TW201911111A - Image capture device - Google Patents

Abstract

An image capture apparatus includes a cover plate, a sensing element, and an optical collimator disposed between the cover plate and the sensing element and includes a first light shielding pattern layer, a second light shielding pattern layer, and a third light shielding pattern layer that are overlapped with each other. The first, second, and third light shielding pattern layers have first, second, and third transparent openings, respectively. A size of each third transparent opening is larger than or equal to a size of each second transparent opening, and the size of each second transparent opening is larger than a size of each first transparent opening. Alternatively, the size of each third transparent opening is larger than the size of each second transparent opening, and the size of each second transparent opening is larger than or equal to the size of each first transparent opening.

Description

Imaging device

The present invention relates to a photoelectric device, and more particularly to an image capturing device.

Types of biometrics include face, voice, iris, retina, vein, palm print, and fingerprint recognition. According to different sensing methods, biometric identification devices can be divided into optical, capacitive, ultrasonic, and thermal sensing. Generally, an optical biometric identification device includes a light source, a light guide element, and a sensor. The light beam emitted by the light source illuminates the object to be identified pressed on the light guide element. The sensor receives the light beam reflected by the object to be identified for identification of biological characteristics. During the process of image pickup by the sensor, the light beam reflected by the fingerprint is easily scattered to the sensor, resulting in poor image acquisition quality and affecting the identification result. Although the existing technology improves the image acquisition quality, at the present stage of the technology, while improving crosstalk, it is easy to excessively limit the amount of light entering the sensor.

The invention provides an image capturing device, which can improve the crosstalk and avoid excessively limiting the amount of light entering the sensor.

An imaging device of the present invention includes a cover plate, a sensor, and an optical collimator. The sensor is arranged on one side of the cover. The optical collimator is disposed between the cover and the sensor. The optical collimator includes a first light-shielding pattern layer, a second light-shielding pattern layer, and a third light-shielding pattern layer that overlap each other. The first light-shielding pattern layer has a plurality of first light-transmitting openings. The second light-shielding pattern layer has a plurality of second light-transmitting openings. The third light-shielding pattern layer has a plurality of third light-transmitting openings. The optical collimator satisfies: the size of each third transparent opening is greater than or equal to the size of each second transparent opening, and the size of each second transparent opening is larger than the size of each first transparent opening; or each third transparent The size of the light opening is larger than the size of each second light-transmitting opening, and the size of each second light-transmitting opening is greater than or equal to the size of each first light-transmitting opening.

In an embodiment of the present invention, a size of each third light-transmitting opening is larger than a size of each second light-transmitting opening. The size of each second light-transmitting opening is larger than the size of each first light-transmitting opening. The first light-shielding pattern layer, the second light-shielding pattern layer, and the third light-shielding pattern layer are arranged from the sensor toward the cover plate or from the cover plate toward the sensor.

In an embodiment of the present invention, a size of each third light-transmitting opening is equal to a size of each second light-transmitting opening. The size of each second light-transmitting opening is larger than the size of each first light-transmitting opening. The first light-shielding pattern layer, the second light-shielding pattern layer, and the third light-shielding pattern layer are arranged from the sensor toward the cover plate or from the cover plate toward the sensor.

In an embodiment of the present invention, a size of each third light-transmitting opening is larger than a size of each second light-transmitting opening. The size of each second light-transmitting opening is equal to the size of each first light-transmitting opening. The first light-shielding pattern layer, the second light-shielding pattern layer, and the third light-shielding pattern layer are arranged from the sensor toward the cover plate or from the cover plate toward the sensor.

In an embodiment of the present invention, the optical collimator further includes a first transparent substrate and a second transparent substrate. The first transparent substrate is located between the sensor and the cover plate. The second transparent substrate is located between the first transparent substrate and the cover plate. The second light-shielding pattern layer is located between the first transparent substrate and the second transparent substrate. One of the first light-shielding pattern layer and the third light-shielding pattern layer is located between the sensor and the first transparent substrate. The other of the first light-shielding pattern layer and the third light-shielding pattern layer is located between the second light-transmitting substrate and the cover plate.

