CN106503635B - Cover board, input module and electronic device for optical finger print identification - Google Patents

Cover board, input module and electronic device for optical finger print identification Download PDF

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Publication number
CN106503635B
CN106503635B CN201610888766.7A CN201610888766A CN106503635B CN 106503635 B CN106503635 B CN 106503635B CN 201610888766 A CN201610888766 A CN 201610888766A CN 106503635 B CN106503635 B CN 106503635B
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CN
China
Prior art keywords
ink layer
finger print
cover board
optical finger
substrate
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Active
Application number
CN201610888766.7A
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Chinese (zh)
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CN106503635A (en
Inventor
张海平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201610888766.7A priority Critical patent/CN106503635B/en
Publication of CN106503635A publication Critical patent/CN106503635A/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/1341Sensing with light passing through the finger

Abstract

The invention discloses a kind of cover boards for optical finger print identification, it includes fingerprint identification area, fingerprint identification area includes opaque portion and multiple transmittance sections for being arranged at intervals in opaque portion, for the size of each transmittance section less than 200 μm, the proportional region of the area of the gross area and fingerprint identification area of multiple transmittance sections is 20%-35%.In above-mentioned cover board, below the settable fingerprint identification area of optical finger print mould group, since the size of each transmittance section is less than 200 μm, the proportional region of the area of the gross area and fingerprint identification area of multiple transmittance sections is 20%-35%, so, visually optical finger print mould group can not only be hidden in below cover board, realizes the hiding effect of optical finger print mould group, it is ensured that enough light can through cover board to carry out fingerprint recognition.The invention also discloses a kind of input module and electronic devices.

Description

Cover board, input module and electronic device for optical finger print identification
Technical field
The present invention relates to fingerprint identification technology more particularly to it is a kind of for optical finger print identification cover board, input module and Electronic device.
Background technique
In the related art, the function that optical finger print mould group realizes fingerprint recognition, optics can be used in certain electronic devices Fingerprint mould group is arranged in below the cover board of electronic device.Therefore, when optical finger print mould group is hidden in below cover board, how to guarantee The light transmittance of cover board becomes technical problem to be solved to carry out optical finger print identification.
Summary of the invention
The present invention is directed at least solve one of the technical problems existing in the prior art.For this purpose, the present invention provides a kind of use In cover board, a kind of input module and a kind of electronic device of optical finger print identification.
The cover board for optical finger print identification of embodiment of the present invention includes fingerprint identification area, and fingerprint identification area includes non- Hyalomere and the multiple transmittance sections being arranged at intervals in opaque portion, the size of each transmittance section is less than 200 μm, multiple transmittance sections The gross area and fingerprint identification area area proportional region be 20%-35%.
In above-mentioned cover board, below the settable fingerprint identification area of optical finger print mould group, since the size of each transmittance section is less than 200 μm, the proportional region of the area of the gross area and fingerprint identification area of multiple transmittance sections is 20%-35%, in this way, not only from view Feeling upper can be such that optical finger print mould group is hidden in below cover board, realize the hiding effect of optical finger print mould group, it is ensured that enough Light can through cover board to carry out fingerprint recognition.
In some embodiments, the fingerprint identification area includes the substrate of light transmission and is coated on the substrate non- Bright ink layer, the nontransparent ink layer are formed with spaced multiple apertures;
A part of the substrate corresponding with the nontransparent ink layer and the nontransparent ink layer limit jointly The opaque portion, another part of the substrate corresponding with the aperture and the aperture limit the light transmission jointly Portion.
In some embodiments, the fingerprint identification area includes the substrate of light transmission and is coated on the substrate non- Bright ink layer, the cover board offer multiple through-holes through the substrate and the nontransparent ink layer, the multiple through-hole Interval setting;
The part of the substrate corresponding with the nontransparent ink layer and the nontransparent ink layer limit institute jointly Opaque portion is stated, the through-hole limits the transmittance section.
In some embodiments, the fingerprint identification area includes the substrate of light transmission, multiple clear ink layers and nontransparent Ink layer, for the multiple clear ink interlayer every being coated on the substrate, the nontransparent ink layer painting is located at the substrate Surrounding that is upper and being located at the multiple clear ink layer;
A part of the substrate corresponding with the nontransparent ink layer and the nontransparent ink layer limit jointly The opaque portion, another part and the multiple clear ink layer of the substrate corresponding with the multiple clear ink layer The multiple transmittance section is limited jointly.
