TWI633493B - Image capture apparatus - Google Patents
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- TWI633493B TWI633493B TW106142487A TW106142487A TWI633493B TW I633493 B TWI633493 B TW I633493B TW 106142487 A TW106142487 A TW 106142487A TW 106142487 A TW106142487 A TW 106142487A TW I633493 B TWI633493 B TW I633493B
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- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
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Abstract
一種取像裝置包括蓋板、感測器以及光學準直器。光學準直器配置在蓋板與感測器之間且包括彼此重疊的第一遮光圖案層、第二遮光圖案層以及第三遮光圖案層。第一、第二以及第三遮光圖案層分別具有多個第一、第二以及第三透光開口。各第三透光開口的尺寸大於或等於各第二透光開口的尺寸,且各第二透光開口的尺寸大於各第一透光開口的尺寸。或者,各第三透光開口的尺寸大於各第二透光開口的尺寸,且各第二透光開口的尺寸大於或等於各第一透光開口的尺寸。An image capturing device includes a cover plate, a sensor, and an optical collimator. The optical collimator is disposed between the cover plate and the sensor and includes a first light-shielding pattern layer, a second light-shielding pattern layer, and a third light-shielding pattern layer that overlap each other. The first, second, and third light-shielding pattern layers have a plurality of first, second, and third light-transmitting openings, respectively. The size of each third light-transmitting opening is greater than or equal to the size of each second light-transmitting opening, and the size of each second light-transmitting opening is larger than the size of each first light-transmitting opening. Alternatively, the size of each third light-transmitting opening is larger than the size of each second light-transmitting opening, and the size of each second light-transmitting opening is greater than or equal to the size of each first light-transmitting opening.
Description
本發明是有關於一種光電裝置,且特別是有關於一種取像裝置。The present invention relates to a photoelectric device, and more particularly to an image capturing device.
生物辨識的種類包括臉部、聲音、虹膜、視網膜、靜脈、掌紋和指紋辨識等。依照感測方式的不同,生物特徵辨識裝置可分為光學式、電容式、超音波式及熱感應式。一般而言,光學式生物特徵辨識裝置包括光源、導光元件以及感測器。光源所發出的光束照射按壓在導光元件上的待辨識物。感測器接收被待辨識物反射的光束,以進行生物特徵的辨識。在感測器取像的過程中,被指紋反射的光束容易散亂地傳遞至感測器,而造成取像品質不佳,影響辨識結果。雖然已有技術針對取像品質進行改善,然而現階段技術在改善串擾(crosstalk)的同時,容易過度限縮感測器的進光量。Types of biometrics include face, voice, iris, retina, vein, palm print, and fingerprint recognition. According to different sensing methods, biometric identification devices can be divided into optical, capacitive, ultrasonic, and thermal sensing. Generally, an optical biometric identification device includes a light source, a light guide element, and a sensor. The light beam emitted by the light source illuminates the object to be identified pressed on the light guide element. The sensor receives the light beam reflected by the object to be identified for identification of biological characteristics. During the process of image pickup by the sensor, the light beam reflected by the fingerprint is easily scattered to the sensor, resulting in poor image acquisition quality and affecting the identification result. Although the existing technology improves the image acquisition quality, at the present stage of the technology, while improving crosstalk, it is easy to excessively limit the amount of light entering the sensor.
本發明提供一種取像裝置,其可在改善串擾的同時,避免過度限縮感測器的進光量。The invention provides an image capturing device, which can improve the crosstalk and avoid excessively limiting the amount of light entering the sensor.
本發明的一種取像裝置包括蓋板、感測器以及光學準直器。感測器配置在蓋板的一側。光學準直器配置在蓋板與感測器之間。光學準直器包括彼此重疊的第一遮光圖案層、第二遮光圖案層以及第三遮光圖案層。第一遮光圖案層具有多個第一透光開口。第二遮光圖案層具有多個第二透光開口。第三遮光圖案層具有多個第三透光開口。光學準直器滿足:各第三透光開口的尺寸大於或等於各第二透光開口的尺寸,且各第二透光開口的尺寸大於各第一透光開口的尺寸;或各第三透光開口的尺寸大於各第二透光開口的尺寸,且各第二透光開口的尺寸大於或等於各第一透光開口的尺寸。An imaging device of the present invention includes a cover plate, a sensor, and an optical collimator. The sensor is arranged on one side of the cover. The optical collimator is disposed between the cover and the sensor. The optical collimator includes a first light-shielding pattern layer, a second light-shielding pattern layer, and a third light-shielding pattern layer that overlap each other. The first light-shielding pattern layer has a plurality of first light-transmitting openings. The second light-shielding pattern layer has a plurality of second light-transmitting openings. The third light-shielding pattern layer has a plurality of third light-transmitting openings. The optical collimator satisfies: the size of each third transparent opening is greater than or equal to the size of each second transparent opening, and the size of each second transparent opening is larger than the size of each first transparent opening; or each third transparent The size of the light opening is larger than the size of each second light-transmitting opening, and the size of each second light-transmitting opening is greater than or equal to the size of each first light-transmitting opening.
在本發明的一實施例中,各第三透光開口的尺寸大於各第二透光開口的尺寸。各第二透光開口的尺寸大於各第一透光開口的尺寸。第一遮光圖案層、第二遮光圖案層以及第三遮光圖案層從感測器朝蓋板排列或從蓋板朝感測器排列。In an embodiment of the present invention, a size of each third light-transmitting opening is larger than a size of each second light-transmitting opening. The size of each second light-transmitting opening is larger than the size of each first light-transmitting opening. The first light-shielding pattern layer, the second light-shielding pattern layer, and the third light-shielding pattern layer are arranged from the sensor toward the cover plate or from the cover plate toward the sensor.
在本發明的一實施例中,各第三透光開口的尺寸等於各第二透光開口的尺寸。各第二透光開口的尺寸大於各第一透光開口的尺寸。第一遮光圖案層、第二遮光圖案層以及第三遮光圖案層從感測器朝蓋板排列或從蓋板朝感測器排列。In an embodiment of the present invention, a size of each third light-transmitting opening is equal to a size of each second light-transmitting opening. The size of each second light-transmitting opening is larger than the size of each first light-transmitting opening. The first light-shielding pattern layer, the second light-shielding pattern layer, and the third light-shielding pattern layer are arranged from the sensor toward the cover plate or from the cover plate toward the sensor.
