TWM598977U - Image capture apparatus and electronic device thereof - Google Patents
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- TWM598977U TWM598977U TW108215947U TW108215947U TWM598977U TW M598977 U TWM598977 U TW M598977U TW 108215947 U TW108215947 U TW 108215947U TW 108215947 U TW108215947 U TW 108215947U TW M598977 U TWM598977 U TW M598977U
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Abstract
Description
本創作涉及一種光電模組及其電子裝置,特別是涉及一種取像裝置及其電子裝置。 This creation relates to a photoelectric module and its electronic device, in particular to an image capturing device and its electronic device.
生物辨識的種類包括臉部、聲音、虹膜、視網膜、靜脈、掌紋和指紋辨識等。依照感測方式的不同,生物特徵辨識裝置可分為光學式、電容式、超音波式及熱感應式。一般而言,光學式生物特徵辨識裝置包括光源、導光元件以及感測器。光源所發出的光束照射按壓於導光元件上的待測物(如手指、掌紋等),感測器接收被待測物反射的光束,以進行生物特徵的辨識。 The types of biometric recognition include face, voice, iris, retina, vein, palm print and fingerprint recognition. According to different sensing methods, biometric identification devices can be divided into optical, capacitive, ultrasonic and thermal induction types. Generally speaking, an optical biometric identification device includes a light source, a light guide element, and a sensor. The light beam emitted by the light source irradiates the object to be measured (such as fingers, palm prints, etc.) pressed on the light guide element, and the sensor receives the light beam reflected by the object to identify the biological characteristics.
以指紋辨識為例,當手指按壓於導光元件上時,指紋的凸部會接觸導光元件,而指紋的凹部不會接觸導光元件。因此,指紋的凸部會破壞光束在導光元件內的全反射,而使感測器取得對應凸部的暗紋。同時,指紋的凹部不會破壞光束在導光元件內的全反射,而使感測器取得對應凹部的亮紋。藉此,對應指紋的凸部與凹部的光束會在感測器的光接收面上形成亮暗相間的條紋圖案。利用演算法計算對應指紋影像的資訊,便可進行使用者身份的辨識。然而,現有的光學式指紋辨識目前仍存在諸多問題尚需克服,例如光束穿透率低、辨識能力容易產生偏差以及製作成本較高等不利發展之難題,為本領域具有通常知識者亟需克服的課題。 Taking fingerprint recognition as an example, when a finger presses on the light guide element, the convex part of the fingerprint will contact the light guide element, and the concave part of the fingerprint will not contact the light guide element. Therefore, the convex part of the fingerprint destroys the total reflection of the light beam in the light guide element, and the sensor obtains the dark pattern corresponding to the convex part. At the same time, the concave part of the fingerprint does not destroy the total reflection of the light beam in the light guide element, and the sensor obtains the bright pattern corresponding to the concave part. Thereby, the light beams corresponding to the convex and concave portions of the fingerprint will form a bright and dark striped pattern on the light receiving surface of the sensor. Using an algorithm to calculate the information corresponding to the fingerprint image, the user's identity can be identified. However, the existing optical fingerprint recognition still has many problems that need to be overcome. For example, the disadvantageous development problems such as low beam transmittance, easy deviation of recognition ability, and high production cost, which are urgently needed by those with ordinary knowledge in the field. Subject.
本創作主要提供一種取像裝置,性能佳,且製造成本低。 This creation mainly provides an imaging device with good performance and low manufacturing cost.
本新型創作主要披露一種取像裝置,包括:一基板,該基板電性連接至少一光源及一取像器;以及一蓋板,該蓋板設置在該光源的一出光測,該蓋板的一表面設置有複數個遮蔽層,其中兩相鄰的遮蔽層之間具有一透光區域。 The present invention mainly discloses an image capturing device, which includes: a substrate electrically connected to at least one light source and an image capturing device; and a cover plate, the cover plate is arranged on a light source of the light source, and the cover plate A plurality of shielding layers are arranged on one surface, and a light-transmitting area is provided between two adjacent shielding layers.
在本新型的一實施例中,其中該透光區域未被遮蔽層所覆蓋。 In an embodiment of the present invention, the light-transmitting area is not covered by the shielding layer.