In some embodiments, the clear ink layer is infrared ray ink layer.
In some embodiments, the thickness of the clear ink layer is less than 20 μm.
In some embodiments, the clear ink layer be in bar shaped, the thickness direction of the clear ink layer with it is described Angular range between substrate is 30-60 °.
In some embodiments, the clear ink layer be in bar shaped, the thickness direction of the clear ink layer with it is described Angle between substrate is 45 °.
In some embodiments, the multiple transmittance section is evenly spaced on.
In some embodiments, the distance between two adjacent described transmittance sections range is 20-30 μm.
In some embodiments, the size range of the transmittance section is 20-35 μm.
In some embodiments, the size of the transmittance section is 30 μm.
In some embodiments, the ratio model of the gross area of the multiple transmittance section and the area of the fingerprint identification area It encloses for 25%-30%.
In some embodiments, the size of the fingerprint identification area is 6mm*4mm.
The input module of embodiment of the present invention includes identifying described in any of the above embodiment for optical finger print Cover board and optical finger print mould group.Optical finger print mould group is arranged below fingerprint identification area, and is used for fingerprint recognition.
In above-mentioned input module, below the settable fingerprint identification area of optical finger print mould group, due to the size of each transmittance section Less than 200 μm, the proportional region of the area of the gross area and fingerprint identification area of multiple transmittance sections is 20%-35%, in this way, not only Optical finger print mould group can visually be hidden in below cover board, realizes the hiding effect of optical finger print mould group, it is ensured that Enough light can be through cover board to carry out fingerprint recognition.
The electronic device of embodiment of the present invention includes the lid for fingerprint recognition of any of the above embodiment Plate.
In above-mentioned electronic device, below the settable fingerprint identification area of optical finger print mould group, due to the size of each transmittance section Less than 200 μm, the proportional region of the area of the gross area and fingerprint identification area of multiple transmittance sections is 20%-35%, in this way, not only Optical finger print mould group can visually be hidden in below cover board, realizes the hiding effect of optical finger print mould group, it is ensured that Enough light can be through cover board to carry out fingerprint recognition.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect and advantage of the invention is from combining in description of the following accompanying drawings to embodiment by change It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the floor map of the cover board for optical finger print identification of embodiment of the present invention;
Fig. 2 is the floor map of the fingerprint identification area of the cover board of embodiment of the present invention;
Fig. 3 be fingerprint identification area in Fig. 2 along A-A to a diagrammatic cross-section;
Fig. 4 be the cover board in Fig. 2 fingerprint identification area along A-A to another diagrammatic cross-section;
Fig. 5 be the cover board in Fig. 2 fingerprint identification area along A-A to another diagrammatic cross-section;
Fig. 6 is another floor map of the fingerprint identification area of the cover board of embodiment of the present invention;
Fig. 7 is diagrammatic cross-section of the fingerprint identification area in Fig. 6 along B-B direction;
Fig. 8 is the floor map of the transmittance section of the fingerprint identification area of embodiment of the present invention;
Fig. 9 is the floor map of another transmittance section of the fingerprint identification area of embodiment of the present invention;
Figure 10 is the floor map of another transmittance section of the fingerprint identification area of embodiment of the present invention;
Figure 11 is the schematic illustration of the input module of embodiment of the present invention.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy Fixed orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic. " first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.? In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can To be mechanical connection, it is also possible to be electrically connected or can mutually communicate;It can be directly connected, it can also be by between intermediary It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower" It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above " Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter, This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with Recognize the application of other techniques and/or the use of other materials.
Fig. 1 and Fig. 2 is please referred to, the cover board 100 for optical finger print identification of embodiment of the present invention includes fingerprint recognition Area 10, fingerprint identification area 10 include opaque portion 12 and multiple transmittance sections 14.Multiple transmittance sections 14 are arranged at intervals on opaque portion In 12.The size of each transmittance section 14 is less than 200 μm, the ratio of the area of the gross area and fingerprint identification area 10 of multiple transmittance sections 14 Example range is 20%-35%.
In above-mentioned cover board 100, settable 10 lower section of fingerprint identification area of optical finger print mould group, due to the ruler of each transmittance section 14 It is very little less than 200 μm, the proportional region of the area of the gross area and fingerprint identification area 10 of multiple transmittance sections 14 is 20%-35%, such as This, not only can visually make optical finger print mould group be hidden in 100 lower section of cover board, realize the hiding effect of optical finger print mould group Fruit, it is ensured that enough light can be through cover board 100 to carry out fingerprint recognition.
