TWM598977U - Image capture apparatus and electronic device thereof - Google Patents

Image capture apparatus and electronic device thereof Download PDF

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Publication number
TWM598977U
TWM598977U TW108215947U TW108215947U TWM598977U TW M598977 U TWM598977 U TW M598977U TW 108215947 U TW108215947 U TW 108215947U TW 108215947 U TW108215947 U TW 108215947U TW M598977 U TWM598977 U TW M598977U
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Taiwan
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light
imaging device
substrate
light source
guide element
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TW108215947U
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Chinese (zh)
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楊國文
游智強
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金佶科技股份有限公司
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Abstract

An image capturing apparatus includes a substrate electrically connected to at least one light source and a imager and a sensor; and a cover plate disposed on a light source of the light source, wherein a surface of the cover plate is provided with a plurality of blocking layer which having a light transmissive region between two adjacent blocking layers.

Description

取像裝置及其電子裝置 Image capturing device and its electronic device

本創作涉及一種光電模組及其電子裝置,特別是涉及一種取像裝置及其電子裝置。 This creation relates to a photoelectric module and its electronic device, in particular to an image capturing device and its electronic device.

生物辨識的種類包括臉部、聲音、虹膜、視網膜、靜脈、掌紋和指紋辨識等。依照感測方式的不同,生物特徵辨識裝置可分為光學式、電容式、超音波式及熱感應式。一般而言,光學式生物特徵辨識裝置包括光源、導光元件以及感測器。光源所發出的光束照射按壓於導光元件上的待測物(如手指、掌紋等),感測器接收被待測物反射的光束,以進行生物特徵的辨識。 The types of biometric recognition include face, voice, iris, retina, vein, palm print and fingerprint recognition. According to different sensing methods, biometric identification devices can be divided into optical, capacitive, ultrasonic and thermal induction types. Generally speaking, an optical biometric identification device includes a light source, a light guide element, and a sensor. The light beam emitted by the light source irradiates the object to be measured (such as fingers, palm prints, etc.) pressed on the light guide element, and the sensor receives the light beam reflected by the object to identify the biological characteristics.

以指紋辨識為例,當手指按壓於導光元件上時,指紋的凸部會接觸導光元件,而指紋的凹部不會接觸導光元件。因此,指紋的凸部會破壞光束在導光元件內的全反射,而使感測器取得對應凸部的暗紋。同時,指紋的凹部不會破壞光束在導光元件內的全反射,而使感測器取得對應凹部的亮紋。藉此,對應指紋的凸部與凹部的光束會在感測器的光接收面上形成亮暗相間的條紋圖案。利用演算法計算對應指紋影像的資訊,便可進行使用者身份的辨識。然而,現有的光學式指紋辨識目前仍存在諸多問題尚需克服,例如光束穿透率低、辨識能力容易產生偏差以及製作成本較高等不利發展之難題,為本領域具有通常知識者亟需克服的課題。 Taking fingerprint recognition as an example, when a finger presses on the light guide element, the convex part of the fingerprint will contact the light guide element, and the concave part of the fingerprint will not contact the light guide element. Therefore, the convex part of the fingerprint destroys the total reflection of the light beam in the light guide element, and the sensor obtains the dark pattern corresponding to the convex part. At the same time, the concave part of the fingerprint does not destroy the total reflection of the light beam in the light guide element, and the sensor obtains the bright pattern corresponding to the concave part. Thereby, the light beams corresponding to the convex and concave portions of the fingerprint will form a bright and dark striped pattern on the light receiving surface of the sensor. Using an algorithm to calculate the information corresponding to the fingerprint image, the user's identity can be identified. However, the existing optical fingerprint recognition still has many problems that need to be overcome. For example, the disadvantageous development problems such as low beam transmittance, easy deviation of recognition ability, and high production cost, which are urgently needed by those with ordinary knowledge in the field. Subject.

本創作主要提供一種取像裝置,性能佳,且製造成本低。 This creation mainly provides an imaging device with good performance and low manufacturing cost.

本新型創作主要披露一種取像裝置,包括:一基板,該基板電性連接至少一光源及一取像器;以及一蓋板,該蓋板設置在該光源的一出光測,該蓋板的一表面設置有複數個遮蔽層,其中兩相鄰的遮蔽層之間具有一透光區域。 The present invention mainly discloses an image capturing device, which includes: a substrate electrically connected to at least one light source and an image capturing device; and a cover plate, the cover plate is arranged on a light source of the light source, and the cover plate A plurality of shielding layers are arranged on one surface, and a light-transmitting area is provided between two adjacent shielding layers.

在本新型的一實施例中,其中該透光區域未被遮蔽層所覆蓋。 In an embodiment of the present invention, the light-transmitting area is not covered by the shielding layer.

在本新型的一實施例中,其中該透光區域為一生物特徵取像區域。 In an embodiment of the present invention, the light-transmitting area is a biological feature imaging area.

在本新型的一實施例中,其中該蓋板更包括:一第一表面,該第一表面遠離所述基板;一第二表面,配置在該第一表面的相對一側;以及一用以連接所述第一表面及第二表面的第三表面。 In an embodiment of the present invention, the cover plate further includes: a first surface, the first surface being away from the substrate; a second surface, disposed on the opposite side of the first surface; and A third surface connecting the first surface and the second surface.

在本新型的一實施例中,其中該光源適於發出一光束,該光束通過該第二表面進入該透光區域。 In an embodiment of the present invention, the light source is adapted to emit a light beam, and the light beam enters the light-transmitting area through the second surface.

在本新型的一實施例中,其中在該第二表面的透光區域上設置一微透鏡陣列。 In an embodiment of the present invention, a microlens array is provided on the light-transmitting area of the second surface.

