CN109389108A - Image capturing device - Google Patents
Image capturing device Download PDFInfo
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- CN109389108A CN109389108A CN201711271306.0A CN201711271306A CN109389108A CN 109389108 A CN109389108 A CN 109389108A CN 201711271306 A CN201711271306 A CN 201711271306A CN 109389108 A CN109389108 A CN 109389108A
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- 238000000034 method Methods 0.000 description 12
- 238000012545 processing Methods 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 10
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- 238000012216 screening Methods 0.000 description 4
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/147—Details of sensors, e.g. sensor lenses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/30—Collimators
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Vascular Medicine (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Scanning Arrangements (AREA)
- Facsimile Heads (AREA)
Abstract
An image capturing device includes a cover plate, a sensor and an optical collimator. The optical collimator is disposed between the cover plate and the sensor and includes a first light shielding pattern layer, a second light shielding pattern layer, and a third light shielding pattern layer overlapping each other. The first, second and third shading pattern layers are respectively provided with a plurality of first, second and third light-transmitting openings. The size of each third light-transmitting opening is larger than or equal to that of each second light-transmitting opening, and the size of each second light-transmitting opening is larger than that of each first light-transmitting opening. Or the size of each third light-transmitting opening is larger than that of each second light-transmitting opening, and the size of each second light-transmitting opening is larger than or equal to that of each first light-transmitting opening.
Description
Technical field
The present invention relates to a kind of electrooptical devices, and in particular to a kind of image-taking device.
Background technique
The type of bio-identification includes face, sound, iris, retina, vein, palmmprint and fingerprint recognition etc..According to sense
The difference of survey mode, biometric devices can be divided into optical profile type, condenser type, Supersonic waves and thermal-induction type.In general,
Optical biologic specific identification device includes light source, light-guide device and sensor.The light beam irradiation pressing that light source is issued exists
Object to be identified on light-guide device.Sensor receives the light beam reflected by object to be identified, to carry out the identification of biological characteristic.Feeling
During surveying device capture, it is easy dispersedly to be transferred to sensor by the light beam that fingerprint reflects, thus cause capture quality bad,
Influence recognition result.Although prior art is improved for capture quality, technology is improving crosstalk at this stage
(crosstalk) it while, is easy excessively to limit the light-inletting quantity of sensor.
Summary of the invention
The present invention provides a kind of image-taking device, and the image-taking device can avoid excessively limiting sense while improving crosstalk
Survey the light-inletting quantity of device.
A kind of image-taking device of the invention includes cover board, sensor and optics collimator.Sensor configurations are in cover board
Side.Optics collimator configures between cover board and sensor.Optics collimator include the first shielding pattern layer to overlap each other,
Second shielding pattern layer and third shielding pattern layer.First shielding pattern layer has multiple first light openings.Second shading
Pattern layer has multiple second light openings.Third shielding pattern layer has multiple third light openings.Optics collimator meets:
The size of each third light openings is greater than or equal to the size of each second light openings, and the size of each second light openings is greater than
The size of each first light openings；Or the size of each third light openings is greater than the size of each second light openings, and each second
The size of light openings is greater than or equal to the size of each first light openings.
In one embodiment of the invention, the size of each third light openings is greater than the size of each second light openings.
The size of each second light openings is greater than the size of each first light openings.First shielding pattern layer, the second shielding pattern layer with
And third shielding pattern layer is arranged from sensor towards cover board or is arranged from cover board towards sensor.
In one embodiment of the invention, the size of each third light openings is equal to the size of each second light openings.
The size of each second light openings is greater than the size of each first light openings.First shielding pattern layer, the second shielding pattern layer with
And third shielding pattern layer is arranged from sensor towards cover board or is arranged from cover board towards sensor.
In one embodiment of the invention, the size of each third light openings is greater than the size of each second light openings.
The size of each second light openings is equal to the size of each first light openings.First shielding pattern layer, the second shielding pattern layer with
And third shielding pattern layer is arranged from sensor towards cover board or is arranged from cover board towards sensor.
