TWM558941U - Image capture apparatus - Google Patents

Image capture apparatus Download PDF

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Publication number
TWM558941U
TWM558941U TW106218480U TW106218480U TWM558941U TW M558941 U TWM558941 U TW M558941U TW 106218480 U TW106218480 U TW 106218480U TW 106218480 U TW106218480 U TW 106218480U TW M558941 U TWM558941 U TW M558941U
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Taiwan
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light
image capturing
reflective element
reflective
light guiding
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TW106218480U
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Chinese (zh)
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黃承鈞
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金佶科技股份有限公司
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Abstract

An image capture apparatus is provided in the instant disclosure. The image capture apparatus includes a light guide device an image capture device and a light emitting device. The light guide device having a first side, a second side and a light emitting portion located at the second side. The light emitting portion includes a plurality of enhanced transmission structures. The image capture device is disposed at the second side of the light guide device corresponding to the position of the enhanced transmission structures. A light beam, which is generated by the light emitting device and transmitted at least by the light guide device, is totally reflected to form a signal light beam. Thereafter, the signal light beam passes through the enhanced transmission structures and then received by the image capture device.

Description

取像裝置 Image capture device

本創作涉及一種光電裝置,特別是涉及一種取像裝置。 The present invention relates to an optoelectronic device, and more particularly to an imaging device.

現有的光學式生物辨識系統可應用於偵測以及辨識臉部、聲音、虹膜、視網膜或是指紋。以光學式指紋辨識系統為例,在光學式指紋辨識系統中的影像擷取裝置通常包括基板、發光件、透光件、導光件以及影像感測器,其中發光件以及影像感測器是設置在基板上,導光件設置在發光件以及影像感測器上,且透光件設置在導光件上。 Existing optical biometric systems can be used to detect and identify faces, sounds, irises, retinas or fingerprints. Taking an optical fingerprint identification system as an example, an image capturing device in an optical fingerprint identification system generally includes a substrate, a light emitting member, a light transmitting member, a light guiding member, and an image sensor, wherein the light emitting member and the image sensor are The light guide is disposed on the substrate, and the light guide is disposed on the light guide and the image sensor, and the light transmissive member is disposed on the light guide.

發光件所產生的光束通過導光件而被傳遞至透光件,並於透光件與環境介質的交界面產生全反射之後再投射到影像感測器被接收。由於手指具有多條不規則的凸紋與凹紋,當使用者將手指放置在透光件上時,凸紋會接觸透光件,但凹紋不會接觸透光件。因此,接觸透光件的凸紋會破壞光束在透光件內的全反射,而未接觸透光件的凹紋則不會影響光束的全反射,從而使影像感測器擷取到的指紋圖案具有對應凸紋的暗紋以及對應凹紋的亮紋。隨後,通過影像處理裝置來處理影像感測器所擷取的指紋圖案,可進一步判定使用者的身分。 The light beam generated by the illuminating member is transmitted to the light transmitting member through the light guiding member, and is totally reflected at the interface between the light transmitting member and the environmental medium, and then projected to the image sensor to be received. Since the finger has a plurality of irregular ridges and indentations, when the user places the finger on the light-transmitting member, the ridge will contact the light-transmitting member, but the concave groove will not contact the light-transmitting member. Therefore, the ridges contacting the light transmitting member may destroy the total reflection of the light beam in the light transmitting member, and the concave lines not contacting the light transmitting member will not affect the total reflection of the light beam, thereby causing the fingerprint captured by the image sensor. The pattern has dark lines corresponding to the ridges and bright lines corresponding to the indentations. Then, the fingerprint pattern captured by the image sensor is processed by the image processing device to further determine the identity of the user.

另外,在現有的影像擷取裝置中,通常會進一步使用光學膠來填充導光件與基板之間的間隙,以及填充導光件和影像感測器之間的空隙。 In addition, in the conventional image capturing device, an optical glue is further used to fill a gap between the light guide and the substrate, and to fill a gap between the light guide and the image sensor.

然而,由於製程條件上的限制,光學膠內可能會具有微小氣泡,或者是沒有被完全固化。若是在導光件和影像感測器之間的光學膠內含有氣泡,或者是因為光學膠未被完全固化而產生空 隙,會導致在透光件被全反射之後的光束在進入影像感測器之前再度被全反射,而無法被影像感測器接收。這將使影像感測器所擷取的指紋圖案不完整,而降低辨識度。 However, due to limitations in process conditions, the optical glue may have tiny bubbles or may not be fully cured. If there is air bubbles in the optical glue between the light guide and the image sensor, or because the optical glue is not fully cured, it is empty. The gap causes the light beam after the light-transmitting member is totally reflected to be totally reflected again before entering the image sensor, and cannot be received by the image sensor. This will make the fingerprint pattern captured by the image sensor incomplete and reduce the recognition.

本創作所要解決的技術問題在於,針對現有技術的不足提供一種取像裝置,解決信號光束在進入影像擷取元件之前再度被全反射而導致取像裝置的辨識度降低的問題。 The technical problem to be solved by the present invention is to provide an image capturing device for the deficiencies of the prior art, which solves the problem that the signal beam is totally reflected again before entering the image capturing component, resulting in a decrease in the visibility of the image capturing device.

為了解決上述的技術問題,本新型所採用的其中一技術方案是,提供一種取像裝置,其包括導光元件、影像擷取元件以及發光元件。導光元件具有第一側以及第二側,導光元件具有位於第二側的出光部,且出光部設有多個增透微結構。影像擷取元件對應於多個增透微結構而配置於導光元件的第二側。發光元件用於產生一在導光元件內傳遞的光束,光束至少在導光元件內經過至少一次全反射而形成一投向多個增透微結構的信號光束,且信號光束穿過多個增透微結構以投向影像擷取元件。 In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide an image capturing device including a light guiding element, an image capturing element, and a light emitting element. The light guiding element has a first side and a second side, the light guiding element has a light exiting portion on the second side, and the light emitting portion is provided with a plurality of antireflection microstructures. The image capturing element is disposed on the second side of the light guiding element corresponding to the plurality of antireflection microstructures. The illuminating element is configured to generate a light beam transmitted in the light guiding element, the light beam forming at least one total reflection in the light guiding element to form a signal beam directed to the plurality of antireflection microstructures, and the signal beam passes through the plurality of antireflection micro The structure is directed to the image capture component.

本創作的其中一有益效果在於,本創作所提供的取像裝置,其能通過“導光元件具有設置在出光部的多個增透微結構”以及“影像擷取元件對應於多個增透微結構配置於導光元件的第二側”的技術方案,以避免信號光束在進入影像擷取元件之前再度被全反射,從而提升取像裝置的影像辨識度。 One of the beneficial effects of the present invention is that the image capturing device provided by the present invention can pass through "the light guiding element has a plurality of antireflection microstructures disposed in the light exiting portion" and the "image capturing component corresponds to a plurality of antireflection The technical solution of the microstructure is disposed on the second side of the light guiding element to prevent the signal beam from being totally reflected again before entering the image capturing component, thereby improving the image recognition degree of the image capturing device.

為使能更進一步瞭解本創作的特徵及技術內容,請參閱以下有關本創作的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本新型加以限制。 In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are provided for reference and description only, and are not intended to limit the present invention.

1、1’、1”‧‧‧取像裝置 1, 1', 1" ‧‧‧ image capture device

10‧‧‧導光元件 10‧‧‧Light guiding elements

S1‧‧‧第一側 S1‧‧‧ first side

S2‧‧‧第二側 S2‧‧‧ second side

100‧‧‧增透微結構 100‧‧‧Enhanced microstructure

100R‧‧‧稜線 100R‧‧‧ ridgeline

100C‧‧‧頂點 100C‧‧‧ culmination

101‧‧‧受光區 101‧‧‧Light-receiving area

102‧‧‧背光區 102‧‧‧Backlight area

C1‧‧‧第一凹陷部 C1‧‧‧The first depression

C2‧‧‧第二凹陷部 C2‧‧‧second depression

14‧‧‧基板 14‧‧‧Substrate

15‧‧‧第一反射元件 15‧‧‧First reflective element

16‧‧‧第二反射元件 16‧‧‧Second reflective element

17‧‧‧第三反射元件 17‧‧‧ Third reflective element

19‧‧‧第四反射元件 19‧‧‧fourth reflective element

18、18a、18b‧‧‧吸光元件 18, 18a, 18b‧‧‧ light absorbing elements

20‧‧‧擋塊 20‧‧ ‧block

F‧‧‧物體 F‧‧‧ objects

D1‧‧‧第一方向 D1‧‧‧ first direction

D2‧‧‧第二方向 D2‧‧‧ second direction

D3‧‧‧第三方向 D3‧‧‧ third direction

E1‧‧‧入光部 E1‧‧‧Into the Department of Light

E2‧‧‧出光部 E2‧‧‧Lighting Department

103‧‧‧光學微結構 103‧‧‧Optical microstructure

11‧‧‧透光元件 11‧‧‧Lighting components

110‧‧‧外表面 110‧‧‧ outer surface

12‧‧‧影像擷取元件 12‧‧‧Image capture component

120‧‧‧光接收面 120‧‧‧Light receiving surface

13‧‧‧發光元件 13‧‧‧Lighting elements

G1‧‧‧光學膠 G1‧‧‧Optical adhesive

P1‧‧‧垂直參考面 P1‧‧‧Vertical reference plane

θ1‧‧‧第一夾角 Θ1‧‧‧ first angle

θ2‧‧‧第二夾角 Θ2‧‧‧second angle

P2‧‧‧連線 P2‧‧‧ connection

L‧‧‧光束 L‧‧‧beam

L’‧‧‧信號光束 L’‧‧‧Signal beam

L1‧‧‧雜散光 L1‧‧‧ stray light

C3‧‧‧凹陷部 C3‧‧‧Depression

圖1為本創作其中一實施例的取像裝置的剖面示意圖。 FIG. 1 is a schematic cross-sectional view of an image taking device according to an embodiment of the present invention.