在本發明的一實施例中,各第三透光開口的尺寸大於各第二透光開口的尺寸。各第二透光開口的尺寸等於各第一透光開口的尺寸。第一遮光圖案層、第二遮光圖案層以及第三遮光圖案層從感測器朝蓋板排列或從蓋板朝感測器排列。In an embodiment of the present invention, a size of each third light-transmitting opening is larger than a size of each second light-transmitting opening. The size of each second light-transmitting opening is equal to the size of each first light-transmitting opening. The first light-shielding pattern layer, the second light-shielding pattern layer, and the third light-shielding pattern layer are arranged from the sensor toward the cover plate or from the cover plate toward the sensor.
在本發明的一實施例中,光學準直器更包括第一透光基板以及第二透光基板。第一透光基板位於感測器與蓋板之間。第二透光基板位於第一透光基板與蓋板之間。第二遮光圖案層位於第一透光基板與第二透光基板之間。第一遮光圖案層以及第三遮光圖案層的其中一個位於感測器與第一透光基板之間。第一遮光圖案層以及第三遮光圖案層的其中另一個位於第二透光基板與蓋板之間。In an embodiment of the present invention, the optical collimator further includes a first transparent substrate and a second transparent substrate. The first transparent substrate is located between the sensor and the cover plate. The second transparent substrate is located between the first transparent substrate and the cover plate. The second light-shielding pattern layer is located between the first transparent substrate and the second transparent substrate. One of the first light-shielding pattern layer and the third light-shielding pattern layer is located between the sensor and the first transparent substrate. The other of the first light-shielding pattern layer and the third light-shielding pattern layer is located between the second light-transmitting substrate and the cover plate.
在本發明的一實施例中,取像裝置更包括光源。光源位於感測器旁,且光源與感測器位於蓋板的一側。In an embodiment of the invention, the image capturing device further includes a light source. The light source is located next to the sensor, and the light source and the sensor are located on one side of the cover.
在本發明的一實施例中,取像裝置更包括顯示面板。顯示面板位於光學準直器與蓋板之間,且所述的顯示面板可以是具有觸控層的顯示面板。In an embodiment of the invention, the image capturing device further includes a display panel. The display panel is located between the optical collimator and the cover plate, and the display panel may be a display panel with a touch layer.
在本發明的一實施例中,取像裝置更包括帶通濾光層以及光源。帶通濾光層位於顯示面板與感測器之間。光源位於感測器旁,且光源與感測器位於蓋板的一側。光源的發光頻譜落在帶通濾光層的穿透頻譜內。In an embodiment of the invention, the image capturing device further includes a band-pass filter layer and a light source. The band-pass filter layer is located between the display panel and the sensor. The light source is located next to the sensor, and the light source and the sensor are located on one side of the cover. The emission spectrum of the light source falls within the transmission spectrum of the bandpass filter layer.
在本發明的一實施例中,光學準直器更包括第四遮光圖案層。第一遮光圖案層、第二遮光圖案層、第三遮光圖案層以及第四遮光圖案層彼此重疊。第四遮光圖案層具有多個第四透光開口。光學準直器滿足:各第四透光開口的尺寸大於或等於各第三透光開口的尺寸。In an embodiment of the invention, the optical collimator further includes a fourth light-shielding pattern layer. The first light-shielding pattern layer, the second light-shielding pattern layer, the third light-shielding pattern layer, and the fourth light-shielding pattern layer overlap each other. The fourth light-shielding pattern layer has a plurality of fourth light-transmitting openings. The optical collimator satisfies that a size of each fourth light-transmitting opening is greater than or equal to a size of each third light-transmitting opening.
基於上述,在本發明實施例的取像裝置中,藉由調變不同遮光圖案層的透光開口的尺寸,除了能夠改善串擾問題之外,還能夠改善製程公差所造成的遮孔現象,使感測器的進光量有效提升。因此,本發明實施例的取像裝置可在改善串擾的同時,避免過度限縮感測器的進光量。Based on the above, in the image capturing device according to the embodiment of the present invention, by adjusting the size of the light-transmitting openings of different light-shielding pattern layers, in addition to improving the problem of crosstalk, it can also improve the phenomenon of masking holes caused by process tolerances. The amount of light entering the sensor is effectively increased. Therefore, the image capturing device according to the embodiment of the present invention can improve the crosstalk and avoid excessively limiting the amount of light entering the sensor.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之各實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如:「上」、「下」、「前」、「後」、「左」、「右」等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明,而並非用來限制本發明。並且,在下列任一實施例中,相同或相似的元件將採用相同或相似的標號。The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of each embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, such as: "up", "down", "front", "rear", "left", "right", etc., are only directions referring to the attached drawings. Therefore, the directional terms used are used for illustration, but not for limiting the present invention. Also, in any of the following embodiments, the same or similar elements will be given the same or similar reference numerals.
圖1是本發明的第一實施例的取像裝置的剖面示意圖。圖2及圖3分別是本發明的第一實施例的取像裝置在無製程公差及有製程公差的情況下的上視示意圖。FIG. 1 is a schematic cross-sectional view of an image pickup device according to a first embodiment of the present invention. FIG. 2 and FIG. 3 are schematic top views of the image capturing device according to the first embodiment of the present invention without process tolerance and process tolerance.
請先參照圖1及圖2,取像裝置100適於擷取待測物的生物特徵。舉例而言,待測物可為手指或手掌,而生物特徵可為指紋、掌紋或靜脈,但不以此為限。Please refer to FIG. 1 and FIG. 2 first. The image capturing device 100 is adapted to capture biological characteristics of the object to be measured. For example, the object to be measured may be a finger or a palm, and the biometric feature may be a fingerprint, a palm print, or a vein, but not limited thereto.
取像裝置100包括蓋板110、感測器120以及光學準直器130。The image capturing device 100 includes a cover plate 110, a sensor 120, and an optical collimator 130.