在本新型的一實施例中,其中該取像器配置在該透光區域中。 In an embodiment of the present invention, the imager is arranged in the light-transmitting area.

在本新型的一實施例中,其中該光源以30度~75度之間的角度傾斜設置於該基板上。 In an embodiment of the present invention, the light source is obliquely disposed on the substrate at an angle between 30 degrees and 75 degrees.

在本新型的一實施例中,其中該光源包括一個或複數個可見光源及/或不可見光源。 In an embodiment of the present invention, the light source includes one or more visible light sources and/or invisible light sources.

在本新型的一實施例中,其中該蓋板更包括:一第一表面,該第一表面遠離所述基板;一第二表面,配置在該第一表面的相對一側;以及一用以連接所述第一表面及第二表面的第三表面;且所述取像裝置更進一步包括:一導光元件,配置在該蓋板與該基板之間,其中該導光元件位於所述第二表面的下方。 In an embodiment of the present invention, the cover plate further includes: a first surface, the first surface being away from the substrate; a second surface, disposed on the opposite side of the first surface; and A third surface connecting the first surface and the second surface; and the image capturing device further includes: a light guide element disposed between the cover plate and the substrate, wherein the light guide element is located on the first surface Below the second surface.

在本新型的一實施例中,其中該導光元件具有上表面及一與上表面相對的下表面,以及用以連接該上表面及該下表面的連接面。 In an embodiment of the present invention, the light guide element has an upper surface, a lower surface opposite to the upper surface, and a connecting surface for connecting the upper surface and the lower surface.

在本新型的一實施例中,其中該導光元件覆蓋該透光區域。 In an embodiment of the present invention, the light guide element covers the light transmission area.

在本新型的一實施例中,其中該導光元件覆蓋該透光區域及遮蔽層。 In an embodiment of the present invention, the light guide element covers the light transmission area and the shielding layer.

在本新型的一實施例中,其中該連接面以一傾斜角度連接於該上表面及/或該下表面。 In an embodiment of the present invention, the connecting surface is connected to the upper surface and/or the lower surface at an oblique angle.

在本新型的一實施例中,其中該連接面以一傾斜角度連接於該上表面及/或該下表面。 In an embodiment of the present invention, the connecting surface is connected to the upper surface and/or the lower surface at an oblique angle.

在本新型的一實施例中,其中該導光元件係一四角形稜鏡。 In an embodiment of the present invention, the light guide element is a quadrangular ridge.

在本新型的一實施例中,其中該基板更包括:一第一基板,用以承載該至少一光源;一第二基板,用以承載該取像器,其中該第一基板與該稜鏡的一斜邊相互平行配置,且該第二基板稜鏡的另一斜邊相互平行配置。 In an embodiment of the present invention, the substrate further includes: a first substrate for carrying the at least one light source; a second substrate for carrying the imager, wherein the first substrate and the sill One oblique side of the second substrate is arranged parallel to each other, and the other oblique side of the second substrate is arranged parallel to each other.

在本新型的一實施例中,其中該蓋板的透光區域上設置有一顯示面板層,且該顯示面板是具有複數個觸控電極。 In an embodiment of the present invention, a display panel layer is disposed on the transparent area of the cover plate, and the display panel has a plurality of touch electrodes.

在本新型的一實施例中,其中該遮蔽層是一油墨或者是一黑色矩陣層。 In an embodiment of the present invention, the shielding layer is an ink or a black matrix layer.

本創作另外披露了一種電子裝置,包括:一影像處理單元,包括上述的取像裝置。 This creation additionally discloses an electronic device, including: an image processing unit, including the above-mentioned image capturing device.

本創作藉由基板電性連接至少一光源及一取像器;並在蓋板設置在該光源的一出光側,該蓋板的一表面設置有複數個遮蔽層,其中兩相鄰的遮蔽層之間具有一透光區域,當光源發出光束後照射到手指反射到透光區域,從而使得取像器可以取得更佳的影像品質,且使整體的構造更為簡單,便於生產。 In this creation, at least one light source and one imager are electrically connected by a substrate; and a cover plate is arranged on a light emitting side of the light source, and a surface of the cover plate is provided with a plurality of shielding layers, of which two adjacent shielding layers There is a light-transmitting area in between. When the light source emits a light beam, the finger is reflected to the light-transmitting area, so that the imager can obtain better image quality, and the overall structure is simpler and easy to produce.

為使能更進一步瞭解本創作的特徵及技術內容,請參閱以下有關本創作的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本創作加以限制。 In order to further understand the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation. However, the provided drawings are only for reference and explanation, not to limit this creation.

1000‧‧‧電子裝置 1000‧‧‧Electronic device

TS‧‧‧上表面 TS‧‧‧Upper surface

10‧‧‧蓋板 10‧‧‧Cover

CS‧‧‧連接面 CS‧‧‧Connecting surface

11‧‧‧遮蔽層 11‧‧‧Masking layer

SS‧‧‧斜面 SS‧‧‧Slope

12‧‧‧透光區域 12‧‧‧Transparent area

100‧‧‧取像裝置 100‧‧‧Image capture device

13‧‧‧微透鏡陣列 13‧‧‧Micro lens array

200‧‧‧取像裝置 200‧‧‧Image capture device

15‧‧‧導光元件 15‧‧‧Light guide element

300‧‧‧取像裝置 300‧‧‧Image capture device

20‧‧‧光源 20‧‧‧Light source

400‧‧‧取像裝置 400‧‧‧Image capture device

30‧‧‧基板 30‧‧‧Substrate

500‧‧‧取像裝置 500‧‧‧Image capture device

30A‧‧‧第一基板 30A‧‧‧First substrate

600‧‧‧取像裝置 600‧‧‧Image capture device

30B‧‧‧第二基板 30B‧‧‧Second substrate

700‧‧‧取像裝置 700‧‧‧Image capture device

40‧‧‧取像器 40‧‧‧Viewfinder

AG‧‧‧空氣間隙層 AG‧‧‧Air gap layer

S1‧‧‧第一表面 S1‧‧‧First surface

BS‧‧‧下表面 BS‧‧‧lower surface

S2‧‧‧第二表面 S2‧‧‧Second surface

SP‧‧‧平面 SP‧‧‧Plane

S3‧‧‧第三表面 S3‧‧‧The third surface

OBJ‧‧‧待測物件 OBJ‧‧‧Object to be tested

圖1是本新型創作一取像裝置的第一實施例示意圖。 Fig. 1 is a schematic diagram of the first embodiment of the new creation-capturing device.

