CN210983441U

CN210983441U - Image capturing device

Info

Publication number: CN210983441U
Application number: CN201922280752.9U
Authority: CN
Inventors: 何孟南; 巫仁杰; 林浩翔
Original assignee: Gingy Technology Inc
Current assignee: Gingy Technology Inc
Priority date: 2018-12-25
Filing date: 2019-12-18
Publication date: 2020-07-10
Anticipated expiration: 2029-12-18
Also published as: TWM594271U

Abstract

An image capturing device includes an image sensor and a light collimator. The light collimator is located on the image sensor and comprises a light channel layer, a plurality of micro lenses and a wall structure. The micro lenses are arranged on the light channel layer, and the micro lenses and the image sensor are respectively positioned on the opposite sides of the light channel layer. The wall structure is arranged on the light channel layer and located on the periphery of the plurality of micro lenses, wherein the height of the wall structure is larger than that of each of the plurality of micro lenses.

Description

Image capturing device

Technical Field

The present invention relates to an optoelectronic device, and more particularly to an image capturing device.

Background

The biometric identification includes face, voice, iris, retina, vein, palm print, fingerprint identification, etc. Depending on the sensing method, biometric identification devices can be classified into optical, capacitive, ultrasonic, and thermal sensing. Generally, an optical biometric device includes a light source, a light guide and a sensor. The light beam emitted by the light source irradiates the object to be measured pressed on the light guide component, and the sensor receives the light beam reflected by the object to be measured so as to identify the biological characteristics.

Taking fingerprint identification as an example, when a finger presses on the light guide element, the convex portion of the fingerprint will contact the light guide element, and the concave portion of the fingerprint will not contact the light guide element. Therefore, the convex portion of the fingerprint destroys the total reflection of the light beam in the light guide component, so that the sensor obtains the dark fringe corresponding to the convex portion. Meanwhile, the concave part of the fingerprint can not destroy the total reflection of the light beam in the light guide component, so that the sensor can obtain the bright lines corresponding to the concave part. Thus, the light beams corresponding to the convex and concave portions of the fingerprint form a striped pattern with alternate brightness and darkness on the light receiving surface of the sensor. The information corresponding to the fingerprint image is calculated by using an algorithm, so that the identity of the user can be identified.

During the image capturing process of the sensor, the light beam reflected by the fingerprint is easily scattered and transmitted to the sensor, and crosstalk (crosstalk) is generated. The crosstalk can reduce the contrast between the dark-stripe area and the bright-stripe area of the fingerprint pattern, which results in poor image capturing quality and affects the identification accuracy. Although the prior art is directed to improving the image quality, the improvement of the prior art still has difficulty in effectively improving the crosstalk problem.

SUMMERY OF THE UTILITY MODEL

The utility model provides a get for instance device, it can have good discernment ability.

The utility model discloses a get for instance device includes image sensor and light collimator. The light collimator is located on the image sensor and comprises a light channel layer, a plurality of micro lenses and a wall structure. The micro lenses are arranged on the light channel layer, and the micro lenses and the image sensor are respectively positioned on the opposite sides of the light channel layer. The wall structure is arranged on the light channel layer and located on the periphery of the plurality of micro lenses, wherein the height of the wall structure is larger than that of each of the plurality of micro lenses.

In an embodiment of the present invention, the projection shape of the wall structure on the light channel layer is a frame shape, and the wall structure surrounds the plurality of microlenses.

In an embodiment of the present invention, the wall structure includes a plurality of pseudo micro lenses (dummy micro lenses), and the height of each of the plurality of pseudo micro lenses is greater than the height of each of the plurality of micro lenses.

In an embodiment of the present invention, the image capturing device further includes a circuit board, a plurality of metal wires and an encapsulating layer. The image sensor is arranged on the circuit board. The image sensor is electrically connected with the circuit board by a plurality of metal wires. The packaging layer covers the metal wires and fixes the image sensor and the optical collimator on the circuit board.

In an embodiment of the invention, the encapsulation layer covers an edge portion of the light collimator.

In an embodiment of the present invention, the encapsulation layer has a supporting portion. The supporting part is located between the image sensor and the optical collimator. The light collimator is supported by the support portion. A gap exists between the optical collimator and the image sensor.

In an embodiment of the present invention, the top surface of the wall structure is flush with the top surface of the encapsulation layer.

In an embodiment of the present invention, the image capturing device further includes a cover plate. The cover plate is located on the packaging layer, wherein the light collimator is located between the cover plate and the image sensor, and air gaps exist between the cover plate and the micro lenses.

In an embodiment of the present invention, the cover plate includes a transparent substrate, a transparent film, a transparent display panel, a transparent touch display panel, or a combination of at least two of the above.

In an embodiment of the present invention, the image capturing device further includes a middle frame. The middle frame is positioned between the packaging layer and the cover plate.

In an embodiment of the present invention, the image capturing device further includes a filter layer. The filter layer is located between the image sensor and the cover plate.

In an embodiment of the present invention, the wall structure and the plurality of microlenses are integrally formed.

