pass through the first openings, the light passing regions, the second openings, and are then transmitted to the reflective layer. The light beams are reflected by the reflective layer and then pass through the second openings again to be transmitted to the light receiving surface of the sensing array. An image capturing apparatus is also provided.

Description

Photosensitive module and imaging device

The present invention relates to a photoelectric module and a photoelectric device using the photoelectric module, and particularly relates to a photosensitive module and an imaging device using the photosensitive module.

Types of biometrics include facial, voice, iris, retina, vein, palmprint, and fingerprint identification. According to different sensing methods, biometrics recognition devices can be divided into optical, capacitive, ultrasonic, and thermal sensing types. Generally speaking, the optical biometric identification device includes a light source, a light guide element, and a sensor. The light beam emitted by the light source irradiates the object to be measured pressed on the light guide element, and the sensor receives the light beam reflected by the object to perform biological feature recognition.

Taking fingerprint recognition as an example, when a finger is pressed on the light guide element, the convex portion of the fingerprint will contact the light guide element, and the concave portion of the fingerprint will not contact the light guide element. Therefore, the convex part of the fingerprint will destroy the total reflection of the light beam in the light guide element, so that the sensor acquires the dark lines corresponding to the convex part. At the same time, the concave part of the fingerprint will not destroy the total reflection of the light beam in the light guide element, but the sensor will obtain the bright lines corresponding to the concave part. By this, the corresponding fingerprint The light beams of the convex portion and the concave portion will form a light and dark stripe pattern on the light receiving surface of the sensor. Using the algorithm to calculate the information corresponding to the fingerprint image, the user's identity can be identified.

During the imaging process of the sensor, the light beam reflected by the fingerprint is easily scattered to the sensor, causing crosstalk. This crosstalk will reduce the contrast between the dark and bright areas of the fingerprint pattern, resulting in poor acquisition quality and affecting the accuracy of identification. Although the existing technology improves the quality of the image acquisition, the improvement of the technology at this stage is still difficult to effectively improve the crosstalk problem.

The present invention provides a photosensitive module and an image capturing device, which can have good identification capabilities.

A photosensitive module of the present invention includes a photosensitive array, a first shielding layer, a second shielding layer, and a reflective layer. The photosensitive array has multiple light-passing areas and a light-receiving surface facing away from the object to be measured. The first shielding layer is located between the photosensitive array and the object to be measured and has a plurality of first openings. The second shielding layer and the first shielding layer are respectively located on opposite sides of the photosensitive array and have a plurality of second openings. The reflective layer and the photosensitive array are respectively located on opposite sides of the second shielding layer. The plurality of first openings allows a plurality of light beams reflected by the object to be tested to pass through. The multiple light-passing regions allow multiple light beams to pass through the multiple first openings. The plurality of second openings allow a plurality of light beams passing through the plurality of light-passing regions to pass and pass to the reflective layer. The reflective layer reflects the multiple light beams, so that the multiple light beams again pass through the multiple second openings and pass to the light receiving surface of the photosensitive array.

In an embodiment of the invention, the photosensitive array includes multiple photosensitive elements. The photosensitive element includes a light receiving surface and a metal layer. The light receiving surface of the photosensitive element is located between the metal layer and the reflective layer.

In an embodiment of the present invention, the photosensitive module further includes a third shielding layer. The third shielding layer is located between the first shielding layer and the metal layer, and the third shielding layer has a plurality of third openings overlapping with the plurality of light passing regions.

In an embodiment of the present invention, the plurality of first openings, the plurality of second openings, and the plurality of light-passing areas are arranged offset from each other.

In an embodiment of the present invention, the photosensitive module further includes a substrate and a light-transmitting adhesive layer. The substrate is disposed between the first shielding layer and the photosensitive array. The light-transmitting adhesive layer is disposed between the photosensitive array and the second shielding layer.

In an embodiment of the present invention, the photosensitive module further includes a plurality of micro lenses. The plurality of microlenses are respectively disposed in the plurality of first openings.