In an embodiment of the invention, the image capturing device further includes a light source. The light source is located next to the sensor, and the light source and the sensor are located on one side of the cover.

In an embodiment of the invention, the image capturing device further includes a display panel. The display panel is located between the optical collimator and the cover plate, and the display panel may be a display panel with a touch layer.

In an embodiment of the invention, the image capturing device further includes a band-pass filter layer and a light source. The band-pass filter layer is located between the display panel and the sensor. The light source is located next to the sensor, and the light source and the sensor are located on one side of the cover. The emission spectrum of the light source falls within the transmission spectrum of the bandpass filter layer.

In an embodiment of the invention, the optical collimator further includes a fourth light-shielding pattern layer. The first light-shielding pattern layer, the second light-shielding pattern layer, the third light-shielding pattern layer, and the fourth light-shielding pattern layer overlap each other. The fourth light-shielding pattern layer has a plurality of fourth light-transmitting openings. The optical collimator satisfies that a size of each fourth light-transmitting opening is greater than or equal to a size of each third light-transmitting opening.

Based on the above, in the image capturing device according to the embodiment of the present invention, by adjusting the size of the light-transmitting openings of different light-shielding pattern layers, in addition to improving the problem of crosstalk, it can also improve the phenomenon of masking holes caused by process tolerances. The amount of light entering the sensor is effectively increased. Therefore, the image capturing device according to the embodiment of the present invention can improve the crosstalk and avoid excessively limiting the amount of light entering the sensor.

In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.

The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of each embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, such as: "up", "down", "front", "rear", "left", "right", etc., are only directions referring to the attached drawings. Therefore, the directional terms used are used for illustration, but not for limiting the present invention. Also, in any of the following embodiments, the same or similar elements will be given the same or similar reference numerals.

FIG. 1 is a schematic cross-sectional view of an image pickup device according to a first embodiment of the present invention. FIG. 2 and FIG. 3 are schematic top views of the image capturing device according to the first embodiment of the present invention without process tolerance and process tolerance.

Please refer to FIG. 1 and FIG. 2 first. The image capturing device 100 is adapted to capture biological characteristics of the object to be measured. For example, the object to be measured may be a finger or a palm, and the biometric feature may be a fingerprint, a palm print, or a vein, but not limited thereto.

The image capturing device 100 includes a cover plate 110, a sensor 120, and an optical collimator 130.

The cover plate 110 has an outer surface SO and an inner surface SI. The outer surface SO and the inner surface SI are opposite to each other, and the outer surface SO is, for example, the touch operation surface of the image capturing device 100, that is, the object to be tested touches the outer surface SO of the cover plate 110 for biometric identification.

The cover 110 is suitable for protecting components (such as the sensor 120 and the optical collimator 130) located below it. It can use a substrate with high mechanical strength to avoid being damaged by the pressure of the object to be measured or the impact of other external forces. A component located under the cover plate 110. In addition, the cover plate 110 is made of transparent material, so that the light beam (beam with fingerprint, palm print, or vein information) reflected by the object to be measured can penetrate the cover plate 110 and be transmitted to the sensor 120. For example, the cover 110 may be a glass cover, such as a glass cover of a display device or a glass cover of a touch device, but is not limited thereto. In one embodiment, the cover plate can also be made of transparent colloid through a heating process or a light curing process. The light-transmitting colloid may be epoxy, silicon, optical glue, resin, or other suitable light-transmitting materials.