In one embodiment of the invention, optics collimator further includes the first transparent substrates and the second transparent substrates.
First transparent substrates are between sensor and cover board.Second transparent substrates are between the first transparent substrates and cover board.Second
Shielding pattern layer is between the first transparent substrates and the second transparent substrates.First shielding pattern layer and third shielding pattern layer
One of them between sensor and the first transparent substrates.First shielding pattern layer and third shielding pattern layer are wherein
Another is between the second transparent substrates and cover board.
In one embodiment of the invention, image-taking device further includes light source.Light source is located at beside sensor, and light source with
Sensor is located at the side of cover board.
In one embodiment of the invention, image-taking device further includes display panel.Display panel is located at optics collimator
Between cover board, and the display panel can be the display panel with touch control layer.
In one embodiment of the invention, image-taking device further includes bandpass filter layer and light source.Bandpass filter layer position
Between display panel and sensor.Light source is located at beside sensor, and light source and sensor are located at the side of cover board.Light source
Luminous frequency spectrum falls in the penetrating in frequency spectrum of bandpass filter layer.
In one embodiment of the invention, optics collimator further includes the 4th shielding pattern layer.First shielding pattern layer,
Second shielding pattern layer, third shielding pattern layer and the 4th shielding pattern layer overlap each other.4th shielding pattern layer has more
A 4th light openings.Optics collimator meets: the size of each 4th light openings is greater than or equal to each third light openings
Size.
Based on above content, in the image-taking device of the embodiment of the present invention, by the light transmission of modulation difference shielding pattern layer
The size of opening, other than it can improve cross-interference issue, additionally it is possible to improve screening hole phenomenon caused by processing procedure tolerance, make to sense
The light-inletting quantity of device is effectively promoted.Therefore, the image-taking device of the embodiment of the present invention can avoid excessively limiting while improving crosstalk
The light-inletting quantity of sensor.
In order to which features described above and advantage of the invention can be clearer and more comprehensible, embodiment is hereafter especially enumerated, and combine attached
Figure is described in detail below.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section of the image-taking device of the first embodiment of the present invention;
Fig. 2 and Fig. 3 is respectively the image-taking device of the first embodiment of the present invention in no processing procedure tolerance and has the case where processing procedure tolerance
Under schematic top plan view;
Fig. 4 to Fig. 8 is the second embodiment of the present invention respectively to the diagrammatic cross-section of the image-taking device of sixth embodiment.
Symbol description:
100,200,300,400,500,600: image-taking device;
110: cover board;
120: sensor;
130: optics collimator;
131: the first transparent substrates;
132: the first shielding pattern layers;
133: the second transparent substrates;
134: the second shielding pattern layers;
136: third shielding pattern layer;
140: display panel;
150: bandpass filter layer;
160: light source;
D: lateral distance;
D ', D ' ': fore-and-aft distance;
G1, G2: gap;
O1: the first light openings;
O2: the second light openings;
O3: third light openings;
R: sensing area;
S131, S133A: surface;
S133B: surface;
SI: inner surface;
SO: outer surface;
SO1, SO2, SO3: size.
Specific embodiment
Below in conjunction in the detailed description of each embodiment of reference attached drawing, it will be clear that ground presents for the present invention aforementioned
And other technologies content, feature and effect.The direction term being previously mentioned in Examples below, such as: "upper", "lower", " preceding ",
" rear ", "left", "right" etc. only refer to the direction of attached drawing.Therefore, the direction term used be for illustrating, and not be used to
The limitation present invention.Also, in any one following embodiment, the same or similar element will use the same or similar label.
Fig. 1 is the diagrammatic cross-section of the image-taking device of the first embodiment of the present invention.Fig. 2 and Fig. 3 is of the invention respectively
The image-taking device of first embodiment is in no processing procedure tolerance and schematic top plan view in the case where have processing procedure tolerance.