圖2為圖1的多個增透微結構在區域II的局部放大示意圖。 2 is a partially enlarged schematic view of a plurality of antireflection microstructures of FIG. 1 in a region II.

圖3為本創作其中一實施例的導光元件的局部底面示意圖。 FIG. 3 is a partial bottom plan view of a light guiding element according to an embodiment of the present invention.

圖4為本創作另一實施例的導光元件的局部底面示意圖。 4 is a partial bottom plan view of a light guiding element according to another embodiment of the present invention.

圖5為本創作另一實施例的導光元件的局部剖面示意圖。 FIG. 5 is a partial cross-sectional view of a light guiding element according to another embodiment of the present invention.

圖6為本創作另一實施例的取像裝置的剖面示意圖。 Fig. 6 is a cross-sectional view showing the image taking device of another embodiment of the present invention.

圖7為本創作再一實施例的取像裝置的剖面示意圖。 FIG. 7 is a cross-sectional view of the image taking device according to still another embodiment of the present invention.

圖8為本創作又一實施例的取像裝置的剖面示意圖。 FIG. 8 is a schematic cross-sectional view of an image taking device according to still another embodiment of the present invention.

圖9為本創作又另一實施例的取像裝置的剖面示意圖。 FIG. 9 is a cross-sectional view of the image taking device according to still another embodiment of the present invention.

圖10為本創作又另一實施例的取像裝置的剖面示意圖。 FIG. 10 is a cross-sectional view of the image taking device according to still another embodiment of the present invention.

圖11為本創作又另一實施例的取像裝置的剖面示意圖。 Figure 11 is a cross-sectional view showing the image taking device of still another embodiment of the present invention.

以下是通過特定的具體實施例來說明本創作所公開有關“取像裝置”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本創作的優點與效果。本創作可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本創作的構思下進行各種修改與變更。另外,本創作的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本創作的相關技術內容,但所公開的內容並非用以限制本創作的保護範圍。 The following is a description of an embodiment of the "image taking device" disclosed in the present disclosure by a specific embodiment, and those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in the present specification. The present invention can be implemented or applied in various other specific embodiments. The details of the present specification can also be variously modified and changed without departing from the concept of the present invention. In addition, the drawings of the present creation are only for the purpose of simple illustration, and are not stated in advance according to the actual size. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the scope of protection of the present invention.

應理解,雖然本文中可能使用術語第一、第二、第三等來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。 It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements or signals, these elements or signals are not limited by these terms. These terms are primarily used to distinguish one element from another, or one signal and another. In addition, the term "or" as used herein may include a combination of any one or more of the associated listed items, depending on the actual situation.

請參閱圖1以及圖2,圖1顯示本創作其中一實施例的取像裝置的剖面示意圖。圖2為圖1的多個增透微結構在區域II的局部放大示意圖。 Please refer to FIG. 1 and FIG. 2. FIG. 1 is a cross-sectional view showing the image capturing apparatus of one embodiment of the present invention. 2 is a partially enlarged schematic view of a plurality of antireflection microstructures of FIG. 1 in a region II.

本創作其中一實施例提供一種取像裝置1。取像裝置1是位於一環境介質中來使用。在一實施例中,前述的環境介質例如是空氣、水或者是其他種類的環境介質。取像裝置1可用以擷取一物體F的影像,以進行辨識。前述的物體F例如是使用者的手指、 手掌、手腕或者是眼球,而取像裝置1所擷取的影像例如是指紋、掌紋、靜脈、瞳孔或者是虹膜等影像,但本創作不以此為限。 One embodiment of the present invention provides an image taking device 1. The image taking device 1 is used in an environmental medium. In one embodiment, the aforementioned environmental medium is, for example, air, water, or other types of environmental media. The image capturing device 1 can be used to capture an image of an object F for identification. The aforementioned object F is, for example, a user's finger, The palm, the wrist or the eyeball, and the image captured by the image capturing device 1 is, for example, a fingerprint, a palm print, a vein, a pupil, or an iris, but the present invention is not limited thereto.

如圖1所示,本創作其中一實施例的取像裝置1包括基板14、發光元件13、導光元件10、透光元件11以及影像擷取元件12。 As shown in FIG. 1, the image capturing apparatus 1 of one embodiment of the present invention includes a substrate 14, a light emitting element 13, a light guiding element 10, a light transmitting element 11, and an image capturing element 12.

導光元件10用以使光束在其中傳遞。因此,導光元件10的材料可以根據所欲傳遞的光束來選擇,例如是可用以傳遞可見光的玻璃、聚甲基丙烯酸甲酯(polymethymethacrylate,PMMA)或是聚碳酸酯(Polycarbonate,PC)。在其他實施例中,當導光元件10所欲傳遞的光束為紅外光或其他不可見光時,導光元件10的材料也可以根據實際需求選擇其他種類。在一實施例中,導光元件10的折射率可大於或等於1.4,且小於或等於1.6,但本創作並不限制。 The light guiding element 10 is used to transmit a light beam therein. Therefore, the material of the light guiding element 10 can be selected according to the light beam to be transmitted, for example, glass for transmitting visible light, polymethymethacrylate (PMMA) or polycarbonate (PC). In other embodiments, when the light beam to be transmitted by the light guiding element 10 is infrared light or other invisible light, the material of the light guiding element 10 can also be selected according to actual needs. In an embodiment, the refractive index of the light guiding element 10 may be greater than or equal to 1.4 and less than or equal to 1.6, but the creation is not limited.

本實施例的導光元件10具有一第一側S1及與第一側S1相對的一第二側S2,且導光元件10並具有位於第二側S2的一入光部E1以及一出光部E2。光束L由入光部E1進入導光元件10,以及在導光元件10內傳遞,之後通過至少一次全反射而形成一信號光束L’,再由導光元件10的出光部E2離開導光元件10。本實施例中,在導光元件10的出光部E2設有多個增透微結構100。 The light guiding element 10 of the present embodiment has a first side S1 and a second side S2 opposite to the first side S1, and the light guiding element 10 has a light entering portion E1 and a light emitting portion on the second side S2. E2. The light beam L enters the light guiding element 10 from the light entering portion E1 and is transmitted in the light guiding element 10, and then forms a signal light beam L' by at least one total reflection, and then exits the light guiding element from the light exiting portion E2 of the light guiding element 10. 10. In the present embodiment, a plurality of antireflection microstructures 100 are provided in the light exit portion E2 of the light guiding element 10.

需先說明的是,當信號光束L’由導光元件10進入到環境介質(如:空氣或氣泡)中時,為了避免光束投射到出光部E2的角度大於導光元件10的全反射臨界角,而導致原本應該由出光部E2出射的信號光束L’又再度被全反射。因此,在本實施例中,通過使出光部E2具有多個增透微結構100,以破壞信號光束L’的全反射。 It should be noted that when the signal beam L' is entered into the environmental medium (such as air or air bubbles) by the light guiding element 10, the angle of the light beam projected to the light exiting portion E2 is greater than the critical angle of the total reflection of the light guiding element 10. Therefore, the signal beam L' which should originally be emitted by the light exit portion E2 is again totally reflected. Therefore, in the present embodiment, the light-emitting portion E2 has a plurality of anti-transmission microstructures 100 to destroy the total reflection of the signal light beam L'.

具體而言,每一個增透微結構100具有一受光區101以及一背光區102。在本實施例中,受光區101使信號光束L’的入射角小於導光元件10的全反射臨界角,而背光區102會使信號光束L’的入射角大於全反射臨界角。在一實施例中,背光區102會大致平行於信號光束L’的主要行進方向,從而使信號光束L’較不容易投射在背光區102。另一方面,受光區101大致垂直於光束的主要 行進方向,且受光區101的面積會大於背光區102的面積,從而使大部分的信號光束L’都投射到受光區101,且投射到受光區101的信號光束L’也較不容易被全反射。 Specifically, each of the anti-reflection microstructures 100 has a light receiving area 101 and a backlight area 102. In the present embodiment, the light receiving area 101 makes the incident angle of the signal light beam L' smaller than the total reflection critical angle of the light guiding element 10, and the backlight area 102 causes the incident angle of the signal light beam L' to be larger than the total reflection critical angle. In one embodiment, backlight region 102 will be substantially parallel to the main direction of travel of signal beam L' such that signal beam L' is less likely to be projected in backlight region 102. On the other hand, the light receiving region 101 is substantially perpendicular to the main beam. The traveling direction, and the area of the light receiving area 101 is larger than the area of the backlight area 102, so that most of the signal light beam L' is projected to the light receiving area 101, and the signal light beam L' projected to the light receiving area 101 is less likely to be fully reflection.

在此,請繼續參考圖1到圖2,須說明的是,儘管少部分的雜散光可能會投射到背光區102,但是投射到背光區102的雜散光會被全反射,而不會從出光部E2出射而干擾影像擷取元件12的信號造成疊影。另外,信號光束L’通過受光區101後,部分光束會在影像擷取元件12的光接收面120後穿過背光區102時折射為另一角度較大的光束,此光束會在透光元件11的外表面110進行全反射,因此全反射光束角度較原路徑來的大,導致此光束行進路線會遠於原路徑,故將不會再次進入到影像擷取元件12的光接收面120,從而避免信號造成疊影的現象。 Here, please continue to refer to FIG. 1 to FIG. 2. It should be noted that although a small amount of stray light may be projected to the backlight region 102, the stray light projected to the backlight region 102 may be totally reflected without being emitted from the light. The signal emitted by the portion E2 that interferes with the image capturing element 12 causes a ghost. In addition, after the signal beam L' passes through the light receiving area 101, part of the light beam will refract into a light beam of another angle when passing through the backlight area 102 after the light receiving surface 120 of the image capturing element 12, and the light beam will be in the light transmitting element. The outer surface 110 of the 11 is totally reflected, so that the total reflected beam angle is larger than that of the original path, so that the beam travels the route farther than the original path, so that it will not enter the light receiving surface 120 of the image capturing element 12 again. Thereby avoiding the phenomenon of signal aliasing.