The sensor 120 is disposed on one side of the cover plate 110 and includes a plurality of light sensing regions R to receive a light beam reflected by the object to be measured. Further, the sensor 120 may include a Charge Coupled Device (CCD), a Complementary Metal-Oxide Semiconductor (CMOS), or other suitable types of image sensing devices. As far as the charge-coupled element is concerned, the plurality of photo-sensing regions R refers to a region where the plurality of charge-coupled elements are located. As for the complementary metal oxide semiconductor device, the multiple light sensing regions R refer to multiple pixel regions in the complementary metal oxide semiconductor device.

In an embodiment, the image capturing device 100 may further include a light source (not shown). The light source is located next to the sensor 120, and the light source and the sensor 120 are located on one side of the cover 110 (for example, both are located below the cover 110). The light source is adapted to provide a light beam for irradiating the object under test, which may include a plurality of light emitting elements. The plurality of light emitting elements may include a light emitting diode, a laser diode, or a combination of the two. In addition, the light beam may include visible light, non-visible light, or a combination of the two. Invisible light may be infrared light, but it is not limited to this. Under the structure that the image capturing device 100 includes a light source, a pulse width modulation circuit may be integrated in the sensor 120. By controlling the light emitting time of the plurality of light emitting elements and the image capturing time of the sensor 120 by the pulse width modulation circuit, the light emitting time of the plurality of light emitting elements is synchronized with the image capturing time of the sensor 130, and precise control can be achieved Effect, but not limited to this.

The optical collimator 130 is disposed between the cover plate 110 and the sensor 120. The optical collimator 130 is adapted to collimate a light beam reflected by the object to be measured and transmitted toward the sensor 120. Further, the optical collimator 130 includes a first light-shielding pattern layer 132, a second light-shielding pattern layer 134, and a third light-shielding pattern layer 136 that overlap each other. The first light-shielding pattern layer 132, the second light-shielding pattern layer 134, and the third light-shielding pattern layer 136 have high absorptivity and low reflectance, so as to reduce the proportion of the light beams transmitted to the light-shielding pattern layer reflected by the light-shielding pattern layer and the light beams. The number of reflections of the light-shielding pattern layer further reduces the ratio of the large-angle light beam (the angle refers to the angle between the transmission path of the light beam and the normal of the sensing area R) received by the sensor 120, thereby improving crosstalk. problem. The low reflectance means that the reflectance is lower than 10% in the visible light band and the infrared light band. For example, the light-shielding pattern layer may be ink with low reflectivity, but is not limited thereto.

In addition, in order that the light beam reflected by the object to be measured can be received by the sensor 120, the first light-shielding pattern layer 132, the second light-shielding pattern layer 134, and the third light-shielding pattern layer 136 each have a plurality of first light-transmitting openings O1, The plurality of second transparent openings O2 and the plurality of third transparent openings O3. Each of the first light-transmitting openings O1 overlaps one of the second light-transmitting openings O2, one of the third light-transmitting openings O3, and a corresponding light-sensing area R, so that a small-angle light beam transmitted toward the sensing area R can pass through A first light-transmitting opening O1, a second light-transmitting opening O2, and a third light-transmitting opening O3 that overlap each other are transmitted to a corresponding light sensing region R.

The optical collimator 130 satisfies that the size SO3 of each third light-transmitting opening O3 is greater than or equal to the size SO2 of each second light-transmitting opening O2, and the size SO2 of each second light-transmitting opening O2 is larger than each first light-transmitting opening O1. The size SO1 of each third light-transmitting opening O3 is larger than the size SO2 of each second light-transmitting opening O2, and the size SO2 of each second light-transmitting opening O2 is greater than or equal to the size of each first light-transmitting opening O1. SO1. Under the structure that the shape of the transparent opening is circular, the size of the transparent opening refers to the diameter of the transparent opening. In a structure in which the shape of the light-transmitting opening is a square, another polygon, or a combination of the foregoing shapes, the size of the light-transmitting opening refers to a width of one side of the light-transmitting opening.