蓋板110具有外表面SO以及內表面SI。外表面SO與內表面SI彼此相對,且外表面SO例如為取像裝置100的觸控操作面,亦即待測物碰觸蓋板110的外表面SO,以進行生物特徵辨識。The cover plate 110 has an outer surface SO and an inner surface SI. The outer surface SO and the inner surface SI are opposite to each other, and the outer surface SO is, for example, the touch operation surface of the image capturing device 100, that is, the object to be tested touches the outer surface SO of the cover plate 110 for biometric identification.
蓋板110適於保護位於其下的元件(如感測器120以及光學準直器130),其可採用高機械強度的基板,以避免因待測物的按壓或其他外力的衝擊而損害到位於蓋板110下方的元件。此外,蓋板110採用透明材質,使被待測物反射的光束(帶有指紋、掌紋或靜脈資訊的光束)能夠穿透蓋板110並朝感測器120傳遞。舉例而言,蓋板110可以是玻璃蓋板,例如是顯示裝置的玻璃蓋板或觸控裝置的玻璃蓋板,但不限於此。在一實施例中,蓋板也可由透光膠體經由升溫製程或照光製程固化而成。所述透光膠體可以是環氧樹脂(epoxy)、矽膠、光學膠、樹脂(resin)或其他合適的透光材料。The cover 110 is suitable for protecting components (such as the sensor 120 and the optical collimator 130) located below it. It can use a substrate with high mechanical strength to avoid being damaged by the pressure of the object to be measured or the impact of other external forces. A component located under the cover plate 110. In addition, the cover plate 110 is made of transparent material, so that the light beam (beam with fingerprint, palm print, or vein information) reflected by the object to be measured can penetrate the cover plate 110 and be transmitted to the sensor 120. For example, the cover 110 may be a glass cover, such as a glass cover of a display device or a glass cover of a touch device, but is not limited thereto. In one embodiment, the cover plate can also be made of transparent colloid through a heating process or a light curing process. The light-transmitting colloid may be epoxy, silicon, optical glue, resin, or other suitable light-transmitting materials.
感測器120配置在蓋板110的一側,其包括多個光感測區R,以接收被待測物反射的光束。進一步而言,感測器120可包括電荷耦合元件(Charge Coupled Device, CCD)、互補式金屬氧化物半導體元件(Complementary Metal-Oxide Semiconductor, CMOS)或其他適當種類的影像感測元件。就電荷耦合元件而言,所述多個光感測區R即是指多個電荷耦合元件的所在區域。就互補式金屬氧化物半導體元件而言,所述多個光感測區R即是指互補式金屬氧化物半導體元件中的多個像素區。The sensor 120 is disposed on one side of the cover plate 110 and includes a plurality of light sensing regions R to receive a light beam reflected by the object to be measured. Further, the sensor 120 may include a Charge Coupled Device (CCD), a Complementary Metal-Oxide Semiconductor (CMOS), or other suitable types of image sensing devices. As far as the charge-coupled element is concerned, the plurality of photo-sensing regions R refers to a region where the plurality of charge-coupled elements are located. As for the complementary metal oxide semiconductor device, the multiple light sensing regions R refer to multiple pixel regions in the complementary metal oxide semiconductor device.
在一實施例中,取像裝置100可進一步包括光源(未繪示)。光源位於感測器120旁,且光源與感測器120位於蓋板110的一側(例如皆位於蓋板110的下方)。光源適於提供照射待測物的光束,其可包括多個發光元件。多個發光元件可包括發光二極體、雷射二極體或上述兩者的組合。此外,光束可包括可見光、非可見光或上述兩者的組合。非可見光可為紅外光,但不以此為限。在取像裝置100包括光源的架構下,感測器120內可整合有脈寬調變電路。藉由脈寬調變電路控制多個發光元件的發光時間與感測器120的取像時間,使多個發光元件的發光時間與感測器130的取像時間同步,可達到精確控制的效果,但不以此為限。In an embodiment, the image capturing device 100 may further include a light source (not shown). The light source is located next to the sensor 120, and the light source and the sensor 120 are located on one side of the cover 110 (for example, both are located below the cover 110). The light source is adapted to provide a light beam for irradiating the object under test, which may include a plurality of light emitting elements. The plurality of light emitting elements may include a light emitting diode, a laser diode, or a combination of the two. In addition, the light beam may include visible light, non-visible light, or a combination of the two. Invisible light may be infrared light, but it is not limited to this. Under the structure that the image capturing device 100 includes a light source, a pulse width modulation circuit may be integrated in the sensor 120. By controlling the light emitting time of the plurality of light emitting elements and the image capturing time of the sensor 120 by the pulse width modulation circuit, the light emitting time of the plurality of light emitting elements is synchronized with the image capturing time of the sensor 130, and precise control can be achieved Effect, but not limited to this.
光學準直器130配置在蓋板110與感測器120之間,其適於準直化被待測物反射且朝感測器120傳遞的光束。進一步而言,光學準直器130包括彼此重疊的第一遮光圖案層132、第二遮光圖案層134以及第三遮光圖案層136。第一遮光圖案層132、第二遮光圖案層134以及第三遮光圖案層136具有高吸收率以及低反射率,以降低傳遞至上述遮光圖案層的光束被上述遮光圖案層反射的比例以及光束被上述遮光圖案層反射的次數,進而有效降低大角度光束(所述角度是指光束的傳遞路徑與感測區R的法線所夾的角度)被感測器120接收到的比例,從而改善串擾問題。所述低反射率是指反射率在可見光波段及紅外光波段低於10%。舉例而言,上述遮光圖案層可以是低反射率的油墨,但不以此為限。The optical collimator 130 is disposed between the cover plate 110 and the sensor 120. The optical collimator 130 is adapted to collimate a light beam reflected by the object to be measured and transmitted toward the sensor 120. Further, the optical collimator 130 includes a first light-shielding pattern layer 132, a second light-shielding pattern layer 134, and a third light-shielding pattern layer 136 that overlap each other. The first light-shielding pattern layer 132, the second light-shielding pattern layer 134, and the third light-shielding pattern layer 136 have high absorptivity and low reflectance, so as to reduce the proportion of the light beams transmitted to the light-shielding pattern layer reflected by the light-shielding pattern layer and the light beams. The number of reflections of the light-shielding pattern layer further reduces the ratio of the large-angle light beam (the angle refers to the angle between the transmission path of the light beam and the normal of the sensing area R) received by the sensor 120, thereby improving crosstalk. problem. The low reflectance means that the reflectance is lower than 10% in the visible light band and the infrared light band. For example, the light-shielding pattern layer may be ink with low reflectivity, but is not limited thereto.