請參照圖2,在本實施例中,多個增透微結構100彼此相連,且每一個增透微結構100的剖面形狀可以呈山形、波浪形或鋸齒形。在圖2的實施例中,每一個增透微結構100的剖面形狀為鋸齒形。另外,本實施例的受光區101與背光區102都是傾斜平面。 Referring to FIG. 2, in the embodiment, the plurality of anti-reflection microstructures 100 are connected to each other, and the cross-sectional shape of each of the anti-transmission microstructures 100 may be mountain-shaped, wavy or zigzag. In the embodiment of FIG. 2, the cross-sectional shape of each of the anti-reflection microstructures 100 is zigzag. In addition, the light receiving region 101 and the backlight region 102 of the present embodiment are both inclined planes.

請配合參照圖2以及圖3。圖3顯示本創作其中一實施例的導光元件的局部底視示意圖。進一步而言,在本實施例中,每一個增透微結構100為非對稱凸柱,且非對稱凸柱沿著第一方向D1延伸,且沿著第二方向D2並排。 Please refer to FIG. 2 and FIG. 3 together. Fig. 3 is a partial bottom plan view showing a light guiding element of one embodiment of the present invention. Further, in the embodiment, each of the anti-reflection microstructures 100 is an asymmetric protrusion, and the asymmetric protrusions extend along the first direction D1 and are arranged side by side along the second direction D2.

每一個非對稱凸柱具有一稜線100R,也就是受光區101與背光區102的交界線。在本實施例中,定義出一通過稜線100R的垂直參考面P1。如圖2所示,垂直參考面P1平行於第三方向D3,也就是平行於導光元件10的厚度方向。受光區101與背光區102是分別位於垂直參考面P1的兩相反側,受光區101與垂直參考面P1形成一第一夾角θ1,而背光區102與垂直參考面P1形成一第二夾角θ2。在本實施例中,第一夾角θ1會大於第二夾角θ2,以確保大部分的光束可投射到受光區101,且不會再被全反射。 Each of the asymmetric studs has a ridgeline 100R, that is, a boundary line between the light receiving region 101 and the backlight region 102. In the present embodiment, a vertical reference plane P1 passing through the ridgeline 100R is defined. As shown in FIG. 2, the vertical reference plane P1 is parallel to the third direction D3, that is, parallel to the thickness direction of the light guiding element 10. The light receiving area 101 and the backlight area 102 are respectively located on opposite sides of the vertical reference plane P1. The light receiving area 101 forms a first angle θ1 with the vertical reference plane P1, and the backlight area 102 forms a second angle θ2 with the vertical reference plane P1. In the present embodiment, the first included angle θ1 is greater than the second included angle θ2 to ensure that most of the light beam can be projected to the light receiving region 101 and is not totally reflected again.

另外,在本實施例中,對於兩相鄰的增透微結構100而言,其中一個增透微結構100的受光區101的邊緣會和另一個增透微結構100的背光區102的邊緣重合。也就是說,在兩相鄰的增透微結構100之間並未形成用以連接兩增透微結構100的連接區,以進一步減少光束被全反射的機率。但是在其他實施例中,只要連接區相對於垂直參考面P1的傾斜角度可以避免光束被全反射,或者是不影響光束的行進路徑,也可以在每兩相鄰的增透微結構100之間設置連接區。 In addition, in the present embodiment, for two adjacent anti-reflection microstructures 100, the edge of the light-receiving region 101 of one of the anti-reflection microstructures 100 coincides with the edge of the backlight region 102 of the other anti-reflection microstructure 100. . That is, a connection region for connecting the two anti-reflection microstructures 100 is not formed between two adjacent anti-reflection microstructures 100 to further reduce the probability of the beam being totally reflected. However, in other embodiments, as long as the angle of inclination of the connection region with respect to the vertical reference plane P1 can prevent the beam from being totally reflected or does not affect the path of the beam, it can also be between every two adjacent anti-reflection microstructures 100. Set the connection area.

另外,本創作實施例的增透微結構100的外觀並不限制於非對稱凸柱,且受光區101以及背光區102也可以是曲面,其中曲面例如是包括凹面或凸面。請參照圖4,其顯示本創作另一實施例的導光元件的局部底視示意圖。在本實施例中,多個增透微結構100是排列成陣列,且每一增透微結構100為偏心微透鏡。 In addition, the appearance of the anti-reflection microstructure 100 of the present embodiment is not limited to the asymmetric stud, and the light-receiving area 101 and the backlight area 102 may also be curved surfaces, wherein the curved surface includes, for example, a concave surface or a convex surface. Referring to FIG. 4, a partial bottom view of a light guiding element of another embodiment of the present invention is shown. In the present embodiment, the plurality of anti-reflection microstructures 100 are arranged in an array, and each of the anti-reflection microstructures 100 is an eccentric microlens.

如圖4所示,每一個增透微結構100的底部截面形狀為圓形,然而,從底視方向看,增透微結構100的頂點100C相對於底部截面形狀(圓形)的圓心偏移。也就是說,增透微結構100的頂點100C並未對準於底部截面形狀(圓形)的圓心。在本實施例中,每一個增透微結構100的邊緣會和另一個增透微結構100的邊緣彼此連接。 As shown in FIG. 4, the bottom cross-sectional shape of each of the anti-reflection microstructures 100 is circular, however, the center of the apex 100C of the anti-reflection microstructure 100 is offset from the center of the bottom cross-sectional shape (circular) as viewed from the bottom direction. . That is, the apex 100C of the anti-reflection microstructure 100 is not aligned to the center of the bottom cross-sectional shape (circular). In this embodiment, the edges of each of the anti-reflection microstructures 100 and the edges of the other anti-reflection microstructures 100 are connected to each other.

另外,在本實施例中,定義沿著第一方向D1排列的同一行的所有增透微結構100的頂點100C形成一連線P2,而連線P2可將每一個增透微結構100的表面區域區分為受光區101以及背光區102。具體而言,受光區101是位於連線P2右半部分的表面區域,而背光區102則是位於連線P2左半部分的表面區域。由圖4中也可以看出,受光區101的面積會大於背光區102的面積。 In addition, in the present embodiment, the apex 100C of all the anti-reflection microstructures 100 defining the same row arranged along the first direction D1 forms a line P2, and the connection line P2 can surface the surface of each of the anti-reflection microstructures 100. The area is divided into a light receiving area 101 and a backlight area 102. Specifically, the light receiving area 101 is a surface area located at the right half of the line P2, and the backlight area 102 is a surface area located at the left half of the line P2. As can also be seen from FIG. 4, the area of the light receiving area 101 may be larger than the area of the backlight area 102.

請參照圖5,其顯示本創作另一實施例的導光元件的局部剖面示意圖。具體而言,圖5可以是圖4中的多個增透微結構100在第二方向D2上的剖面示意圖。在本實施例中,增透微結構100的剖面形狀是大致呈波浪形或山形,也就是說,受光區101與背光 區102都是曲面。 Referring to FIG. 5, a partial cross-sectional view of a light guiding element of another embodiment of the present invention is shown. Specifically, FIG. 5 may be a schematic cross-sectional view of the plurality of anti-reflection microstructures 100 of FIG. 4 in the second direction D2. In this embodiment, the cross-sectional shape of the anti-reflection microstructure 100 is substantially wavy or mountain-shaped, that is, the light-receiving area 101 and the backlight. Zones 102 are all curved surfaces.

另外,通過受光區101任意一點的切面和通過頂點100C的垂直參考面P1之間形成一第一夾角θ1,而通過背光區102任意一點的切面和通過頂點100C的垂直參考面P1之間形成一第二夾角,且第一夾角會大於第二夾角。據此,當光束投射到受光區101時,可以確保光束的入射角小於導光元件10的全反射臨界角,以避免光束被全反射。 In addition, a first angle θ1 is formed between a tangent plane passing through an arbitrary point of the light receiving region 101 and a vertical reference plane P1 passing through the vertex 100C, and a tangent plane passing through any point of the backlight region 102 and a vertical reference plane P1 passing through the vertex 100C form a The second angle is, and the first angle is greater than the second angle. Accordingly, when the light beam is projected to the light receiving region 101, it is ensured that the incident angle of the light beam is smaller than the total reflection critical angle of the light guiding element 10 to prevent the light beam from being totally reflected.

在其他實施例中,增透微結構100也可以是其他種類的偏心錐體,例如是偏心多角形錐體,也就是增透微結構100的底部截面形狀為三角形、四角形或其他多邊形。只要能夠減少光束被全反射的比例(或者增加光束穿透出光部E2的比例)本創作實施例並不限制增透微結構100的形狀。 In other embodiments, the anti-reflection microstructures 100 can also be other types of eccentric cones, such as eccentric polygonal cones, that is, the bottom cross-sectional shape of the anti-reflection microstructures 100 is triangular, quadrangular, or other polygonal shape. The presently-created embodiment does not limit the shape of the anti-reflection microstructure 100 as long as it can reduce the proportion of the total reflection of the light beam (or increase the proportion of the light beam that passes through the light exit portion E2).