In the case where the sizes of the plurality of light-transmitting openings of the plurality of light-shielding pattern layers are the same, the larger the size of the plurality of light-transmitting openings, the greater the amount of light entering the light sensing region R, but it is prone to crosstalk problems. Conversely, the smaller the size of the multiple light-transmitting openings, although the problem of crosstalk can be effectively improved, the amount of light incident is likely to be too small. In addition, the centers of the plurality of transparent openings of different light-shielding pattern layers may not be aligned due to process tolerances. In other words, the light-shielding pattern layer closer to the light-sensing region R may shield the light-transmitting openings above it (cavitation phenomenon), so that the effective opening value corresponding to each light-sensing region R The intersection area of the light-transmitting openings) is smaller than the preset effective opening value (that is, the size of the light-transmitting openings), which causes the actual light entering amount of each light sensing area R to be smaller than the preset light entering amount of each light sensing area R.

In view of the foregoing, in the embodiment, when designing the sizes of the plurality of light-transmitting openings of different light-shielding pattern layers, the cross-talk problem, the amount of light entering, and the process-cavity phenomenon caused by the process tolerance are all taken into consideration. For example, according to the size of each light sensing region R, the lateral distance D between two adjacent light sensing regions R, and the vertical distance between two adjacent light-shielding pattern layers (including the vertical distance D 'and the vertical distance D' ' ) The size SO1 of the first light-transmitting opening O1 of the first light-shielding pattern layer 132 is designed to improve the problems of crosstalk and excessively small amount of light. In addition, at least one of the remaining light-shielding pattern layers (such as at least one of the second light-shielding pattern layer 134 and the third light-shielding pattern layer 136) has a light-transmitting opening having a size larger than that of the first light-shielding pattern layer 132. The size SO1 of the light-transmitting opening O1. In this way, even if the centers of the plurality of light-transmitting openings of different light-shielding pattern layers cannot be aligned due to process tolerances (see FIG. 3), the light-shielding pattern layer closer to the light sensing region R can be effectively prevented from being blocked by the light-transmitting openings above it. , So that the effective opening value corresponding to each light sensing area R is equal to or similar to a preset effective opening value (that is, the size SO1 of the first light-transmitting opening O1), thereby improving crosstalk while avoiding over-limiting sensing The amount of light entering the device 120.

In this embodiment, the size SO3 of each third light-transmitting opening O3 is larger than the size SO2 of each second light-transmitting opening O2, and the size SO2 of each second light-transmitting opening O2 is larger than the size SO1 of each first light-transmitting opening O1. . In addition, the first light-shielding pattern layer 132, the second light-shielding pattern layer 134, and the third light-shielding pattern layer 136 are aligned from the sensor 120 toward the cover plate 110. However, the relative relationship between the sizes of different light-transmitting openings and the arrangement of different light-shielding pattern layers can be changed according to requirements, and is not limited to what is shown in FIG. 1.

According to different requirements, the optical collimator 100 may further include other components. For example, the optical collimator 100 may further include a first light-transmitting substrate 131 and a second light-transmitting substrate 133 to carry the above-mentioned light-shielding pattern layer. The first transparent substrate 131 and the second transparent substrate 133 are suitable for transmitting light beams. For example, the light-transmitting substrate may be a glass substrate, a plastic substrate, a transparent photoresist, or the like, but is not limited thereto.

