TWI748643B - Fingerprint identification module, method for making same and electronic device - Google Patents

Abstract

The embodiments of the present disclosure provide a fingerprint identification module, a method for making the fingerprint identification module, and an electronic device. The fingerprint identification module defines a fingerprint identification area and a peripheral area surrounding the fingerprint identification area. The fingerprint recognition module includes a first light-shielding layer, optical sensors, a second light-shielding layer, a support portion arranged in the peripheral area, and a gap portion arranged in the fingerprint recognition area. The first light-shielding layer defines first through holes. The second light shielding layer defines second through holes. Each of the second through holes exposes one of the optical sensors and is aligned with one of the first through holes. Optical signal reflected by a fingerprint is collimated by the first through holes, the gap portion and the second through holes and then is received by the optical sensors to realize fingerprint imaging.

Description

Fingerprint identification module, its preparation method and electronic device

The present invention relates to the technical field of fingerprint identification, in particular to a fingerprint identification module, a preparation method of the fingerprint identification module and an electronic device using the fingerprint identification module.

Conventionally, the structure of the fingerprint identification module adopts either light shielding layers and cover layers alternately stacked to form a collimating structure for fingerprint imaging, or a lens for fingerprint imaging. However, in a structure in which light-shielding layers and covering layers are alternately stacked to form a collimating structure for fingerprint imaging, it is necessary to fabricate as many as seven to eight layers in sequence, which is difficult to produce; while in a structure that uses lenses for fingerprint imaging, The lens is thicker than the collimating structure, and when the fingerprint recognition area is larger, the lens is difficult to manufacture.

An embodiment of the present invention provides a fingerprint recognition module, which defines a fingerprint recognition area and a peripheral area surrounding the fingerprint recognition area, wherein the fingerprint recognition module includes: a first substrate, the first substrate includes a transparent A first substrate and a first light-shielding layer located on the first substrate, the first light-shielding layer defines a plurality of first through holes arranged at intervals; A second substrate, the second substrate includes a transparent second substrate, a plurality of optical sensors arranged on the second substrate at intervals, and a Two light-shielding layers, the second light-shielding layer defines a plurality of second through holes arranged at intervals, and each of the second through holes exposes one of the optical sensors and is aligned with one of the first through holes, so The first light-shielding layer, the optical sensor, and the second light-shielding layer are located between the first base and the second base; a support portion, the support portion is located between the first substrate and the Between the second substrates and arranged in the peripheral area, for bonding the first substrate and the second substrate and maintaining a distance between the first substrate and the second substrate; and a gap portion , The gap portion is located between the first substrate and the second substrate and is disposed in the fingerprint recognition area; wherein the light signal reflected by the fingerprint passes through the first through hole, the gap portion and the fingerprint recognition area. The second through hole is collimated and received by the optical sensor, and the optical sensor senses the optical signal to realize fingerprint imaging.

In the fingerprint recognition module, the first light-shielding layer, the gap portion, and the second light-shielding layer can form a collimating structure. In this way, a support part is formed in the peripheral area of the fingerprint recognition module to maintain a certain distance between the first substrate and the second substrate, so that a certain distance between the first light-shielding layer and the second light-shielding layer can be provided in the fingerprint recognition area. Thickness to achieve the collimation of light. Compared with stacking multiple layers (up to seven to eight layers) of light shielding layer and cover layer in sequence to maintain a certain thickness of the collimation structure, the fingerprint recognition module reduces the number of film layers and reduces the manufacturing difficulty. In addition, the production of the gap portion of the fingerprint identification module is not limited by the area of the fingerprint identification area, and compared with the method of using a lens for fingerprint imaging, the production difficulty is also reduced.

An embodiment of the present invention also provides a method for preparing a fingerprint identification module, which includes: A first substrate is provided, the first substrate includes a transparent first base and a first light-shielding layer on the first base, the first light-shielding layer defines a plurality of first through holes arranged at intervals; and a second A substrate, the second substrate comprising a transparent second substrate, a plurality of optical sensors arranged on the second substrate at intervals, and a second light shielding located on the side of the optical sensor away from the second substrate Layer, the second light-shielding layer defines a plurality of second through holes arranged at intervals, and each of the second through holes exposes one optical sensor; and on the first substrate or the second substrate A support portion is formed around the periphery of the support portion, and the support portion adheres the first substrate and the second substrate and maintains a distance between the first substrate and the second substrate; wherein, each of the second substrates The through hole is aligned with one of the first through holes, the first light-shielding layer, the optical sensor, and the second light-shielding layer are located between the first substrate and the second substrate, and the first The area enclosed by the supporting portion between a substrate and the second substrate forms a gap portion.