In an embodiment of the present invention, each of the plurality of microlenses is a multilayer structure.

In an embodiment of the present invention, the optical channel layer includes a combination of the light shielding layer and the light transmissive layer, a plurality of optical fibers, a plurality of pinholes, or a grating.

In an embodiment of the present invention, the image sensor includes a plurality of image sensing elements. The light channel layer comprises a light-transmitting substrate, a first light shielding layer and a second light shielding layer. The light-transmitting substrate is provided with a first surface and a second surface. The first surface is located between the plurality of microlenses and the second surface. The first light shielding layer is arranged on the first surface and provided with a plurality of first openings. The second light shielding layer is arranged on the second surface and provided with a plurality of second openings. The plurality of first openings, the plurality of second openings, the plurality of microlenses and the plurality of image sensing components are overlapped with each other. Each of the plurality of image sensing elements has an area of As. The projection area of each of the plurality of microlenses is Am. Each of the plurality of first openings has an area a 1. Each of the plurality of second openings has an area a 2. The image capture device satisfies A1 ≦ A2< Am < As.

In an embodiment of the present invention, the thickness of the transparent substrate is T, the width of each of the plurality of microlenses is W, the thickness of each of the plurality of microlenses is Tm, and the image capturing device satisfies T ≦ pi [ (W/2)²+Tm²)]/(2Tm)。

In an embodiment of the present invention, a width of each of the plurality of first openings is W1, a width of each of the plurality of second openings is W2, and the image capturing device satisfies that 2 μm ≦ W1 ≦ 30 μm, and 2 μm ≦ W2 ≦ 30 μm.

In an embodiment of the present invention, a maximum thickness of the stacked structure of the plurality of microlenses and the optical channel layer is less than 100 μm.

In an embodiment of the present invention, the image capturing device further includes an inner light collimator (inner light collimator). The internal light collimator is located between the light collimator and the image sensor and includes a light channel layer and a plurality of micro lenses. The micro lenses are arranged on the light channel layer of the inner light collimator, and the micro lenses and the image sensor of the inner light collimator are respectively positioned on the opposite sides of the light channel layer of the inner light collimator. The plurality of micro-lenses of the inner light collimator overlap the plurality of micro-lenses of the light collimator in a stacking direction of the light collimator and the inner light collimator.

In an embodiment of the present invention, the inner light collimator further includes a wall structure. The wall structure of the inner light collimator is arranged on the light channel layer of the inner light collimator and is positioned at the periphery of the micro lenses of the inner light collimator. The height of the wall structure of the inner light collimator is larger than the height of each of the plurality of micro-lenses of the inner light collimator.

Based on the above, in the embodiment of the present invention, the light is collimated by the light collimator to improve the crosstalk problem, so that the image capturing device has good identification capability. In addition, by arranging the wall structure with the height higher than that of each micro lens on the periphery of the micro lenses, the scratching damage caused by the careless touch of the micro lenses can be avoided, and the subsequent assembly is facilitated.

In order to make the aforementioned and other features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1A is a schematic cross-sectional view of an image capturing device according to an embodiment of the present invention.

FIG. 1B is a schematic top view of the light collimator of FIG. 1A.

Fig. 2 is a schematic cross-sectional view of an image capturing device according to another embodiment of the present invention.

Fig. 3 is a schematic cross-sectional view of an image capturing device according to another embodiment of the present invention.

Fig. 4 is a schematic cross-sectional view of an image capturing device according to still another embodiment of the present invention.

Fig. 5 is a schematic cross-sectional view of an image capturing device according to yet another embodiment of the present invention.

Fig. 6 is a schematic cross-sectional view of an image capturing device according to yet another embodiment of the present invention.

Fig. 7 is a schematic cross-sectional view of an image capturing device according to yet another embodiment of the present invention.

Fig. 8 is a schematic cross-sectional view of an image capturing device according to yet another embodiment of the present invention.

Fig. 9A is a schematic cross-sectional view of an image capturing device according to yet another embodiment of the present invention.

Fig. 9B is a schematic top view of the light channel layer in fig. 9A.

FIG. 9C is a schematic top view of the image sensor of FIG. 9A.

Fig. 10 is a schematic cross-sectional view of an image capturing device according to still another embodiment of the present invention.

Fig. 11 is a schematic cross-sectional view of an image capturing device according to yet another embodiment of the present invention.

Others of which:

1. 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H, 1I, 1J: image capturing device

10: image sensor

110. 11A, 11C, 11D, 11H, 11I, 11J1, 11J 2: optical collimator

110. 110C, 110H: optical channel layer 1100: light-transmitting substrate

1101: first light-shielding layer 1102: a second light-shielding layer

1103: third light-shielding layers 111, 111I: micro-lens

1110: first layer 1111: second layer

112: the wall structure 113: base layer

12: wiring board 13: metal wire

14. 14B, 14C: the encapsulation layer 140: supporting part

15. 15G: filter layer 16: cover plate

17: the middle frame 18: adhesive layer

AG: air gaps As, Am, a1, a 2: area of

G. G': gap O1: first opening

O2: second opening O3: third opening

S1: first surface S2: second surface

ST14B, ST14C, ST 112: top surface T, Tm: thickness of

TT: maximum thicknesses T111, T112: height

W, W1, W2: width Z: the thickness direction.