The first transparent substrate 131 is located between the sensor 120 and the cover plate 110, and the second transparent substrate 133 is located between the first transparent substrate 131 and the cover plate 110. The second light-shielding pattern layer 134 is located between the first transparent substrate 131 and the second transparent substrate 133. The first light-shielding pattern layer 132 is located between the sensor 120 and the first transparent substrate 131. The third light-shielding pattern layer 136 is located between the second transparent substrate 133 and the cover plate 110. In this embodiment, the first light-shielding pattern layer 132 is disposed on a surface S131 of the first light-transmitting substrate 131 facing the sensor 120, and the second light-shielding pattern layer 134 is embedded in the second light-transmitting substrate 133 facing the first light-transmitting substrate. In the surface S133A of 131, the third light-shielding pattern layer 136 is disposed on the surface S133B of the second transparent substrate 133 facing the cover plate 110, but it is not limited thereto. In one embodiment, the first light-shielding pattern layer 132 may be embedded in a surface S131 of the first transparent substrate 131 facing the sensor 120. In addition, the second light-shielding pattern layer 134 may be disposed on a surface S133A of the second transparent substrate 133 facing the first transparent substrate 131. Furthermore, the third light-shielding pattern layer 136 may be embedded in a surface S133B of the second transparent substrate 133 facing the cover plate 110.

Between the cover plate 110 and the second transparent substrate 133, between the second transparent substrate 133 and the first transparent substrate 131, and between the first transparent substrate 131 and the sensor 120, an adhesive layer (not shown) (Shown) or a fixing mechanism (not shown). The adhesive layer may be an optical clear adhesive (OCA) or a die attach film (DAF), but is not limited thereto. When the cover plate 110 and the second transparent substrate 133 are fixed together by an adhesive layer, the adhesive layer may be located in the gap G1 between the cover plate 110 and the second transparent substrate 133, and the third light-shielding pattern layer 136 and Between the cover plates 110 or a combination of the two. In other words, the light transmitting medium in the gap G1 between the cover plate 110 and the second transparent substrate 133 may be air or an adhesive layer. In addition, when the second transparent substrate 133 and the first transparent substrate 131 are fixed together by an adhesive layer, the adhesive layer may be located between the second transparent substrate 133 and the first transparent substrate 131 and the second light shielding Between the pattern layer 134 and the first transparent substrate 131 or a combination of the two. In addition, when the first transparent substrate 131 and the sensor 120 are fixed together by an adhesive layer, the adhesive layer may be located in the gap G2 between the first transparent substrate 131 and the sensor 120, and the first light-shielding Between the pattern layer 132 and the sensor 120 or a combination of the two. In other words, the light transmission medium in the gap G2 between the first transparent substrate 131 and the sensor 120 may be air or an adhesive layer.

Next, other embodiments of the image capturing device will be described with reference to FIGS. 4 to 8. The same components are denoted by the same reference numerals, and will not be described again below. 4 to 8 are schematic cross-sectional views of image pickup devices according to the second to sixth embodiments of the present invention, respectively.

Please refer to FIG. 4. The main differences between the image capturing device 200 of the second embodiment of the present invention and the image capturing device 100 of FIG. 1 are as follows. In the imaging device 200, the size SO3 of each third light-transmitting opening O3 is equal to the size SO2 of each second light-transmitting opening O2, and the size SO2 of each second light-transmitting opening O2 is larger than the size of each first light-transmitting opening O1. SO1. In this embodiment, the first light-shielding pattern layer 132, the second light-shielding pattern layer 134, and the third light-shielding pattern layer 136 are arranged from the sensor 120 toward the cover plate 110, but not limited thereto. In another embodiment, the first light-shielding pattern layer 132, the second light-shielding pattern layer 134, and the third light-shielding pattern layer 136 may be arranged from the cover plate 110 toward the sensor 120, so that the third light-shielding pattern layer 136 is located on the sensor. 120 and the first transparent substrate 131, and the first light-shielding pattern layer 132 is located between the second transparent substrate 133 and the cover plate 110.