此外,為了使被待測物反射的光束能夠被感測器120接收,第一遮光圖案層132、第二遮光圖案層134以及第三遮光圖案層136分別具有多個第一透光開口O1、多個第二透光開口O2以及多個第三透光開口O3。各第一透光開口O1重疊於其中一個第二透光開口O2、其中一個第三透光開口O3以及對應的一個光感測區R,以使朝感測區R傳遞的小角度光束可經由彼此重疊的一個第一透光開口O1、一個第二透光開口O2以及一個第三透光開口O3而傳遞至對應的一個光感測區R。In addition, in order that the light beam reflected by the object to be measured can be received by the sensor 120, the first light-shielding pattern layer 132, the second light-shielding pattern layer 134, and the third light-shielding pattern layer 136 each have a plurality of first light-transmitting openings O1, The plurality of second transparent openings O2 and the plurality of third transparent openings O3. Each of the first light-transmitting openings O1 overlaps one of the second light-transmitting openings O2, one of the third light-transmitting openings O3, and a corresponding light-sensing area R, so that a small-angle light beam transmitted toward the sensing area R can pass through A first light-transmitting opening O1, a second light-transmitting opening O2, and a third light-transmitting opening O3 that overlap each other are transmitted to a corresponding light sensing region R.
光學準直器130滿足:各第三透光開口O3的尺寸SO3大於或等於各第二透光開口O2的尺寸SO2,且各第二透光開口O2的尺寸SO2大於各第一透光開口O1的尺寸SO1;或各第三透光開口O3的尺寸SO3大於各第二透光開口O2的尺寸SO2,且各第二透光開口O2的尺寸SO2大於或等於各第一透光開口O1的尺寸SO1。在上述透光開口的形狀為圓形的架構下,所述透光開口的尺寸是指透光開口的直徑。在上述透光開口的形狀為方形、其他多邊形或上述形狀的結合的架構下,所述透光開口的尺寸是指透光開口的其中一邊的寬度。The optical collimator 130 satisfies that the size SO3 of each third light-transmitting opening O3 is greater than or equal to the size SO2 of each second light-transmitting opening O2, and the size SO2 of each second light-transmitting opening O2 is larger than each first light-transmitting opening O1. The size SO1 of each third light-transmitting opening O3 is larger than the size SO2 of each second light-transmitting opening O2, and the size SO2 of each second light-transmitting opening O2 is greater than or equal to the size of each first light-transmitting opening O1. SO1. Under the structure that the shape of the transparent opening is circular, the size of the transparent opening refers to the diameter of the transparent opening. In a structure in which the shape of the light-transmitting opening is a square, another polygon, or a combination of the foregoing shapes, the size of the light-transmitting opening refers to a width of one side of the light-transmitting opening.
在多個遮光圖案層的多個透光開口的尺寸皆相同的情況下,多個透光開口的尺寸越大,則光感測區R的進光量越大,但容易有串擾問題。相反地,多個透光開口的尺寸越小,雖然能有效改善串擾問題,但容易造成進光量過小。此外,不同遮光圖案層的多個透光開口的中心可能因製程公差而無法對齊。也就是說,較靠近光感測區R的遮光圖案層可能遮蔽到其上方的透光開口(遮孔現象),使得各光感測區R所對應的有效開口值(不同遮光圖案層的多個透光開口的交集區域)比預設的有效開口值(即透光開口的尺寸)小,進而造成各光感測區R的實際進光量小於各光感測區R的預設進光量。In the case where the sizes of the plurality of light-transmitting openings of the plurality of light-shielding pattern layers are the same, the larger the size of the plurality of light-transmitting openings, the greater the amount of light entering the light sensing region R, but it is prone to crosstalk problems. Conversely, the smaller the size of the multiple light-transmitting openings, although the problem of crosstalk can be effectively improved, the amount of light incident is likely to be too small. In addition, the centers of the plurality of transparent openings of different light-shielding pattern layers may not be aligned due to process tolerances. In other words, the light-shielding pattern layer closer to the light-sensing region R may shield the light-transmitting openings above it (cavitation phenomenon), so that the effective opening value corresponding to each light-sensing region R The intersection area of the light-transmitting openings) is smaller than the preset effective opening value (that is, the size of the light-transmitting openings), which causes the actual light entering amount of each light sensing area R to be smaller than the preset light entering amount of each light sensing area R.
有鑑於上述,本實施例在設計不同遮光圖案層的多個透光開口的尺寸時,將串擾問題、進光量以及製程公差所造成的遮孔現象皆納入考量。舉例而言,依據各光感測區R的尺寸、相鄰兩光感測區R的橫向距離D以及相鄰兩遮光圖案層之間的縱向距離(包括縱向距離D’及縱向距離D’’)設計第一遮光圖案層132的第一透光開口O1的尺寸SO1,以同時改善串擾及進光量過小的問題。此外,還藉由使其餘遮光圖案層中的至少一層(如第二遮光圖案層134及第三遮光圖案層136的其中至少一個)的透光開口的尺寸大於第一遮光圖案層132的第一透光開口O1的尺寸SO1。如此,即使因為製程公差使得不同遮光圖案層的多個透光開口的中心無法對齊(參見圖3),也可有效避免較靠近光感測區R的遮光圖案層遮蔽到其上方的透光開口,使得各光感測區R所對應的有效開口值等於或近似於預設的有效開口值(即第一透光開口O1的尺寸SO1),進而在改善串擾的同時,避免過度限縮感測器120的進光量。In view of the foregoing, in the embodiment, when designing the sizes of the plurality of light-transmitting openings of different light-shielding pattern layers, the cross-talk problem, the amount of light entering, and the process-cavity phenomenon caused by the process tolerance are all taken into consideration. For example, according to the size of each light sensing region R, the lateral distance D between two adjacent light sensing regions R, and the vertical distance between two adjacent light-shielding pattern layers (including the vertical distance D 'and the vertical distance D' ' ) The size SO1 of the first light-transmitting opening O1 of the first light-shielding pattern layer 132 is designed to improve the problems of crosstalk and excessively small amount of light. In addition, at least one of the remaining light-shielding pattern layers (such as at least one of the second light-shielding pattern layer 134 and the third light-shielding pattern layer 136) has a light-transmitting opening having a size larger than that of the first light-shielding pattern layer 132. The size SO1 of the light-transmitting opening O1. In this way, even if the centers of the plurality of light-transmitting openings of different light-shielding pattern layers cannot be aligned due to process tolerances (see FIG. 3), the light-shielding pattern layer closer to the light sensing region R can be effectively prevented from being blocked by the light-transmitting openings above it. , So that the effective opening value corresponding to each light sensing area R is equal to or similar to a preset effective opening value (that is, the size SO1 of the first light-transmitting opening O1), thereby improving crosstalk while avoiding over-limiting sensing The amount of light entering the device 120.