The cover board 100 of embodiment of the present invention can be applied to electronic device, and electronic device is, for example, mobile phone or tablet computer, So that the hiding effect of optical finger print mould group may be implemented in electronic device, it is ensured that enough light can penetrate cover board 100 to carry out fingerprint recognition.It should be noted that the type of electronic device include but is not limited to more than example.
It needs to illustrate to be also possible to non-transparent, it is noted that opaque portion 12 can be light transmission.Light includes visible Light and black light.The cross section (section for being parallel to the upper surface of cover board 100) of transmittance section 14 can form the figure of closed loop, It can make the maximum circle of diameter in closed loop pattern, diameter of a circle is the size of transmittance section 14.In other words, diameter of a circle is less than 200μm。
Such as shown in Fig. 8, the cross section of transmittance section 14 is regular pentagon, and the size of transmittance section 14 is the inscribe of regular pentagon Diameter of a circle.
As also shown in fig. 9, the cross section of transmittance section 14 is irregular figure, then the diameter in irregular figure is maximum Diameter of a circle is the size of transmittance section 14.
Again as shown in Figure 10, the cross section of transmittance section 14 is rectangle, and the maximum diameter of a circle of diameter in rectangle is Rectangular width, then, the size of transmittance section 14 is rectangular width.
The gross area of above-described transmittance section 14 is the gross area of the cross section of transmittance section 14, the face of fingerprint identification area 10 Product is the area of the cross section of fingerprint identification area 10.
Specifically, cover board 100 includes display area 16 and non-display area 18.Normally, the intermediate region of cover board 100 is made For display area 16, non-display area 18 is arranged in around display area 16.For example, non-display area 18 is arranged in viewing area The top and or bottom side in domain 16.Fingerprint identification area 10 can be set in non-display area 18.
In order to enable electronic device is more beautiful, ink, the face of ink can be sprayed in the lower surface of non-display area 18 Color is, for example, that colors, the concrete conditions such as white, black or blue can be arranged according to actual needs.Ink not only can satisfy Demand of the user to the electronic device of different colours can also cover the structure inside electronic device to reach beautification electronic device Effect.
Referring to Fig. 3, in some embodiments, fingerprint identification area 10 includes that the substrate 20 of light transmission and painting are located at substrate 20 On nontransparent ink layer 22, nontransparent ink layer 22 is formed with spaced multiple apertures 24.
A part and nontransparent ink layer 22 of substrate 20 corresponding with nontransparent ink layer 22 limit nontransparent jointly Portion 12, another part of substrate 20 corresponding with aperture 24 and aperture 24 limit transmittance section 14 jointly.
In this way, opaque portion 12 and the structure of transmittance section 14 are simple, be conducive to the manufacture of cover board 100.In addition, light is successively worn Aperture 24 and substrate 20 are crossed to be emitted to 20 top of substrate, light reaches the finger surface back reflection outside substrate 20, the light of reflection Line enters 20 lower section of substrate after substrate 20 and aperture 24 successively to realize the function of optical finger print identification.
Since light is directly through substrate 20, so that light penetration is preferable, be conducive to carry out fingerprint recognition.It needs to illustrate , light can be visible light, is also possible to infrared ray.Such as the wavelength of visible light is 550nm, the wavelength of infrared ray is 850nm。
Specifically, substrate 20 includes upper surface 20a and lower surface 20b.It is appreciated that the upper surface 20a of substrate 20 is defeated The appearance for entering component 200, towards user.User can carry out corresponding gesture operation on the 20a of upper surface, such as click, The operation such as pressing or sliding realizes corresponding function to control electronic device.Nontransparent ink layer 22, which can apply, is located at lower surface 20b.
The material of substrate 20 can be made of translucent materials such as glass, ceramics or sapphires.Since substrate 20 is due to conduct The input part of electronic device, substrate 20 are often subject to the contact such as collide or scratch.For example, electronic device is put into pocket by user When, substrate 20 may be scratched by the key in user's pocket and be damaged.
Therefore, the material of substrate 20 can use the biggish material of hardness, such as above sapphire material.Certainly, Protection board can be bonded to prevent substrate 20 to be scraped off in the upper surface 20a of substrate 20.