An imaging device of the present invention includes a display panel and a photosensitive module. The photosensitive module is disposed on one side of the display panel and includes a photosensitive array, a first shielding layer, a second shielding layer, and a reflective layer. The photosensitive array has multiple light-passing areas and a light-receiving surface facing away from the object to be measured. The first shielding layer is located between the photosensitive array and the object to be measured and has a plurality of first openings. The second shielding layer and the first shielding layer are respectively located on opposite sides of the photosensitive array and have a plurality of second openings. The reflective layer and the photosensitive array are respectively located on opposite sides of the second shielding layer. The plurality of first openings allows a plurality of light beams reflected by the object to be tested to pass through. The multiple light-passing regions allow multiple light beams to pass through the multiple first openings. The plurality of second openings allow a plurality of light beams passing through the plurality of light-passing regions to pass and pass to the reflective layer. There will be more reflective layers The light beams are reflected to make the light beams pass through the second openings again and pass to the light receiving surface of the photosensitive array.

In an embodiment of the present invention, the imaging device further includes an adhesive layer. The adhesive layer is located between the display panel and the first shielding layer.

In an embodiment of the present invention, there is an air gap between the plurality of micro lenses and the display panel.

In an embodiment of the present invention, a band-pass filter layer is provided between the display panel and the substrate or a band-pass filter layer is provided between the substrate and the reflective layer.

Based on the above, in the embodiment of the present invention, the stray light beam is shielded (absorbed) through the plurality of shielding layers, and the light beam reflected by the object to be measured is transmitted to the back of the photosensitive array through the plurality of openings of the plurality of shielding layers and the reflective layer The light receiving surface of the object to be measured. Therefore, the photosensitive module can effectively improve the crosstalk problem, and the photosensitive module and the imaging device using the photosensitive module can have a good identification ability.

In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below and described in detail in conjunction with the accompanying drawings.

1, 2, 3‧‧‧ acquisition device

10‧‧‧Display panel

12, 22, 32 ‧‧‧ photosensitive module

13, 33, 125‧‧‧ Adhesive layer

120‧‧‧Photosensitive array

121‧‧‧The first masking layer

122‧‧‧Second masking layer

123‧‧‧Reflective layer

124‧‧‧ substrate

126‧‧‧The third masking layer

127‧‧‧Microlens

1200‧‧‧Photosensitive element

1202‧‧‧Metal layer

D1, D2‧‧‧Offset

G‧‧‧Air gap

L, L1‧‧‧beam

O‧‧‧Object to be tested

O1‧‧‧First opening

O2‧‧‧Second opening

O3‧‧‧The third opening

R120‧‧‧Light passing area

S1‧‧‧Display

S2‧‧‧Bottom

S120, S1200 ‧‧‧ light receiving surface

S123, S127‧‧‧surface

θ‧‧‧angle

1 to 3 are partial cross-sectional schematic diagrams of the image capturing devices of the first to third embodiments of the present invention, respectively.

Direction words mentioned in the embodiment, for example: "up", "down", "front", "Rear", "Left", "Right", etc. are only the directions with reference to the drawings. Therefore, the directional terms used are for illustration, not for limiting the new model. In the drawings, each drawing depicts general features of methods, structures, and/or materials used in particular exemplary embodiments. However, these drawings should not be construed as defining or limiting the scope or nature covered by these exemplary embodiments. For example, for clarity, the relative sizes, thicknesses, and positions of the various film layers, regions, and/or structures may be reduced or enlarged.

In the embodiments, the same or similar elements will use the same or similar reference numerals, and redundant descriptions thereof will be omitted. In addition, the features in the different exemplary embodiments can be combined with each other without conflict, and simple equivalent changes and modifications made in accordance with this specification or the scope of the patent application are still covered by this patent. In addition, the terms "first" and "second" mentioned in this specification or the scope of patent application are only used to name discrete components or distinguish different embodiments or ranges, not to limit the number of components. The upper limit or the lower limit is not intended to limit the manufacturing order or setting order of the components.