在本新型的一實施例中,其中該透光區域為一生物特徵取像區域。 In an embodiment of the present invention, the light-transmitting area is a biological feature imaging area.
在本新型的一實施例中,其中該蓋板更包括:一第一表面,該第一表面遠離所述基板;一第二表面,配置在該第一表面的相對一側;以及一用以連接所述第一表面及第二表面的第三表面。 In an embodiment of the present invention, the cover plate further includes: a first surface, the first surface being away from the substrate; a second surface, disposed on the opposite side of the first surface; and A third surface connecting the first surface and the second surface.
在本新型的一實施例中,其中該光源適於發出一光束,該光束通過該第二表面進入該透光區域。 In an embodiment of the present invention, the light source is adapted to emit a light beam, and the light beam enters the light-transmitting area through the second surface.
在本新型的一實施例中,其中在該第二表面的透光區域上設置一微透鏡陣列。 In an embodiment of the present invention, a microlens array is provided on the light-transmitting area of the second surface.
在本新型的一實施例中,其中該取像器配置在該透光區域中。 In an embodiment of the present invention, the imager is arranged in the light-transmitting area.
在本新型的一實施例中,其中該光源以30度~75度之間的角度傾斜設置於該基板上。 In an embodiment of the present invention, the light source is obliquely disposed on the substrate at an angle between 30 degrees and 75 degrees.
在本新型的一實施例中,其中該光源包括一個或複數個可見光源及/或不可見光源。 In an embodiment of the present invention, the light source includes one or more visible light sources and/or invisible light sources.
在本新型的一實施例中,其中該蓋板更包括:一第一表面,該第一表面遠離所述基板;一第二表面,配置在該第一表面的相對一側;以及一用以連接所述第一表面及第二表面的第三表面;且所述取像裝置更進一步包括:一導光元件,配置在該蓋板與該基板之間,其中該導光元件位於所述第二表面的下方。 In an embodiment of the present invention, the cover plate further includes: a first surface, the first surface being away from the substrate; a second surface, disposed on the opposite side of the first surface; and A third surface connecting the first surface and the second surface; and the image capturing device further includes: a light guide element disposed between the cover plate and the substrate, wherein the light guide element is located on the first surface Below the second surface.
在本新型的一實施例中,其中該導光元件具有上表面及一與上表面相對的下表面,以及用以連接該上表面及該下表面的連接面。 In an embodiment of the present invention, the light guide element has an upper surface, a lower surface opposite to the upper surface, and a connecting surface for connecting the upper surface and the lower surface.
在本新型的一實施例中,其中該導光元件覆蓋該透光區域。 In an embodiment of the present invention, the light guide element covers the light transmission area.
在本新型的一實施例中,其中該導光元件覆蓋該透光區域及遮蔽層。 In an embodiment of the present invention, the light guide element covers the light transmission area and the shielding layer.
在本新型的一實施例中,其中該連接面以一傾斜角度連接於該上表面及/或該下表面。 In an embodiment of the present invention, the connecting surface is connected to the upper surface and/or the lower surface at an oblique angle.
在本新型的一實施例中,其中該連接面以一傾斜角度連接於該上表面及/或該下表面。 In an embodiment of the present invention, the connecting surface is connected to the upper surface and/or the lower surface at an oblique angle.
在本新型的一實施例中,其中該導光元件係一四角形稜鏡。 In an embodiment of the present invention, the light guide element is a quadrangular ridge.
在本新型的一實施例中,其中該基板更包括:一第一基板,用以承載該至少一光源;一第二基板,用以承載該取像器,其中該第一基板與該稜鏡的一斜邊相互平行配置,且該第二基板稜鏡的另一斜邊相互平行配置。 In an embodiment of the present invention, the substrate further includes: a first substrate for carrying the at least one light source; a second substrate for carrying the imager, wherein the first substrate and the sill One oblique side of the second substrate is arranged parallel to each other, and the other oblique side of the second substrate is arranged parallel to each other.
在本新型的一實施例中,其中該蓋板的透光區域上設置有一顯示面板層,且該顯示面板是具有複數個觸控電極。 In an embodiment of the present invention, a display panel layer is disposed on the transparent area of the cover plate, and the display panel has a plurality of touch electrodes.