In the method for preparing the fingerprint recognition module, optical spacers are formed in the peripheral area of the fingerprint recognition module to maintain a certain distance between the first substrate and the second substrate, so that the first light-shielding layer and the second light-shielding layer can be made There is a certain thickness in the fingerprint recognition area between the layers, so as to realize the collimation of the light. Compared with stacking multiple layers (up to seven to eight layers) of light shielding layer and cover layer in sequence to maintain a certain thickness of the collimation structure, the fingerprint recognition module reduces the number of film layers and reduces the manufacturing difficulty. In addition, the production of the gap portion of the fingerprint identification module is not limited by the area of the fingerprint identification area, and compared with the method of using a lens for fingerprint imaging, the production difficulty is also reduced.

An embodiment of the present invention further provides an electronic device, which includes a display panel and a fingerprint recognition module, wherein the display panel has a display surface, and the fingerprint recognition module is located on a side of the display panel away from the display surface. On the other hand, the fingerprint identification module is the aforementioned fingerprint identification module.

Since the electronic device includes the above-mentioned fingerprint identification module, it also reduces the manufacturing difficulty.

100: electronic device

20: display panel

SA: Sensing area

22: display surface

10: Fingerprint recognition module

FA: Fingerprint recognition area

NA: Surrounding area

11: The first substrate

112: First substrate

114: first shading layer

1142: first through hole

1144: first opening

116: Overlay

118: third shading layer

1182: third through hole

12: Second substrate

122: second base

1222: prominent area

124: Optical Sensor

126: second shading layer

1262: second through hole

1264: second opening

128: protective layer

13: Frame glue

14: Optical spacer

15: Clearance

16: Flip chip film

162: Fingerprint recognition chip

164: flexible circuit board

17: Support

FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the invention.

2 is a schematic plan view of a fingerprint identification module according to an embodiment of the present invention.

Fig. 3 is a schematic partial cross-sectional view along the line A-A in Fig. 2.

4 is a schematic partial cross-sectional view of an electronic device using the fingerprint identification module shown in FIG. 3.

5A is a schematic partial cross-sectional view of a fingerprint identification module according to another embodiment of the invention.

FIG. 5B is a schematic partial cross-sectional view of a fingerprint identification module according to still another embodiment of the present invention.

FIG. 6 is a schematic plan view of a fingerprint identification module according to another embodiment of the present invention.

FIG. 7 is a flowchart of a method for preparing a fingerprint identification module according to an embodiment of the present invention.

FIG. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the invention. As shown in FIG. 1, the electronic device 100 includes a display panel 20 and a fingerprint recognition module 10 located under the display panel 20. The display panel 20 has a display surface 22, and the fingerprint recognition module 10 is located on the side of the display panel 20 away from the display surface 22 for receiving through the display panel 20 reflections from external objects (eg, fingers). Optical signal, and convert the received optical signal into a corresponding electrical signal for fingerprint identification.

As shown in FIG. 1, the display panel 20 defines a sensing area SA that can be contacted by an external object (for example, a finger). The fingerprint identification module 10 is aligned with the sensing area SA. When a finger touches the sensing area SA, the fingerprint identification module 10 can collect a fingerprint image of the finger to obtain corresponding fingerprint information.

In one embodiment, the sensing area SA is at least partially located in the display area of the display panel 20. In other embodiments, the sensing area SA can be extended to the entire display area of the display panel 20. The area of the display panel 20 for displaying images is a display area, and the area outside the display area of the display panel 20 is a non-display area.

In one embodiment, the display panel 20 may be a self-luminous display panel, which has a self-luminous unit (not shown). For example, the display panel 20 may be an organic light emitting diode (OLED) display panel or a micro light emitting diode (Micro LED) display panel. Part of the self-luminous unit in the display panel 20 can be used as a detection light source for fingerprint detection. When an external object (such as a finger) presses the sensing area SA on the display panel 20, the display panel 20 emits a detection beam to the finger above the sensing area SA, and the detection beam is reflected on the surface of the finger to form an emission Light. The detection beam reflected from the finger is received by the fingerprint identification module 10 and converted into a corresponding electrical signal to realize fingerprint identification.