請再參照圖1。本實施例的取像裝置1還包括透光元件11。透光元件11設置在導光元件10的第一側S1,並具有一和環境介質接觸並且背向導光元件10的外表面110。若是取像裝置1應用於光學式指紋辨識系統中,用以擷取指紋及/或靜脈影像,透光元件11的外表面110可供手指接觸或按壓,以進行偵測及辨識。 Please refer to Figure 1 again. The image taking device 1 of the present embodiment further includes a light transmitting member 11. The light transmissive element 11 is disposed on the first side S1 of the light guiding element 10 and has an outer surface 110 that is in contact with the environmental medium and that is opposite to the light element 10. If the image capturing device 1 is used in an optical fingerprinting system for capturing fingerprints and/or vein images, the outer surface 110 of the light transmitting member 11 can be touched or pressed by a finger for detection and identification.

透光元件11的材料可以和導光元件10的材料相同並具有相近的折射係數。據此,當光束由導光元件10傳遞到透光元件11時,可避免光束產生折射。在一實施例中,透光元件11的材料可選自玻璃、聚甲基丙烯酸甲酯(polymethymethacrylate,PMMA)或是聚碳酸酯(Polycarbonate,PC)或其他適當的材料。另外,透光元件11可通過選用適合的光學膠(未圖示)或者是其他固定手段設置在導光元件10上。在本案中,所述的透光元件可以是一個OLED顯示面板或者是帶有觸控層的OLED顯示面板,其結構可以參閱申請人在美國所提交的62/533,632號,專利名稱為生物感測裝置的內文相關部分。應當理解的是,帶有觸控層的OLED顯示面板的外表面具有保護層,此外,並不加以侷限該顯示器是剛性或者是 柔性的面板,在此一併敘明。 The material of the light transmissive element 11 may be the same as the material of the light guiding element 10 and have similar refractive indices. According to this, when the light beam is transmitted from the light guiding element 10 to the light transmitting element 11, refraction of the light beam can be prevented. In an embodiment, the material of the light transmissive element 11 may be selected from the group consisting of glass, polymethymethacrylate (PMMA) or polycarbonate (PC) or other suitable materials. In addition, the light transmissive element 11 can be disposed on the light guiding element 10 by using a suitable optical glue (not shown) or other fixing means. In the present case, the light transmissive element may be an OLED display panel or an OLED display panel with a touch layer, and the structure thereof can be referred to the applicant's U.S. Patent No. 62/533,632, the patent name is biological sensing. The relevant part of the context of the device. It should be understood that the outer surface of the OLED display panel with the touch layer has a protective layer, and further, it is not limited to the display being rigid or Flexible panels are described here.

取像裝置1還包括位於導光元件10第二側的基板14、發光元件13以及影像擷取元件12,其中發光元件13與影像擷取元件12都設置在基板14上。基板14可以是線路板,線路板已具有預先配置的線路。另外,基板14的材料為吸光材料。 The image capturing device 1 further includes a substrate 14 on the second side of the light guiding element 10, a light emitting element 13 and an image capturing element 12, wherein the light emitting element 13 and the image capturing element 12 are both disposed on the substrate 14. The substrate 14 can be a circuit board that already has pre-configured lines. In addition, the material of the substrate 14 is a light absorbing material.

影像擷取元件12對應於導光元件10的多個增透微結構100而配置於基板14上,用以擷取物體F的影像。換句話說,導光元件10是位於影像擷取元件12以及透光元件11之間。 The image capturing component 12 is disposed on the substrate 14 corresponding to the plurality of antireflection microstructures 100 of the light guiding component 10 for capturing an image of the object F. In other words, the light guiding element 10 is located between the image capturing element 12 and the light transmitting element 11.

影像擷取元件12具有一光接收面120,以接受由導光元件10的出光部E2所出射的光束L。換言之,光束穿過多個增透微結構100之後,會投射到影像擷取元件12的光接收面120。影像擷取元件12例如是電荷耦合元件(Charge Coupled Device,CCD)或是互補式金屬氧化物半導體元件(Complementary Metal-Oxide Semiconductor,CMOS)。然而,在其他實施例中,影像擷取元件12也可以使用其他影像感測器。 The image capturing element 12 has a light receiving surface 120 for receiving the light beam L emitted by the light exiting portion E2 of the light guiding element 10. In other words, after the light beam passes through the plurality of anti-reflection microstructures 100, it is projected onto the light-receiving surface 120 of the image capturing element 12. The image capturing element 12 is, for example, a charge coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS). However, in other embodiments, the image capture component 12 can also use other image sensors.

發光元件13鄰近於導光元件10的入光部E1設置在基板14上,用於產生一在導光元件10內傳遞的光束L。在本實施例中,發光元件13是設置於導光元件10之外,並且發光元件13所產生的光束L會投射至導光元件10的一入光部E1。發光元件13所產生的光束L可以是可見光或者是紅外光,且發光元件13可以是發光二極體或是其他適合的發光元件,本創作並不限制。 The light-emitting element 13 is disposed on the substrate 14 adjacent to the light-input portion E1 of the light-guiding element 10 for generating a light beam L transmitted in the light guiding element 10. In the present embodiment, the light-emitting element 13 is disposed outside the light-guiding element 10, and the light beam L generated by the light-emitting element 13 is projected to a light-injecting portion E1 of the light-guiding element 10. The light beam L generated by the light-emitting element 13 may be visible light or infrared light, and the light-emitting element 13 may be a light-emitting diode or other suitable light-emitting element, and the creation is not limited.

進一步而言,本創作實施例的導光元件10的第二側S2還具有一用以容納發光元件13的第一凹陷部C1以及一用以容納影像擷取元件12的第二凹陷部C2。導光元件10的入光部E1位於第一凹陷部C1,而導光元件10的出光部E2是位於第二凹陷部C2。 Further, the second side S2 of the light guiding element 10 of the present embodiment further has a first recess C1 for accommodating the light emitting element 13 and a second recess C2 for accommodating the image capturing element 12. The light incident portion E1 of the light guiding element 10 is located at the first recess portion C1, and the light exit portion E2 of the light guiding element 10 is located at the second recess portion C2.

如圖1所示,當發光元件、導光元件10以及影像擷取元件12都設置在基板14上時,發光元件13正好可容納並且被卡固於第一凹陷部C1內,而影像擷取元件12正好可容納並且被卡固於第 二凹陷部C2內。另外,在本實施例中,多個增透微結構100是位於第二凹陷部C2的底部。如此,可以縮小取像裝置1的整體體積。然而,在其他實施例中,第一凹陷部C1與第二凹陷部C2也可以省略。在另一實施例中,發光元件13可以是被埋設在導光元件10內。具體而言,可以先將發光元件13固定在基板14上之後,再通過灌膠以及固化等步驟來形成導光元件10,從而使發光元件13被埋設於導光元件10內。此時,發光元件13所產生的光束L不需通過其他介質而直接在導光元件10內被傳遞。 As shown in FIG. 1, when the light-emitting element, the light-guiding element 10, and the image capturing element 12 are all disposed on the substrate 14, the light-emitting element 13 can be accommodated and clamped in the first recess C1, and the image is captured. Element 12 is just accommodating and is stuck in the Two recesses inside C2. In addition, in the present embodiment, the plurality of anti-reflection microstructures 100 are located at the bottom of the second recessed portion C2. In this way, the overall volume of the image taking device 1 can be reduced. However, in other embodiments, the first recess C1 and the second recess C2 may also be omitted. In another embodiment, the light emitting element 13 may be embedded within the light guiding element 10. Specifically, after the light-emitting element 13 is fixed on the substrate 14 , the light-guiding element 10 is formed by a step of potting and curing, and the light-emitting element 13 is embedded in the light-guiding element 10 . At this time, the light beam L generated by the light-emitting element 13 is directly transmitted through the light guiding element 10 without passing through other medium.

除此之外,本創作實施例的發光元件13都是設置於導光元件10的第二側S2,但在其他實施例中,發光元件13也可以設置在導光元件10的第一側S1。 In addition, the light-emitting elements 13 of the present embodiment are disposed on the second side S2 of the light-guiding element 10, but in other embodiments, the light-emitting elements 13 may also be disposed on the first side S1 of the light-guiding element 10. .

另外,本創作實施例的取像裝置1還進一步包括第一反射元件15以及第二反射元件16。第一反射元件15與第二反射元件16分別配置在導光元件10的第一側S1與第二側S2。具體而言,第一反射元件15是位於透光元件11與導光元件10之間,第二反射元件16是位於基板14以及導光元件10之間。在一實施例中,第一反射元件15與第二反射元件16可以是反射片或者是形成於導光元件10表面的反射膜層,本創作並未限制。 In addition, the image taking device 1 of the present embodiment further includes a first reflective element 15 and a second reflective element 16. The first reflective element 15 and the second reflective element 16 are disposed on the first side S1 and the second side S2 of the light guiding element 10, respectively. Specifically, the first reflective element 15 is located between the light transmissive element 11 and the light guiding element 10 , and the second reflective element 16 is located between the substrate 14 and the light guiding element 10 . In an embodiment, the first reflective element 15 and the second reflective element 16 may be a reflective sheet or a reflective film layer formed on the surface of the light guiding element 10, which is not limited in the present invention.

另外,在本實施例中,第一反射元件15與第二反射元件16可彼此相互錯開設置,並在導光元件10的厚度方向上至少部分重疊,以將光束L導引至透光元件11。在其他實施例中,第一反射元件15與第二反射元件16也可以完全錯開而不重疊。因此,只要能夠將光束L導引至透光元件11,本創作並不限制第一反射元件15與第二反射元件16的相對位置或者是使光束L產生反射的形式。 In addition, in the present embodiment, the first reflective element 15 and the second reflective element 16 may be disposed offset from each other and at least partially overlapped in the thickness direction of the light guiding element 10 to guide the light beam L to the light transmitting element 11 . In other embodiments, the first reflective element 15 and the second reflective element 16 may also be completely staggered without overlapping. Therefore, the present invention does not limit the relative position of the first reflective element 15 and the second reflective element 16 or the form in which the light beam L is reflected as long as the light beam L can be guided to the light transmitting element 11.