1 to 3 are schematic partial cross-sectional views of the imaging devices 1 to 3 of the first to third embodiments of the present invention, respectively. In the embodiment of the present invention, the imaging devices 1 to 3 are adapted to capture the biological characteristics of the object O to be measured. For example, the object to be measured O may be a user's finger, palm, wrist, or eyeball, and the corresponding biological feature may be a fingerprint, palm print, vein, pupil, iris, etc., but not limited thereto.

Please refer to FIG. 1, the imaging device 1 of the first embodiment includes a display panel 10 and a photosensitive module 12. The display panel 10 has a display surface S1 and a bottom surface S2 opposite to the display surface S1. The display panel 10 outputs an image beam (not shown) via the display surface S1, To allow users to view the image screen. In this embodiment, the display surface S2 of the display panel 10 is also a biometric recognition surface, that is, the object to be tested O touches the display surface S2 for biometric recognition.

The display panel 110 may be a thin film transistor liquid crystal display panel (TFT-LCD panel), a micro light emitting diode display panel (Micro Light Emitting Diode display panel, Micro LED display panel) or an organic light emitting diode Polar body display panel (Organic Light Emitting Diode display panel, OLED display panel), but not limited to this. In addition, the display panel 10 may be a display panel with touch electrodes.

Part of the image beam (such as visible light) provided by the display panel 10 can be used for biometric identification, but not limited to this. In another embodiment, the imaging device 1 may further include a light source (not shown) for providing a light beam for biometric identification. The wavelength of the light beam provided by the light source may be different from the wavelength of the image light beam (the wavelength of visible light). For example, the light source may be a non-visible light source, such as an infrared light source, but it is not limited thereto. In addition, the light source may be disposed outside the display panel 10 or integrated into the display panel 10.

The photosensitive module 12 is disposed on one side of the display panel 10. For example, the photosensitive module 12 may be fixed on the bottom surface S1 of the display panel 10 through an adhesive layer or a fixing mechanism (not shown).

The photosensitive module 12 includes a photosensitive array 120, a first shielding layer 121, a second shielding layer 122, and a reflective layer 123. The photosensitive array 120 is adapted to receive the light beam L (ie, light with biological characteristics) reflected by the object to be measured O, so as to perform biological characteristic recognition. sense The light array 120 has a plurality of light passing regions R120 and a light receiving surface S120 facing away from the object O to be measured. In detail, the photosensitive array 120 includes a plurality of photosensitive elements 1200 arranged in an array. Each photosensitive element 1200 includes a light receiving surface S1200. The light-receiving surface S120 of the photosensitive array 120 is a collection of a plurality of light-receiving surfaces S1200 of these photosensitive elements 1200. In addition, each photosensitive element 1200 also includes a metal layer 1202. The metal layer 1202 is a metal electrode of the photosensitive element 1200. The light receiving surface S1200 of the photosensitive element 1200 is located between the metal layer 1202 and the reflective layer 123, that is, the light receiving surface S1200 of the photosensitive element 1200 faces the reflective layer 123 and faces away from the object to be measured O, so that the light receiving surface of the photosensitive array 120 S120 turns the object O to be tested.

Since the metal layer 1202 itself is opaque, the metal layer 1202 of each photosensitive element 1200 can prevent the light beam (such as the light beam L1) directly emitted from the object O to be directed to the photosensitive element 1200 from being received by the light receiving surface S1200. That is to say, the area where the metal layer 1202 of each photosensitive element 1200 is located is the light-shielding area of the photosensitive array 120, and the area between the metal layers 1202 of two adjacent photosensitive elements 1200 is the light passing area R120. In other words, the light beam can pass between two adjacent photosensitive elements 1200, and the size of the light passing area R120 of the photosensitive array 120 is defined by the distance between the metal layers 1202 of the two adjacent photosensitive elements 1200.