在本實施例中,各第三透光開口O3的尺寸SO3大於各第二透光開口O2的尺寸SO2,且各第二透光開口O2的尺寸SO2大於各第一透光開口O1的尺寸SO1。此外,第一遮光圖案層132、第二遮光圖案層134以及第三遮光圖案層136從感測器120朝蓋板110排列。然而,不同透光開口的尺寸相對關係以及不同遮光圖案層的排列方式可依需求改變,而不以圖1所顯示的為限。In this embodiment, the size SO3 of each third light-transmitting opening O3 is larger than the size SO2 of each second light-transmitting opening O2, and the size SO2 of each second light-transmitting opening O2 is larger than the size SO1 of each first light-transmitting opening O1. . In addition, the first light-shielding pattern layer 132, the second light-shielding pattern layer 134, and the third light-shielding pattern layer 136 are aligned from the sensor 120 toward the cover plate 110. However, the relative relationship between the sizes of different light-transmitting openings and the arrangement of different light-shielding pattern layers can be changed according to requirements, and is not limited to what is shown in FIG. 1.
依據不同的需求,光學準直器100可進一步包括其他元件。舉例而言,光學準直器100可進一步包括第一透光基板131以及第二透光基板133,以承載上述遮光圖案層。第一透光基板131以及第二透光基板133適於讓光束穿透。舉例而言,上述透光基板可以是玻璃基板、塑膠基板或透明光阻等等,但不以此為限。According to different requirements, the optical collimator 100 may further include other components. For example, the optical collimator 100 may further include a first light-transmitting substrate 131 and a second light-transmitting substrate 133 to carry the above-mentioned light-shielding pattern layer. The first transparent substrate 131 and the second transparent substrate 133 are suitable for transmitting light beams. For example, the light-transmitting substrate may be a glass substrate, a plastic substrate, a transparent photoresist, or the like, but is not limited thereto.
第一透光基板131位於感測器120與蓋板110之間,而第二透光基板133位於第一透光基板131與蓋板110之間。第二遮光圖案層134位於第一透光基板131與第二透光基板133之間。第一遮光圖案層132位於感測器120與第一透光基板131之間。第三遮光圖案層136位於第二透光基板133與蓋板110之間。在本實施例中,第一遮光圖案層132配置在第一透光基板131面向感測器120的表面S131上,第二遮光圖案層134嵌入於第二透光基板133面向第一透光基板131的表面S133A中,且第三遮光圖案層136配置在第二透光基板133面向蓋板110的表面S133B上,但不以此為限。在一實施例中,第一遮光圖案層132可內嵌於第一透光基板131面向感測器120的表面S131中。此外,第二遮光圖案層134可配置在第二透光基板133面向第一透光基板131的表面S133A上。再者,第三遮光圖案層136可內嵌於第二透光基板133面向蓋板110的表面S133B中。The first transparent substrate 131 is located between the sensor 120 and the cover plate 110, and the second transparent substrate 133 is located between the first transparent substrate 131 and the cover plate 110. The second light-shielding pattern layer 134 is located between the first transparent substrate 131 and the second transparent substrate 133. The first light-shielding pattern layer 132 is located between the sensor 120 and the first transparent substrate 131. The third light-shielding pattern layer 136 is located between the second transparent substrate 133 and the cover plate 110. In this embodiment, the first light-shielding pattern layer 132 is disposed on a surface S131 of the first light-transmitting substrate 131 facing the sensor 120, and the second light-shielding pattern layer 134 is embedded in the second light-transmitting substrate 133 facing the first light-transmitting substrate. In the surface S133A of 131, the third light-shielding pattern layer 136 is disposed on the surface S133B of the second transparent substrate 133 facing the cover plate 110, but it is not limited thereto. In one embodiment, the first light-shielding pattern layer 132 may be embedded in a surface S131 of the first transparent substrate 131 facing the sensor 120. In addition, the second light-shielding pattern layer 134 may be disposed on a surface S133A of the second transparent substrate 133 facing the first transparent substrate 131. Furthermore, the third light-shielding pattern layer 136 may be embedded in a surface S133B of the second transparent substrate 133 facing the cover plate 110.