Please also refer to Fig. 1 and Fig. 2, image-taking device 100 is suitable for capturing the biological characteristic of determinand.For example, determinand
It can be finger or palm, and biological characteristic can be fingerprint, palmmprint or vein, but not limited to this.
Image-taking device 100 includes cover board 110, sensor 120 and optics collimator 130.
Cover board 110 has outer surface SO and inner surface SI.Outer surface SO and inner surface SI are relative to each other, and outer surface SO
The for example, touch operation surface of image-taking device 100, that is, determinand touch the outer surface SO of cover board 110, special to carry out biology
Sign identification.
Cover board 110 is suitable for protecting the element (such as sensor 120 and optics collimator 130) being located under it, and cover board 110 can
Using the substrate of high mechanical strength, damage to avoid because of the impact of the pressing of determinand or other external force positioned at cover board 110
The element of lower section.In addition, cover board 110 uses transparent material, make the light beam reflected by determinand (with fingerprint, palmmprint or vein
The light beam of information) cover board 110 can be penetrated and transmitted towards sensor 120.For example, cover board 110 can be glass cover-plate, example
The glass cover-plate of the glass cover-plate or touch device of display equipment in this way, but not limited to this.In one embodiment, cover board
It can be solidified by light transmission colloid by heating processing procedure or irradiation processing procedure.The light transmission colloid can be epoxy resin (epoxy),
Silica gel, optical cement, resin (resin) or other suitable translucent materials.
For the configuration of sensor 120 in the side of cover board 110, sensor 120 includes multiple optical sensing area R, to be measured to receive
The light beam of object reflection.Furthermore, it is understood that sensor 120 may include charge coupled cell (Charge Coupled Device,
CCD), complementary metal oxide semiconductor element (Complementary Metal-Oxide Semiconductor,
) or the Image Sensor of other appropriate types CMOS.For charge coupled cell, the multiple optical sensing area R refers to more
The region of a charge coupled cell.For complementary metal oxide semiconductor element, the multiple optical sensing area R is
Refer to multiple pixel regions in complementary metal oxide semiconductor element.
In one embodiment, image-taking device 100 can further comprise light source (not shown).Light source is located at sensor 120
Side, and light source and sensor 120 are located at the side (such as the lower section for being respectively positioned on cover board 110) of cover board 110.Light source is adapted to provide for
The light beam of determinand is irradiated, light source may include a plurality of light-emitting elements.A plurality of light-emitting elements may include light emitting diode, two pole of laser
The combination of pipe or both.In addition, light beam may include the combination of visible light, non-visible light or both.Non-visible light can
For infrared light, but not limited to this.In the case where image-taking device 100 includes the framework of light source, pulsewidth tune can be integrated in sensor 120
Power transformation road.By the fluorescent lifetime of PWM circuit control a plurality of light-emitting elements and the capture time of sensor 120, make multiple
The capture time synchronization of the fluorescent lifetime of light-emitting component and sensor 130, can reach the effect accurately controlled, but not as
Limit.
Optics collimator 130 configure between cover board 110 and sensor 120, optics collimator 130 be suitable for collimationization by
The light beam surveying object reflection and being transmitted towards sensor 120.Furthermore, it is understood that optics collimator 130 includes that first to overlap each other hides
Light pattern layer 132, the second shielding pattern layer 134 and third shielding pattern layer 136.First shielding pattern layer 132, the second shading
Pattern layer 134 and third shielding pattern layer 136 have high-absorbility and antiradar reflectivity, are transferred to above-mentioned shading figure to reduce
The light beam of pattern layer is by the ratio that above-mentioned shielding pattern layer reflects and the number that light beam is reflected by above-mentioned shielding pattern layer, Jin Eryou
Effect reduces wide-angle light beam (angle refers to angle folded by the transmission path of light beam and the normal of sensing area R) sensed device
120 ratios received, so as to improve cross-interference issue.The antiradar reflectivity refers to reflectivity in visible light wave range and infrared waves
Section is lower than 10%.For example, above-mentioned shielding pattern layer can be the ink of antiradar reflectivity, and but not limited to this.