舉例而言,在其他實施例中,也可以通過設計光束L的行進方向,使光束L在導光元件10與環境介質之間產生全反射。在這個情況下,第二反射元件16可以被省略。 For example, in other embodiments, the light beam L can also be totally reflected between the light guiding element 10 and the environmental medium by designing the direction of travel of the light beam L. In this case, the second reflective element 16 can be omitted.

整體而言,發光元件13所產生的光束L由入光部E1進入導光元件10內之後,依序通過第一反射元件15的反射與第二反射元件16的反射,而在導光元件10內向透光元件11傳遞,並且在透光元件11與環境介質的交界面,也就是透光元件11的外表面110,產生全反射。 In general, after the light beam L generated by the light-emitting element 13 enters the light-guiding element 10 from the light-input portion E1, the reflection of the first reflective element 15 and the reflection of the second reflective element 16 are sequentially performed, and the light-guiding element 10 is The inwardly transmissive element 11 is transferred, and at the interface of the light transmissive element 11 with the environmental medium, that is, the outer surface 110 of the light transmissive element 11, total reflection occurs.

當物體F(如:手指)接觸透光元件11的外表面110時,手指的凸紋接觸到外表面110,會使一部分光束L無法產生全反射,從而使影像擷取元件12取得對應手指凸紋的暗紋。另一方面,手指的凹紋並未接觸到透光元件11的外表面110,而使另一部分光束L仍可被全反射而形成一信號光束L’。信號光束L’朝向導光元件10的出光部E2投射,並通過導光元件10的多個增透微結構100而投向影像擷取元件12的光接收面120。後續再通過一影像處理元件,對影像擷取元件12所接收到的信號光束L’進行影像處理,可以得到物體F的指紋影像。 When the object F (eg, a finger) contacts the outer surface 110 of the light transmissive element 11, the convex line of the finger contacts the outer surface 110, so that a part of the light beam L cannot generate total reflection, so that the image capturing element 12 obtains a corresponding finger convex. Dark lines of grain. On the other hand, the concave of the finger does not contact the outer surface 110 of the light transmitting member 11, but the other partial light beam L can still be totally reflected to form a signal light beam L'. The signal light beam L' is projected toward the light exit portion E2 of the light guiding element 10, and is directed to the light receiving surface 120 of the image capturing element 12 through the plurality of antireflection microstructures 100 of the light guiding element 10. Subsequently, an image processing component is used to perform image processing on the signal beam L' received by the image capturing component 12 to obtain a fingerprint image of the object F.

也就是說,在本創作實施例中,通過在導光元件10的出光部E2設置增透微結構100,可以避免信號光束L’在進入影像擷取元件12之前被再度全反射,從而降低取像裝置1的影像辨識度。 That is to say, in the present embodiment, by providing the anti-reflection microstructure 100 in the light-emitting portion E2 of the light guiding element 10, it is possible to prevent the signal light beam L' from being totally totally reflected before entering the image capturing element 12, thereby reducing the taking. Image recognition of the image device 1.

請參照圖6,圖6為本創作另一實施例的取像裝置的剖面示意圖。圖6的取像裝置1和圖1的取像裝置1相同或相對應的元件具有相同的標號,且相同的部分不再贅述。 Please refer to FIG. 6. FIG. 6 is a cross-sectional view of the image capturing apparatus according to another embodiment of the present invention. The same or corresponding elements of the image capturing device 1 of FIG. 6 and the image capturing device 1 of FIG. 1 have the same reference numerals, and the same portions will not be described again.

在圖6實施例中,取像裝置1還包括位於導光元件10第二側S2的第三反射元件17。也就是說,第二反射元件16與第三反射元件17位於導光元件10的同一側,但彼此分隔設置。在本實施例中,光束L通過第一反射元件15、第二反射元件16與第三反射元件17的反射,以在導光元件10內進行傳遞,並投射至透光元件11。 In the embodiment of Fig. 6, the image taking device 1 further comprises a third reflective element 17 on the second side S2 of the light guiding element 10. That is, the second reflective element 16 and the third reflective element 17 are located on the same side of the light guiding element 10, but are spaced apart from each other. In the present embodiment, the light beam L is reflected by the first reflective element 15, the second reflective element 16, and the third reflective element 17 to be transmitted within the light guiding element 10 and projected to the light transmitting element 11.

在本實施例中,第一反射元件15與第二反射元件16在導光元件10的厚度方向上是完全重疊,而第一反射元件15和第三反 射元件17在導光元件10的厚度方向上只有部分重疊。 In the present embodiment, the first reflective element 15 and the second reflective element 16 are completely overlapped in the thickness direction of the light guiding element 10, and the first reflective element 15 and the third opposite element The radiation elements 17 are only partially overlapped in the thickness direction of the light guiding element 10.

另外,本實施例的取像裝置1還包括一設置於第二反射元件16與第三反射元件17之間的吸光元件18。在本實施例中,吸光元件18和第一反射元件15在導光元件10的厚度方向重疊。進一步而言,第一反射元件15的垂直投影可和吸光元件18至少部分重疊。 In addition, the image taking device 1 of the embodiment further includes a light absorbing element 18 disposed between the second reflective element 16 and the third reflective element 17. In the present embodiment, the light absorbing element 18 and the first reflective element 15 overlap in the thickness direction of the light guiding element 10. Further, the vertical projection of the first reflective element 15 can at least partially overlap the light absorbing element 18.

在其他實施例中,也可以在導光元件10的其他區域,也就是未設置第一反射元件15、第二反射元件16以及第三反射元件17的區域設置吸光元件18。舉例而言,取像裝置1還可以進一步包括設置在導光元件10的兩相反側壁面上的多個吸光元件18,前述的側壁面是指連接於導光元件10的第一側S1與第二側S2之間的表面。吸光元件18可以是對光束L不透明且不反光的遮蔽層,例如是油墨層或黏著層,或者是遮蔽片,但前述例示並非用以限制本創作的範圍。 In other embodiments, the light absorbing element 18 may also be disposed in other regions of the light guiding element 10, that is, regions where the first reflective element 15, the second reflective element 16, and the third reflective element 17 are not disposed. For example, the image capturing device 1 may further include a plurality of light absorbing elements 18 disposed on opposite side wall surfaces of the light guiding element 10, wherein the side wall surface refers to the first side S1 and the first side connected to the light guiding element 10. The surface between the two sides S2. The light absorbing element 18 may be an opaque layer that is opaque to the light beam L and is non-reflective, such as an ink layer or an adhesive layer, or a masking sheet, but the foregoing illustrations are not intended to limit the scope of the present invention.

吸光元件18可以吸收並減少未依循預定光路前進的雜散光,從而避免影像擷取元件12接收到來自信號光束L’以外的雜散光。另外,配置吸光元件18可以增加取像面積,並使傳遞到影像擷取元件12的信號光束L’更均勻,而有利於提高成像品質。 The light absorbing element 18 can absorb and reduce stray light that does not follow the predetermined optical path, thereby preventing the image capturing element 12 from receiving stray light from the signal light beam L'. In addition, the arrangement of the light absorbing element 18 can increase the image taking area and make the signal light beam L' transmitted to the image capturing element 12 more uniform, which is advantageous for improving the image quality.

請繼續參照圖7,圖7為本創作另一實施例的取像裝置的剖面示意圖。圖7的取像裝置1和圖6的取像裝置1相同或相對應的元件具有相同的標號,且相同的部分不再贅述。 Please refer to FIG. 7. FIG. 7 is a schematic cross-sectional view of the image taking device according to another embodiment of the present invention. The same or corresponding elements of the image capturing device 1 of FIG. 7 and the image capturing device 1 of FIG. 6 have the same reference numerals, and the same portions will not be described again.

在圖7的實施例中,取像裝置1還包括位於導光元件10第一側S1的第四反射元件19。也就是說,第一反射元件15與第四反射元件19位於導光元件10的同一側,但彼此分隔設置。在本實施例中,光束L是依序通過第一反射元件15、第二反射元件16、第四反射元件19與第三反射元件17的反射,以在導光元件10內進行傳遞,並投射至透光元件11。 In the embodiment of Fig. 7, the image taking device 1 further comprises a fourth reflective element 19 on the first side S1 of the light guiding element 10. That is, the first reflective element 15 and the fourth reflective element 19 are located on the same side of the light guiding element 10, but are disposed apart from each other. In the present embodiment, the light beam L is sequentially reflected by the first reflective element 15, the second reflective element 16, the fourth reflective element 19, and the third reflective element 17 to be transmitted and projected in the light guiding element 10. To the light transmissive element 11.

在本實施例中,第一反射元件15與第二反射元件16在導光 元件10的厚度方向上至少部分重疊,而第四反射元件19和第三反射元件17在導光元件10的厚度方向上也是部分重疊。但是,第一反射元件15與第三反射元件17在導光元件10的厚度方向上完全不重疊。 In the embodiment, the first reflective element 15 and the second reflective element 16 are guided by light. The element 10 at least partially overlaps in the thickness direction, and the fourth reflective element 19 and the third reflective element 17 also partially overlap in the thickness direction of the light guiding element 10. However, the first reflective element 15 and the third reflective element 17 do not overlap at all in the thickness direction of the light guiding element 10.

另外,本實施例的取像裝置1除了包括一設置於第二反射元件16與第三反射元件17之間的吸光元件18a之外,還進一步包括設置在第一反射元件15與第三反射元件17之間的另一吸光元件18b。在本實施例中,兩個吸光元件18a、18b和第一反射元件15在導光元件10的厚度方向上至少部分重疊。 In addition, the image capturing device 1 of the present embodiment further includes a first reflective component 15 and a third reflective component in addition to a light absorbing component 18a disposed between the second reflective component 16 and the third reflective component 17. Another light absorbing element 18b between 17. In the present embodiment, the two light absorbing elements 18a, 18b and the first reflective element 15 at least partially overlap in the thickness direction of the light guiding element 10.