In an embodiment, the electronic device 100 may be, but is not limited to, consumer electronic products, household electronic products, vehicle-mounted electronic products, financial terminal products, and the like. Among them, consumer electronic products are, for example, mobile phones, tablet computers, notebook computers, desktop monitors, and all-in-one computers. Home electronic products are, for example, smart door locks, refrigerators, and so on. Car-mounted electronic products are, for example, car navigation systems, car DVDs, and the like. Financial terminal products are, for example, ATM machines, self-service business terminals, etc.

Hereinafter, the fingerprint identification module 10 according to the embodiment of the present invention will be described with reference to FIGS. 2 to 6.

FIG. 2 is a schematic plan view of the fingerprint identification module 10 according to an embodiment of the present invention. As shown in FIG. 2, the fingerprint recognition module 10 defines a fingerprint recognition area FA and a peripheral area NA surrounding the fingerprint recognition area FA. It can be understood that the fingerprint recognition area FA of the fingerprint recognition module 10 corresponds to the sensing area SA of the display panel 20.

In one embodiment, the fingerprint recognition area FA is roughly elliptical, which is roughly the same shape as a finger. In other embodiments, the fingerprint recognition area FA may also be rectangular, which is not limited here.

Fig. 3 is a schematic partial cross-sectional view along the line A-A in Fig. 2. As shown in FIG. 3, the fingerprint recognition module 10 includes a first substrate 11 and a second substrate 12 that are arranged opposite to each other. The first substrate 11 includes a first base 112 and a first light shielding layer 114 on the first base 112. The first light shielding layer 114 defines a plurality of first through holes 1142 arranged at intervals. The second substrate 12 includes a second substrate 122, a plurality of optical sensors 124 arranged on the second substrate 122 at intervals, and a second light shielding located on the side of the optical sensor 124 away from the second substrate 122 Layer 126. The second light shielding layer 126 defines a plurality of second through holes 1262 arranged at intervals. Each second through hole 1262 exposes one optical sensor 124 and is aligned with one first through hole 1142. The first light shielding layer 114, the optical sensor 124 and the second light shielding layer 126 are located between the first substrate 112 and the second substrate 122.

In an embodiment, the first through holes 1142, the second through holes 1262, and the optical sensors 124 may be arranged in an array.

As shown in FIG. 3, the fingerprint recognition module 10 further includes a supporting portion 17 and a gap portion 15 between the first substrate 11 and the second substrate 12. Wherein, the supporting portion 17 includes a sealant 13 and an optical spacer 14.

The sealant 13 is aligned with the peripheral area NA to bond the first substrate 11 and the second substrate 12 together. The optical spacer 14 is arranged in the sealant 13 to maintain a distance between the first substrate 11 and the second substrate 12. The gap 15 is aligned with the fingerprint recognition area FA to collimate the light signal reflected by the finger together with the first light shielding layer 114 and the second light shielding layer 126.

FIG. 4 is a schematic partial cross-sectional view of an electronic device 100 using the fingerprint identification module 10 shown in FIG. 3. As shown in FIG. 4, the fingerprint identification module 10 is located on the display panel 20 away from its display surface 22. One side. Among them, part of the self-luminous unit in the display panel 20 is used as the detection light source of the fingerprint identification module 10 to emit light. When a finger touches the sensing area SA (fingerprint recognition area FA) of the display surface 22 of the display panel 20, the light emitted by the self-luminous unit in the display panel 20 is incident on the display surface 22 and passes through the valleys and ridges of the fingerprint of the finger. Reflection occurs. The optical signal reflected by the fingerprint of the finger is collimated and then received by the optical sensor 124. The optical sensor 124 senses the optical signal to realize fingerprint imaging.

In one embodiment, the optical sensor 124 includes a photodiode, which can convert the received optical signal (eg, the difference in light intensity) into a difference signal of an electrical signal, thereby realizing fingerprint recognition and determining the fingerprint image.