圖2是本新型創作一取像裝置的第二實施例示意圖。 Fig. 2 is a schematic diagram of a second embodiment of the new creation-capturing device.

圖3是本新型創作一取像裝置的第三實施例示意圖。 Fig. 3 is a schematic diagram of the third embodiment of the new creation-capturing device.

圖4是本新型創作一取像裝置的第四實施例示意圖。 Fig. 4 is a schematic diagram of a fourth embodiment of the new creation-capturing device.

圖5是本新型創作一取像裝置的第五實施例示意圖。 Fig. 5 is a schematic diagram of a fifth embodiment of the new creation-capturing device.

圖6是本新型創作一取像裝置的第六實施例示意圖。 Fig. 6 is a schematic diagram of the sixth embodiment of the new creation-capturing device.

圖7是本新型創作一取像裝置的第七實施例示意圖。 Fig. 7 is a schematic diagram of a seventh embodiment of the new creation-capturing device.

圖8是本新型創作一電子裝置的實施例示意圖。 Fig. 8 is a schematic diagram of an embodiment of an electronic device of the present invention.

於實施方式中所提到的方向用語,例如:「上」、「下」、「前」、「後」、「左」、「右」等,僅是參考附圖的方向。因此,使用的方向用語是用來說明,而並非用來限制本發明。在附圖中,各圖式繪示的是特定示範實施例中所使用的方法、結構及/或材料的通常性特徵。然而,這些圖式不應被解釋為界定或限制由這些示範實施例所涵蓋的範圍或性質。舉例來說,為了清楚起見,各膜層、區域及/或結構的相對尺寸、厚度及位置可能縮小或放大。 The directional terms mentioned in the embodiments, such as "up", "down", "front", "rear", "left", "right", etc., are only directions with reference to the drawings. Therefore, the directional terms used are used to illustrate, but not to limit the present invention. In the drawings, each drawing depicts the general features of the methods, structures, and/or materials used in specific exemplary embodiments. However, these drawings should not be construed as defining or limiting the scope or nature covered by these exemplary embodiments. For example, for the sake of clarity, the relative size, thickness, and position of each layer, region, and/or structure may be reduced or enlarged.

在實施方式中,相同或相似的元件將採用相同或相似的標號,且將省略其贅述。此外,不同示範實施例中的特徵在沒有衝突的情況下可相互組合,且依本說明書或申請專利範圍所作之簡單的等效變化與修飾,皆仍屬本專利涵蓋之範圍內。另外,本說明書或申請專利範圍中提及的「第一」、「第二」等用語僅用以命名分立(discrete)的元件或區別不同實施例或範圍,而並非用來限制元件數量上的上限或下限,也並非用以限定元件的製造順序或設置順序。 In the embodiments, the same or similar elements will use the same or similar reference numerals, and the redundant description will be omitted. In addition, the features in different exemplary embodiments can be combined without conflict, and simple equivalent changes and modifications made in accordance with this specification or the scope of the patent application still fall within the scope of this patent. In addition, the terms "first" and "second" mentioned in this specification or the scope of the patent application are only used to name discrete elements or distinguish different embodiments or ranges, and are not used to limit the number of elements. The upper limit or lower limit is not used to limit the manufacturing sequence or the arrangement sequence of the components.

取像裝置100位於一環境介質中來使用,其中,環境介質例如是空氣、水或者是其他種類的環境介質。前述的待測物件OBJ例如是使用者的手指、手掌、手腕或者是眼球,而取像裝置100 所擷取的影像例如是指紋、掌紋、靜脈、瞳孔或者是虹膜等影像,但本創作不以此為限。 The image capturing device 100 is used in an environmental medium, where the environmental medium is, for example, air, water, or other types of environmental media. The aforementioned object OBJ to be tested is, for example, the user's finger, palm, wrist, or eyeball, and the imaging device 100 The captured images are, for example, fingerprints, palm prints, veins, pupils or iris, but this creation is not limited to this.

請參考圖1,圖1揭示了一種取像裝置100,取像裝置100包括一基板30,以及一對應基板30的蓋板10,基板30電性連接有至少一光源20及一取像器40,光源20的出光面朝向所述蓋板10,且蓋板10包括第一表面S1,位於第一表面另一側的第二表面S2以及分別用以連接第一表面及第二表面的第三表面S3,在本實施例中,第一表面S1適於接觸一待測物件OBJ,例如:手指或手掌等等…本新型並不加以侷限。 Please refer to FIG. 1. FIG. 1 shows an image capturing device 100. The image capturing device 100 includes a substrate 30 and a cover plate 10 corresponding to the substrate 30. The substrate 30 is electrically connected to at least one light source 20 and an image capture device 40. , The light emitting surface of the light source 20 faces the cover plate 10, and the cover plate 10 includes a first surface S1, a second surface S2 located on the other side of the first surface, and a third surface connected to the first surface and the second surface. The surface S3. In this embodiment, the first surface S1 is suitable for contacting an object OBJ to be tested, such as a finger or a palm, etc.... The present invention is not limited.