The first shielding layer 121 is located between the photosensitive array 120 and the object O and has a plurality of first openings O1 through which light beams pass. The first shielding layer 121 is used to shield or absorb stray light beams. For example, the first shielding layer 121 has a high absorption rate and a low reflectivity, so as to reduce the ratio of the light beam transmitted to the first shielding layer 121 to be reflected by the first shielding layer 121 and the number of times the light beam is reflected by the first shielding layer 121, To effectively reduce The ratio of the noise or crosstalk beam received by the light receiving surface S120. The material of the first shielding layer 121 may be ink with low reflectivity, photoresist, carbon compound, etc., but it is not limited thereto.

The second shielding layer 122 and the first shielding layer 121 are respectively located on opposite sides of the photosensitive array 120 and have a plurality of second openings 02. The second shielding layer 122 is used to shield or absorb the stray light beam. For example, the second shielding layer 122 has a high absorption rate and a low reflectivity, so as to reduce the ratio of the light beam transmitted to the second shielding layer 122 being reflected by the second shielding layer 122 and the number of times the light beam is reflected by the second shielding layer 122, Furthermore, the ratio of noise or crosstalk beams received by the light receiving surface S120 is effectively reduced. The material of the second shielding layer 122 may be ink with low reflectivity, photoresist, carbon compound, etc., but it is not limited thereto.

The reflective layer 123 and the photosensitive array 120 are respectively located on opposite sides of the second shielding layer 122. For example, the second shielding layer 122 may be disposed on the surface S123 of the reflective layer 123 facing the photosensitive array 120. The reflective layer 123 is used to reflect the biological beam to the light receiving surface S120. For example, the reflective layer 123 may be a single metal layer or a metal stack selected from aluminum, silver, copper, nickel, zinc, and chromium, but not limited thereto. In an embodiment, the reflective layer 123 may be composed of a carrier board (not shown) and a metal layer (not shown) disposed on the carrier board. The carrier board may be a flexible or non-flexible printed circuit board, and the metal layer may be a patterned or unpatterned metal layer.

The plurality of first openings O1 of the first shielding layer 121 allows the light beam L reflected by the object O to pass. The plurality of light passing regions R120 of the photosensitive array 120 pass the light beam L passing through the plurality of first openings O1. The plurality of second openings 02 of the second shielding layer 122 pass the light beam L passing through the plurality of light passing regions R120 and pass the light beam L to the reflective layer 123. The reflective layer 123 reflects the light beam L, so that the light beam L once again passes through the plurality of second openings 02 and is transmitted to the light receiving surface S120 of the photosensitive array 120. In this embodiment, the plurality of first openings O1, the plurality of second openings O2, and the plurality of light passing regions R120 are offset from each other, so that the light beam L reflected by the object to be measured O is at a specific angle of incidence (eg, angle θ ) is transferred to the reflective layer 123, and the reflective layer 123 is reflected by the reflective layer 123 at the same reflection angle (such as angle θ ) as the specific incident angle and transferred to the light receiving surface S120 of the photosensitive array 120. The specific incident angle (such as angle θ ) is greater than 0 degrees and less than 90 degrees. In other words, the light beam L reflected by the object O is not normally incident on the light-receiving surface S120 of the photosensitive array 120, but obliquely transmitted to the reflective layer 123, and then transmitted to the photosensitive array 120 through the reflection of the reflective layer 123的光RX面 S120. Under this design, the light beam L that can be received by the light-receiving surface S120 of the photosensitive array 120 is mainly transmitted in sequence through a plurality of first openings O1, a plurality of light-passing regions R120, and a plurality of second openings O2 at a specific incident angle To the reflective layer 123, it is then reflected by the reflective layer 123 at the same reflection angle as the specific incident angle, and then passes through the plurality of second openings 02 and is transferred to the light receiving surface S120 of the photosensitive array 120.