在本新型的一實施例中,其中該遮蔽層是一油墨或者是一黑色矩陣層。 In an embodiment of the present invention, the shielding layer is an ink or a black matrix layer.
本創作另外披露了一種電子裝置,包括:一影像處理單元,包括上述的取像裝置。 This creation additionally discloses an electronic device, including: an image processing unit, including the above-mentioned image capturing device.
本創作藉由基板電性連接至少一光源及一取像器;並在蓋板設置在該光源的一出光側,該蓋板的一表面設置有複數個遮蔽層,其中兩相鄰的遮蔽層之間具有一透光區域,當光源發出光束後照射到手指反射到透光區域,從而使得取像器可以取得更佳的影像品質,且使整體的構造更為簡單,便於生產。 In this creation, at least one light source and one imager are electrically connected by a substrate; and a cover plate is arranged on a light emitting side of the light source, and a surface of the cover plate is provided with a plurality of shielding layers, of which two adjacent shielding layers There is a light-transmitting area in between. When the light source emits a light beam, the finger is reflected to the light-transmitting area, so that the imager can obtain better image quality, and the overall structure is simpler and easy to produce.
為使能更進一步瞭解本創作的特徵及技術內容,請參閱以下有關本創作的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本創作加以限制。 In order to further understand the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation. However, the provided drawings are only for reference and explanation, not to limit this creation.
1000‧‧‧電子裝置 1000‧‧‧Electronic device
TS‧‧‧上表面 TS‧‧‧Upper surface
10‧‧‧蓋板 10‧‧‧Cover
CS‧‧‧連接面 CS‧‧‧Connecting surface
11‧‧‧遮蔽層 11‧‧‧Masking layer
SS‧‧‧斜面 SS‧‧‧Slope
12‧‧‧透光區域 12‧‧‧Transparent area
100‧‧‧取像裝置 100‧‧‧Image capture device
13‧‧‧微透鏡陣列 13‧‧‧Micro lens array
200‧‧‧取像裝置 200‧‧‧Image capture device
15‧‧‧導光元件 15‧‧‧Light guide element
300‧‧‧取像裝置 300‧‧‧Image capture device
20‧‧‧光源 20‧‧‧Light source
400‧‧‧取像裝置 400‧‧‧Image capture device
30‧‧‧基板 30‧‧‧Substrate
500‧‧‧取像裝置 500‧‧‧Image capture device
30A‧‧‧第一基板 30A‧‧‧First substrate
600‧‧‧取像裝置 600‧‧‧Image capture device
30B‧‧‧第二基板 30B‧‧‧Second substrate
700‧‧‧取像裝置 700‧‧‧Image capture device
40‧‧‧取像器 40‧‧‧Viewfinder
AG‧‧‧空氣間隙層 AG‧‧‧Air gap layer
S1‧‧‧第一表面 S1‧‧‧First surface
BS‧‧‧下表面 BS‧‧‧lower surface
S2‧‧‧第二表面 S2‧‧‧Second surface
SP‧‧‧平面 SP‧‧‧Plane
S3‧‧‧第三表面 S3‧‧‧The third surface
OBJ‧‧‧待測物件 OBJ‧‧‧Object to be tested
圖1是本新型創作一取像裝置的第一實施例示意圖。 Fig. 1 is a schematic diagram of the first embodiment of the new creation-capturing device.
圖2是本新型創作一取像裝置的第二實施例示意圖。 Fig. 2 is a schematic diagram of a second embodiment of the new creation-capturing device.
圖3是本新型創作一取像裝置的第三實施例示意圖。 Fig. 3 is a schematic diagram of the third embodiment of the new creation-capturing device.
圖4是本新型創作一取像裝置的第四實施例示意圖。 Fig. 4 is a schematic diagram of a fourth embodiment of the new creation-capturing device.
圖5是本新型創作一取像裝置的第五實施例示意圖。 Fig. 5 is a schematic diagram of a fifth embodiment of the new creation-capturing device.
圖6是本新型創作一取像裝置的第六實施例示意圖。 Fig. 6 is a schematic diagram of the sixth embodiment of the new creation-capturing device.