蓋板110與第二透光基板133之間、第二透光基板133與第一透光基板131之間以及第一透光基板131與感測器120之間可藉由黏著層(未繪示)或固定機構(未繪示)而固定在一起。黏著層可以是光學膠粘劑(Optical Clear Adhesive, OCA)或芯片附著薄膜(Die Attach Film, DAF),但不以此為限。當蓋板110與第二透光基板133之間藉由黏著層而固定在一起,黏著層可位於蓋板110與第二透光基板133之間的縫隙G1中、第三遮光圖案層136與蓋板110之間或上述兩個的組合。換句話說,蓋板110與第二透光基板133之間的縫隙G1中的光傳遞介質可以是空氣或黏著層。此外,當第二透光基板133與第一透光基板131之間藉由黏著層而固定在一起,黏著層可位於第二透光基板133與第一透光基板131之間、第二遮光圖案層134與第一透光基板131之間或上述兩個的組合。另外,當第一透光基板131與感測器120之間藉由黏著層而固定在一起,黏著層可位於第一透光基板131與感測器120之間的縫隙G2中、第一遮光圖案層132與感測器120之間或上述兩個的組合。換句話說,第一透光基板131與感測器120之間的縫隙G2中的光傳遞介質可以是空氣或黏著層。Between the cover plate 110 and the second transparent substrate 133, between the second transparent substrate 133 and the first transparent substrate 131, and between the first transparent substrate 131 and the sensor 120, an adhesive layer (not shown) (Shown) or a fixing mechanism (not shown). The adhesive layer may be an optical clear adhesive (OCA) or a die attach film (DAF), but is not limited thereto. When the cover plate 110 and the second transparent substrate 133 are fixed together by an adhesive layer, the adhesive layer may be located in the gap G1 between the cover plate 110 and the second transparent substrate 133, and the third light-shielding pattern layer 136 and Between the cover plates 110 or a combination of the two. In other words, the light transmitting medium in the gap G1 between the cover plate 110 and the second transparent substrate 133 may be air or an adhesive layer. In addition, when the second transparent substrate 133 and the first transparent substrate 131 are fixed together by an adhesive layer, the adhesive layer may be located between the second transparent substrate 133 and the first transparent substrate 131 and the second light shielding Between the pattern layer 134 and the first transparent substrate 131 or a combination of the two. In addition, when the first transparent substrate 131 and the sensor 120 are fixed together by an adhesive layer, the adhesive layer may be located in the gap G2 between the first transparent substrate 131 and the sensor 120, and the first light-shielding Between the pattern layer 132 and the sensor 120 or a combination of the two. In other words, the light transmission medium in the gap G2 between the first transparent substrate 131 and the sensor 120 may be air or an adhesive layer.
接著搭配圖4至圖8說明取像裝置的其他實施型態,其中相同的元件以相同的標號表示,於下便不再重述。圖4至圖8分別是本發明的第二實施例至第六實施例的取像裝置的剖面示意圖。Next, other embodiments of the image capturing device will be described with reference to FIGS. 4 to 8. The same components are denoted by the same reference numerals, and will not be described again below. 4 to 8 are schematic cross-sectional views of image pickup devices according to the second to sixth embodiments of the present invention, respectively.
請參照圖4,本發明的第二實施例的取像裝置200與圖1的取像裝置100的主要差異如下所述。在取像裝置200中,各第三透光開口O3的尺寸SO3等於各第二透光開口O2的尺寸SO2,且各第二透光開口O2的尺寸SO2大於各第一透光開口O1的尺寸SO1。在本實施例中,第一遮光圖案層132、第二遮光圖案層134以及第三遮光圖案層136從感測器120朝蓋板110排列,但不以此為限。在另一實施例中,第一遮光圖案層132、第二遮光圖案層134以及第三遮光圖案層136可從蓋板110朝感測器120排列,使得第三遮光圖案層136位於感測器120與第一透光基板131之間,而第一遮光圖案層132位於第二透光基板133與蓋板110之間。Please refer to FIG. 4. The main differences between the image capturing device 200 of the second embodiment of the present invention and the image capturing device 100 of FIG. 1 are as follows. In the imaging device 200, the size SO3 of each third light-transmitting opening O3 is equal to the size SO2 of each second light-transmitting opening O2, and the size SO2 of each second light-transmitting opening O2 is larger than the size of each first light-transmitting opening O1. SO1. In this embodiment, the first light-shielding pattern layer 132, the second light-shielding pattern layer 134, and the third light-shielding pattern layer 136 are arranged from the sensor 120 toward the cover plate 110, but not limited thereto. In another embodiment, the first light-shielding pattern layer 132, the second light-shielding pattern layer 134, and the third light-shielding pattern layer 136 may be arranged from the cover plate 110 toward the sensor 120, so that the third light-shielding pattern layer 136 is located on the sensor. 120 and the first transparent substrate 131, and the first light-shielding pattern layer 132 is located between the second transparent substrate 133 and the cover plate 110.
請參照圖5,本發明的第三實施例的取像裝置300與圖1的取像裝置100的主要差異如下所述。在取像裝置300中,各第三透光開口O3的尺寸SO3大於各第二透光開口O2的尺寸SO2,且各第二透光開口O2的尺寸SO2等於各第一透光開口O1的尺寸SO1。在本實施例中,第一遮光圖案層132、第二遮光圖案層134以及第三遮光圖案層136從感測器120朝蓋板110排列,但不以此為限。在另一實施例中,第一遮光圖案層132、第二遮光圖案層134以及第三遮光圖案層136可從蓋板110朝感測器120排列,使得第三遮光圖案層136位於感測器120與第一透光基板131之間,而第一遮光圖案層132位於第二透光基板133與蓋板110之間。Referring to FIG. 5, the main differences between the image capturing device 300 of the third embodiment of the present invention and the image capturing device 100 of FIG. 1 are as follows. In the image capturing device 300, the size SO3 of each third light-transmitting opening O3 is larger than the size SO2 of each second light-transmitting opening O2, and the size SO2 of each second light-transmitting opening O2 is equal to the size of each first light-transmitting opening O1. SO1. In this embodiment, the first light-shielding pattern layer 132, the second light-shielding pattern layer 134, and the third light-shielding pattern layer 136 are arranged from the sensor 120 toward the cover plate 110, but not limited thereto. In another embodiment, the first light-shielding pattern layer 132, the second light-shielding pattern layer 134, and the third light-shielding pattern layer 136 may be arranged from the cover plate 110 toward the sensor 120, so that the third light-shielding pattern layer 136 is located on the sensor. 120 and the first transparent substrate 131, and the first light-shielding pattern layer 132 is located between the second transparent substrate 133 and the cover plate 110.
請參照圖6,本發明的第四實施例的取像裝置400與圖1的取像裝置100的主要差異如下所述。在圖1的取像裝置100中,不同的遮光圖案層的多個透光開口的尺寸是從感測器120朝蓋板110逐步遞增。另一方面,在圖6的取像裝置400中,不同的遮光圖案層的多個透光開口的尺寸是從感測器120朝蓋板110逐步遞減。Referring to FIG. 6, the main differences between the image capturing device 400 of the fourth embodiment of the present invention and the image capturing device 100 of FIG. 1 are as follows. In the image capturing device 100 of FIG. 1, the sizes of the plurality of light-transmitting openings of different light-shielding pattern layers are gradually increased from the sensor 120 toward the cover 110. On the other hand, in the image capturing device 400 in FIG. 6, the sizes of the plurality of light-transmitting openings of different light-shielding pattern layers are gradually decreased from the sensor 120 toward the cover plate 110.