The above-mentioned misalignment setting means that the plurality of first openings O1, the plurality of second openings O2, and the plurality of light passing regions R120 are not aligned. For example, the first opening O1, the second opening O2, and the light passing region R120 may have the same width, wherein the offset D1 of the light passing region R120 relative to the first opening O1 is smaller than the width of the first opening O1, and the first The offset D2 of the two openings O2 relative to the light passing region R120 is smaller than the light flux The width of R120. In an embodiment, the first opening O1, the second opening O2, and the light passing region R120 may have different widths. In addition, the offset D1 and the offset D2 may be different.

According to different requirements, the photosensitive module 12 may further include other elements and/or films. For example, the photosensitive module 12 may further include a substrate 124 and an adhesive layer 125, wherein the substrate 124 is disposed between the first shielding layer 121 and the photosensitive array 120, and the adhesive layer 125 is disposed between the photosensitive array 120 and the second shielding layer 122 between.

In detail, the two opposite sides of the substrate 124 can be used to carry the first shielding layer 121 and the photosensitive array 120, respectively. The substrate 124 may be made of a light-transmitting material to allow the light beam to pass through. For example, the substrate 124 may be a transparent glass substrate, a plastic substrate, or a transparent ceramic substrate. The glass substrate may be a chemically or physically strengthened glass substrate or an unreinforced glass substrate. The plastic substrate can be polycarbonate (PC), polyethylene terephthalate (PET), polymethylmethacrylate (PMMA) or polyimide (PI), etc. , But not limited to this.

The adhesive layer 125 is used to adhere the reflective layer 123 provided with the second shielding layer 122 to the substrate 124 provided with the photosensitive array 120. The adhesive layer 125 can be formed by curing a light-transmitting material to allow the light beam to pass through. For example, the material of the adhesive layer 125 may be Optically Clear Adhesive (OCA), Liquid Optical Clear Adhesive (LOCA), or Die Attach Film (DAF). Limited.

In another embodiment, the photosensitive module 12 may further include more basic Boards, more adhesive layers or other components will not be repeated here.

According to different requirements, the imaging device 1 may further include other elements and/or film layers. For example, the imaging device 1 may further include an adhesive layer 13 or a fixing mechanism (not shown) to fix the display panel 10 and the photosensitive module 12 together. When the adhesive layer 13 is used to fix the display panel 10 and the photosensitive module 12, the display panel 10 and the photosensitive module 12 may be fully bonded or partially bonded (for example, the periphery is bonded but the center is not bonded). The material of the adhesive layer 13 may be optical transparent adhesive, liquid optical transparent adhesive or chip attachment film, but it is not limited thereto.

Please refer to FIG. 2. The main difference between the imaging device 2 of the second embodiment and the imaging device 1 of FIG. 1 is as follows. In the imaging device 2, the photosensitive module 22 further includes a third shielding layer 126, wherein the third shielding layer 126 is located between the first shielding layer 121 and the metal layer 1202, and the third shielding layer 126 has a plurality of light passing through A plurality of third openings O3 overlapping the region R120. The arrangement relationship between the plurality of light passing regions R120 and the plurality of third openings O3 is one-to-one, and each third opening O3 at least partially overlaps with the corresponding light passing region R120. FIG. 2 shows that each third opening O3 and the corresponding light passing region R120 have the same width, and the two completely overlap, but the present invention is not limited to this.

The third shielding layer 126 is used to shield or absorb the stray light beam. For example, the third shielding layer 126 has a high absorption rate and a low reflectivity, so as to reduce the ratio of the light beam (such as the light beam L1) transmitted to the third shielding layer 126 being reflected by the third shielding layer 126 and the light beam being reflected by the third shielding layer The number of reflections of 126 effectively reduces the proportion of noise or crosstalk beams received by the light receiving surface S120. The material of the third shielding layer 126 may be low reflectance ink, photoresist, carbon compound, etc., but it is not limited thereto.