In addition, in order to enable the light beam reflected by determinand to be sensed device 120 and receive, the first shielding pattern layer 132, the
Two shielding pattern layers 134 and third shielding pattern layer 136 are respectively provided with multiple first light openings O1, multiple second light transmissions are opened
Mouth O2 and multiple third light openings O3.Each first light openings O1 and one of them second light openings O2, one of them
Third light openings O3 and corresponding optical sensing area R overlapping, so as to can pass through towards the low-angle light beam that sensing area R is transmitted
The first light openings O1, a second light openings O2 and third light openings O3 that overlap each other and be transferred to
A corresponding optical sensing area R.
Optics collimator 130 meets: the size SO3 of each third light openings O3 is greater than or equal to each second light openings O2
Size SO2, and the size SO2 of each second light openings O2 be greater than each first light openings O1 size SO1；Or each third is saturating
The size SO3 of light opening O3 is greater than the size SO2 of each second light openings O2, and the size SO2 of each second light openings O2 is big
In or equal to each first light openings O1 size SO1.It is the light transmission under circular framework in the shape of above-mentioned light openings
The size of opening refers to the diameter of light openings.It is rectangular, other polygons or above-mentioned shape in the shape of above-mentioned light openings
Combination framework under, the size of the light openings refers to the width on wherein one side of light openings.
In the case where the size of multiple light openings of multiple shielding pattern layers is all the same, the size of multiple light openings
Bigger, then the light-inletting quantity of optical sensing area R is bigger, but has been easy cross-interference issue.On the contrary, the size of multiple light openings is smaller,
Although can effectively improve cross-interference issue, it be easy to cause light-inletting quantity too small.In addition, multiple light openings of different shielding pattern layers
Center may can not be aligned because of processing procedure tolerance.That is, the shielding pattern layer of closer optical sensing area R may cover
Light openings (hiding hole phenomenon) above the shielding pattern layer, so that effective vent value corresponding to each optical sensing area R is (different
The intersection area of multiple light openings of shielding pattern layer) it is smaller than preset effective vent value (i.e. the sizes of light openings), into
And the default light-inletting quantity for causing the practical light-inletting quantity of each optical sensing area R to be less than each optical sensing area R.
In view of above content, the present embodiment will go here and there when designing the size of multiple light openings of different shielding pattern layers
It disturbs screening hole phenomenon caused by problem, light-inletting quantity and processing procedure tolerance and is included in and consider.For example, according to each optical sensing area R
Size, adjacent two optical sensing areas R lateral distance D and adjacent two shielding pattern layer between fore-and-aft distance (including longitudinal direction
Distance D ' and fore-and-aft distance D ' ') design the first shielding pattern layer 132 the first light openings O1 size SO1, to improve simultaneously
Crosstalk and the too small problem of light-inletting quantity.In addition, also by least one layer (such as the second light-shielding pattern made in remaining shielding pattern layer
Layer 134 and third shielding pattern layer 136 wherein at least one) light openings size be greater than the first shielding pattern layer 132
The first light openings O1 size SO1.In this way, even if because processing procedure tolerance opens multiple light transmissions of different shielding pattern layers
Mouthful center can not be aligned the shielding pattern layer masking that also can effectively avoid closer optical sensing area R (referring to Fig. 3) to the screening
Light openings above light pattern layer, so that effective vent value corresponding to each optical sensing area R is equal or approximate and preset has
It imitates opening value (i.e. the size SO1 of the first light openings O1), and then while improving crosstalk, avoids excessively limiting sensor
120 light-inletting quantity.
In the present embodiment, the size SO3 of each third light openings O3 is greater than the size SO2 of each second light openings O2,
And the size SO2 of each second light openings O2 is greater than the size SO1 of each first light openings O1.In addition, the first shielding pattern layer
132, the second shielding pattern layer 134 and third shielding pattern layer 136 are arranged from sensor 120 towards cover board 110.However, different
The arrangement mode of the size relativeness of light openings and different shielding pattern layers can change according to demand, without with Fig. 1 institute
Display is limited.