從圖1可知,第二表面S2具有複數個遮蔽層11,兩相鄰的遮蔽層11之間形成有一開口,用來定義出一透光區域12。從本實施例中可知,蓋板10適於保護位於其下的元件,其可以是玻璃基板或塑膠基板。玻璃基板可以是經化學強化或物理強化的玻璃基板,也可以是未經強化的玻璃基板。塑膠基板可以是聚碳酸酯(polycarbonate,PC)、聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)、聚甲基丙烯酸甲酯(polymethylmethacrylate,PMMA)或聚醯亞胺(polyimide,PI)等,但不以此為限。 It can be seen from FIG. 1 that the second surface S2 has a plurality of shielding layers 11, and an opening is formed between two adjacent shielding layers 11 to define a light-transmitting area 12. It can be seen from this embodiment that the cover plate 10 is suitable for protecting the components located thereunder, and it can be a glass substrate or a plastic substrate. The glass substrate may be a chemically strengthened or physically strengthened glass substrate, or an unstrengthened glass substrate. The plastic substrate can be polycarbonate (PC), polyethylene terephthalate (PET), polymethylmethacrylate (PMMA) or polyimide (PI), etc. , But not limited to this.

請繼續參考圖1,在本實施例中,取像裝置100的遮蔽層11還包括油墨層或者是透過半導體製程的光罩製程來形成一圖案層或黑矩陣層(即Black Matrix遮蔽層11),並形成所述的遮蔽層11及透光區域12,所述的該些遮蔽層係形成於蓋板10的第二表面S2,遮蔽層11若選用油墨材料亦可,例如但不限於是黑色的半透光材料。也就是說,遮蔽層11可使部分波長的光束通過,而使另一部分波長的光束被吸收。亦即,遮蔽層11的穿透率可選擇性地位於10%至100%之間。在本實施例中,遮蔽層11可採用塗佈、蒸鍍、蝕刻顯影或雷射的製程形成於蓋坂10的第二表面S2,然而本新型創作不以此為限。 Please continue to refer to FIG. 1. In this embodiment, the shielding layer 11 of the image capturing device 100 further includes an ink layer or a pattern layer or a black matrix layer (ie Black Matrix shielding layer 11) formed through a photomask process of a semiconductor process. , And form the shielding layer 11 and the light-transmitting area 12, and the shielding layers are formed on the second surface S2 of the cover plate 10. If the shielding layer 11 is made of ink, such as but not limited to black The translucent material. In other words, the shielding layer 11 can pass light beams of part of the wavelengths, while allowing light beams of another part of the wavelengths to be absorbed. That is, the transmittance of the shielding layer 11 can be selectively between 10% and 100%. In this embodiment, the shielding layer 11 can be formed on the second surface S2 of the Geban 10 by a process of coating, evaporation, etching and development, or laser, but the invention is not limited to this.

本創作中的任一實施例中,光源20適於提供照射待測物的光束。光源20可以包括一個或多個發光元件。發光元件朝向待測物 件OBJ發出光束。發光元件可以包括發光二極體、雷射二極體或上述兩者的組合。此外,光束可以包括可見光、非可見光或上述兩者的組合。非可見光可為紅外光,但不以此為限。舉例而言,倘若光源20選自紅外光,則遮蔽層11可以使可見光(環境光)的穿透率介在0%~10%之間,使紅外光的穿透率超過80%以上。 In any embodiment of the present invention, the light source 20 is suitable for providing a light beam illuminating the object to be measured. The light source 20 may include one or more light-emitting elements. The light-emitting element faces the object under test The OBJ emits a light beam. The light-emitting element may include a light-emitting diode, a laser diode, or a combination of the two. In addition, the light beam may include visible light, non-visible light, or a combination of both. The invisible light may be infrared light, but it is not limited to this. For example, if the light source 20 is selected from infrared light, the shielding layer 11 can make the transmittance of visible light (ambient light) between 0% and 10%, and make the transmittance of infrared light exceed 80%.

此外,本創作中的任一實施例中,該光源20可以是配置在一外殼所形成的一腔室內(圖未繪出),且所述的腔室填充有擴散粒子(圖未繪出)。這裡所指的擴散粒子的材料例如聚苯乙烯、聚甲基丙烯酯、甲基丙烯酸甲酯與苯乙烯共聚合物、聚碳酸酯、聚乙烯、矽樹脂、碳酸鈣、二氧化矽、二氧化鈦或是其組合。擴散粒子之粒徑則例如在0.01μm~30.0μm之間,但本新型並不限於此。 In addition, in any embodiment of the present creation, the light source 20 may be configured in a cavity formed by a housing (not shown in the figure), and the cavity is filled with diffusion particles (not shown in the figure) . The material of the diffusion particles referred to here is for example polystyrene, polymethacrylate, methyl methacrylate and styrene copolymer, polycarbonate, polyethylene, silicone resin, calcium carbonate, silicon dioxide, titanium dioxide or Is its combination. The diameter of the diffusion particles is, for example, between 0.01 μm and 30.0 μm, but the present invention is not limited to this.

從本實施例的另一可行的方案是在所述的光源20出光面上方配置一光擴散片或一光擴散膜(圖未繪出),該光擴散片或光擴散膜亦可以採用上述的材料及比例所製成。在此須加以說明的是,光源20若為一發光二極體時,其外殼也可以在表面上形成粗糙面,使發出光束光束擴散的更均勻。 Another feasible solution from this embodiment is to dispose a light diffusion sheet or a light diffusion film (not shown in the figure) above the light exit surface of the light source 20. The light diffusion sheet or light diffusion film may also be the above Made of materials and proportions. It should be noted here that if the light source 20 is a light-emitting diode, the outer shell of the light source 20 can also form a rough surface on the surface to make the light beam spread more uniformly.