Please refer to FIG. 3. The main difference between the imaging device 3 of the third embodiment and the imaging device 1 of FIG. 1 is as follows. In the imaging device 3, the photosensitive module 32 further includes a plurality of micro lenses 127. These microlenses 127 are respectively provided in the plurality of first openings O1. The arrangement relationship between the plurality of microlenses 127 and the plurality of first openings O1 is, for example, one-to-one, but not limited thereto. Each microlens 127 is adapted to collimate the light beam L transmitted toward the reflective layer 123. For example, the surface S127 of each microlens 127 facing the display panel 10 is a convex surface, and the convex surface may be spherical or aspherical, but not limited thereto. In addition, the adhesive layer 33 between the display panel 10 and the first shielding layer 121 is, for example, partially bonding (eg, surrounding) the display panel 10 and the first shielding layer 121 so that the plurality of micro lenses 127 and the display panel 10 There is an air gap G between them.

In any of the above embodiments of the present invention, the photosensitive module may further include a band-pass filter layer (not shown). The band-pass filter layer may be disposed between the display panel 10 and the substrate 124 or between the substrate 124 and the reflective layer 123 to filter other light beams than biometrics to avoid ambient light beams or light beams from other light sources It is transferred to the photosensitive element 1200 to further improve the recognition capability of the image capturing device. For example, the bandpass filter layer may be an infrared bandpass filter layer, which passes a light beam with a wavelength of 800 nm to 900 nm, and filters a light beam with a wavelength other than 800 nm to 900 nm. Correspondingly, the photosensitive module may further include an infrared light source whose wavelength falls within the range of 800 nm to 900 nm. In other embodiments, the band-pass filter layer may be a band-pass filter layer that passes a light beam with a wavelength of 840 nm to 860 nm or a light beam with a wavelength of 890 nm to 990 nm, and the photosensitive module may further include a wavelength falling between 840 nm and 860 nm Or an infrared light source in the range of 890nm to 990nm, but the present invention is not limited to this.

In summary, in the embodiment of the present invention, the stray light beam is shielded (absorbed) through the plurality of shielding layers, and the light beam reflected by the object to be measured is transmitted to the photosensitive through the plurality of openings of the plurality of shielding layers and the reflective layer The array faces away from the light receiving surface of the object to be measured. Therefore, the photosensitive module can effectively improve the crosstalk problem, and the photosensitive module and the imaging device using the photosensitive module can have a good identification ability. In one embodiment, a shielding layer may be further provided on the metal layer of each photosensitive element in the photosensitive array to further reduce crosstalk. In another embodiment, the photosensitive module may further include a plurality of microlenses respectively disposed in the plurality of first openings to collimate the light beam.

Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Anyone who has ordinary knowledge in the technical field can make some changes and retouching without departing from the spirit and scope of the present invention. The scope of protection of this new model shall be subject to the scope defined in the appended patent application.

1‧‧‧Acquisition device

10‧‧‧Display panel

12‧‧‧Photosensitive module

13, 125‧‧‧ adhesive layer

120‧‧‧Photosensitive array

121‧‧‧The first masking layer

122‧‧‧Second masking layer

123‧‧‧Reflective layer

124‧‧‧ substrate

1200‧‧‧Photosensitive element

1202‧‧‧Metal layer

D1, D2‧‧‧Offset

L, L1‧‧‧beam

O‧‧‧Object to be tested

O1‧‧‧First opening

O2‧‧‧Second opening

R120‧‧‧Light passing area

S1‧‧‧Display

S2‧‧‧Bottom

S120, S1200 ‧‧‧ light receiving surface

S123‧‧‧Surface

θ‧‧‧angle

Claims (19)