Optics collimator 100 can further comprise other elements according to different requirements,.For example, optics collimator
100 can further comprise the first transparent substrates 131 and the second transparent substrates 133, to carry above-mentioned shielding pattern layer.First thoroughly
Photopolymer substrate 131 and the second transparent substrates 133 are adapted to allow for light beam and penetrate.For example, above-mentioned transparent substrates can be glass base
Plate, plastic base or transparent photoresist etc., but not limited to this.
First transparent substrates 131 are between sensor 120 and cover board 110, and the second transparent substrates 133 are located at first thoroughly
Between photopolymer substrate 131 and cover board 110.Second shielding pattern layer 134 is located at the first transparent substrates 131 and the second transparent substrates 133
Between.First shielding pattern layer 132 is located between sensor 120 and the first transparent substrates 131.Third shielding pattern layer 136
Between the second transparent substrates 133 and cover board 110.In the present embodiment, the configuration of the first shielding pattern layer 132 is in the first light transmission base
For plate 131 towards on the surface S131 of sensor 120, the second shielding pattern layer 134 is embedded in the second transparent substrates 133 towards first
In the surface S133A of transparent substrates 131, and third shielding pattern layer 136 is configured in the second transparent substrates 133 towards cover board 110
Surface S133B on, but not limited to this.In one embodiment, the first shielding pattern layer 132 can be embedded in the first light transmission base
Plate 131 is towards in the surface S131 of sensor 120.In addition, the second shielding pattern layer 134 is configurable on the second transparent substrates 133
On surface S133A towards the first transparent substrates 131.In addition, third shielding pattern layer 136 can be embedded in the second transparent substrates
In the 133 surface S133B towards cover board 110.
Between cover board 110 and the second transparent substrates 133, between the second transparent substrates 133 and the first transparent substrates 131 and
It can be fixed on by adhesion layer (not shown) or fixed mechanism (not shown) between first transparent substrates 131 and sensor 120
Together.Adhesion layer can be optical adhesive (Optical Clear Adhesive, OCA) or chip attachment film (Die
Attach Film, DAF), but not limited to this.When being fixed between cover board 110 and the second transparent substrates 133 by adhesion layer
Together, adhesion layer can in the gap G1 between cover board 110 and the second transparent substrates 133, third shielding pattern layer 136 with
Between cover board 110 or above-mentioned two combination.In other words, in the gap G1 between cover board 110 and the second transparent substrates 133
Light transfer medium can be air or adhesion layer.In addition, when between the second transparent substrates 133 and the first transparent substrates 131 by
Adhesion layer and be fixed together, adhesion layer can be between the second transparent substrates 133 and the first transparent substrates 131, the second shading
Between pattern layer 134 and the first transparent substrates 131 or above-mentioned two combination.In addition, when the first transparent substrates 131 and sensor
It is fixed together between 120 by adhesion layer, adhesion layer can seam between the first transparent substrates 131 and sensor 120
In gap G2, between the first shielding pattern layer 132 and sensor 120 or above-mentioned two combination.In other words, the first transparent substrates
The light transfer medium in the G2 of gap between 131 and sensor 120 can be air or adhesion layer.
Then Fig. 4 to Fig. 8 is combined to illustrate the other embodiments of image-taking device, wherein identical element is with identical label
It indicates, no longer repeats below.Fig. 4 to Fig. 8 is image-taking device of the second embodiment of the present invention to sixth embodiment respectively
Diagrammatic cross-section.