100 image sensing component.

Detailed Description

Directional phrases used herein include, for example: the upper, lower, front, rear, left, right, etc. are only referred to the direction of the drawing. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting.

In the drawings, each figure illustrates a general feature of a method, structure, or material used in a particular embodiment. These drawings, however, should not be construed as defining or limiting the scope or nature encompassed by these embodiments. For example, the relative sizes, thicknesses, and locations of various layers, regions, or structures may be reduced or exaggerated for clarity.

In the embodiments described below, the same or similar components will be given the same or similar reference numerals, and a repetition thereof will be omitted. Furthermore, the features of the various embodiments may be combined without conflict and, accordingly, simple equivalent changes and modifications may be made within the scope of this disclosure or the appended claims and are intended to be covered by this patent.

The terms "first," "second," and the like in the description and in the claims, are used for naming discrete components or distinguishing between different embodiments or ranges, and are not used for limiting the upper or lower limit of the number of components or for limiting the manufacturing or arrangement order of the components. Further, a component/film layer disposed on (or over) another component/film layer can encompass the situation where the component/film layer is disposed directly on (or over) the other component/film layer, and the two components/film layers are in direct contact; and where the component/film layer is disposed indirectly on (or over) the other component/film layer, and one or more component/film layers are present between the two components/film layers. For example, any two adjacent components, any two adjacent films, or between adjacent components and films may be fixed to each other through an adhesive layer (not shown) or a fixing mechanism (such as a screw or a fastener; not shown) if necessary, and will not be described again below.

Fig. 1A is a schematic cross-sectional view of an image capturing device according to an embodiment of the present invention. FIG. 1B is a schematic top view of the light collimator of FIG. 1A. Fig. 2 to 8, 9A, 10 and 11 are schematic cross-sectional views of an image capturing device according to other embodiments of the present invention. Fig. 9B and 9C are schematic top views of the light channel layer and the image sensor in fig. 9A, respectively.

In any embodiment of the present invention, the image capturing device can be used in an environmental medium. The ambient medium may comprise air, water or other types of media. The image capturing device is suitable for capturing an image of a biological feature of an object (not shown) to be measured. For example, the object to be measured may be a finger, a palm, a wrist or an eyeball of the user, and the corresponding biometric features may be a fingerprint, a palm print, a vein, a pupil or an iris, but not limited thereto.

Referring to fig. 1A and 1B, the image capturing device 1 includes an image sensor 10 and a light collimator 11. In the present embodiment, the image capturing device 1 may further include a circuit board 12, a plurality of metal wires 13, and an encapsulation layer 14, but not limited thereto.

The image sensor 10 is adapted to receive a light beam (light beam with biometric information) reflected by the object to be measured. For example, the image sensor 10 may include a Charge Coupled Device (CCD), a Complementary Metal-Oxide Semiconductor (CMOS) Device, or other suitable types of image sensing devices.

The light collimator 11 is located on the image sensor 10. The optical collimator 11 is suitable for collimating the light beam reflected by the object to be measured, so as to improve the crosstalk problem, and the image capturing device 1 has good identification capability. The light collimator 11 may comprise a light channel layer 110, a plurality of microlenses 111, and a wall structure 112.

The light channel layer 110 is adapted to collimate the light beam reflected by the test object. For example, the light channel layer 110 may include a combination of light shielding and light transmitting layers, a plurality of optical fibers (fibers), a plurality of pinholes (pinholes), gratings (gratings), or other suitable light collimating components.

The microlenses 111 are disposed on the light channel layer 110, and the microlenses 111 and the image sensor 10 are respectively located on opposite sides of the light channel layer 110. The plurality of microlenses 111 are adapted to converge the light beams, allowing more light beams to pass through the light channel layer 110 and be received by the image sensor 10.

In the present embodiment, as shown in fig. 1A, each of the plurality of microlenses 111 may have a hemispherical cross-sectional shape. However, the cross-sectional shape of each of the plurality of microlenses 111 can be changed to other shapes as needed, and the hemisphere is not limited to one half of a sphere. Further, as shown in fig. 1B, a projection shape of each of the plurality of microlenses 111 on the light channel layer 110 may be a circle. However, the projection shape of each of the plurality of microlenses 111 can be changed to other shapes, such as a quadrangle or other polygons, as desired.