A photosensitive module, including: A photosensitive array with multiple light-passing areas and a light-receiving surface facing away from the object to be measured; A first shielding layer, located between the photosensitive array and the object to be measured, and having a plurality of first openings; A second shielding layer located on the opposite side of the photosensitive array from the first shielding layer and having a plurality of second openings; and A reflective layer and the photosensitive array are respectively located on opposite sides of the second shielding layer, wherein the first openings allow a plurality of light beams reflected by the object to be tested to pass through, and the light passing regions allow the first openings to pass through The light beams pass through, and the second openings allow the light beams passing through the light-passing regions to pass through and pass to the reflective layer, which reflects the light beams so that the light beams pass through the second holes again. Open and transfer to the light receiving surface of the photosensitive array. The photosensitive module according to item 1 of the patent application scope, wherein the photosensitive array includes a plurality of photosensitive elements, each of the photosensitive elements includes a light receiving surface and a metal layer, and the light receiving surface of the photosensitive element is located on the metal Between the layer and the reflective layer. The photosensitive module as described in item 2 of the patent application scope further includes: A third shielding layer, wherein the third shielding layer is located between the first shielding layer and the metal layer, and the third shielding layer has a plurality of third openings overlapping the light-passing regions. The photosensitive module as described in item 1 of the patent application scope further includes: A substrate disposed between the first shielding layer and the photosensitive array; and An adhesive layer is disposed between the photosensitive array and the second shielding layer. The photosensitive module as described in item 4 of the patent application scope further includes: A band-pass filter layer is located between a display panel and the substrate, wherein the substrate is located between the display panel and the reflective layer. The photosensitive module as described in item 4 of the patent application scope further includes: A bandpass filter layer is located between the substrate and the reflective layer. The photosensitive module according to any one of items 1 to 4 of the patent application range, wherein the first openings, the second openings, and the light-passing areas are arranged in misalignment with each other. The photosensitive module as described in item 7 of the patent application scope further includes: A plurality of microlenses are respectively disposed in the first openings. The photosensitive module according to any one of items 1 to 4 of the patent application scope, further including: A plurality of microlenses are respectively disposed in the first openings. An imaging device, including: A display panel; and A photosensitive module is provided on one side of the display panel and includes: A photosensitive array with multiple light-passing areas and a light-receiving surface facing away from the object to be measured; A first shielding layer, located between the photosensitive array and the object to be measured, and having a plurality of first openings; A second shielding layer located on the opposite side of the photosensitive array from the first shielding layer and having a plurality of second openings; and A reflective layer and the photosensitive array are respectively located on opposite sides of the second shielding layer, wherein the first openings allow a plurality of light beams reflected by the object to be tested to pass through, and the light passing regions allow the first openings to pass through The light beams pass through, the second openings allow the light beams passing through the light passing regions to pass through and pass to the reflective layer, the reflective layer reflects the light beams so that the light beams pass through the second Open and transfer to the light receiving surface of the photosensitive array. The imaging device as described in item 10 of the patent application scope further includes: An adhesive layer is located between the display panel and the first shielding layer. An imaging device as described in item 10 of the patent application range, wherein the photosensitive array includes a plurality of photosensitive elements, each of the photosensitive elements includes a light receiving surface and a metal layer, and the light receiving surface of the photosensitive element is located on the metal Between the layer and the reflective layer. The imaging device as described in item 12 of the patent application scope, wherein the photosensitive module further includes: A third shielding layer, wherein the third shielding layer is located between the first shielding layer and the metal layer, and the third shielding layer has a plurality of third openings overlapping the light-passing regions. The imaging device as described in item 10 of the patent application scope, wherein the photosensitive module further includes: A substrate disposed between the first shielding layer and the photosensitive array; An adhesive layer is disposed between the photosensitive array and the second shielding layer. The imaging device as described in item 14 of the patent application scope, wherein the photosensitive module further includes: A band-pass filter layer is located between the display panel and the substrate. The imaging device as described in item 14 of the patent application scope, wherein the photosensitive module further includes: A bandpass filter layer is located between the substrate and the reflective layer. The image capturing device according to any one of items 10 to 14 of the patent application range, wherein the photosensitive module further includes: A plurality of microlenses are respectively disposed in the first openings. The imaging device as described in item 17 of the patent application range, wherein an air gap is provided between the microlenses and the display panel. The image capturing device according to any one of the items 10 to 14 of the patent application range, wherein the first openings, the second openings, and the light-passing areas are arranged in misalignment with each other.

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