圖7是本新型創作一取像裝置的第七實施例示意圖。 Fig. 7 is a schematic diagram of a seventh embodiment of the new creation-capturing device.
圖8是本新型創作一電子裝置的實施例示意圖。 Fig. 8 is a schematic diagram of an embodiment of an electronic device of the present invention.
於實施方式中所提到的方向用語,例如:「上」、「下」、「前」、「後」、「左」、「右」等,僅是參考附圖的方向。因此,使用的方向用語是用來說明,而並非用來限制本發明。在附圖中,各圖式繪示的是特定示範實施例中所使用的方法、結構及/或材料的通常性特徵。然而,這些圖式不應被解釋為界定或限制由這些示範實施例所涵蓋的範圍或性質。舉例來說,為了清楚起見,各膜層、區域及/或結構的相對尺寸、厚度及位置可能縮小或放大。 The directional terms mentioned in the embodiments, such as "up", "down", "front", "rear", "left", "right", etc., are only directions with reference to the drawings. Therefore, the directional terms used are used to illustrate, but not to limit the present invention. In the drawings, each drawing depicts the general features of the methods, structures, and/or materials used in specific exemplary embodiments. However, these drawings should not be construed as defining or limiting the scope or nature covered by these exemplary embodiments. For example, for the sake of clarity, the relative size, thickness, and position of each layer, region, and/or structure may be reduced or enlarged.
在實施方式中,相同或相似的元件將採用相同或相似的標號,且將省略其贅述。此外,不同示範實施例中的特徵在沒有衝突的情況下可相互組合,且依本說明書或申請專利範圍所作之簡單的等效變化與修飾,皆仍屬本專利涵蓋之範圍內。另外,本說明書或申請專利範圍中提及的「第一」、「第二」等用語僅用以命名分立(discrete)的元件或區別不同實施例或範圍,而並非用來限制元件數量上的上限或下限,也並非用以限定元件的製造順序或設置順序。 In the embodiments, the same or similar elements will use the same or similar reference numerals, and the redundant description will be omitted. In addition, the features in different exemplary embodiments can be combined without conflict, and simple equivalent changes and modifications made in accordance with this specification or the scope of the patent application still fall within the scope of this patent. In addition, the terms "first" and "second" mentioned in this specification or the scope of the patent application are only used to name discrete elements or distinguish different embodiments or ranges, and are not used to limit the number of elements. The upper limit or lower limit is not used to limit the manufacturing sequence or the arrangement sequence of the components.
取像裝置100位於一環境介質中來使用,其中,環境介質例如是空氣、水或者是其他種類的環境介質。前述的待測物件OBJ例如是使用者的手指、手掌、手腕或者是眼球,而取像裝置100