和圖6的實施例相似,兩個吸光元件18a、18b可以吸收並減少未依循預定光路前進的雜散光,從而避免影像擷取元件12接收到來自信號光束L’以外的雜散光。另外,配置吸光元件18可以增加取像面積,並使傳遞到影像擷取元件12的信號光束L’更均勻,而有利於提高成像品質。 Similar to the embodiment of Fig. 6, the two light absorbing elements 18a, 18b can absorb and reduce stray light that does not follow the predetermined optical path, thereby preventing the image capturing element 12 from receiving stray light from the signal beam L'. In addition, the arrangement of the light absorbing element 18 can increase the image taking area and make the signal light beam L' transmitted to the image capturing element 12 more uniform, which is advantageous for improving the image quality.

另外,在本實施例中,取像裝置1還進一步包括一設置在第一凹陷部C1內的擋塊20。擋塊20位於發光元件13與影像擷取元件12之間,以避免光束L直接投射至影像擷取元件12。另一方面,擋塊20可侷限發光元件13所產生的光束L的發散角度,從而可更精準地控制光束L以預定的入射角度進入導光元件10內。如此,可更進一步精準控制光束L的光路,並確保大部分的光束L都可朝向物體F投射,而提高影像擷取元件12的成像品質。 In addition, in the embodiment, the image capturing apparatus 1 further includes a stopper 20 disposed in the first recessed portion C1. The stop 20 is located between the light-emitting element 13 and the image capturing element 12 to prevent the light beam L from being directly projected onto the image capturing element 12. On the other hand, the stopper 20 can limit the divergence angle of the light beam L generated by the light-emitting element 13, so that the light beam L can be more accurately controlled to enter the light guiding element 10 at a predetermined incident angle. In this way, the optical path of the light beam L can be further precisely controlled, and it is ensured that most of the light beam L can be projected toward the object F, and the image quality of the image capturing element 12 is improved.

請繼續參照圖8,圖8為本創作又一實施例的取像裝置的剖面示意圖。圖8的取像裝置1和圖6的取像裝置1相同或相對應的元件具有相同的標號,且相同的部分不再贅述。 Please refer to FIG. 8. FIG. 8 is a schematic cross-sectional view of the image capturing apparatus according to still another embodiment of the present invention. The same or corresponding elements of the image capturing device 1 of FIG. 8 and the image capturing device 1 of FIG. 6 have the same reference numerals, and the same portions will not be described again.

在圖8的實施例中,導光元件10包括一設置於第二反射元件16與第三反射元件17之間的多個光學微結構103。在本實施例中,多個光學微結構103分布的範圍和第一反射元件15在導光元件10的厚度方向至少部分重疊。進一步而言,第一反射元件15 的垂直投影可和多個光學微結構103分布的範圍至少部分重疊。 In the embodiment of FIG. 8, light directing element 10 includes a plurality of optical microstructures 103 disposed between second reflective element 16 and third reflective element 17. In the present embodiment, the range in which the plurality of optical microstructures 103 are distributed and the first reflective element 15 at least partially overlap in the thickness direction of the light guiding element 10. Further, the first reflective element 15 The vertical projection can at least partially overlap the extent of the distribution of the plurality of optical microstructures 103.

每一光學微結構103的形狀可以和前述的增透微結構100相同。舉例而言,光學微結構103的剖面形狀也可以是鋸齒形、波浪形或山形,但本創作不以此為限。 The shape of each of the optical microstructures 103 can be the same as the aforementioned anti-reflection microstructures 100. For example, the cross-sectional shape of the optical microstructure 103 may also be zigzag, wavy or mountain shape, but the present invention is not limited thereto.

多個光學微結構103可以使通過第一反射元件15反射之後的一部分光束穿過多個光學微結構103而從導光元件10投射而出。進一步而言,未依據預定路徑行進的雜散光L1可通過光學微結構103投射至導光元件10之外,而被基板14所吸收,從而避免影像擷取元件12接收到來自信號光束L’以外的雜散光L1。另外,光學微結構103的配置可以增加取像面積,並使傳遞到影像擷取元件12的信號光束L’更均勻,而有利於提高成像品質。 The plurality of optical microstructures 103 may cause a portion of the light beam reflected by the first reflective element 15 to pass through the plurality of optical microstructures 103 to be projected from the light guiding element 10. Further, the stray light L1 that does not travel according to the predetermined path can be projected by the optical microstructure 103 to the outside of the light guiding element 10 and absorbed by the substrate 14, thereby preventing the image capturing element 12 from receiving the signal light beam L'. The stray light L1. In addition, the configuration of the optical microstructures 103 can increase the image taking area and make the signal beam L' transmitted to the image capturing element 12 more uniform, which is advantageous for improving the image quality.

另外,和圖7的實施例相似,在圖8的實施例中,取像裝置1還進一步包括一設置在第一凹陷部C1內的擋塊20,以避免光束L直接投射至影像擷取元件12,以及可侷限發光元件13所產生的光束L的發散角度,從而可更精準地控制光束L以預定的入射角度進入導光元件10內。 In addition, similar to the embodiment of FIG. 7, in the embodiment of FIG. 8, the image capturing device 1 further includes a stopper 20 disposed in the first recess C1 to prevent the light beam L from being directly projected to the image capturing member. 12, and the divergence angle of the light beam L generated by the light-emitting element 13 can be limited, so that the light beam L can be more accurately controlled to enter the light guiding element 10 at a predetermined incident angle.

請繼續參照圖9,圖9為本創作又另一實施例的取像裝置的剖面示意圖。圖9的取像裝置1和圖7的取像裝置1相同或相對應的元件具有相同或相似的標號,且相同的部分不再贅述。 Please continue to refer to FIG. 9. FIG. 9 is a cross-sectional view of the image taking device according to still another embodiment of the present invention. The same or corresponding elements of the image capturing device 1 of FIG. 9 and the image capturing device 1 of FIG. 7 have the same or similar reference numerals, and the same portions will not be described again.

在圖9的實施例中,取像裝置1包括設置於第一反射元件15與第四反射元件19的吸光元件18,且導光元件10包括一設置於第二反射元件16與第三反射元件17之間的多個光學微結構103。 In the embodiment of FIG. 9, the image capturing device 1 includes light absorbing elements 18 disposed on the first reflective element 15 and the fourth reflective element 19, and the light guiding element 10 includes a second reflective element 16 and a third reflective element. A plurality of optical microstructures 103 between 17.

在本實施例中,多個光學微結構103分布的範圍和第一反射元件15以及第四反射元件19在導光元件10的厚度方向完全不重疊。另外,吸光元件18和第二反射元件16在導光元件10的厚度方向至少部分重疊,但是吸光元件18和第三反射元件在導光元件10的厚度方向完全不重疊。 In the present embodiment, the range in which the plurality of optical microstructures 103 are distributed and the first reflective element 15 and the fourth reflective element 19 do not overlap at all in the thickness direction of the light guiding element 10. Further, the light absorbing element 18 and the second reflective element 16 at least partially overlap in the thickness direction of the light guiding element 10, but the light absorbing element 18 and the third reflecting element do not overlap at all in the thickness direction of the light guiding element 10.

本實施例的吸光元件18和光學微結構103可以使未依據預定 路徑行進的雜散光L1從導光元件10出射,而被基板14所吸收,或者是直接被吸光元件18所吸收,從而避免影像擷取元件12接收到來自信號光束L’以外的雜散光。另外,吸光元件18和光學微結構103的配置可以增加取像面積,並使傳遞到影像擷取元件12的信號光束L’更均勻,而有利於提高成像品質。 The light absorbing element 18 and the optical microstructure 103 of the present embodiment can be made unscheduled The stray light L1 traveling through the path is emitted from the light guiding element 10, is absorbed by the substrate 14, or is directly absorbed by the light absorbing element 18, thereby preventing the image capturing element 12 from receiving stray light from the signal light beam L'. In addition, the arrangement of the light absorbing element 18 and the optical microstructures 103 can increase the image taking area and make the signal light beam L' transmitted to the image capturing element 12 more uniform, which is advantageous for improving the image quality.

請參照圖10,圖10為本創作又另一實施例的取像裝置的剖面示意圖。圖10的取像裝置1’和圖1的取像裝置1相同或相對應的元件具有相同或相似的標號,且相同的部分不再贅述。 Please refer to FIG. 10. FIG. 10 is a cross-sectional view of the image capturing apparatus according to still another embodiment of the present invention. The same or corresponding elements of the image capturing device 1' of Fig. 10 and the image capturing device 1 of Fig. 1 have the same or similar reference numerals, and the same portions will not be described again.

在本實施例中,取像裝置1’省略如圖1所示的透光元件11。據此,發光元件13所產生的光束L由入光部E1進入導光元件10內之後,依序通過第一反射元件15的反射與第二反射元件16的反射,而在導光元件10內傳遞,並且在導光元件10與環境介質的交界面,也就是位於導光元件10的第一側S1之表面,產生全反射。 In the present embodiment, the image pickup device 1' omits the light transmitting member 11 as shown in Fig. 1. Accordingly, after the light beam L generated by the light-emitting element 13 enters the light-guiding element 10 by the light-input portion E1, it is sequentially reflected by the first reflective element 15 and reflected by the second reflective element 16 in the light-guiding element 10. The transfer, and at the interface of the light guiding element 10 with the environmental medium, that is to say on the surface of the first side S1 of the light guiding element 10, produces total reflection.