In FIG. 4, the light reflected by the finger passes through the display panel 20, the first substrate 11, and the gap portion 15 in sequence, and then is received by the optical sensor 124. The light reflected by the finger is blocked at the position of the first light shielding layer 114 where the first through hole 1142 is not opened and the position of the second light shielding layer 126 where the second through hole 1262 is not opened. The light reflected by the finger passes through the first through hole 1142 (small hole structure) and the third through hole 1182 and then forms an image on the optical sensor 124. Thereby, the collimating structure formed by the first light-shielding layer 114 and the second light-shielding layer 126 limits the fingerprint range that each optical sensor 124 can collect (L1 in FIG. 4). At the same time, since the light in the area around the fingerprint range L1 is absorbed by the unopened areas of the first light-shielding layer 114 and the third light-shielding layer 118, interference light is reduced and the accuracy of fingerprint recognition is improved.

The distance between adjacent wave crests and wave crests of a normal person's fingerprint is about 500 micrometers to 600 micrometers. That is, the fingerprint distance (the distance between a wave trough and an adjacent wave crest) of a normal person is approximately 250 to 300 microns. In one embodiment, by adjusting the distance from the display surface 22 to the optical sensor 124 and the size of the first through hole 1142 and the second through hole 1262, the fingerprint range collected by each optical sensor 124 can be adjusted to The fingerprint range L1 collected by each optical sensor 124 is 200 micrometers to 400 micrometers. Among them, if If L1 is less than 200 microns, there is a problem that the detection light source of the display panel 20 is insufficient. If L1 is greater than 400 microns, the resolution of the fingerprint image is poor, and the fingerprint recognition accuracy is low.

In one embodiment, the fingerprint ranges collected by two adjacent optical sensors 124 do not overlap. That is, the object image areas corresponding to two adjacent imaging areas do not overlap, so as to improve the signal-to-noise ratio detected by the optical sensor 124.

In one embodiment, the first through hole 1142 and the third through hole 1182 are both circular holes, and the sizes of the two are the same. The ratio of the diameter of the first through hole 1142 (that is, the diameter of the third through hole 1182) to the distance between the display surface 22 and the optical sensor 124 is approximately 1:7, so that the light reflected by the finger has a relatively high value. Good collimation effect. In other embodiments, the first through hole 1142 and the third through hole 1182 may also be rectangular, etc., which are not limited.

In one embodiment, the materials of the first substrate 112 and the second substrate 122 are both transparent, for example, transparent glass. The material of the first light-shielding layer 114 and the second light-shielding layer 126 may be an opaque material such as organic black matrix or metal.

In one embodiment, the material of the gap 15 is air. That is, the gap portion 15 is an air gap. In the fingerprint recognition module 10, the first light shielding layer 114, the gap portion 15 (air gap), and the second light shielding layer 126 can form a collimating structure. Thereby, an optical spacer 14 is formed in the peripheral area NA of the fingerprint recognition module 10 to maintain a certain distance between the first substrate 11 and the second substrate 12, so that the first light-shielding layer 114 and the second light-shielding layer 126 There is a certain thickness between the fingerprint identification area FA, and then the light is collimated. Compared with stacking multiple layers (up to seven to eight layers) of light shielding layer and cover layer in sequence to maintain a certain thickness of the collimation structure, the fingerprint identification module 10 reduces the number of film layers and reduces the manufacturing difficulty. In addition, the production of the gap 15 (air gap) of the fingerprint recognition module 10 is not Due to the limitation of the area of the fingerprint recognition area FA, compared with the method of using a lens to perform fingerprint imaging, the manufacturing difficulty is also reduced.

In another embodiment, the gap 15 may be a transparent medium. The transparent medium is, for example, an optical clear resin (Optical Clear Resin, OCR). That is, in the fingerprint recognition module 10, the first light shielding layer 114, the gap portion 15 (transparent medium), and the second light shielding layer 126 can form a collimating structure. In this way, an optical spacer 14 is formed in the peripheral area NA of the fingerprint recognition module 10 to maintain a certain distance between the first substrate 11 and the second substrate 12, and the fingerprint recognition area FA is filled with a transparent medium to enable the first A light shielding layer 114 and a second light shielding layer 126 have a certain thickness in the fingerprint recognition area FA, so as to achieve light collimation. Similarly, compared to stacking multiple layers (up to seven to eight layers) of light shielding layer and cover layer 116 in sequence to maintain a certain thickness of the collimation structure, the fingerprint recognition module 10 reduces the number of film layers and reduces Difficulty of production. In addition, the production of the gap 15 (transparent medium) of the fingerprint identification module 10 is not limited by the area of the fingerprint identification area FA. Compared with the method of fingerprint imaging using a lens, the production difficulty is also reduced.