所擷取的影像例如是指紋、掌紋、靜脈、瞳孔或者是虹膜等影像,但本創作不以此為限。
The
請參考圖1,圖1揭示了一種取像裝置100,取像裝置100包括一基板30,以及一對應基板30的蓋板10,基板30電性連接有至少一光源20及一取像器40,光源20的出光面朝向所述蓋板10,且蓋板10包括第一表面S1,位於第一表面另一側的第二表面S2以及分別用以連接第一表面及第二表面的第三表面S3,在本實施例中,第一表面S1適於接觸一待測物件OBJ,例如:手指或手掌等等…本新型並不加以侷限。
Please refer to FIG. 1. FIG. 1 shows an
從圖1可知,第二表面S2具有複數個遮蔽層11,兩相鄰的遮蔽層11之間形成有一開口,用來定義出一透光區域12。從本實施例中可知,蓋板10適於保護位於其下的元件,其可以是玻璃基板或塑膠基板。玻璃基板可以是經化學強化或物理強化的玻璃基板,也可以是未經強化的玻璃基板。塑膠基板可以是聚碳酸酯(polycarbonate,PC)、聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)、聚甲基丙烯酸甲酯(polymethylmethacrylate,PMMA)或聚醯亞胺(polyimide,PI)等,但不以此為限。
It can be seen from FIG. 1 that the second surface S2 has a plurality of shielding
請繼續參考圖1,在本實施例中,取像裝置100的遮蔽層11還包括油墨層或者是透過半導體製程的光罩製程來形成一圖案層或黑矩陣層(即Black Matrix遮蔽層11),並形成所述的遮蔽層11及透光區域12,所述的該些遮蔽層係形成於蓋板10的第二表面S2,遮蔽層11若選用油墨材料亦可,例如但不限於是黑色的半透光材料。也就是說,遮蔽層11可使部分波長的光束通過,而使另一部分波長的光束被吸收。亦即,遮蔽層11的穿透率可選擇性地位於10%至100%之間。在本實施例中,遮蔽層11可採用塗佈、蒸鍍、蝕刻顯影或雷射的製程形成於蓋坂10的第二表面S2,然而本新型創作不以此為限。
Please continue to refer to FIG. 1. In this embodiment, the
本創作中的任一實施例中,光源20適於提供照射待測物的光束。光源20可以包括一個或多個發光元件。發光元件朝向待測物
件OBJ發出光束。發光元件可以包括發光二極體、雷射二極體或上述兩者的組合。此外,光束可以包括可見光、非可見光或上述兩者的組合。非可見光可為紅外光,但不以此為限。舉例而言,倘若光源20選自紅外光,則遮蔽層11可以使可見光(環境光)的穿透率介在0%~10%之間,使紅外光的穿透率超過80%以上。
In any embodiment of the present invention, the
此外,本創作中的任一實施例中,該光源20可以是配置在一外殼所形成的一腔室內(圖未繪出),且所述的腔室填充有擴散粒子(圖未繪出)。這裡所指的擴散粒子的材料例如聚苯乙烯、聚甲基丙烯酯、甲基丙烯酸甲酯與苯乙烯共聚合物、聚碳酸酯、聚乙烯、矽樹脂、碳酸鈣、二氧化矽、二氧化鈦或是其組合。擴散粒子之粒徑則例如在0.01μm~30.0μm之間,但本新型並不限於此。
In addition, in any embodiment of the present creation, the
從本實施例的另一可行的方案是在所述的光源20出光面上方配置一光擴散片或一光擴散膜(圖未繪出),該光擴散片或光擴散膜亦可以採用上述的材料及比例所製成。在此須加以說明的是,光源20若為一發光二極體時,其外殼也可以在表面上形成粗糙面,使發出光束光束擴散的更均勻。
Another feasible solution from this embodiment is to dispose a light diffusion sheet or a light diffusion film (not shown in the figure) above the light exit surface of the
從本實施例中來看,基板30上取像器40的物側面(取像位置)位於蓋板10的透光區域中,且遮蔽層不覆蓋所述取像器的取像位置。光源20以一預設角度插置於基板30,使光源20可以以一特定角度發出光束,該光束經過第二表面S2進入至透光區域12,並將光束傳遞至第一表面S1的待測物件OBJ上(如指紋),並將帶有該待測物件OBJ的光束信號再次通過透光區域12及第二表面S2,使取像器40可以接收到該等帶有物件的光束信號。
From this embodiment, the object side (imaging position) of the
本新型任一實施例中所指的取像器40適於接收光束被待測物件OBJ反射的部分(例如:帶有指紋圖案資訊的光束)。取像器40更進一步包括感光元件,所述的感光元件可包括電荷耦合元件(Charge Coupled Device,CCD)、互補式金屬氧化物半導體元件(Complementary Metal-Oxide Semiconductor,CMOS)或其他適當種類的影像感測元件。本實施例中的取像器可以採用定焦鏡頭(透