The wall structure 112 is disposed on the light channel layer 110 and located at the periphery of the plurality of microlenses 111. As shown in fig. 1A, the wall structure 112 and the plurality of microlenses 111 may be disposed on the same surface of the light channel layer 110. In addition, the height T112 of the wall structure 112 is greater than the height T111 of each of the plurality of microlenses 111. The height T112 of the wall structure 112 may be the maximum distance between the bottom surface (the surface of the wall structure 112 contacting the light channel layer 110) and the top surface of the wall structure 112, based on the surface of the light channel layer 110 carrying the wall structure 112 and the plurality of microlenses 111. Similarly, the height T111 of each of the microlenses 111 can be the maximum distance between the bottom surface (the surface of the microlens 111 contacting the light channel layer 110) and the top surface of any microlens 111, based on the surface of the light channel layer 110 and the carrier wall structure 112. By disposing the wall structure 112 with a height higher than that of each microlens 111 around the plurality of microlenses 111, scratching damage caused by inadvertent contact of the plurality of microlenses 111 can be avoided, and subsequent assembly is facilitated.

In one embodiment, the wall structure 112 and the plurality of microlenses 111 can be integrally formed, so as to simplify the number of process steps and shorten the process time, but not limited thereto. In another embodiment, the wall structure 112 and the microlenses 111 can be formed on the light channel layer 110, respectively, and the wall structure 112 and the microlenses 111 can have the same material or different materials.

In the present embodiment, as shown in fig. 1A, the cross-sectional shape of the wall structure 112 may be rectangular. In addition, as shown in fig. 1B, the projection shape of the wall structure 112 on the light channel layer 110 may be a frame shape (frame shape), and the wall structure 112 may surround the plurality of microlenses 111. However, the cross-sectional shape, the projection shape, or the relative arrangement relationship between the wall structure 112 and the microlenses 111 can be changed as required, and is not limited to that shown in fig. 1A and 1B. For example, the cross-sectional shape of the wall structure 112 may also be square, trapezoidal, or other polygonal shapes.

In one embodiment, the wall structure 112 may include a plurality of pseudo-microlenses (not shown). The plurality of pseudo-microlenses are disposed around the plurality of microlenses 111, and the height of each of the plurality of pseudo-microlenses is greater than the height T111 of each of the plurality of microlenses 111, so as to protect the plurality of microlenses 111. Since the plurality of pseudo microlenses mainly serves to protect the plurality of microlenses 111, the design of parameters (such as radius of curvature, refractive index, etc.) of the plurality of pseudo microlenses may not be limited. For example, the pseudo microlenses and the microlenses 111 can have the same or different materials, the same or different cross-sectional shapes, and/or the same or different projection shapes.

The circuit board 12 is adapted to carry the image sensor 10, and the image sensor 10 is disposed on the circuit board 12. The wiring Board 12 may be a Printed Circuit Board (PCB), a Flexible Printed Circuit Board (FPCB), or a substrate on which a wiring layer is formed.

A plurality of metal wires 13 electrically connect the image sensor 10 and the wiring board 12. For example, the metal wires 13 may be connected between pads (not shown) of the image sensor 10 and pads (not shown) of the circuit board 12 by a wire bonding process.

The encapsulation layer 14 covers the metal wires 13 and fixes the image sensor 10 and the optical collimator 11 on the circuit board 12. The encapsulation layer 14 may be formed by using a known molding compound (molding compound), but is not limited thereto. In the present embodiment, the image sensor 10, the optical collimator 11 and the plurality of metal lines 13 are formed on the circuit board 12, and then the image sensor 10, the optical collimator 11 and the plurality of metal lines 13 are fixed by the packaging layer 14. Thus, the encapsulation layer 14 covers the edge portions of the light-collimator 11 (e.g. covers the outer edges of the wall structure 112).

The formation of the encapsulation layer 14 helps to achieve good electrical performance (e.g., prevent oxidation of the metal wires 13 or reduce poor bonding between the metal wires 13 and the wiring board 12) and to improve the mechanical strength of the image sensor 10 (e.g., prevent the image sensor 10 from being easily broken due to thinning). Therefore, the method is beneficial to meeting the requirement of thinning and the improvement of yield, and the processing time can not be greatly increased. In addition, the encapsulation layer 14 can further shield a light source disposed on the side or other stray light from entering the transparent substrate, thereby avoiding crosstalk caused by the stray light beam.

The image capturing device 1 may further include other components according to different requirements. For example, the image capturing device 1 may further include a cover plate (not shown), a filter layer (not shown), a middle frame (not shown), an adhesive layer (not shown), a fixing mechanism (not shown), a light source (not shown), or a combination of at least two of the above. The following embodiments may be modified in the same manner, and will not be repeated below.

Referring to fig. 2, the main difference between the image capturing device 1A and the image capturing device 1 of fig. 1A is that the light collimator 11A of the image capturing device 1A further includes a base layer 113, a plurality of microlenses 111 and a wall structure 112 are disposed on the base layer 113 and are in contact with the base layer 113, for example, the base layer 113, the wall structure 112 and the plurality of microlenses 111 may be integrally formed, and the base layer 113, the wall structure 112 and the plurality of microlenses 111 are formed by, for example, stamping or molding (molding).