Referring to Fig. 4, in some embodiments, fingerprint identification area 10 includes that the substrate 20 of light transmission and painting are located at substrate 20 On nontransparent ink layer 22, cover board 100 offers multiple through-holes 26, Duo Getong through substrate 20 and nontransparent ink layer 22 The setting of the interval of hole 26.
The part of substrate 20 corresponding with nontransparent ink layer 22 and nontransparent ink layer 22 limit opaque portion jointly 12, through-hole 26 limits transmittance section 14.
In this way, light can pass through through-hole 26 to carry out fingerprint recognition, light is emitted to substrate 20 directly through through-hole 26 Top, so that the light transmittance of cover board 100 is preferable.In addition, user is difficult to perceive lid by naked eyes since the size of through-hole 26 is smaller Through-hole 26 is offered on plate 100.
In one example, when manufacturing fingerprint identification area 10, it can first be coated with nontransparent ink layer 22 on the base plate 20, so It is processed in fingerprint identification area 10 by the processing method of laser afterwards and forms multiple through-holes 26, so as to form opaque portion 12 And transmittance section 14.
Referring to Fig. 5, in some embodiments, fingerprint identification area 10 includes substrate 20, the multiple clear inks of light transmission Layer 28 and nontransparent ink layer 22, multiple intervals of clear ink layer 28 are coated on the base plate 20, and the nontransparent painting of ink layer 22 is located at Surrounding on substrate 20 and positioned at multiple clear ink layers 28.
A part and nontransparent ink layer 22 of substrate 20 corresponding with nontransparent ink layer 22 limit nontransparent jointly Portion 12, another part and multiple clear ink layers 28 of substrate 20 corresponding with multiple clear ink layers 28 limit multiple jointly Transmittance section 14.
In this way, light, which can pass through clear ink layer 28, is emitted to the top of substrate 20 to carry out fingerprint recognition.
It should be pointed out that above nontransparent ink layer 22 can be the colors such as white, black or blue.It can manage Solution, the color of nontransparent ink layer 22 can specifically be set according to the actual situation.
In some embodiments, clear ink layer 28 is infrared ray ink layer (IR ink layer).
In this way, clear ink layer 28 can keep higher light transmittance, such as thoroughly when the light of fingerprint recognition is infrared ray The light transmittance through infrared ray of gloss oil layer of ink 28 is greater than 90%, and in other words, light source 102 is emitted to the infrared of clear ink layer 28 In line, 90% or more infrared ray can penetrate clear ink layer 28.
Specifically, infrared ray ink layer can make infrared ray pass through, and stop visible light and ultraviolet light.Infrared ray ink Layer is shown as black or the color close with black, such as navy blue under visible light.
As previously discussed, nontransparent ink layer 22 can be white, the nontransparent ink of infrared ray ink layer setting white In layer 22, the contrast of color is higher, still, since the size of clear ink layer 28 is smaller, so that even if nontransparent ink layer 22 be white, and the also more difficult presence for perceiving clear ink layer 28 of the naked eyes of user solves in tradition, uses the non-of white The technical issues of cannot achieve optical finger print identification when transparent ink layer 22.
In order to guarantee the light transmittance of clear ink layer 28, in some embodiments, the thickness of clear ink layer 28 is less than 20μm。
Fig. 6 and Fig. 7 is please referred to, in some embodiments, clear ink layer 28 is in bar shaped, the thickness of clear ink layer 28 Angle α range between direction and substrate 20 is 30-60 °.Preferably, between the thickness direction and substrate 20 of clear ink layer 28 Angle α be 45 °.
In this way, can not only guarantee the light transmittance of clear ink layer 28 when the color of nontransparent ink layer 22 is white, The contrast between clear ink layer 28 and nontransparent ink layer 22 can also be reduced, so that human eye is not readily apparent light transmission oil Layer of ink 28.
In some embodiments, multiple transmittance sections 14 are evenly spaced on.
In this way, the formation easy to manufacture of multiple transmittance sections 14, advantageously reduces the production cost of cover board 100.In an example In, multiple transmittance sections 14 are distributed in matrix, such as shown in the transmittance section 14 of Fig. 2.
In addition, so that it is more uniform through the light of 10 various pieces of fingerprint identification area, so that optical finger print identification Effect is preferable.