Referring to FIG. 5, the main differences between the image capturing device 300 of the third embodiment of the present invention and the image capturing device 100 of FIG. 1 are as follows. In the image capturing device 300, the size SO3 of each third light-transmitting opening O3 is larger than the size SO2 of each second light-transmitting opening O2, and the size SO2 of each second light-transmitting opening O2 is equal to the size of each first light-transmitting opening O1. SO1. In this embodiment, the first light-shielding pattern layer 132, the second light-shielding pattern layer 134, and the third light-shielding pattern layer 136 are arranged from the sensor 120 toward the cover plate 110, but not limited thereto. In another embodiment, the first light-shielding pattern layer 132, the second light-shielding pattern layer 134, and the third light-shielding pattern layer 136 may be arranged from the cover plate 110 toward the sensor 120, so that the third light-shielding pattern layer 136 is located on the sensor. 120 and the first transparent substrate 131, and the first light-shielding pattern layer 132 is located between the second transparent substrate 133 and the cover plate 110.

Referring to FIG. 6, the main differences between the image capturing device 400 of the fourth embodiment of the present invention and the image capturing device 100 of FIG. 1 are as follows. In the image capturing device 100 of FIG. 1, the sizes of the plurality of light-transmitting openings of different light-shielding pattern layers are gradually increased from the sensor 120 toward the cover 110. On the other hand, in the image capturing device 400 in FIG. 6, the sizes of the plurality of light-transmitting openings of different light-shielding pattern layers are gradually decreased from the sensor 120 toward the cover plate 110.

Further, the first light-shielding pattern layer 132, the second light-shielding pattern layer 134, and the third light-shielding pattern layer 136 are arranged from the cover plate 110 toward the sensor 120, so that the third light-shielding pattern layer 136 is located between the sensor 120 and the first Between the transparent substrates 131, and the first light-shielding pattern layer 132 is located between the second transparent substrate 133 and the cover plate 110. In this embodiment, the third light-shielding pattern layer 136 is disposed on the surface S131 of the first light-transmitting substrate 131 facing the sensor 120, and the first light-shielding pattern layer 132 is disposed on the second light-transmitting substrate 133 facing the cover 110. On the surface S133B, but not limited to this. In an embodiment, the third light-shielding pattern layer 136 may be embedded in the surface S131 of the first light-transmitting substrate 131 facing the sensor 120, and the first light-shielding pattern layer 132 may be embedded in the second light-transmitting substrate 133 facing In the surface S133B of the cover plate 110.

Referring to FIG. 7, the main differences between the image capturing device 500 of the fifth embodiment of the present invention and the image capturing device 100 of FIG. 1 are as follows. In the image capturing device 500, the image capturing device 500 further includes a display panel 140 to provide a display function. The display panel 140 is located between the optical collimator 130 and the cover plate 110. For example, the display panel 140 may be a Thin Film Transistor Liquid Crystal Display panel (TFT-LCD panel), a Micro Light Emitting Diode display panel, or a Micro LED display panel. Or an organic light emitting diode display panel (Organic Light Emitting Diode display panel, OLED display panel), or a display panel with a touch layer (ie, electrode wiring), etc., but not limited to this. When the display panel 140 is a self-emitting display panel, a part of the light beam provided by the display panel 140 may be used for biometric identification, but is not limited thereto.

Referring to FIG. 8, the main differences between the image capturing device 600 of the sixth embodiment of the present invention and the image capturing device 500 of FIG. 7 are as follows. In the image capturing device 600, the image capturing device 600 further includes a band-pass filter layer 150 and a light source 160. The bandpass filter layer 150 is located between the display panel 140 and the sensor 120, and the light source 160 is located next to the sensor 120, and the light source 160 and the sensor 120 are located on one side of the cover 110 (for example, both are located on the cover 110) Below).

In this embodiment, the bandpass filter layer 150 is located between the optical collimator 130 and the sensor 120, and the light source 160 is located on one side of the sensor 120, but not limited thereto. In one embodiment, the band-pass filter layer 150 may be located between the display panel 140 and the optical collimator 130. In addition, the light source 160 may be located on multiple sides of the sensor 120, for example, disposed on multiple sides, multiple corners of the sensor 120, or a combination of the two.