也就是說,位於導光元件10第一側S1的表面可作為被物體F接觸的接觸面。當物體F(如:手指)由導光元件10的第一側S1接觸導光元件10時,手指的凸紋會使一部分光束L無法產生全反射,從而使影像擷取元件12取得對應手指凸紋的暗紋。另一方面,手指的凹紋並未接觸到導光元件10的第一側S1表面,而使另一部分光束L仍可被全反射而形成一信號光束L’。信號光束L’朝向導光元件10的出光部E2投射,並通過導光元件10的多個增透微結構100而投向影像擷取元件12的光接收面120。之後,再通過一影像處理元件,對影像擷取元件12所接收到的信號光束L’進行影像處理,可以得到物體F的指紋影像並根據指紋影像進行身分辨識。 That is, the surface on the first side S1 of the light guiding element 10 can serve as a contact surface that is contacted by the object F. When the object F (eg, a finger) is in contact with the light guiding element 10 by the first side S1 of the light guiding element 10, the convexity of the finger causes a part of the light beam L to be unable to generate total reflection, so that the image capturing element 12 obtains the corresponding finger convex. Dark lines of grain. On the other hand, the concave of the finger does not contact the surface of the first side S1 of the light guiding element 10, but the other partial light beam L can still be totally reflected to form a signal light beam L'. The signal light beam L' is projected toward the light exit portion E2 of the light guiding element 10, and is directed to the light receiving surface 120 of the image capturing element 12 through the plurality of antireflection microstructures 100 of the light guiding element 10. Then, through the image processing component, the signal beam L' received by the image capturing component 12 is subjected to image processing, and the fingerprint image of the object F can be obtained and the identity recognition can be performed according to the fingerprint image.

圖11為本創作又另一實施例的取像裝置的剖面示意圖。本實例的取像裝置1”和圖10的取像裝置1’相同或相對應的元件具有相同或相似的標號,且相同的部分不再贅述。 Figure 11 is a cross-sectional view showing the image taking device of still another embodiment of the present invention. The same or corresponding elements of the image capturing device 1" of the present example and the image capturing device 1' of Fig. 10 have the same or similar reference numerals, and the same portions will not be described again.

在本實施例中,導光元件10的第二側S2不具有第一凹陷部C1以及第二凹陷部C2。也就是說,導光元件10在第二側S2的表面為平面,但多個增透微結構100仍設置在位於第二側S2的出光部E2。 In the present embodiment, the second side S2 of the light guiding element 10 does not have the first recessed portion C1 and the second recessed portion C2. That is, the light guiding element 10 is planar on the surface of the second side S2, but the plurality of antireflection microstructures 100 are still disposed on the light exiting portion E2 located on the second side S2.

另外,本實施例的取像裝置1”還包括光學膠G1。光學膠G1連接在導光元件10與基板14之間,以使導光元件10固定於基板14上,且發光元件13與影像擷取元件12是埋入光學膠G1內。另外,光學膠G1的折射係數會和導光元件10大致相同,例如可大於或等於1.4,且小於或等於1.6。因此,光束L從導光元件10進入到光學膠G1內,或者是由光學膠G1進入導光元件10內時,會根據預定的光路前進,而不會產生折射。 In addition, the image capturing device 1 ′ of the embodiment further includes an optical glue G1. The optical glue G1 is connected between the light guiding element 10 and the substrate 14 to fix the light guiding element 10 on the substrate 14 , and the light emitting element 13 and the image The capturing element 12 is embedded in the optical glue G1. In addition, the refractive index of the optical glue G1 may be substantially the same as that of the light guiding element 10, for example, may be greater than or equal to 1.4 and less than or equal to 1.6. Therefore, the light beam L is from the light guiding element. When 10 enters the optical glue G1 or enters the light guiding element 10 by the optical glue G1, it advances according to a predetermined optical path without causing refraction.

須說明的是,光學膠G1並未填滿影像擷取元件12以及出光部E2(多個增透微結構100)之間所定義出的空隙。因此,通過在出光部E2設置的多個增透微結構100,可大幅減少信號光束L’在出光部E2再度被全反射的機率,從而提高影像擷取元件12的成像品質。 It should be noted that the optical glue G1 does not fill the gap defined between the image capturing element 12 and the light exiting portion E2 (the plurality of anti-reflecting microstructures 100). Therefore, by the plurality of anti-transmission microstructures 100 provided in the light-emitting portion E2, the probability that the signal light beam L' is again totally reflected by the light-emitting portion E2 can be greatly reduced, thereby improving the image quality of the image capturing element 12.

另外,在本實施例中,導光元件10位於導光元件10第一側S1的表面具有另一凹陷部C3,且凹陷部C3的位置是對應於第一反射元件15的位置,以降低導光元件10的部分厚度,而有利於針對不同產品,提供較薄的取像裝置。 In addition, in the embodiment, the light guiding element 10 is located on the surface of the first side S1 of the light guiding element 10 and has another recessed portion C3, and the position of the recessed portion C3 is corresponding to the position of the first reflective element 15 to reduce the guide. The partial thickness of the light element 10 facilitates providing a thinner image capture device for different products.

[實施例的有益效果] [Advantageous Effects of Embodiments]

本創作的其中一有益效果在於,本創作所提供的取像裝置1,其能通過“導光元件10具有位於出光部E2的多個增透微結構100”以及“影像擷取元件12對應於多個增透微結構100配置於導光元件10的第二側S2’的技術方案,以避免信號光束L’在進入影像擷取元件12之前再度被全反射,從而提升取像裝置1的影像辨識度。更進一步來說,在本創作實施例的取像裝置1中,由於在導光元件10的出光部E2設置多個增透微結構100,可避免信號光 束L’被再度全反射,因而允許基板14與導光元件10之間可不填充光學膠。因此,除了可進一步避免光學膠內含有微小氣泡或是固化不完全而造成光束散射的問題,並可進一步降低成本。 One of the beneficial effects of the present invention is that the image capturing device 1 provided by the present invention can pass the "light guiding element 10 has a plurality of antireflection microstructures 100 located in the light exit portion E2" and the "image capturing element 12 corresponds to The plurality of anti-reflection microstructures 100 are disposed on the second side S2 ′ of the light guiding element 10 to prevent the signal beam L′ from being totally reflected again before entering the image capturing component 12 , thereby improving the image of the image capturing device 1 . Further, in the image capturing apparatus 1 of the present embodiment, since a plurality of anti-transmission microstructures 100 are disposed in the light-emitting portion E2 of the light guiding element 10, signal light can be avoided. The beam L' is again totally reflected, thus allowing the optical glue to be unfilled between the substrate 14 and the light guiding element 10. Therefore, in addition to further avoiding the problem that the optical glue contains fine bubbles or incomplete curing, the light beam is scattered, and the cost can be further reduced.

對於需要應用光學膠G1來填充於導光元件10與基板14之間的實施例(如:取像裝置1”)而言,即便影像擷取元件12與出光部E2之間沒有填滿光學膠G1,通過在出光部E2設置的多個增透微結構100,可大幅減少信號光束L’在出光部E2再度被全反射的機率,從而提高影像擷取元件12的成像品質。 For an embodiment (such as the image capturing device 1) that needs to apply the optical glue G1 to be filled between the light guiding element 10 and the substrate 14, even if the image capturing element 12 and the light exiting portion E2 are not filled with the optical glue G1, by the plurality of anti-transmission microstructures 100 provided in the light-emitting portion E2, the probability that the signal light beam L' is again totally reflected by the light-emitting portion E2 can be greatly reduced, thereby improving the image quality of the image capturing element 12.

另一方面,通過在導光元件10的第一側S1或第二側S2設置吸光元件18或是光學微結構103兩者中的至少其中一者,可以減少影像擷取元件12接收的雜散光L1,並可增加取像面積,使傳遞到影像擷取元件12的信號光束L’更均勻,而有利於提高取像裝置1的成像品質。 On the other hand, by providing at least one of the light absorbing element 18 or the optical microstructure 103 on the first side S1 or the second side S2 of the light guiding element 10, the stray light received by the image capturing element 12 can be reduced. L1, and the imaging area can be increased to make the signal beam L' transmitted to the image capturing element 12 more uniform, which is advantageous for improving the imaging quality of the image capturing apparatus 1.

以上所公開的內容僅為本創作的優選可行實施例,並非因此侷限本創作的申請專利範圍,所以凡是運用本創作說明書及圖式內容所做的等效技術變化,均包含於本創作的申請專利範圍內。 The above disclosure is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, any equivalent technical changes made by using the present specification and the content of the schema are included in the application for this creation. Within the scope of the patent.

Claims (20)