Referring to fig. 3, the main differences between the image capturing device 1B and the image capturing device 1 of fig. 1A are as follows. In the image capturing device 1B, the encapsulation layer 14B has a supporting portion 140. The supporting portion 140 is located between the image sensor 10 and the optical collimator 11, and the optical collimator 11 is supported by the supporting portion 140. Further, in the present embodiment, the image sensor 10 and the plurality of metal lines 13 are formed on the wiring board 12, and then the image sensor 10 and the plurality of metal lines 13 are fixed by the packaging layer 14. Then, the light collimator 11 is disposed on the supporting portion 140 of the encapsulation layer 14B. Therefore, a gap G exists between the light collimator 11 and the image sensor 10. The light transmission medium in the gap G may be air, but is not limited thereto.

In the present embodiment, the top surface ST112 of the wall structure 112 is flush or nearly flush with the top surface ST14B of the encapsulation layer 14B. In other words, the top surface ST14B of the encapsulation layer 14B is also higher than the plurality of microlenses 111. Under this configuration, the wall structure 112 and the packaging layer 14B can jointly protect the plurality of microlenses 111. In addition, the top surface ST112 of the wall structure 112 and the top surface ST14B of the encapsulation layer 14B form a flat surface suitable for carrying other components (e.g., cover plate, filter layer, or middle frame, etc.).

Referring to fig. 4, the main differences between the image capturing device 1C and the image capturing device 1 of fig. 1A are as follows. In the image capturing device 1C, the light channel layer 110C of the light collimator 11C includes a light-transmitting substrate 1100 and a first light-shielding layer 1101.

The transparent substrate 1100 is suitable for light beams to pass through, and the transparent substrate 1100 may be made of any transparent material, without any limitation on the material of the transparent substrate 1100. The first light-shielding layer 1101 is provided on one side of the light-transmitting substrate 1100. For example, the first light-shielding layer 1101 may be disposed on a side of the light-transmitting substrate 1100 facing the image sensor 10 or a side of the light-transmitting substrate 1100 away from the image sensor 10. Alternatively, the first light-shielding layer 1101 may be formed in the light-transmitting substrate 1100.

The first light-shielding layer 1101 is adapted to absorb light beams to reduce the influence of stray light on the biometric feature recognition result. The first light-shielding layer 1101 can be made of any light-absorbing material, and the material of the first light-shielding layer 1101 is not limited thereto. The first light-shielding layer 1101 has a plurality of first openings O1. The first openings O1, the microlenses 111, and the image sensing elements 100 of the image sensor 10 overlap each other in the thickness direction Z of the image capturing device 1C.

The top surface ST112 of the wall structure 112 is flush with the top surface ST14C of the encapsulation layer 14C, and the encapsulation layer 14C does not cover the edge portions of the light collimator 11C. For example, the encapsulation layer 14C does not cover the wall structure 112 of the light collimator 11C.

Referring to fig. 5, the image capturing device 1D and the image capturing device 1C of fig. 4 have the following main differences. In the image capturing device 1D, the light channel layer 110D of the light collimator 11D further includes a second light shielding layer 1102 and a third light shielding layer 1103. The third light-shielding layer 1103 is disposed on a side of the transparent substrate 1100 away from the image sensor 10, and the third light-shielding layer 1103 is formed in the transparent substrate 1100 and located between the first light-shielding layer 1101 and the third light-shielding layer 1103. The second light-shielding layer 1102 and the third light-shielding layer 1103 can be made of any light-absorbing material, and the materials of the second light-shielding layer 1102 and the third light-shielding layer 1103 are not limited herein. The second light-shielding layer 1102 has a plurality of second openings O2, and the third light-shielding layer 1103 has a plurality of third openings O3. The plurality of first openings O1, the plurality of second openings O2, the plurality of third openings O3, the plurality of microlenses 111, and the plurality of image sensing elements 100 of the image sensor 10 overlap each other in the thickness direction Z of the image capturing apparatus 1D.

In the present embodiment, the plurality of first openings O1, the plurality of second openings O2, and the plurality of third openings O3 have the same size. However, the size of the opening of each light-shielding layer or the number of light-shielding layers in the light channel layer 110D can be designed according to the requirement, and is not limited to that shown in fig. 5.

Referring to fig. 6, the image capturing device 1E mainly differs from the image capturing device 1D shown in fig. 5 in that the image capturing device 1E further includes a filter layer 15. The filter layer 15 is adapted to filter out stray light. For example, when the biometric identification is performed by visible light, the filter layer 15 may be used to filter light (e.g., infrared light) outside the wavelength band of the visible light. On the other hand, when the biometric feature is recognized by infrared light, the filter layer 15 may be used to filter light (e.g., visible light) outside the wavelength band of the infrared light. In the present embodiment, the filter layer 15 is located between the image sensor 10 and the optical collimator 11D. In another embodiment, the filter layer 15 may be disposed on the top surface ST112 of the wall structure 112 and the top surface ST14C of the encapsulation layer 14C. Alternatively, the filter layer 15 is disposed between the image sensor 10 and the light collimator 11D and on the top surface ST112 of the wall structure 112 and the top surface ST14C of the packaging layer 14C.