從本實施例中來看,基板30上取像器40的物側面(取像位置)位於蓋板10的透光區域中,且遮蔽層不覆蓋所述取像器的取像位置。光源20以一預設角度插置於基板30,使光源20可以以一特定角度發出光束,該光束經過第二表面S2進入至透光區域12,並將光束傳遞至第一表面S1的待測物件OBJ上(如指紋),並將帶有該待測物件OBJ的光束信號再次通過透光區域12及第二表面S2,使取像器40可以接收到該等帶有物件的光束信號。 From this embodiment, the object side (imaging position) of the imager 40 on the substrate 30 is located in the light-transmitting area of the cover plate 10, and the shielding layer does not cover the imaging position of the imager. The light source 20 is inserted into the substrate 30 at a predetermined angle, so that the light source 20 can emit a light beam at a specific angle. The light beam enters the light-transmitting area 12 through the second surface S2, and transmits the light beam to the test on the first surface S1 On the object OBJ (such as a fingerprint), the light beam signal with the object OBJ to be tested passes through the transparent area 12 and the second surface S2 again, so that the imagefinder 40 can receive the light beam signals with the object.

本新型任一實施例中所指的取像器40適於接收光束被待測物件OBJ反射的部分(例如:帶有指紋圖案資訊的光束)。取像器40更進一步包括感光元件,所述的感光元件可包括電荷耦合元件(Charge Coupled Device,CCD)、互補式金屬氧化物半導體元件(Complementary Metal-Oxide Semiconductor,CMOS)或其他適當種類的影像感測元件。本實施例中的取像器可以採用定焦鏡頭(透 鏡)、變焦鏡頭(透鏡)或者是可調焦的鏡頭(透鏡)等,且取像器40可以被容置於一鏡筒內(未繪示),該鏡筒可以包括調節機構去調整焦距,本新型創作並不侷限所述取像器鏡頭的鏡片(透鏡)數量,在任一可行的方案中,該取像器鏡頭可以是由正屈光度、負屈光度(單片或多片)鏡頭(透鏡)及/或光圈等元件所組成(合),並予陳明。 The imager 40 referred to in any embodiment of the present invention is adapted to receive the part of the light beam reflected by the object OBJ (for example, the light beam with fingerprint pattern information). The image taker 40 further includes a photosensitive element, and the photosensitive element may include a charge coupled device (CCD), a complementary metal-oxide semiconductor (Complementary Metal-Oxide Semiconductor, CMOS) or other appropriate types of image Sensing element. The image taker in this embodiment can use a fixed focus lens (transparent Lens), zoom lens (lens) or adjustable focus lens (lens), etc., and the imager 40 can be housed in a lens barrel (not shown), the lens barrel may include an adjustment mechanism to adjust the focus , The creation of this new model is not limited to the number of lenses (lenses) of the imager lens. In any feasible solution, the imager lens can be a lens (lens) with positive or negative refractive power (single or multiple). ) And/or aperture and other components (combined), and Chen Ming.

請參照圖2,圖2為圖1的第一變形實施例,與圖1的相同之處,在此並不加以重覆贅述,圖2與圖1的差異在於:蓋板10的透光區域12下方的第二表面S2上形成有一微透鏡陣列13(Micro-Lens array),所述的微透鏡陣列13是由多個半球形狀的多個透鏡排列在第二表面S2,且該些透鏡可以是透過膠材黏著於該第二表面S2上,從本實施例中,也可以是透過一體成型的方式形成於所述的第二表面S2。須加以說明的是,所述的微透鏡陣列13配置於第二表面S2與取像器40之間,且微透鏡陣列13與取像器之間存在有一空氣間隙層AG。其中,該微透鏡陣列13具有聚光的特性,可有效提升取像器40所接收到之光訊號的強度,從而有助於提升整體取像裝置的辨識率。 Please refer to FIG. 2. FIG. 2 is a first modified embodiment of FIG. 1. The same parts as FIG. 1 will not be repeated here. The difference between FIG. 2 and FIG. 1 lies in the light-transmitting area of the cover plate 10. A micro-lens array 13 (Micro-Lens array) is formed on the second surface S2 below 12. The micro-lens array 13 is composed of a plurality of hemispherical lenses arranged on the second surface S2, and the lenses can It is adhered to the second surface S2 through an adhesive material. From this embodiment, it can also be formed on the second surface S2 through an integral molding method. It should be noted that the microlens array 13 is disposed between the second surface S2 and the imager 40, and there is an air gap layer AG between the microlens array 13 and the imager. Among them, the microlens array 13 has a light-gathering characteristic, which can effectively increase the intensity of the light signal received by the image capture device 40, thereby helping to improve the recognition rate of the overall image capture device.

請參考圖3,圖3是本創作另一實施例,圖3主要繪示一取像裝置300,取像裝置300包括一基板30,以及一對應基板30的蓋板10,基板30電性連接有至少一光源20及一取像器40,光源20的出光面朝向所述蓋板10,且蓋板10包括第一表面S1,位於第一表面另一側的第二表面S2以及分別用以連接第一表面S1及第二表面S2的第三表面S3,在本實施例中,第一表面S1適於接觸一待測物件OBJ,例如:手指或手掌等等…本新型並不加以侷限。 Please refer to FIG. 3, which is another embodiment of the present creation. FIG. 3 mainly shows an image capturing device 300. The image capturing device 300 includes a substrate 30 and a cover 10 corresponding to the substrate 30. The substrate 30 is electrically connected There are at least one light source 20 and an image taker 40. The light emitting surface of the light source 20 faces the cover plate 10, and the cover plate 10 includes a first surface S1, a second surface S2 on the other side of the first surface, and The third surface S3 connecting the first surface S1 and the second surface S2. In this embodiment, the first surface S1 is suitable for contacting an object OBJ to be tested, such as a finger or a palm, etc... The present invention is not limited.