進一步而言,第一遮光圖案層132、第二遮光圖案層134以及第三遮光圖案層136從蓋板110朝感測器120排列,使得第三遮光圖案層136位於感測器120與第一透光基板131之間,且第一遮光圖案層132位於第二透光基板133與蓋板110之間。在本實施例中,第三遮光圖案層136配置在第一透光基板131面向感測器120的表面S131上,且第一遮光圖案層132配置在第二透光基板133面向蓋板110的表面S133B上,但不以此為限。在一實施例中,第三遮光圖案層136可內嵌於第一透光基板131面向感測器120的表面S131中,而第一遮光圖案層132可內嵌於第二透光基板133面向蓋板110的表面S133B中。Further, the first light-shielding pattern layer 132, the second light-shielding pattern layer 134, and the third light-shielding pattern layer 136 are arranged from the cover plate 110 toward the sensor 120, so that the third light-shielding pattern layer 136 is located between the sensor 120 and the first Between the transparent substrates 131, and the first light-shielding pattern layer 132 is located between the second transparent substrate 133 and the cover plate 110. In this embodiment, the third light-shielding pattern layer 136 is disposed on the surface S131 of the first light-transmitting substrate 131 facing the sensor 120, and the first light-shielding pattern layer 132 is disposed on the second light-transmitting substrate 133 facing the cover 110. On the surface S133B, but not limited to this. In an embodiment, the third light-shielding pattern layer 136 may be embedded in the surface S131 of the first light-transmitting substrate 131 facing the sensor 120, and the first light-shielding pattern layer 132 may be embedded in the second light-transmitting substrate 133 facing In the surface S133B of the cover plate 110.
請參照圖7,本發明的第五實施例的取像裝置500與圖1的取像裝置100的主要差異如下所述。在取像裝置500中,取像裝置500進一步包括顯示面板140,以提供顯示功能。顯示面板140位於光學準直器130與蓋板110之間。舉例而言,顯示面板140可以是薄膜電晶體液晶顯示面板(Thin Film Transistor Liquid Crystal Display panel, TFT-LCD panel)、微型發光二極體顯示面板(Micro Light Emitting Diode display panel, Micro LED display panel)或有機發光二極體顯示面板(Organic Light Emitting Diode display panel, OLED display panel),或者是帶有觸控層(即電極走線)的顯示面板等等,但不以此為限。當顯示面板140為自發光型顯示面板時,顯示面板140所提供的光束的一部分可用於生物特徵辨識,但不以此為限。Referring to FIG. 7, the main differences between the image capturing device 500 of the fifth embodiment of the present invention and the image capturing device 100 of FIG. 1 are as follows. In the image capturing device 500, the image capturing device 500 further includes a display panel 140 to provide a display function. The display panel 140 is located between the optical collimator 130 and the cover plate 110. For example, the display panel 140 may be a Thin Film Transistor Liquid Crystal Display panel (TFT-LCD panel), a Micro Light Emitting Diode display panel, or a Micro LED display panel. Or an organic light emitting diode display panel (Organic Light Emitting Diode display panel, OLED display panel), or a display panel with a touch layer (ie, electrode wiring), etc., but not limited to this. When the display panel 140 is a self-emitting display panel, a part of the light beam provided by the display panel 140 may be used for biometric identification, but is not limited thereto.
請參照圖8,本發明的第六實施例的取像裝置600與圖7的取像裝置500的主要差異如下所述。在取像裝置600中,取像裝置600進一步包括帶通濾光層150以及光源160。帶通濾光層150位於顯示面板140與感測器120之間,而光源160位於感測器120旁,且光源160與感測器120位於蓋板110的一側(例如皆位於蓋板110的下方)。Referring to FIG. 8, the main differences between the image capturing device 600 of the sixth embodiment of the present invention and the image capturing device 500 of FIG. 7 are as follows. In the image capturing device 600, the image capturing device 600 further includes a band-pass filter layer 150 and a light source 160. The bandpass filter layer 150 is located between the display panel 140 and the sensor 120, and the light source 160 is located next to the sensor 120, and the light source 160 and the sensor 120 are located on one side of the cover 110 (for example, both are located on the cover 110) Below).
在本實施例中,帶通濾光層150位於光學準直器130與感測器120之間,且光源160位於感測器120的其中一側,但不以此為限。在一實施例中,帶通濾光層150可位於顯示面板140與光學準直器130之間。此外,光源160可位於感測器120的多側,例如配置在感測器120的多邊、多個角落或上述兩個的組合。In this embodiment, the bandpass filter layer 150 is located between the optical collimator 130 and the sensor 120, and the light source 160 is located on one side of the sensor 120, but not limited thereto. In one embodiment, the band-pass filter layer 150 may be located between the display panel 140 and the optical collimator 130. In addition, the light source 160 may be located on multiple sides of the sensor 120, for example, disposed on multiple sides, multiple corners of the sensor 120, or a combination of the two.
光源160適於提供生物特徵辨識用的光束。帶通濾光層150適於讓來自光源160的光束通過(也就是光源160的發光頻譜落在帶通濾光層150的穿透頻譜內)且過濾其他光束,以避免環境光束或來自顯示面板140的光束傳遞至感測器120所造成的干擾,進而提升取像裝置600的辨識能力。舉例而言,帶通濾光層150可為紅外帶通濾光層,其讓波長為800 nm至900 nm的光束通過,且過濾波長為800 nm至900 nm以外的光束。對應地,光源120選用波長落在800 nm至900 nm的範圍內的紅外光源。在其他實施例中,帶通濾光層420可選用讓波長為840 nm至860 nm的光束或波長為890 nm至990 nm的光束通過的帶通濾光層,且光源120選用波長落在840 nm至860 nm或890nm至990nm的範圍內的紅外光源,但本發明並不限於此。The light source 160 is adapted to provide a light beam for biometric identification. The bandpass filter layer 150 is suitable for passing the light beam from the light source 160 (that is, the light emission spectrum of the light source 160 falls within the transmission spectrum of the bandpass filter layer 150) and filtering other light beams to avoid ambient light beams or from the display panel. The interference caused by the 140 light beam transmitted to the sensor 120 further improves the recognition capability of the image capturing device 600. For example, the bandpass filter layer 150 may be an infrared bandpass filter layer, which allows a light beam with a wavelength of 800 nm to 900 nm to pass, and filters a light beam with a wavelength other than 800 nm to 900 nm. Correspondingly, the light source 120 is an infrared light source with a wavelength in the range of 800 nm to 900 nm. In other embodiments, the bandpass filter layer 420 may be a bandpass filter layer that allows a light beam with a wavelength of 840 nm to 860 nm or a light beam with a wavelength of 890 nm to 990 nm to pass, and the light source 120 is selected to have a wavelength of 840. An infrared light source in a range of nm to 860 nm or 890 nm to 990 nm, but the present invention is not limited thereto.