Referring to fig. 7, the image capturing device 1F and the image capturing device 1E of fig. 6 are mainly different as follows. The image capturing device 1F further includes a cover 16, a middle frame 17, and an adhesive layer 18.

The cover plate 16 is located on the packaging layer 14C, wherein the light collimator 11D is located between the cover plate 16 and the image sensor 10. The surface of the cover 16 away from the optical collimator 11D may be a pressing surface of the object, that is, the object is pressed on the surface of the cover 16 away from the optical collimator 11D for biometric identification.

The cover 16 is adapted to protect the components disposed thereunder, such as the light collimator 11D and the image sensor 10. for example, the cover 16 may include a transparent substrate, a transparent film, a transparent Display panel, a transparent touch Display panel, or a combination of at least two of the above, the transparent Display panel may be a transparent TFT-lcd panel (Thin film transistor L i _ quick Crystal Display panel, TFT-L CD panel), a Micro light Emitting Diode Display panel (Micro L high Emitting Diode Display panel, Micro L D Display panel), or an Organic light Emitting Diode Display panel (Organic L high Emitting Diode Display panel, O L ED Display panel).

A portion of the image beam (e.g., visible light) provided by the light-transmissive display panel or the light-transmissive touch display panel may be used for biometric identification, but is not limited thereto. In an embodiment, the image capturing device 1F may further include a light source (not shown) for providing a light beam for biometric identification. The wavelength of the light beam provided by the light source may be different from the wavelength of the image light beam (wavelength of visible light). For example, the light source may be a non-visible light source, such as an infrared light source, but not limited thereto. In addition, the light source can be disposed outside the light-transmitting display panel or the light-transmitting touch display panel or integrated in the light-transmitting display panel or the light-transmitting touch display panel.

The middle frame 17 is located between the package layer 14C and the cover plate 16, and the middle frame 17 may be disposed on the top surface ST112 of the wall structure 112 and the top surface ST14C of the package layer 14C. In another embodiment, the middle frame 17 may be disposed on the top surface ST14C of the encapsulation layer 14C, and the middle frame 17 may not overlap with the wall structure 112 in the thickness direction Z of the image capturing device 1F.

The adhesive layer 18 joins the middle frame 17 to the cover plate 16. In the present embodiment, the projection shape of the adhesive layer 18 on the cover 16 is a frame shape, and the adhesive layer 18 does not overlap with the plurality of microlenses 111 in the thickness direction Z of the image capturing device 1F. That is, the adhesive layer 18 is not filled into the gap G' between the cover plate 16 and the microlenses 111, so that an air gap AG exists between the cover plate 16 and the microlenses 111.

The filter layer 15 is located between the image sensor 10 and the cover plate 16. For example, the filter layer 15 may be located between the image sensor 10 and the optical collimator 11D or between the optical collimator 11D and the cover plate 16.

Referring to fig. 8, the image capturing device 1G and the image capturing device 1F of fig. 7 are mainly different as follows. The image pickup device 1G omits the middle frame 17 and the filter layer 15 of fig. 7. Furthermore, the image capturing device 1G further comprises a filter layer 15G between the light collimator 11D and the cover plate 16. The description of filter layer 15G may refer to the description of filter layer 15, and will not be repeated here.

Referring to fig. 9A to 9C, the image capturing device 1H and the image capturing device 1A of fig. 2 have the following main differences. The image capturing device 1H omits the circuit board 12, the plurality of metal wires 13, and the encapsulation layer 14 shown in fig. 2. However, in an embodiment, the image capturing device 1H may further include the circuit board 12, the metal wires 13 and the encapsulation layer 14 of fig. 2. Alternatively, the image capturing device 1H may further include the circuit board 12, the plurality of metal lines 13, and the encapsulation layer 14B shown in fig. 3.

In the image capturing device 1H, the light channel layer 110H of the light collimator 11H includes a light-transmitting substrate 1100, a first light-shielding layer 1101, and a second light-shielding layer 1102. The transparent substrate 1100 has a first surface S1 and a second surface S2. The first surface S1 is located between the plurality of microlenses 111 and the second surface S2. The first light shielding layer 1101 is disposed on the first surface S1 and has a plurality of first openings O1. The second light shielding layer 1102 is disposed on the second surface S2 and has a plurality of second openings O2. The plurality of first openings O1, the plurality of second openings O2, the plurality of microlenses 111, and the plurality of image sensing elements 100 overlap each other in the thickness direction Z of the image capturing apparatus 1H.

Each of the plurality of image sensors 100 has an area As. The projection area of each of the plurality of microlenses 111 is Am (see fig. 1B). Each of the plurality of first openings O1 has an area a 1. Each of the plurality of second openings O2 has an area a 2. The image capturing device 1H satisfies A1 ≦ A2< Am < As. By satisfying the area design, the image capturing device 1H has better image capturing quality, so that the image capturing device 1H has good identification capability.