In some embodiments, the distance between two adjacent transmittance sections 14 range is 20-30 μm.
If two transmittance sections 14 are closer, two transmittance sections 14 may connection, be unfavorable for the manufacture of transmittance section 14 at Type.If two transmittance sections 14 are apart from the gross area and 10 domain of fingerprint identification area for, being difficult to meet farther out multiple transmittance sections 14 The proportional region of area.
Therefore, the distance between two above transmittance section 14 range not only makes transmittance section 14 easy to manufacture, can also protect Card has enough light to pass through cover board 100 to realize the function of optical finger print identification.
In some embodiments, the size range of transmittance section 14 is 20-35 μm.In one example, transmittance section 14 Having a size of 30 μm.
In this way, human eye is not readily apparent transmittance section 14, optical finger print identification mould group can visually be hidden under cover board 100 Side.
In some embodiments, the proportional region of the gross area and the area of fingerprint identification area 10 of multiple transmittance sections 14 is 25%-30%.
In some embodiments, the size of fingerprint identification area 10 is 6mm*4mm.
In this way, according to the finger-print region size of the finger of user, when the size of fingerprint identification area 10 is 6mm*4mm, not only The effect of fingerprint recognition may be implemented, it is also possible that the size of fingerprint identification area 10 is smaller, cover board 100 is easy to manufacture.
In one example, the shape of fingerprint identification area 10 is rectangle, then, the length L of fingerprint identification area 10 can be 6mm, width W can be 4mm.In other embodiments, the shape of fingerprint identification area 10 can be for example the shapes such as oblong.
11 are please referred to, the input module 300 of embodiment of the present invention includes referring to for optics for any of the above embodiment The cover board 100 and optical finger print mould group 200 of line identification.Optical finger print mould group 200 is arranged below fingerprint identification area 10, and is used for Fingerprint recognition.
In above-mentioned input module 300, settable 10 lower section of fingerprint identification area of optical finger print mould group 200, due to each light transmission For the size in portion 14 less than 200 μm, the proportional region of the area of the gross area and fingerprint identification area 10 of multiple transmittance sections 14 is 20%- 35%, in this way, optical finger print mould group 200 not only can visually be made to be hidden in 100 lower section of cover board, realize optical finger print mould group 200 hiding effects, it is ensured that enough light can through cover board 100 to carry out fingerprint recognition.
Specifically, optical finger print mould group 200 includes light source 202 and daylighting processing unit 204.The light that light source 202 is emitted Through reflecting on the fingerprint strain line of finger surface after cover board 100, the ridge line of finger reflects less light to daylighting processing unit 204, Gu Wen reflect more light to daylighting processing unit 204.
Daylighting processing unit 204 receives the light of finger surface fingerprint reflection, and handles shape according to the intensity of transmitting light At finger print pattern, daylighting processing unit 204 compares obtained finger print pattern and predetermined pattern, to realize fingerprint Function.
The electronic device of embodiment of the present invention includes the lid for fingerprint recognition of any of the above embodiment Plate 100.
In above-mentioned electronic device, below the settable fingerprint identification area of optical finger print mould group, due to the size of each transmittance section Less than 200 μm, the proportional region of the area of the gross area and fingerprint identification area of multiple transmittance sections is 20%-35%, in this way, not only Optical finger print mould group can visually be hidden in below cover board, realizes the hiding effect of optical finger print mould group, it is ensured that Enough light can be through cover board to carry out fingerprint recognition.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the invention.In this specification In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that: These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principle of the present invention and objective and become Type, the scope of the present invention are defined by the claims and their equivalents.

Claims (15)

1. a kind of cover board for optical finger print identification, which is characterized in that the cover board includes fingerprint identification area, and the fingerprint is known Other area includes opaque portion and multiple transmittance sections for being arranged at intervals in the opaque portion, and the size of each transmittance section is small In 200 μm, the cross section of the transmittance section forms closed loop pattern, makees the maximum circle of diameter, the circle in the closed loop pattern Diameter be the transmittance section size, the ratio model of the area of the gross area of the multiple transmittance section and the fingerprint identification area It encloses for 20%-35%, the size range of the transmittance section is 20-35 μm.
2. the cover board for optical finger print identification as described in claim 1, which is characterized in that the fingerprint identification area includes saturating The substrate of light and it is coated with nontransparent ink layer on the substrate, the nontransparent ink layer is formed with spaced multiple Aperture;
A part of the substrate corresponding with the nontransparent ink layer and the nontransparent ink layer limit described jointly Opaque portion, another part of the substrate corresponding with the aperture and the aperture limit the transmittance section jointly.