鏡)、變焦鏡頭(透鏡)或者是可調焦的鏡頭(透鏡)等,且取像器40可以被容置於一鏡筒內(未繪示),該鏡筒可以包括調節機構去調整焦距,本新型創作並不侷限所述取像器鏡頭的鏡片(透鏡)數量,在任一可行的方案中,該取像器鏡頭可以是由正屈光度、負屈光度(單片或多片)鏡頭(透鏡)及/或光圈等元件所組成(合),並予陳明。
The
請參照圖2,圖2為圖1的第一變形實施例,與圖1的相同之處,在此並不加以重覆贅述,圖2與圖1的差異在於:蓋板10的透光區域12下方的第二表面S2上形成有一微透鏡陣列13(Micro-Lens array),所述的微透鏡陣列13是由多個半球形狀的多個透鏡排列在第二表面S2,且該些透鏡可以是透過膠材黏著於該第二表面S2上,從本實施例中,也可以是透過一體成型的方式形成於所述的第二表面S2。須加以說明的是,所述的微透鏡陣列13配置於第二表面S2與取像器40之間,且微透鏡陣列13與取像器之間存在有一空氣間隙層AG。其中,該微透鏡陣列13具有聚光的特性,可有效提升取像器40所接收到之光訊號的強度,從而有助於提升整體取像裝置的辨識率。
Please refer to FIG. 2. FIG. 2 is a first modified embodiment of FIG. 1. The same parts as FIG. 1 will not be repeated here. The difference between FIG. 2 and FIG. 1 lies in the light-transmitting area of the
請參考圖3,圖3是本創作另一實施例,圖3主要繪示一取像裝置300,取像裝置300包括一基板30,以及一對應基板30的蓋板10,基板30電性連接有至少一光源20及一取像器40,光源20的出光面朝向所述蓋板10,且蓋板10包括第一表面S1,位於第一表面另一側的第二表面S2以及分別用以連接第一表面S1及第二表面S2的第三表面S3,在本實施例中,第一表面S1適於接觸一待測物件OBJ,例如:手指或手掌等等…本新型並不加以侷限。
Please refer to FIG. 3, which is another embodiment of the present creation. FIG. 3 mainly shows an
從圖3可知,第二表面S2具有複數個遮蔽層11,兩相鄰的遮蔽層11之間形成有一開口,用來定義出一透光區域12。從本實施例中可知,蓋板10適於保護位於其下的元件,其可以是玻璃基板或塑膠基板。玻璃基板可以是經化學強化或物理強化的玻璃基板,也可以是未經強化的玻璃基板。塑膠基板可以是聚碳酸酯(polycarbonate,PC)、聚對苯二甲酸乙二酯(polyethylene
terephthalate,PET)、聚甲基丙烯酸甲酯(polymethylmethacrylate,PMMA)或聚醯亞胺(polyimide,PI)等,但不以此為限。
It can be seen from FIG. 3 that the second surface S2 has a plurality of shielding
在本實施例中,取像裝置300的遮蔽層11還包括油墨層或者是透過半導體製程的光罩製程來形成一圖案層(即遮蔽層11),並形成所述的遮蔽層11及透光區域12,所述的該些遮蔽層係形成於蓋板10的第二表面S2,遮蔽層11若選用油墨材料亦可,例如但不限於是黑色的半透光材料。也就是說,遮蔽層11可使部分光束通過,而使另一部分光束被吸收。亦即,遮蔽層11的穿透率可選擇性地位於10%至100%之間。在本實施例中,遮蔽層11可採用塗佈、蒸鍍、蝕刻顯影或雷射的製程形成於蓋板10的第二表面S2;此外,遮蔽層也可以透過該彩色濾光層使用相同光罩堆疊製成,然而本新型創作不以此為限。
In this embodiment, the
請繼續參考圖3,蓋板10下方的第二表面設置有一導光元件15,所述的導光元件50具有與第二表面S2接合的上表面TS,一配置在上表面TS相對一側的下表面BS,以及一分別連接所述上表面TS及下表面BS的連接面CS,在圖3中的實施例中可知,所述的導光元件15覆蓋所述的透光區域12以及位於透光區域兩側的部分遮蔽層11。
Please continue to refer to FIG. 3, the second surface under the
從圖3可知,光源20適於提供照射待測物的光束。光源20可以包括一個或多個發光元件。發光元件朝向待測物件OBJ發出光束。發光元件可以包括發光二極體、雷射二極體或上述兩者的組合。此外,光束可以包括可見光、非可見光或上述兩者的組合。非可見光可為紅外光,但不以此為限。舉例而言,光源20發出光束後,光束會進入到導光元件15及導光元件的連接面CS後向另一方向進行全反射傳遞(本實施例中,該連接面非垂直,為一傾斜面),當光束傳遞至透光區域12時,光束會穿過透光區域進入到蓋板10,並且照射到物件(如手指),以取得手指的波峰及波谷信號後,將蓋有該手指信號的光束反射至透光區域12,並使所述取像器40接收光束被待測物件OBJ反射的部分(例如:帶有指紋圖