Under the framework of FIG. 9A, the image capturing device 1H satisfies T ≦ π [ (W/2)²+Tm²)]/(2Tm), the image capturing quality can be better, so that the image capturing apparatus 1H has good recognition capability. In the above relation, T is the thickness of the transparent substrate 1100, for example, the maximum thickness of the transparent substrate 1100. W is a width of each of the plurality of microlenses 111, for example, a maximum width of a projected shape of each microlens 111. Tm is a thickness of each of the plurality of microlenses 111, for example, a maximum thickness of each microlens 111 (Tm ═ T111). In one embodiment, the image capturing device 1H satisfies T ≦ π [ (W/2)²+Tm²)]/(4Tm), may have a preferenceThe image quality of the image capturing device 1H is good.

In the present embodiment, the width W1 of each of the plurality of first openings O1 and the width W2 of each of the plurality of second openings O2 satisfy, for example, 2 μm ≦ W1 ≦ 30 μm and 2 μm ≦ W2 ≦ 30 μm.

With the above design, the image capturing device 1H can satisfy the requirement of thin type. In one embodiment, the maximum thickness TT of the stacked structure of the microlenses 111 and the light channel layer 110H (including the base layer 113, if any) is less than 100 μm, such as 80 μm, but not limited thereto.

Referring to fig. 10, the main difference between the image capturing device 1I and the image capturing device 1H of fig. 9A is that each of the microlenses 111I of the light collimator 11I is a multi-layer structure. In the present embodiment, each microlens 111I includes a first layer 1110 and a second layer 1111. The materials of the first layer 1110 and the second layer 1111 may be different, and the materials of the first layer 1110 and the second layer 1111 may be selected according to the requirement, which is not limited herein. In other embodiments, each microlens 111I may include more layers. In addition, any embodiment of the present invention can be modified in the same manner, and will not be repeated hereinafter.

Referring to fig. 11, the main differences between the image capturing device 1J and the image capturing device 1H of fig. 9A are as follows. In the image capturing device 1J, the image capturing device 1J includes an image sensor 10, a light collimator 11J1, a light collimator 11J2, and a cover 16. For convenience of illustration, the light collimator 11J2 located between the light collimator 11J1 and the image sensor 10 may be referred to as an internal light collimator.

In the present embodiment, the light collimator 11J1 and the light collimator 11J2 are both configured as the light collimator 11H in fig. 9A, but not limited thereto. In another embodiment, the light collimators 11J1 and 11J2 may adopt the structure of the light collimators shown in other embodiments. Alternatively, the light collimator 11J1 and the light collimator 11J2 may have different architectures. For example, the light collimator 11J2 may omit the wall structure 112. In other embodiments, the image capturing device 1J may include a plurality of internal light collimators, and the plurality of internal light collimators may be arranged between the image sensor 10 and the light collimator 11J1 along the thickness direction Z of the image capturing device 1J. In addition, the plurality of microlenses 111 of the internal light collimator (e.g., the light collimator 11J2) overlap the plurality of microlenses 111 of the light collimator 11J1 in the stacking direction of the light collimator 11J1 and the internal light collimator (e.g., the light collimator 11J 2).

In summary, in the embodiments of the present invention, the light collimator collimates the light to improve the crosstalk problem, so that the image capturing device has good identification capability. In addition, by arranging the wall structure with the height higher than that of each micro lens on the periphery of the micro lenses, the scratching damage caused by the careless touch of the micro lenses can be avoided, and the subsequent assembly is facilitated.

In one embodiment, the wall structure and the plurality of microlenses may be integrally formed, thereby simplifying the number of process steps and reducing the process time. In one embodiment, the formation of the encapsulation layer can maintain good electrical performance and improve the mechanical strength of the image sensor, thereby satisfying the requirement of thinning and the improvement of yield. In one embodiment, the top surface of the wall structure and the top surface of the encapsulation layer may be flush to form a flat surface suitable for carrying other components. In one embodiment, the stray light can be filtered by the filter layer. In one embodiment, a cover plate may be further provided to protect the components located thereunder. The cover plate may include a light-transmissive substrate, a light-transmissive film, a light-transmissive display panel, a light-transmissive touch display panel, or a combination of at least two of the foregoing. In one embodiment, a portion of the image beam provided by the light-transmissive display panel or the light-transmissive touch display panel can be used for biometric identification; alternatively, the image capturing device may further include a light source for providing a light beam for biometric identification. In one embodiment, the image capturing quality can be improved by designing the areas of the optical collimator and the image sensor. In one embodiment, the image capturing quality can be improved by designing the thickness of the transparent substrate, the thickness and the width of the micro-lens. In one embodiment, the image capturing device can meet the requirement of thin type. In one embodiment, each microlens may have a multi-layer structure as desired. In one embodiment, the image capturing device may have a plurality of light collimators (including a light collimator and an internal light collimator).

Although the present invention has been described with reference to the above embodiments, it is not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention.