The light source 160 is adapted to provide a light beam for biometric identification. The bandpass filter layer 150 is suitable for passing the light beam from the light source 160 (that is, the light emission spectrum of the light source 160 falls within the transmission spectrum of the bandpass filter layer 150) and filtering other light beams to avoid ambient light beams or from the display panel. The interference caused by the 140 light beam transmitted to the sensor 120 further improves the recognition capability of the image capturing device 600. For example, the bandpass filter layer 150 may be an infrared bandpass filter layer, which allows a light beam with a wavelength of 800 nm to 900 nm to pass, and filters a light beam with a wavelength other than 800 nm to 900 nm. Correspondingly, the light source 120 is an infrared light source with a wavelength in the range of 800 nm to 900 nm. In other embodiments, the bandpass filter layer 420 may be a bandpass filter layer that allows a light beam with a wavelength of 840 nm to 860 nm or a light beam with a wavelength of 890 nm to 990 nm to pass, and the light source 120 is selected to have a wavelength of 840. An infrared light source in a range of nm to 860 nm or 890 nm to 990 nm, but the present invention is not limited thereto.

Although the optical collimators 130 in the first to sixth embodiments all include only three light-shielding pattern layers, the number of light-shielding pattern layers in the optical collimator 130 is not limited thereto. In an embodiment, the optical collimator may further include a fourth light-shielding pattern layer (not shown). The first light-shielding pattern layer, the second light-shielding pattern layer, the third light-shielding pattern layer, and the fourth light-shielding pattern layer overlap each other, and the fourth light-shielding pattern layer has a plurality of fourth light-transmitting openings. The optical collimator satisfies that a size of each fourth light-transmitting opening is greater than or equal to a size of each third light-transmitting opening. In addition, the first light-shielding pattern layer, the second light-shielding pattern layer, the third light-shielding pattern layer, and the fourth light-shielding pattern layer may be arranged from the sensor toward the cover plate or from the cover plate toward the sensor. In another implementation, the optical collimator may include more than four light-shielding pattern layers (not shown), wherein the size of each fifth light-transmitting opening is greater than or equal to the size of each fourth light-transmitting opening, and the remaining light-shielding pattern layers The size of the light-transmitting opening is deduced by analogy, and is not repeated here.

In summary, in the image capturing device according to the embodiment of the present invention, by adjusting the size of the light-transmitting openings of different light-shielding pattern layers, in addition to improving the crosstalk problem, the hole-capping phenomenon caused by manufacturing tolerances can also be improved. , So that the amount of light entering the sensor is effectively increased. Therefore, the image capturing device according to the embodiment of the present invention can improve the crosstalk and avoid excessively limiting the amount of light entering the sensor.

Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.

100, 200, 300, 400, 500, 600‧‧‧ image pickup devices

110‧‧‧ cover

120‧‧‧Sensor

130‧‧‧Optical Collimator

131‧‧‧The first transparent substrate

132‧‧‧first light-shielding pattern layer

133‧‧‧Second transparent substrate

134‧‧‧second light-shielding pattern layer

136‧‧‧third light-shielding pattern layer

140‧‧‧display panel

150‧‧‧ Bandpass Filter

160‧‧‧light source

D‧‧‧Horizontal distance

D ’, D’’ ‧‧‧ vertical distance

G1, G2 ‧‧‧ gap

O1‧‧‧The first transparent opening

O2‧‧‧Second transparent opening

O3‧‧‧ third light-transmitting opening

R‧‧‧sensing area

S131, S133A‧‧‧ Surface

S133B‧‧‧Surface

SI‧‧‧Inner surface

SO‧‧‧ Outer surface

SO1, SO2, SO3 ‧‧‧ size

FIG. 1 is a schematic cross-sectional view of an image pickup device according to a first embodiment of the present invention. FIG. 2 and FIG. 3 are schematic top views of the image capturing device according to the first embodiment of the present invention without process tolerance and process tolerance. 4 to 8 are schematic cross-sectional views of image pickup devices according to the second to sixth embodiments of the present invention, respectively.