In one embodiment, the first substrate 11 further includes a transparent cover layer 116 located on the side of the first light shielding layer 114 away from the first base 112, and a transparent cover layer 116 located on the cover layer 116 away from the first base 112. A third light shielding layer 118 on the surface of the substrate 112. The third light shielding layer 118 defines a plurality of third through holes 1182 arranged at intervals. Each of the third through holes 1182 is aligned with one of the first through holes 1142 and one of the second through holes 1262.

As shown in FIG. 4, along the thickness direction of the first substrate 11, the projection of the third through hole 1182 on the first base 112 completely covers the projection of the first through hole 1142 on the first base 112. The maximum imaging size of the light signal reflected by the fingerprint on the second substrate 122 after being collimated by the first through hole 1142, the third through hole 1182, and the gap 15 (L2 in FIG. 4) Less than two adjacent ones The spacing of the fingerprint sensor. That is, by disposing the third light-shielding layer 118 between the first light-shielding layer 114 and the second light-shielding layer 126 to absorb part of the light reflected by the finger, the light reflected by the finger in the fingerprint area L3 is only reflected by one optical fiber. The sensor 124 receives. In this way, the optical signals detected by the adjacent optical sensors 124 will not interfere with each other, which improves the accuracy of fingerprint recognition.

In an embodiment, the material of the third light shielding layer 118 may be an opaque material such as organic black matrix or metal. The material of the cover layer 116 may be a transparent resin. In one embodiment, if the material of the third light-shielding layer 118 is metal, the second substrate 12 may further include a protective layer 128 that fills the second through holes 1262 and completely covers the third light-shielding layer 118 to prevent oxidation of the metal in the third light-shielding layer 118. The material of the protection layer 128 may be a silicon oxide (SiOx) layer, a silicon nitride (SiNx) layer or a multilayer formation thereof.

In one embodiment, the size of the first through hole 1142, the third through hole 1182, and the hole size of the second through hole 1262 are related to the height of the cover layer 116 and the height of the gap 15. In one embodiment, the hole diameters of the first through hole 1142 and the second through hole 1262 are both 4 microns, the height of the cover layer 116 is approximately 6 microns to 10 microns, and the height of the gap 15 is approximately 25 microns to 35 microns. Micrometers, so that the light reflected by the finger has a better collimation effect between the display surface 22 and the optical sensor 124.

In FIG. 4, the optical spacer 14 is a spherical optical spacer. A plurality of spherical optical spacers 14 are scattered in the sealant 13. Wherein, both ends of the optical spacer 14 are supported on the first substrate 11 and the second substrate 12 respectively, so that there is a certain distance between the first light-shielding layer 114 and the second light-shielding layer 126. Wherein, the first light shielding layer 114, the gap portion 15 and the second light shielding layer 126 constitute a collimating structure to collimate the light reflected by the finger. Due to the arrangement of the optical spacer 14, a thickness can be maintained between the first light-shielding layer 114 and the second light-shielding layer 126, which avoids the manufacturing process of multiple layers in sequence and reduces the manufacturing difficulty. At the same time, no matter what the gap 15 is The air gap is still filled with transparent medium, and its production is not affected by The limitation of the area of the fingerprint identification area FA reduces the difficulty of manufacturing compared to the method of using a lens for fingerprint imaging.

In other embodiments, the optical spacer 14 may be a columnar optical spacer, and a plurality of columnar optical spacers 14 are arranged in the sealant 13 at intervals. One end of each columnar optical spacer 14 is formed on the first substrate 11, and the other end is against the second substrate 12; or one end of each columnar optical spacer 14 is formed on the second substrate 12, and the other end is against First substrate 11. Alternatively, the optical spacer 14 may be a closed strip-shaped barrier wall surrounding the fingerprint recognition area FA; or, the optical spacer 14 may be an unclosed strip-shaped barrier wall surrounding the fingerprint recognition area FA. Wherein, the opposite ends of the retaining wall respectively resist the first substrate 11 and the second substrate 12.