從圖3可知,第二表面S2具有複數個遮蔽層11,兩相鄰的遮蔽層11之間形成有一開口,用來定義出一透光區域12。從本實施例中可知,蓋板10適於保護位於其下的元件,其可以是玻璃基板或塑膠基板。玻璃基板可以是經化學強化或物理強化的玻璃基板,也可以是未經強化的玻璃基板。塑膠基板可以是聚碳酸酯(polycarbonate,PC)、聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)、聚甲基丙烯酸甲酯(polymethylmethacrylate,PMMA)或聚醯亞胺(polyimide,PI)等,但不以此為限。 It can be seen from FIG. 3 that the second surface S2 has a plurality of shielding layers 11, and an opening is formed between two adjacent shielding layers 11 to define a transparent area 12. It can be seen from this embodiment that the cover plate 10 is suitable for protecting the components located thereunder, and it can be a glass substrate or a plastic substrate. The glass substrate may be a chemically strengthened or physically strengthened glass substrate, or an unstrengthened glass substrate. The plastic substrate can be polycarbonate (PC), polyethylene terephthalate (polyethylene terephthalate) terephthalate (PET), polymethylmethacrylate (PMMA) or polyimide (PI), but not limited to this.

在本實施例中,取像裝置300的遮蔽層11還包括油墨層或者是透過半導體製程的光罩製程來形成一圖案層(即遮蔽層11),並形成所述的遮蔽層11及透光區域12,所述的該些遮蔽層係形成於蓋板10的第二表面S2,遮蔽層11若選用油墨材料亦可,例如但不限於是黑色的半透光材料。也就是說,遮蔽層11可使部分光束通過,而使另一部分光束被吸收。亦即,遮蔽層11的穿透率可選擇性地位於10%至100%之間。在本實施例中,遮蔽層11可採用塗佈、蒸鍍、蝕刻顯影或雷射的製程形成於蓋板10的第二表面S2;此外,遮蔽層也可以透過該彩色濾光層使用相同光罩堆疊製成,然而本新型創作不以此為限。 In this embodiment, the shielding layer 11 of the image capturing device 300 further includes an ink layer or a patterned layer (ie, shielding layer 11) formed through a photomask process of a semiconductor manufacturing process, and forming the shielding layer 11 and the light-transmitting layer. In area 12, the aforementioned shielding layers are formed on the second surface S2 of the cover plate 10. If the shielding layer 11 is selected from ink materials, such as but not limited to black semi-transparent materials. In other words, the shielding layer 11 can allow part of the light beam to pass through, while allowing another part of the light beam to be absorbed. That is, the transmittance of the shielding layer 11 can be selectively between 10% and 100%. In this embodiment, the shielding layer 11 can be formed on the second surface S2 of the cover plate 10 by a process of coating, evaporation, etching and development, or laser; in addition, the shielding layer can also use the same light through the color filter layer. The cover is made by stacking, but the creation of the new type is not limited to this.

請繼續參考圖3,蓋板10下方的第二表面設置有一導光元件15,所述的導光元件50具有與第二表面S2接合的上表面TS,一配置在上表面TS相對一側的下表面BS,以及一分別連接所述上表面TS及下表面BS的連接面CS,在圖3中的實施例中可知,所述的導光元件15覆蓋所述的透光區域12以及位於透光區域兩側的部分遮蔽層11。 Please continue to refer to FIG. 3, the second surface under the cover plate 10 is provided with a light guide element 15, and the light guide element 50 has an upper surface TS joined to the second surface S2, and a light guide element 50 is arranged on the opposite side of the upper surface TS. The lower surface BS, and a connecting surface CS respectively connecting the upper surface TS and the lower surface BS, it can be seen from the embodiment in FIG. 3 that the light guide element 15 covers the light-transmitting area 12 and is located Part of the shielding layer 11 on both sides of the light area.

從圖3可知,光源20適於提供照射待測物的光束。光源20可以包括一個或多個發光元件。發光元件朝向待測物件OBJ發出光束。發光元件可以包括發光二極體、雷射二極體或上述兩者的組合。此外,光束可以包括可見光、非可見光或上述兩者的組合。非可見光可為紅外光,但不以此為限。舉例而言,光源20發出光束後,光束會進入到導光元件15及導光元件的連接面CS後向另一方向進行全反射傳遞(本實施例中,該連接面非垂直,為一傾斜面),當光束傳遞至透光區域12時,光束會穿過透光區域進入到蓋板10,並且照射到物件(如手指),以取得手指的波峰及波谷信號後,將蓋有該手指信號的光束反射至透光區域12,並使所述取像器40接收光束被待測物件OBJ反射的部分(例如:帶有指紋圖 案資訊的光束)。 It can be seen from FIG. 3 that the light source 20 is suitable for providing a light beam for illuminating the object to be measured. The light source 20 may include one or more light-emitting elements. The light emitting element emits a light beam toward the object under test OBJ. The light-emitting element may include a light-emitting diode, a laser diode, or a combination of the two. In addition, the light beam may include visible light, non-visible light, or a combination of both. The invisible light may be infrared light, but it is not limited to this. For example, after the light source 20 emits a light beam, the light beam enters the light guide element 15 and the connecting surface CS of the light guide element and then performs total reflection transmission in another direction (in this embodiment, the connecting surface is non-vertical and is an inclined When the light beam is transmitted to the light-transmitting area 12, the light beam will pass through the light-transmitting area and enter the cover plate 10, and irradiate an object (such as a finger) to obtain the peak and valley signals of the finger, and then the finger will be covered The signal beam is reflected to the light-transmitting area 12, and the imager 40 receives the part of the beam reflected by the object under test OBJ (for example: with fingerprint The beam of case information).