Referring to figure 4., the main difference of the image-taking device 100 of the image-taking device 200 and Fig. 1 of the second embodiment of the present invention
As described below.In image-taking device 200, the size SO3 of each third light openings O3 is equal to the size of each second light openings O2
SO2, and the size SO2 of each second light openings O2 is greater than the size SO1 of each first light openings O1.In the present embodiment,
One shielding pattern layer 132, the second shielding pattern layer 134 and third shielding pattern layer 136 are from sensor 120 towards 110 row of cover board
Column, but not limited to this.In another embodiment, the first shielding pattern layer 132, the second shielding pattern layer 134 and third
Shielding pattern layer 136 can from cover board 110 towards sensor 120 arrange so that third shielding pattern layer 136 be located at sensor 120 and
Between first transparent substrates 131, and the first shielding pattern layer 132 is between the second transparent substrates 133 and cover board 110.
Referring to figure 5., the main difference of the image-taking device 100 of the image-taking device 300 and Fig. 1 of the third embodiment of the present invention
As described below.In image-taking device 300, the size SO3 of each third light openings O3 is greater than the size of each second light openings O2
SO2, and the size SO2 of each second light openings O2 is equal to the size SO1 of each first light openings O1.In the present embodiment,
One shielding pattern layer 132, the second shielding pattern layer 134 and third shielding pattern layer 136 are from sensor 120 towards 110 row of cover board
Column, but not limited to this.In another embodiment, the first shielding pattern layer 132, the second shielding pattern layer 134 and third
Shielding pattern layer 136 can from cover board 110 towards sensor 120 arrange so that third shielding pattern layer 136 be located at sensor 120 and
Between first transparent substrates 131, and the first shielding pattern layer 132 is between the second transparent substrates 133 and cover board 110.
Please refer to Fig. 6, the main difference of the image-taking device 100 of the image-taking device 400 and Fig. 1 of the fourth embodiment of the present invention
As described below.In the image-taking device 100 of Fig. 1, the size of multiple light openings of different shielding pattern layers is from sensor
120 are gradually incremented by towards cover board 110.On the other hand, in the image-taking device of Fig. 6 400, multiple light transmissions of different shielding pattern layers
The size of opening is gradually successively decreased from sensor 120 towards cover board 110.
Furthermore, it is understood that the first shielding pattern layer 132, the second shielding pattern layer 134 and third shielding pattern layer 136 from
Cover board 110 is arranged towards sensor 120 so that third shielding pattern layer 136 be located at sensor 120 and the first transparent substrates 131 it
Between, and the first shielding pattern layer 132 is between the second transparent substrates 133 and cover board 110.In the present embodiment, third shading
Pattern layer 136 configures on surface S131 of first transparent substrates 131 towards sensor 120, and the first shielding pattern layer 132 is matched
It sets on surface S133B of second transparent substrates 133 towards cover board 110, but not limited to this.In one embodiment, third
Shielding pattern layer 136 can be embedded in the first transparent substrates 131 towards in the surface S131 of sensor 120, and the first light-shielding pattern
Layer 132 can be embedded in the second transparent substrates 133 towards in the surface S133B of cover board 110.
Please refer to Fig. 7, the main difference of the image-taking device 100 of the image-taking device 500 and Fig. 1 of the fifth embodiment of the present invention
As described below.In image-taking device 500, image-taking device 500 further comprises display panel 140, to provide display function.Display
Panel 140 is between optics collimator 130 and cover board 110.For example, display panel 140 can be thin film transistor (TFT) liquid
LCD panel (Thin Film Transistor Liquid Crystal Display panel, TFT-LCD panel),
Micro-led display panel (Micro Light Emitting Diode display panel, Micro LED
Display panel) or organic LED display panel (Organic Light Emitting Diode display
Panel, OLED display panel), or have touch control layer (i.e. electrode cabling) display panel etc., but not with
This is limited.When display panel 140 is emissive type display panel, a part of light beam provided by display panel 140 is available
In living things feature recognition, but not limited to this.
Please refer to Fig. 8, the main difference of the image-taking device 500 of the image-taking device 600 and Fig. 7 of the sixth embodiment of the present invention
As described below.In image-taking device 600, image-taking device 600 further comprises bandpass filter layer 150 and light source 160.Band logical filter
Photosphere 150 is between display panel 140 and sensor 120, and light source 160 is located at the side of sensor 120, and light source 160 with
Sensor 120 is located at the side (such as the lower section for being respectively positioned on cover board 110) of cover board 110.