FIG. 5A is a schematic partial cross-sectional view of a fingerprint identification module 10 according to another embodiment of the invention. In FIG. 5A, the supporting portion 17 is a transparent adhesive layer. The first substrate 11 and the second substrate 12 are aligned with each other by the supporting portion 17. Among them, the first substrate 11 and the second substrate 12 are bonded by the support portion 17 on the one hand, and on the other hand, the thickness of the support portion 17 can be adjusted to adjust the distance between the first substrate 11 and the second substrate 12. In one embodiment, the adhesive layer may be a transparent tape, and its material is, for example, polyethylene terephthalate (PET), but it is not limited thereto.

FIG. 5B is a schematic partial cross-sectional view of the fingerprint identification module 10 according to still another embodiment of the present invention. As shown in FIG. 5B, the first light shielding layer 114 is further provided with a plurality of first openings 1144 arranged at intervals. The second light shielding layer 126 is also provided with a plurality of second openings 1264 arranged at intervals. Along the thickness direction of the first substrate 11, the projection of each first opening 1144 on the first base 112 and the projection of each second opening 1264 on the first base 112 both fall on the third light shielding layer 118. That is, the light reflected by the finger can be absorbed by the third light shielding layer 118 even through the first opening 1144 without reaching the optical sensor 124. In the same way, by The third light shielding layer 118 can absorb part of the light located above the second opening 1264, avoiding mutual interference of light, and improving the accuracy of fingerprint recognition.

In one embodiment, a light-shielding material layer may be formed on the first substrate 112 first, and then the light-shielding material layer may be patterned to form the first opening 1144 and the first through hole 1142 at the same time, thereby obtaining the first light-shielding layer 114. Since the first opening 1144 and the first through hole 1142 can be formed in the same patterning step, the manufacturing process is simplified. Similarly, the second opening 1264 and the second through hole 1262 can also be formed in the same patterning step to further simplify the manufacturing process.

Please refer to FIG. 1 again. The fingerprint recognition module 10 includes a fingerprint recognition chip 162, and the optical sensor 124 is electrically connected to the fingerprint recognition chip 162. In FIG. 1, the flip chip film 16 includes a flexible circuit board 164 and a fingerprint recognition chip 162 fixed on the flexible circuit board 164. That is, in FIG. 1, the fingerprint recognition chip 162 adopts a chip on FPC (COF) package. After the second substrate 12 and the first substrate 11 are bonded by the sealant 13, the second base 122 has a protruding area 1222 extending beyond the first substrate 11. The chip on film 16 is located in the protruding area 1222.

In another embodiment, the fingerprint recognition chip 162 adopts a chip on glass (COG) packaging method. As shown in FIG. 6, the fingerprint recognition chip 162 is fixed on the second substrate 122, and then is led out to the flexible circuit board 164 by a lead (not shown) or the like.

FIG. 7 is a flowchart of a manufacturing method of the fingerprint identification module 10 according to an embodiment of the present invention. As shown in Figure 7, the preparation method roughly includes the following steps.

Step S1: Provide the first substrate 11.

In one embodiment, the step of providing the first substrate 11 includes providing a transparent first substrate 112, forming a light-shielding material layer (not shown) on the first substrate 112, and patterning the light-shielding material layer, A plurality of first through holes 1142 are formed at intervals to obtain a first light shielding layer 114.

In another embodiment, the step of patterning the light-shielding material layer further forms a plurality of first openings 1144 arranged at intervals, and each first opening 1144 is located between two adjacent first through holes 1142.

In still another embodiment, the step of providing the first substrate 11 further includes forming a covering layer 116 on the side of the first light-shielding layer 114 away from the first base 112, and forming a light-shielding layer 116 on the side of the covering layer 116 away from the first base 112 A material layer (not shown) and the light-shielding material layer are patterned to form a plurality of third through holes 1182 arranged at intervals to obtain a third light-shielding layer 118.

In one embodiment, the material of the first substrate 112 is glass, and the material of the first light-shielding layer 114 and the third light-shielding layer 118 are opaque materials such as black matrix or metal.

Step S2: Provide a second substrate 12.