圖4為圖3的變形實施例,其差異在於:所述的光源20位於取像器40的兩側,且所述的導光元件15的兩個連接面CS均為傾斜表面,以利於光束傳輸。 4 is a modified embodiment of FIG. 3, the difference is that the light source 20 is located on both sides of the imager 40, and the two connecting surfaces CS of the light guide element 15 are both inclined surfaces to facilitate the light beam transmission.

圖5為圖3的另一變形實施例,所述的導光元件15僅覆蓋左邊的遮蔽層11、透光區域12、及部分的右方的遮蔽層11,且所述的光源20僅垂直配置在兩遮蔽層的下方。 5 is another modified embodiment of FIG. 3. The light guide element 15 only covers the shielding layer 11 on the left, the light-transmitting area 12, and part of the shielding layer 11 on the right, and the light source 20 is only vertical It is arranged under the two shielding layers.

圖6示出了本新型創作的另一可行的實施例,該取像裝置600的導光元件15主要是一個呈梯形的稜鏡,所述的導光元件的頂面TS與第二表面S2連接,相對於該頂面的底面BS為一平面,用以連接所述頂面TS與底面BS的連接面CS為一斜面;在本實施例中,該取像裝置600更進一步包括第一基板30A及第二基板30B,第一基板30A電性連接至少一光源20,第二基板30B電性連接至少一取像器40,且所述的第一基板30A及第二基板30B分別與各自的連接面CS相互平行設置。 FIG. 6 shows another feasible embodiment of the present invention. The light guide element 15 of the image capturing device 600 is mainly a trapezoid, and the top surface TS of the light guide element and the second surface S2 Connected, the bottom surface BS relative to the top surface is a flat surface, and the connecting surface CS used to connect the top surface TS and the bottom surface BS is an inclined surface; in this embodiment, the image capturing device 600 further includes a first substrate 30A and the second substrate 30B. The first substrate 30A is electrically connected to at least one light source 20, the second substrate 30B is electrically connected to at least one imagefinder 40, and the first substrate 30A and the second substrate 30B are connected to their respective The connecting surfaces CS are arranged parallel to each other.

圖7為圖6的變形實施例,其中差異在於導光元件15呈等腰三角或者是正三角形。於本實施例中,該導光元件15具有一與第二表面S2平行的一平面SP,以及兩個與平面等長的斜面SS;其中,該取像裝置700更進一步包括第一基板30A及第二基板30B,第一基板30A電性連接至少一光源20,第二基板30B電性連接至少一取像器40,且所述的第一基板30A及第二基板30B分別與各自的斜面SS相互平行設置。 FIG. 7 is a modified embodiment of FIG. 6, the difference is that the light guide element 15 is an isosceles triangle or an equilateral triangle. In this embodiment, the light guide element 15 has a plane SP parallel to the second surface S2 and two slopes SS having the same length as the plane; wherein, the image capturing device 700 further includes a first substrate 30A and The second substrate 30B, the first substrate 30A is electrically connected to at least one light source 20, the second substrate 30B is electrically connected to at least one imagefinder 40, and the first substrate 30A and the second substrate 30B are respectively connected to the respective slope SS Set up parallel to each other.

圖8揭露本新型創作一電子裝置1000的實施例,該實施例中,基板10可以包括有一影像處理單元,用於處理所述取像器40所擷取到的物件影像(如指紋影像),並用以比對該影像是否予以儲存於一記憶體內的指紋資料是否相符,倘若相符,則進行解鎖或者是開放權限等。 FIG. 8 discloses an embodiment of an electronic device 1000 of the present invention. In this embodiment, the substrate 10 may include an image processing unit for processing the object image (such as fingerprint image) captured by the imager 40, And it is used to compare whether the fingerprint data stored in a memory matches the image, and if they match, unlock or open permissions, etc.

此外,本新型創作的任一實施例中,該蓋板10的透光區域12上設置有一顯示面板層,且該顯示面板是具有複數個觸控電極。 當蓋板10為顯示面板時,光源20可以由顯示面板作為提供光束的來源,本創作並不加以侷限所述顯示面板的種類。 In addition, in any embodiment of the present invention, a display panel layer is provided on the transparent area 12 of the cover plate 10, and the display panel has a plurality of touch electrodes. When the cover 10 is a display panel, the light source 20 can be the display panel as a source of light beams, and this creation is not limited to the type of the display panel.

雖然本新型創作已以實施例揭露如上,然其並非用以限定本新型創作,任何所屬技術領域中具有通常知識者,在不脫離本新型創作的精神和範圍內,當可作些許的更動與潤飾,故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。 Although the creation of this new type has been disclosed in the above embodiments, it is not intended to limit the creation of this new type. Anyone with ordinary knowledge in the technical field can make some changes and changes without departing from the spirit and scope of the new creation. Retouching, so the scope of protection of the creation of this new model shall be subject to the scope of the attached patent application.