In the present embodiment, bandpass filter layer 150 is between optics collimator 130 and sensor 120, and light source 160
Positioned at the wherein side of sensor 120, but not limited to this.In one embodiment, bandpass filter layer 150 can be located at display surface
Between plate 140 and optics collimator 130.In addition, light source 160 can be located at more sides of sensor 120, such as configuration in sensor
120 polygon, multiple corners or above-mentioned two combination.
Light source 160 is adapted to provide for the light beam of living things feature recognition.Bandpass filter layer 150 is adapted to allow for from light source 160
Light beam passes through (the luminous frequency spectrum of namely light source 160 fall in bandpass filter layer 150 penetrate in frequency spectrum) and filters other light beams,
To avoid environment light beam or the light beam from display panel 140 is transferred to interference caused by sensor 120, and then promotes capture
The recognition capability of device 600.For example, bandpass filter layer 150 can be infrared bandpass filter layer, and bandpass filter layer 150 allows wave
The light beam of a length of 800 nm to 900 nm pass through, and wavelength-filtered is the light beam other than 800 nm to 900 nm.Accordingly, light source
120 selection wavelength fall in the infrared light supply in the range of 800 nm to 900 nm.In other embodiments, bandpass filter layer 420
It can be selected and wavelength is allowed to be bandpass filter that light beam that the light beam or wavelength of 840 nm to 860 nm is 890 nm to 990 nm passes through
Layer, and light source 120 selects wavelength to fall in the infrared light supply in the range of 840 nm to 860 nm or 890nm to 990nm, but this hair
It is bright to be not limited to this.
Although optics collimator 130 of the first embodiment into sixth embodiment only includes three layers of shielding pattern layer,
The quantity of shielding pattern layer in optics collimator 130 is not limited.In one embodiment, optics collimator can be further
Including the 4th shielding pattern layer (not shown).First shielding pattern layer, the second shielding pattern layer, third shielding pattern layer and
Four shielding pattern layers overlap each other, and the 4th shielding pattern layer has multiple 4th light openings.Optics collimator meets: each the
The size of four light openings is greater than or equal to the size of each third light openings.In addition, the first shielding pattern layer, the second shading figure
Pattern layer, third shielding pattern layer and the 4th shielding pattern layer can be arranged from sensor towards cover board or be arranged from cover board towards sensor
Column.In yet another embodiment, optics collimator may include four layers or more of shielding pattern layer (not shown), wherein each 5th is saturating
The size of light opening is greater than or equal to the size of each 4th light openings, and the size of the light openings of remaining shielding pattern layer is according to this
Analogize, details are not described herein.
In conclusion in the image-taking device of the embodiment of the present invention, by the light openings of modulation difference shielding pattern layer
Size, other than it can improve cross-interference issue, additionally it is possible to improve screening hole phenomenon caused by processing procedure tolerance, make sensor
Light-inletting quantity is effectively promoted.Therefore, the image-taking device of the embodiment of the present invention can avoid excessively limiting sensing while improving crosstalk
The light-inletting quantity of device.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of image-taking device, which is characterized in that the image-taking device includes:
Cover board；
Sensor, the sensor configurations are in the side of the cover board；And
Optics collimator, the optics collimator configuration is between the cover board and the sensor, wherein the optical alignment
Device includes the first shielding pattern layer, the second shielding pattern layer and third shielding pattern layer, first shielding pattern layer, described
Second shielding pattern layer and the third shielding pattern layer overlap each other, and first shielding pattern layer is saturating with multiple first
Light opening, second shielding pattern layer have multiple second light openings, and the third shielding pattern layer has multiple thirds
Light openings, and the optics collimator meets:
The size of each third light openings is greater than or equal to the size of each second light openings, and each described second is saturating
The size of light opening is greater than the size of each first light openings；Or
The size of each third light openings is greater than the size of each second light openings, and each second light openings
Size be greater than or equal to each first light openings size.