In one embodiment, the step of providing the second substrate 12 includes providing a transparent second substrate 122, forming a plurality of optical sensors 124 spaced apart on the second substrate 122, and forming a plurality of optical sensors 124 on the optical sensors 124. A light-shielding material layer (not shown) is formed on a side away from the second substrate 122 and the light-shielding material layer is patterned to form a plurality of second through holes 1262 arranged at intervals. Each of the second through holes 1262 exposes one of the optical sensors 124 to obtain the second light shielding layer 126.

In one embodiment, the material of the second substrate 122 is glass, and the material of the second light shielding layer 126 is an opaque material such as black matrix or metal.

Step S3: forming a supporting portion 17 on the periphery of the first substrate 11 or the second substrate 12. The supporting portion 17 adheres the first substrate 11 and the second substrate 12 and maintains a distance between the first substrate 11 and the second substrate 12.

In one embodiment, the supporting portion 17 is a transparent adhesive layer. In step S3, the first substrate 11 and the second substrate 12 may be aligned with each other using a transparent tape (eg, PET) of a desired thickness.

In another embodiment, the supporting portion 17 includes a sealant 13 and an optical spacer 14. Step S3 includes forming a sealant 13 and an optical spacer 14 on the periphery of the first substrate 11 or the second substrate 12. Wherein, the optical spacer 14 is located in the sealant 13.

In one embodiment, the optical spacer 14 is a spherical optical spacer. A sealant 13 is formed on the periphery of the first substrate 11 or the second substrate 12, and then optical spacers 14 are dispersed in the sealant 13.

In another embodiment, the optical spacer 14 is a columnar optical spacer. A columnar optical spacer 14 may be formed on the periphery of the first substrate 11 or the second substrate 12 first, and then the sealant 13 may be coated so that the optical spacer 14 is located in the sealant 13.

In yet another embodiment, the optical spacer 14 is a strip-shaped retaining wall. A strip-shaped retaining wall may be formed on the periphery of the first substrate 11 or the second substrate 12 first, and then the sealant 13 may be coated so that the optical spacer 14 is located in the sealant 13.

It should be noted that the steps of forming the optical spacer 14 and the sealant 13 are not limited to this, and the manufacturing steps of the optical spacer and sealant in the liquid crystal display panel can be borrowed.

Wherein, after the first substrate 11 and the second substrate 12 are bonded, each of the second through holes 1262 is aligned with one of the first through holes 1142, and the first light shielding layer 114, the optical sensor The filter 124 and the second light shielding layer 126 are located between the first substrate 112 and the second substrate 122. The optical spacer 14 maintains a distance between the first substrate 11 and the second substrate 12, and the area enclosed by the sealant 13 between the first substrate 11 and the second substrate 12 The gap 15 is formed.

In one embodiment, the material of the gap 15 is a transparent medium. In step S3, it further includes filling the transparent medium in the area enclosed by the sealant 13. The transparent medium may be a transparent resin.

In one embodiment, the method further includes providing a fingerprint recognition chip 162 so that the fingerprint recognition chip 162 is arranged on the second substrate 122 by a flexible circuit board carrier chip packaging method or a glass carrier chip packaging method.

The manufacturing method of the fingerprint identification module 10 can be borrowed from the manufacturing method of the liquid crystal display panel. The optical spacer 14 is arranged between the first substrate 11 and the second substrate 12, so that the first light-shielding layer 114 and the second light-shielding layer 114 are provided. A thickness can be maintained between the layers 126, which avoids the manufacturing process of sequentially manufacturing multiple layers and reduces the manufacturing difficulty. At the same time, regardless of whether the gap 15 is an air gap or filled with a transparent medium, its production is not limited by the area of the fingerprint identification area FA. Compared with the method of fingerprint imaging using a lens, the production difficulty is also reduced.

The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced. Without departing from the spirit and scope of the technical solution of the present invention.