Claims (10)

An image capturing device includes: a cover plate; a sensor disposed on one side of the cover plate; and an optical collimator disposed between the cover plate and the sensor, wherein the optical collimator The device includes a first light-shielding pattern layer, a second light-shielding pattern layer, and a third light-shielding pattern layer. The first light-shielding pattern layer, the second light-shielding pattern layer, and the third light-shielding pattern layer overlap each other. The pattern layer has a plurality of first light-transmitting openings, the second light-shielding pattern layer has a plurality of second light-transmitting openings, the third light-shielding pattern layer has a plurality of third light-transmitting openings, and the optical collimator satisfies: each The size of the third transparent opening is greater than or equal to the size of each of the second transparent openings, and the size of each of the second transparent openings is larger than the size of each of the first transparent openings; or each of the third transparent openings The size of is greater than the size of each of the second light-transmitting openings, and the size of each of the second light-transmitting openings is greater than or equal to the size of each of the first light-transmitting openings. The image capturing device according to item 1 of the scope of patent application, wherein the size of each of the third transparent openings is larger than the size of each of the second transparent openings, and the size of each of the second transparent openings is larger than each of the first transparent openings. The size of the light opening, and the first light-shielding pattern layer, the second light-shielding pattern layer, and the third light-shielding pattern layer are arranged from the sensor toward the cover or from the cover toward the sensor. The image capturing device according to item 1 of the scope of patent application, wherein the size of each of the third transparent openings is equal to the size of each of the second transparent openings, and the size of each of the second transparent openings is larger than that of each of the first transparent openings. The size of the light opening, and the first light-shielding pattern layer, the second light-shielding pattern layer, and the third light-shielding pattern layer are arranged from the sensor toward the cover or from the cover toward the sensor. The image capturing device according to item 1 of the scope of patent application, wherein the size of each of the third transparent openings is larger than the size of each of the second transparent openings, and the size of each of the second transparent openings is equal to each of the first transparent openings. The size of the light opening, and the first light-shielding pattern layer, the second light-shielding pattern layer, and the third light-shielding pattern layer are arranged from the sensor toward the cover or from the cover toward the sensor. The image capturing device according to any one of claims 1 to 4, wherein the optical collimator further includes a first light-transmitting substrate and a second light-transmitting substrate, and the first light-transmitting substrate is located in the Between the sensor and the cover, the second transparent substrate is located between the first transparent substrate and the cover, and the second light-shielding pattern layer is located between the first transparent substrate and the second transparent substrate One of the first light-shielding pattern layer and the third light-shielding pattern layer is located between the sensor and the first light-transmitting substrate, and one of the first light-shielding pattern layer and the third light-shielding pattern layer is in between. The other is located between the second transparent substrate and the cover plate. The image capturing device according to any one of claims 1 to 4, further comprising: a light source located beside the sensor, and the light source and the sensor located on one side of the cover. The image capturing device according to any one of claims 1 to 4, further comprising: a display panel located between the optical collimator and the cover plate. The image capturing device according to item 7 of the scope of patent application, further comprising: a band-pass filter layer between the display panel and the sensor; and a light source located beside the sensor, and the light source and The sensor is located on one side of the cover plate, wherein the light emission spectrum of the light source falls within the transmission spectrum of the bandpass filter layer. The image capturing device according to item 1 of the patent application scope, wherein the optical collimator further includes a fourth light-shielding pattern layer, the first light-shielding pattern layer, the second light-shielding pattern layer, the third light-shielding pattern layer, and The fourth light-shielding pattern layer overlaps each other, the fourth light-shielding pattern layer has a plurality of fourth light-transmitting openings, and the optical collimator satisfies: a size of each of the fourth light-transmitting openings is greater than or equal to each of the third light-transmitting openings The size of the opening. The image capturing device according to item 7 of the scope of patent application, wherein the display panel is a display panel with a touch layer.