雖然第一實施例至第六實施例中的光學準直器130皆只包括三層遮光圖案層,但光學準直器130中的遮光圖案層的數量不以此為限。在一實施例中,光學準直器可進一步包括第四遮光圖案層(未繪示)。第一遮光圖案層、第二遮光圖案層、第三遮光圖案層以及第四遮光圖案層彼此重疊,且第四遮光圖案層具有多個第四透光開口。光學準直器滿足:各第四透光開口的尺寸大於或等於各第三透光開口的尺寸。此外,第一遮光圖案層、第二遮光圖案層、第三遮光圖案層以及第四遮光圖案層可從感測器朝蓋板排列或從蓋板朝感測器排列。在又一實施中,光學準直器可包括四層以上的遮光圖案層(未繪示),其中各第五透光開口的尺寸大於或等於各第四透光開口的尺寸,其餘遮光圖案層的透光開口的尺寸依此類推,於此不再贅述。Although the optical collimators 130 in the first to sixth embodiments all include only three light-shielding pattern layers, the number of light-shielding pattern layers in the optical collimator 130 is not limited thereto. In an embodiment, the optical collimator may further include a fourth light-shielding pattern layer (not shown). The first light-shielding pattern layer, the second light-shielding pattern layer, the third light-shielding pattern layer, and the fourth light-shielding pattern layer overlap each other, and the fourth light-shielding pattern layer has a plurality of fourth light-transmitting openings. The optical collimator satisfies that a size of each fourth light-transmitting opening is greater than or equal to a size of each third light-transmitting opening. In addition, the first light-shielding pattern layer, the second light-shielding pattern layer, the third light-shielding pattern layer, and the fourth light-shielding pattern layer may be arranged from the sensor toward the cover plate or from the cover plate toward the sensor. In another implementation, the optical collimator may include more than four light-shielding pattern layers (not shown), wherein the size of each fifth light-transmitting opening is greater than or equal to the size of each fourth light-transmitting opening, and the remaining light-shielding pattern layers The size of the light-transmitting opening is deduced by analogy, and is not repeated here.
綜上所述,在本發明實施例的取像裝置中,藉由調變不同遮光圖案層的透光開口的尺寸,除了能夠改善串擾問題之外,還能夠改善製程公差所造成的遮孔現象,使感測器的進光量有效提升。因此,本發明實施例的取像裝置可在改善串擾的同時,避免過度限縮感測器的進光量。In summary, in the image capturing device according to the embodiment of the present invention, by adjusting the size of the light-transmitting openings of different light-shielding pattern layers, in addition to improving the crosstalk problem, the hole-capping phenomenon caused by manufacturing tolerances can also be improved. , So that the amount of light entering the sensor is effectively increased. Therefore, the image capturing device according to the embodiment of the present invention can improve the crosstalk and avoid excessively limiting the amount of light entering the sensor.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.
100、200、300、400、500、600‧‧‧取像裝置
110‧‧‧蓋板
120‧‧‧感測器
130‧‧‧光學準直器
131‧‧‧第一透光基板
132‧‧‧第一遮光圖案層
133‧‧‧第二透光基板
134‧‧‧第二遮光圖案層
136‧‧‧第三遮光圖案層
140‧‧‧顯示面板
150‧‧‧帶通濾光層
160‧‧‧光源
D‧‧‧橫向距離
D’、D’’‧‧‧縱向距離
G1、G2‧‧‧縫隙
O1‧‧‧第一透光開口
O2‧‧‧第二透光開口
O3‧‧‧第三透光開口
R‧‧‧感測區
S131、S133A‧‧‧表面
S133B‧‧‧表面
SI‧‧‧內表面
SO‧‧‧外表面
SO1、SO2、SO3‧‧‧尺寸100, 200, 300, 400, 500, 600‧‧‧ image pickup devices
110‧‧‧ cover
120‧‧‧Sensor
130‧‧‧Optical Collimator
131‧‧‧The first transparent substrate
132‧‧‧first light-shielding pattern layer
133‧‧‧Second transparent substrate
134‧‧‧second light-shielding pattern layer
136‧‧‧third light-shielding pattern layer
140‧‧‧display panel
150‧‧‧ Bandpass Filter
160‧‧‧light source
D‧‧‧Horizontal distance
D ', D``‧‧‧ Vertical distance
G1, G2 ‧‧‧ gap
O1‧‧‧The first transparent opening
O2‧‧‧Second transparent opening
O3‧‧‧ third light-transmitting opening
R‧‧‧sensing area
S131, S133A‧‧‧ Surface
S133B‧‧‧Surface
SI‧‧‧Inner surface
SO‧‧‧ Outer surface
SO1, SO2, SO3 ‧‧‧ size
圖1是本發明的第一實施例的取像裝置的剖面示意圖。 圖2及圖3分別是本發明的第一實施例的取像裝置在無製程公差及有製程公差的情況下的上視示意圖。 圖4至圖8分別是本發明的第二實施例至第六實施例的取像裝置的剖面示意圖。FIG. 1 is a schematic cross-sectional view of an image pickup device according to a first embodiment of the present invention. FIG. 2 and FIG. 3 are schematic top views of the image capturing device according to the first embodiment of the present invention without process tolerance and process tolerance. 4 to 8 are schematic cross-sectional views of image pickup devices according to the second to sixth embodiments of the present invention, respectively.
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Also Published As
Publication number | Publication date |
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CN109389108B (en) | 2022-03-01 |
TW201911111A (en) | 2019-03-16 |
CN109389108A (en) | 2019-02-26 |
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