10: Fingerprint recognition module

FA: Fingerprint recognition area

NA: Surrounding area

11: The first substrate

112: First substrate

114: first shading layer

1142: first through hole

116: Overlay

118: third shading layer

1182: third through hole

12: Second substrate

122: second base

124: Optical Sensor

126: second shading layer

1262: second through hole

128: protective layer

13: Frame glue

14: Optical spacer

15: Clearance

17: Support

Claims (10)

A fingerprint recognition module is defined with a fingerprint recognition area and a peripheral area surrounding the fingerprint recognition area. The improvement is that the fingerprint recognition module includes: a first substrate, and the first substrate includes a transparent first substrate And a first light-shielding layer located on the first base, the first light-shielding layer defines a plurality of first through holes arranged at intervals; a second substrate, the second substrate includes a transparent second base, which is arranged at intervals The plurality of optical sensors on the second substrate and the second light shielding layer located on the side of the optical sensor away from the second substrate, the second light shielding layer defines a plurality of second communication channels arranged at intervals Hole, each of the second through holes exposes one of the optical sensors and is aligned with one of the first through holes, the first light-shielding layer, the optical sensor, and the second light-shielding layer Is located between the first base and the second base; a support portion, the support portion is located between the first substrate and the second substrate and is arranged in the peripheral area for bonding the The first substrate and the second substrate maintain a distance between the first substrate and the second substrate, and the support portion includes a sealant and an optical spacer or the support located in the sealant Part is a transparent adhesive layer; and a gap part, the gap part is located between the first substrate and the second substrate and is arranged in the fingerprint recognition area; wherein the light signal reflected by the fingerprint passes through the The first through hole, the gap portion, and the second through hole are collimated and received by the optical sensor, and the optical sensor senses the optical signal to realize fingerprint imaging. The fingerprint recognition module according to claim 1, wherein, in the case where the supporting portion includes an optical spacer, opposite ends of the optical spacer are respectively supported on the first substrate and the second substrate , So that there is a certain distance between the first light-shielding layer and the second light-shielding layer. The fingerprint recognition module according to claim 1, wherein the material of the gap part is air or a transparent medium. The fingerprint recognition module according to claim 1, wherein the range of fingerprints collected by each of the optical sensors is 200 micrometers to 400 micrometers. The fingerprint identification module according to claim 1, wherein the fingerprint ranges collected by two adjacent optical sensors do not overlap. The fingerprint recognition module according to claim 3, wherein the first substrate further includes a transparent cover layer located on a side of the first light shielding layer away from the first substrate, and a transparent cover layer located away from the cover layer A third light-shielding layer on the surface of the first substrate; the third light-shielding layer defines a plurality of third through holes arranged at intervals, and each of the third through holes is aligned with one of the first through holes and one The second through hole; wherein the optical signal reflected by the fingerprint is collimated by the first through hole, the third through hole, and the gap, and the maximum imaging size on the second substrate is smaller than that of the adjacent The distance between the two fingerprint sensors. The fingerprint recognition module according to claim 1, wherein the fingerprint recognition module further includes a fingerprint recognition chip, the optical sensor is electrically connected to the fingerprint recognition chip, and the fingerprint recognition chip uses a flip chip film The packaging method or the packaging method using glass-carrying chip. A method for preparing a fingerprint recognition module, including: providing a first substrate, the first substrate comprising a transparent first base and a first light-shielding layer on the first base, the first light-shielding layer defines There are a plurality of first through holes arranged at intervals; a second substrate is provided, and the second substrate includes a transparent second substrate, a plurality of optical sensors arranged on the second substrate at intervals, and the optical sensors On the side away from the second substrate A second light-shielding layer, the second light-shielding layer defines a plurality of second through holes arranged at intervals, and each of the second through holes exposes one optical sensor; and on the first substrate or the The periphery of the second substrate forms a supporting portion, and the supporting portion adheres the first substrate and the second substrate and maintains a distance between the first substrate and the second substrate; wherein, each The second through hole is aligned with one of the first through holes, and the first light shielding layer, the optical sensor, and the second light shielding layer are located between the first substrate and the second substrate, The area enclosed by the supporting portion between the first substrate and the second substrate forms a gap portion. The method for manufacturing a fingerprint recognition module according to claim 8, wherein the supporting portion includes a sealant and an optical spacer located in the sealant or the supporting portion is a transparent adhesive layer. An electronic device includes a display panel and a fingerprint recognition module, wherein the display panel has a display surface, the fingerprint recognition module is located on a side of the display panel away from the display surface, the fingerprint recognition module It is the fingerprint identification module according to any one of Claims 1 to 7.

Images