2. image-taking device according to claim 1, which is characterized in that the size of each third light openings is greater than each institute
The size of the second light openings is stated, the size of each second light openings is greater than the size of each first light openings, and
First shielding pattern layer, second shielding pattern layer and the third shielding pattern layer are from the sensor towards described
Cover board is arranged or is arranged from the cover board towards the sensor.
3. image-taking device according to claim 1, which is characterized in that the size of each third light openings is equal to each institute
The size of the second light openings is stated, the size of each second light openings is greater than the size of each first light openings, and
First shielding pattern layer, second shielding pattern layer and the third shielding pattern layer are from the sensor towards described
Cover board is arranged or is arranged from the cover board towards the sensor.
4. image-taking device according to claim 1, which is characterized in that the size of each third light openings is greater than each institute
The size of the second light openings is stated, the size of each second light openings is equal to the size of each first light openings, and
First shielding pattern layer, second shielding pattern layer and the third shielding pattern layer are from the sensor towards described
Cover board is arranged or is arranged from the cover board towards the sensor.
5. image-taking device according to any one of claim 1 to 4, which is characterized in that the optics collimator further includes
First transparent substrates and the second transparent substrates, first transparent substrates are between the sensor and the cover board, institute
The second transparent substrates are stated between first transparent substrates and the cover board, second shielding pattern layer is located at described the
Between one transparent substrates and second transparent substrates, first shielding pattern layer and the third shielding pattern layer its
In one between the sensor and first transparent substrates, and first shielding pattern layer and the third hide
The another one of light pattern layer are between second transparent substrates and the cover board.
6. image-taking device according to any one of claim 1 to 4, which is characterized in that the image-taking device further include:
Light source, the light source are located at beside the sensor, and the light source and the sensor are located at the side of the cover board.
7. image-taking device according to any one of claim 1 to 4, which is characterized in that the image-taking device further include:
Display panel, the display panel is between the optics collimator and the cover board.
8. image-taking device according to claim 7, which is characterized in that the image-taking device further include:
Bandpass filter layer, the bandpass filter layer is between the display panel and the sensor；And
Light source, the light source are located at beside the sensor, and the light source and the sensor are located at the side of the cover board,
Wherein the luminous frequency spectrum of the light source falls in the penetrating in frequency spectrum of the bandpass filter layer.
9. image-taking device according to claim 1, which is characterized in that the optics collimator further includes the 4th light-shielding pattern
Layer, first shielding pattern layer, second shielding pattern layer, the third shielding pattern layer and the 4th shading figure
Pattern layer overlaps each other, and the 4th shielding pattern layer has multiple 4th light openings, and the optics collimator meets:
The size of each 4th light openings is greater than or equal to the size of each third light openings.
10. image-taking device according to claim 7, which is characterized in that the display panel is the display with touch control layer
Panel.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/976,883 US10091402B1 (en) | 2015-12-11 | 2018-05-11 | Image capture apparatus |
| US16/008,037 US10460188B2 (en) | 2014-08-26 | 2018-06-14 | Bio-sensing apparatus |
| US16/996,883 US20200381470A1 (en) | 2014-08-26 | 2020-08-18 | Image capture device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106126793 | 2017-08-08 | ||
| TW106126793 | 2017-08-08 |
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| Publication Number | Publication Date |
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| CN109389108A true CN109389108A (en) | 2019-02-26 |
| CN109389108B CN109389108B (en) | 2022-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711271306.0A Active CN109389108B (en) | 2014-08-26 | 2017-12-05 | Image capturing device |
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| TW (1) | TWI633493B (en) |
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Also Published As
| Publication number | Publication date |
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| TW201911111A (en) | 2019-03-16 |
| TWI633493B (en) | 2018-08-21 |
| CN109389108B (en) | 2022-03-01 |
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