案資訊的光束)。
It can be seen from FIG. 3 that the
圖4為圖3的變形實施例,其差異在於:所述的光源20位於取像器40的兩側,且所述的導光元件15的兩個連接面CS均為傾斜表面,以利於光束傳輸。
4 is a modified embodiment of FIG. 3, the difference is that the
圖5為圖3的另一變形實施例,所述的導光元件15僅覆蓋左邊的遮蔽層11、透光區域12、及部分的右方的遮蔽層11,且所述的光源20僅垂直配置在兩遮蔽層的下方。
5 is another modified embodiment of FIG. 3. The
圖6示出了本新型創作的另一可行的實施例,該取像裝置600的導光元件15主要是一個呈梯形的稜鏡,所述的導光元件的頂面TS與第二表面S2連接,相對於該頂面的底面BS為一平面,用以連接所述頂面TS與底面BS的連接面CS為一斜面;在本實施例中,該取像裝置600更進一步包括第一基板30A及第二基板30B,第一基板30A電性連接至少一光源20,第二基板30B電性連接至少一取像器40,且所述的第一基板30A及第二基板30B分別與各自的連接面CS相互平行設置。
FIG. 6 shows another feasible embodiment of the present invention. The
圖7為圖6的變形實施例,其中差異在於導光元件15呈等腰三角或者是正三角形。於本實施例中,該導光元件15具有一與第二表面S2平行的一平面SP,以及兩個與平面等長的斜面SS;其中,該取像裝置700更進一步包括第一基板30A及第二基板30B,第一基板30A電性連接至少一光源20,第二基板30B電性連接至少一取像器40,且所述的第一基板30A及第二基板30B分別與各自的斜面SS相互平行設置。
FIG. 7 is a modified embodiment of FIG. 6, the difference is that the
圖8揭露本新型創作一電子裝置1000的實施例,該實施例中,基板10可以包括有一影像處理單元,用於處理所述取像器40所擷取到的物件影像(如指紋影像),並用以比對該影像是否予以儲存於一記憶體內的指紋資料是否相符,倘若相符,則進行解鎖或者是開放權限等。
FIG. 8 discloses an embodiment of an
此外,本新型創作的任一實施例中,該蓋板10的透光區域12上設置有一顯示面板層,且該顯示面板是具有複數個觸控電極。
當蓋板10為顯示面板時,光源20可以由顯示面板作為提供光束的來源,本創作並不加以侷限所述顯示面板的種類。
In addition, in any embodiment of the present invention, a display panel layer is provided on the
雖然本新型創作已以實施例揭露如上,然其並非用以限定本新型創作,任何所屬技術領域中具有通常知識者,在不脫離本新型創作的精神和範圍內,當可作些許的更動與潤飾,故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。 Although the creation of this new type has been disclosed in the above embodiments, it is not intended to limit the creation of this new type. Anyone with ordinary knowledge in the technical field can make some changes and changes without departing from the spirit and scope of the new creation. Retouching, so the scope of protection of the creation of this new model shall be subject to the scope of the attached patent application.
200‧‧‧取像裝置 200‧‧‧Image capture device
30‧‧‧基板 30‧‧‧Substrate
10‧‧‧蓋板 10‧‧‧Cover
40‧‧‧取像器 40‧‧‧Viewfinder
11‧‧‧遮蔽層 11‧‧‧Masking layer
S1‧‧‧第一表面 S1‧‧‧First surface
12‧‧‧透光區域 12‧‧‧Transparent area
S2‧‧‧第二表面 S2‧‧‧Second surface
13‧‧‧微透鏡陣列 13‧‧‧Micro lens array
S3‧‧‧第三表面 S3‧‧‧The third surface
20‧‧‧光源 20‧‧‧Light source
AG‧‧‧空氣間隙層 AG‧‧‧Air gap layer
Claims (20)
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