Claims

1. An image capturing apparatus, comprising:

an image sensor; and

a light collimator on the image sensor, wherein the light collimator comprises: an optical channel layer;

the micro lenses are arranged on the light channel layer, and the micro lenses and the image sensor are respectively positioned on the opposite sides of the light channel layer; and

and the wall structure is arranged on the light channel layer and positioned at the periphery of the plurality of micro lenses, wherein the height of the wall structure is greater than that of each of the plurality of micro lenses.

2. The image capturing apparatus as claimed in claim 1, wherein the projection shape of the wall structure on the light channel layer is a frame shape, and the wall structure surrounds the microlenses.

3. The image capturing apparatus as claimed in claim 1, wherein the wall structure includes a plurality of pseudo-microlenses, and a height of each of the pseudo-microlenses is greater than a height of each of the microlenses.

4. The image capturing apparatus of claim 1, further comprising:

a circuit board, wherein the image sensor is disposed on the circuit board;

a plurality of metal wires electrically connecting the image sensor and the circuit board; and

and the packaging layer is used for coating the metal wires and fixing the image sensor and the optical collimator on the circuit board.

5. The image capturing apparatus of claim 4, wherein the encapsulation layer covers an edge portion of the light collimator.

6. The image capturing apparatus as claimed in claim 4, wherein the package layer has a supporting portion, the supporting portion is located between the image sensor and the light collimator, the light collimator is supported by the supporting portion, and a gap exists between the light collimator and the image sensor.

7. The image capturing apparatus of claim 4, wherein a top surface of the wall structure is flush with a top surface of the encapsulation layer.

8. The image capturing apparatus as claimed in claim 4, further comprising:

a cover plate on the packaging layer, wherein the light collimator is located between the cover plate and the image sensor, and an air gap is formed between the cover plate and the micro lenses.

9. The image capturing apparatus of claim 8, wherein the cover plate comprises a transparent substrate, a transparent film, a transparent display panel, a transparent touch display panel, or a combination of at least two of the above.

10. The image capturing apparatus of claim 8, further comprising: and the middle frame is positioned between the packaging layer and the cover plate.

11. The image capturing apparatus of claim 8, further comprising: and the filter layer is positioned between the image sensor and the cover plate.

12. The image capturing apparatus as claimed in claim 1, wherein the wall structure and the microlenses are integrally formed.

13. The image capturing apparatus as claimed in claim 1, wherein each of the plurality of microlenses is a multi-layer structure.

14. The image capturing apparatus as claimed in claim 1, wherein the light channel layer comprises a combination of a light shielding layer and a light transmitting layer, a plurality of optical fibers, a plurality of pinholes or a grating.

15. The image capturing apparatus as claimed in claim 1, wherein the image sensor includes a plurality of image sensing elements, and the light channel layer includes:

a transparent substrate having a first surface and a second surface, the first surface being located between the microlenses and the second surface;

a first light shielding layer disposed on the first surface and having a plurality of first openings; and

a second light-shielding layer disposed on the second surface and having a plurality of second openings,

wherein the plurality of first openings, the plurality of second openings, the plurality of microlenses and the plurality of image sensing elements overlap each other, and

the area of each of the image sensing elements is As, the projected area of each of the microlenses is Am, the area of each of the first openings is a1, the area of each of the second openings is a2, and the image capturing device satisfies a1 ≦ a2< Am < As.

16. The image capturing apparatus as claimed in claim 15, wherein the light transmissive substrate has a thickness T, each of the microlenses has a width W, each of the microlenses has a thickness Tm, and the image capturing apparatus satisfies T ≦ π [ (W/2)²+Tm²)]/(2Tm)。

17. The image capturing apparatus as claimed in claim 16, wherein the light transmissive substrate has a thickness T, each of the microlenses has a width W, each of the microlenses has a thickness Tm, and the image capturing apparatus satisfies T ≦ π [ (W/2)²+Tm²)]/(4Tm)。

18. The image capturing apparatus of claim 15, wherein the width of each of the plurality of first openings is W1, the width of each of the plurality of second openings is W2, and the image capturing apparatus satisfies 2 μm W1 μm 30 μm, and 2 μm W2 μm 30 μm.

19. The image capturing apparatus as claimed in claim 15, wherein a maximum thickness of the stacked structure of the microlenses and the light channel layer is less than 100 μm.

20. The image capturing apparatus of claim 1, further comprising:

an internal light collimator located between the light collimator and the image sensor and comprising:

an optical channel layer; and

a plurality of microlenses disposed on the light channel layer of the inner light collimator, and the plurality of microlenses and the image sensor of the inner light collimator are respectively located at opposite sides of the light channel layer of the inner light collimator, wherein the plurality of microlenses of the inner light collimator overlap with the plurality of microlenses of the light collimator in a stacking direction of the light collimator and the inner light collimator.

21. The image capturing apparatus of claim 20, wherein the internal light collimator further comprises:

a wall structure disposed on the light channel layer of the inner light collimator and located at the periphery of the plurality of microlenses of the inner light collimator, wherein the height of the wall structure of the inner light collimator is greater than the height of each of the plurality of microlenses of the inner light collimator.