200‧‧‧取像裝置 200‧‧‧Image capture device

30‧‧‧基板 30‧‧‧Substrate

10‧‧‧蓋板 10‧‧‧Cover

40‧‧‧取像器 40‧‧‧Viewfinder

11‧‧‧遮蔽層 11‧‧‧Masking layer

S1‧‧‧第一表面 S1‧‧‧First surface

12‧‧‧透光區域 12‧‧‧Transparent area

S2‧‧‧第二表面 S2‧‧‧Second surface

13‧‧‧微透鏡陣列 13‧‧‧Micro lens array

S3‧‧‧第三表面 S3‧‧‧The third surface

20‧‧‧光源 20‧‧‧Light source

AG‧‧‧空氣間隙層 AG‧‧‧Air gap layer

Claims (20)

一種取像裝置,包括:一基板,該基板電性連接至少一光源及一取像器;以及一蓋板,該蓋板設置在該光源的一出光側,該蓋板的一表面設置有複數個遮蔽層,其中兩相鄰的遮蔽層之間具有一透光區域。 An image capturing device includes: a substrate electrically connected to at least one light source and an image capture device; and a cover plate arranged on a light-emitting side of the light source, and a plurality of A shielding layer, in which there is a light-transmitting area between two adjacent shielding layers. 如請求項1所述的取像裝置,其中該透光區域未被遮蔽層所覆蓋。 The imaging device according to claim 1, wherein the light-transmitting area is not covered by the shielding layer. 如請求項1所述的取像裝置,其中該透光區域為一生物特徵取像區域。 The imaging device according to claim 1, wherein the light-transmitting area is a biometric imaging area. 如請求項1所述的取像裝置,其中該蓋板更包括:一第一表面,該第一表面遠離所述基板;一第二表面,配置在該第一表面的相對一側;以及一用以連接所述第一表面及第二表面的第三表面。 The imaging device according to claim 1, wherein the cover plate further comprises: a first surface, the first surface being away from the substrate; a second surface, disposed on the opposite side of the first surface; and a Used to connect the first surface and the third surface of the second surface. 如請求項4所述的取像裝置,其中該光源適於發出一光束,該光束通過該第二表面進入該透光區域。 The imaging device according to claim 4, wherein the light source is adapted to emit a light beam, and the light beam enters the light-transmitting area through the second surface. 如請求項4所述的取像裝置,其中在該第二表面的透光區域上設置一微透鏡陣列。 The imaging device according to claim 4, wherein a microlens array is provided on the light-transmitting area of the second surface. 如請求項1所述的取像裝置,其中該取像器配置在該透光區域中。 The image capturing device according to claim 1, wherein the image capturing device is arranged in the light transmission area. 如請求項1所述的取像裝置,其中該光源以30度~75度之間的角度傾斜設置於該基板上。 The imaging device according to claim 1, wherein the light source is obliquely disposed on the substrate at an angle between 30 degrees and 75 degrees. 如請求項1所述的取像裝置,其中該光源包括一個或複數個可見光源及/或不可見光源,且所述的光源為具有擴散粒子的光源。 The imaging device according to claim 1, wherein the light source includes one or more visible light sources and/or invisible light sources, and the light source is a light source with diffuse particles. 如請求項1所述的取像裝置,其中該蓋板更包括:一第一表面,該第一表面遠離所述基板;一第二表面,配置在該第一表面的相對一側;以及一用以連接所述第一表面及第二表面的第三表面;且所述取像裝置更進一步包括:一導光元件,配置在該蓋板與該基板之間,其中該導光元件位於所述第二表面的下方。 The imaging device according to claim 1, wherein the cover plate further comprises: a first surface, the first surface being away from the substrate; a second surface, arranged on the opposite side of the first surface; and a A third surface for connecting the first surface and the second surface; and the image capturing device further includes: a light guide element disposed between the cover and the substrate, wherein the light guide element is located at the Below the second surface. 如請求項10所述的取像裝置,其中該導光元件具有上表面及一與上表面相對的下表面,以及用以連接該上表面及該下表面的連接面。 The imaging device according to claim 10, wherein the light guide element has an upper surface, a lower surface opposite to the upper surface, and a connecting surface for connecting the upper surface and the lower surface. 如請求項11所述的取像裝置,其中該導光元件覆蓋該透光區域。 The imaging device according to claim 11, wherein the light guide element covers the light transmission area. 如請求項10所述的取像裝置,其中該導光元件覆蓋該透光區域及遮蔽層。 The imaging device according to claim 10, wherein the light guide element covers the light-transmitting area and the shielding layer. 如請求項12所述的取像裝置,其中該連接面以一傾斜角度連接於該上表面及/或該下表面。 The imaging device according to claim 12, wherein the connecting surface is connected to the upper surface and/or the lower surface at an oblique angle. 如請求項14所述的取像裝置,其中該連接面以一傾斜角度連接於該上表面及/或該下表面。 The imaging device according to claim 14, wherein the connecting surface is connected to the upper surface and/or the lower surface at an oblique angle. 如請求項10所述的取像裝置,其中該導光元件係一四角 形稜鏡。 The imaging device according to claim 10, wherein the light guide element is a four-corner Shape 稜鏡. 如請求項16所述的取像裝置,其中該基板更包括: The imaging device according to claim 16, wherein the substrate further includes: 一第一基板,用以承載該至少一光源; A first substrate for carrying the at least one light source; 一第二基板,用以承載該取像器,其中該第一基板與該稜鏡的一斜邊相互平行配置,且該第二基板稜鏡的另一斜邊相互平行配置。 A second substrate for supporting the imager, wherein the first substrate and one oblique side of the ridge are arranged in parallel to each other, and the other oblique side of the second substrate is arranged in parallel to each other. 如請求項1所述的取像裝置,其中該蓋板的透光區域上設置有一顯示面板層,且該顯示面板是具有複數個觸控電極。 The imaging device according to claim 1, wherein a display panel layer is arranged on the light-transmitting area of the cover plate, and the display panel has a plurality of touch electrodes. 如請求項1至18項中任一項的取像裝置,其中該遮蔽層是一油墨或者是一黑色矩陣層。 The imaging device according to any one of claims 1 to 18, wherein the shielding layer is an ink or a black matrix layer. 一種電子裝置,包括: An electronic device, including: 一影像處理單元,以及如請求項1至18項其中任一項所述的取像裝置。 An image processing unit, and the imaging device according to any one of Claims 1 to 18.
TW108215947U 2019-11-08 2019-11-29 Image capture apparatus and electronic device thereof TWM598977U (en)

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