一種取像裝置,其包括:一導光元件,其具有一第一側以及一第二側,其中,所述導光元件具有一位於所述第二側的出光部,且所述出光部設有多個增透微結構;一影像擷取元件,其對應於多個所述增透微結構而配置於所述導光元件的所述第二側;以及一發光元件,其用於產生一在所述導光元件內傳遞的光束;其中,所述光束至少在所述導光元件內經過至少一次全反射而形成一投向多個所述增透微結構的信號光束,且所述信號光束穿過多個所述增透微結構以投向所述影像擷取元件。 An image capturing device comprising: a light guiding element having a first side and a second side, wherein the light guiding element has a light exiting portion on the second side, and the light emitting part is provided a plurality of antireflection microstructures; an image capture element disposed on the second side of the light guiding element corresponding to the plurality of the antireflection microstructures; and a light emitting element for generating a a light beam transmitted within the light guiding element; wherein the light beam forms at least one total reflection in the light guiding element to form a signal beam directed to a plurality of the antireflection microstructures, and the signal beam A plurality of the anti-reflection microstructures are passed through to the image capture element. 如請求項1所述的取像裝置,還進一步包括一設置於所述導光元件第一側的透光元件,且所述光束通過所述導光元件與所述透光元件的導引,以及通過所述透光元件的一外表面的全反射而形成所述信號光束。 The image capturing device of claim 1, further comprising a light transmissive element disposed on the first side of the light guiding element, and the light beam is guided by the light guiding element and the light transmitting element, And forming the signal beam by total reflection of an outer surface of the light transmissive element. 如請求項1所述的取像裝置,其中,所述導光元件具有一全反射臨界角,每一所述增透微結構包括一使所述信號光束的入射角小於所述全反射臨界角的受光區以及一使所述信號光束的入射角大於所述全反射臨界角的背光區,且所述受光區的面積大於所述背光區的面積。 The image capturing device of claim 1, wherein the light guiding element has a total reflection critical angle, and each of the antireflection microstructures comprises an incident angle of the signal beam that is smaller than the total reflection critical angle a light receiving area and a backlight area for causing an incident angle of the signal beam to be greater than a critical angle of the total reflection, and an area of the light receiving area is larger than an area of the backlight area. 如請求項3所述的取像裝置,其中,每一所述增透微結構為一非對稱凸柱,所述非對稱凸柱具有一稜線,所述受光區和一通過所述稜線的垂直參考面之間形成一第一夾角,所述背光區和所述垂直參考面形成一第二夾角,且所述第一夾角大於所述第二夾角。 The image capturing device of claim 3, wherein each of the antireflection microstructures is an asymmetric protrusion, the asymmetric protrusion has a ridge line, the light receiving area and a vertical line passing through the ridge line A first angle is formed between the reference surfaces, the backlight region and the vertical reference surface form a second angle, and the first angle is greater than the second angle. 如請求項4所述的取像裝置,其中,所述受光區與所述背光區分別位於所述垂直參考面的兩相反側。 The image capturing device of claim 4, wherein the light receiving area and the backlight area are respectively located on opposite sides of the vertical reference surface. 如請求項3所述的取像裝置,其中,多個所述增透微結構排列成陣列,且每一所述增透微結構為一偏心微透鏡,所述偏心微透鏡具有一頂點,通過所述受光區的任意一點的切面和一通過所述頂點的垂直參考面之間形成一第一夾角,通過所述背光區的任意一點的切面和所述垂直參考面形成一第二夾角,且所述第一夾角大於所述第二夾角。 The image capturing device of claim 3, wherein the plurality of antireflection microstructures are arranged in an array, and each of the antireflection microstructures is an eccentric microlens, the eccentric microlens having a vertex Forming a first angle between a cut surface of any point of the light receiving area and a vertical reference surface passing through the vertex, and forming a second angle by the cut surface of any point of the backlight area and the vertical reference surface, and The first angle is greater than the second angle. 如請求項3所述的取像裝置,其中,每一所述增透微結構的所述受光區與所述背光區為一傾斜平面或一曲面。 The image capturing device of claim 3, wherein the light receiving area of each of the antireflection microstructures and the backlight area are an inclined plane or a curved surface. 如請求項1所述的取像裝置,其中,多個所述增透微結構彼此相連,且所述增透微結構的剖面形狀呈山形、波浪形或鋸齒形。 The image capturing device of claim 1, wherein the plurality of the antireflection microstructures are connected to each other, and the cross-sectional shape of the antireflection microstructure is a mountain shape, a wave shape or a zigzag shape. 如請求項1所述的取像裝置,還進一步包括:一設置於所述第一側的第一反射元件及一設置於所述第二側的第二反射元件,其中,所述光束依序通過所述第一反射元件與所述第二反射元件的反射,以在所述導光元件內進行傳遞。 The image capturing device of claim 1, further comprising: a first reflective element disposed on the first side and a second reflective element disposed on the second side, wherein the light beam is sequentially The reflection of the first reflective element and the second reflective element is performed within the light guiding element. 如請求項9所述的取像裝置,其中,所述第一反射元件與所述第二反射元件在所述導光元件的厚度方向上至少部份重疊。 The image taking device of claim 9, wherein the first reflective element and the second reflective element at least partially overlap in a thickness direction of the light guiding element. 如請求項10所述的取像裝置,還進一步包括:一設置於所述第二側的第三反射元件,所述第二反射元件與所述第三反射元件彼此分隔設置,所述光束通過所述第一反射元件、所述第二反射元件與所述第三反射元件的反射,以在所述導光元件內進 行傳遞。 The image capturing device of claim 10, further comprising: a third reflective element disposed on the second side, the second reflective element and the third reflective element being spaced apart from each other, the light beam passing Reflection of the first reflective element, the second reflective element, and the third reflective element to enter the light guiding element Line pass. 如請求項11所述的取像裝置,還進一步包括:一設置在所述第二反射元件以及所述第三反射元件之間的吸光元件,其中,所述第一反射元件與所述第二反射元件在所述導光元件的厚度方向上至少部分重疊。 The image capturing device of claim 11, further comprising: a light absorbing element disposed between the second reflective element and the third reflective element, wherein the first reflective element and the second The reflective elements at least partially overlap in the thickness direction of the light guiding elements. 如請求項12所述的取像裝置,還進一步包括:一設置於所述第一側的第四反射元件,所述第一反射元件與所述第四反射元件彼此分隔設置,所述光束通過所述第一反射元件、所述第二反射元件、所述第三反射元件以及所述第四反射元件的反射,以在所述導光元件內進行傳遞。 The image capturing device of claim 12, further comprising: a fourth reflective element disposed on the first side, the first reflective element and the fourth reflective element being spaced apart from each other, the light beam passing Reflections of the first reflective element, the second reflective element, the third reflective element, and the fourth reflective element are transmitted within the light directing element. 如請求項13所述的取像裝置,還進一步包括:另一設置在所述第一反射元件與所述第四反射元件之間的吸光元件,且兩個所述吸光元件在所述導光元件的厚度方向上至少部分重疊。 The image capturing device of claim 13, further comprising: another light absorbing element disposed between the first reflective element and the fourth reflective element, and the two light absorbing elements are at the light guiding The elements overlap at least partially in the thickness direction. 如請求項11所述的取像裝置,其中,所述導光元件還包括一位所述第二反射元件以及所述第三反射元件之間的多個光學微結構,以使通過所述第一反射元件反射之後的一部分所述光束穿過多個所述光學微結構而從所述導光元件投射而出。 The image capturing device of claim 11, wherein the light guiding element further comprises a plurality of optical microstructures between the second reflective element and the third reflective element to enable passage of the first A portion of the light beam after reflection by a reflective element is projected from the light directing element through a plurality of the optical microstructures. 如請求項15所述的取像裝置,還進一步包括:一設置於所述第一側的第四反射元件,所述第一反射元件與所述第四反射元件彼此分隔設置,所述光束通過所述第一反射元件、所述第二反射元件、所述第三反射元件以及所述第四反射元件的反射,以在所述導光元件內進行傳遞。 The image capturing device of claim 15, further comprising: a fourth reflective element disposed on the first side, the first reflective element and the fourth reflective element being spaced apart from each other, the light beam passing Reflections of the first reflective element, the second reflective element, the third reflective element, and the fourth reflective element are transmitted within the light directing element. 如請求項16所述的取像裝置,還進一步包括:一設置在所述 第一反射元件與所述第四反射元件之間的吸光元件,且所述吸光元件與多個所述光學微結構所分佈的區域在所述導光元件的厚度方向上至少部分重疊。 The image capturing apparatus of claim 16, further comprising: a setting in the a light absorbing element between the first reflective element and the fourth reflective element, and the region of the light absorbing element and the plurality of optical microstructures at least partially overlap in a thickness direction of the light guiding element. 如請求項1所述的取像裝置,還進一步包括:一基板,所述發光元件、所述導光元件以及所述影像擷取元件都設置在所述基板上,所述導光元件在所述第二側具有一用以容納所述發光元件的第一凹陷部以及一用以容納所述影像擷取元件的一第二凹陷部,且多個所述增透微結構位於所述第二凹陷部的表面。 The image capturing device of claim 1, further comprising: a substrate, wherein the light emitting element, the light guiding element, and the image capturing element are all disposed on the substrate, and the light guiding element is in the The second side has a first recess for receiving the light emitting element and a second recess for receiving the image capturing element, and the plurality of the antireflection microstructures are located at the second The surface of the recess. 如請求項18所述的取像裝置,還進一步包括一設置在所述第一凹陷部內的擋塊,其中,所述擋塊位於所述發光元件與所述影像擷取元件之間,以避免所述光束直接投射至所述影像擷取元件。 The image capturing device of claim 18, further comprising a stopper disposed in the first recess, wherein the stopper is located between the light emitting element and the image capturing component to avoid The beam is projected directly onto the image capture element. 如請求項1所述的取像裝置,還進一步包括:一基板,所述發光元件、所述導光元件以及所述影像擷取元件都設置在所述基板上;以及一光學膠,其連接於所述基板與所述導光元件之間,以使所述導光元件固定於所述基板上,其中,所述發光元件與所述影像擷取元件埋設於所述光學膠內,且所述出光部與所述影像擷取元件之間定義出一空隙。 The image capturing device of claim 1, further comprising: a substrate, the light emitting element, the light guiding element and the image capturing element are all disposed on the substrate; and an optical glue connected Between the substrate and the light guiding element, the light guiding element is fixed on the substrate, wherein the light emitting element and the image capturing element are embedded in the optical glue, and A gap is defined between the light portion and the image capturing element.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020057696A1 (en) * 2018-09-19 2020-03-26 JENETRIC GmbH Apparatus for optically directly recording skin prints for mobile applications
TWI737430B (en) * 2020-07-24 2021-08-21 大陸商業成科技(成都)有限公司 Light-emitting component, method for making the same, and electronic device using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020057696A1 (en) * 2018-09-19 2020-03-26 JENETRIC GmbH Apparatus for optically directly recording skin prints for mobile applications
US11328531B2 (en) 2018-09-19 2022-05-10 JENETRIC GmbH Apparatus for optically directly recording skin prints for mobile applications
TWI737430B (en) * 2020-07-24 2021-08-21 大陸商業成科技(成都)有限公司 Light-emitting component, method for making the same, and electronic device using the same

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