3. the cover board for optical finger print identification as described in claim 1, which is characterized in that the fingerprint identification area includes saturating The substrate of light and it is coated with nontransparent ink layer on the substrate, the cover board is offered through the substrate and described non- Multiple through-holes of bright ink layer, the multiple through-hole interval setting;
The part of the substrate corresponding with the nontransparent ink layer and the nontransparent ink layer limit described non-jointly Hyalomere, the through-hole limit the transmittance section.
4. the cover board for optical finger print identification as described in claim 1, which is characterized in that the fingerprint identification area includes saturating The substrate of light, multiple clear ink layers and nontransparent ink layer, the multiple clear ink interlayer every being coated on the substrate, The nontransparent ink layer is coated with the surrounding on the substrate and being located at the multiple clear ink layer;
A part of the substrate corresponding with the nontransparent ink layer and the nontransparent ink layer limit described jointly Opaque portion, another part and the multiple clear ink layer of the substrate corresponding with the multiple clear ink layer are common Limit the multiple transmittance section.
5. the cover board for optical finger print identification as claimed in claim 4, which is characterized in that the clear ink layer is infrared Line ink layer.
6. the cover board for optical finger print identification as claimed in claim 4, which is characterized in that the thickness of the clear ink layer Less than 20 μm.
7. the cover board for optical finger print identification as claimed in claim 4, which is characterized in that the clear ink layer is in item Shape, the angular range between the thickness direction and the substrate of the clear ink layer are 30-60 °.
8. the cover board for optical finger print identification as claimed in claim 4, which is characterized in that the clear ink layer is in item Shape, the angle between the thickness direction and the substrate of the clear ink layer is 45 °.
9. such as the described in any item cover boards for optical finger print identification of claim 1-8, which is characterized in that the multiple light transmission Portion is evenly spaced on.
10. the cover board for optical finger print identification as claimed in claim 9, which is characterized in that two adjacent light transmissions The distance between portion range is 20-30 μm.
11. the cover board for optical finger print identification as described in claim 1, which is characterized in that the size of the transmittance section is 30μm。
12. as described in claim 1 for optical finger print identification cover board, which is characterized in that the multiple transmittance section it is total The proportional region of area and the area of the fingerprint identification area is 25%-30%.
13. the cover board for optical finger print identification as described in claim 1, which is characterized in that the ruler of the fingerprint identification area Very little is 6mm*4mm.
14. a kind of input module characterized by comprising
Such as the described in any item cover boards identified for optical finger print of claim 1-13;And
Optical finger print mould group below the fingerprint identification area is set, and the optical finger print mould group is used for fingerprint recognition.
15. a kind of electronic device, which is characterized in that described in any item for optical finger print identification including such as claim 1-13 Cover board.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018133768A1 (en) * 2017-01-17 2018-07-26 苏州晶方半导体科技股份有限公司 Packaging structure and packaging method for fingerprint recognition chip
WO2018184164A1 (en) * 2017-04-06 2018-10-11 深圳市汇顶科技股份有限公司 Fingerprint identification device, manufacturing method of cover plate thereof, and electronic terminal
CN106971171A (en) * 2017-04-10 2017-07-21 广东小天才科技有限公司 A kind of covering plate structure recognized for optical finger print
CN107170360B (en) * 2017-04-27 2020-03-24 Oppo广东移动通信有限公司 Display screen, preparation method thereof and mobile terminal
CN107092311B (en) 2017-04-27 2020-03-03 Oppo广东移动通信有限公司 Display screen, display device and mobile terminal
CN110825171B (en) * 2017-04-27 2023-06-20 Oppo广东移动通信有限公司 Display screen, display device and mobile terminal
CN107092310B (en) * 2017-04-27 2020-04-03 Oppo广东移动通信有限公司 Display screen, display device and mobile terminal
CN108932466A (en) * 2017-05-24 2018-12-04 义隆电子股份有限公司 Electronic device and image capturing module thereof
CN107423691A (en) * 2017-06-28 2017-12-01 联想(北京)有限公司 A kind of fingerprint sensor, electronic equipment and fingerprint sensor manufacture method
TWI633493B (en) * 2017-08-08 2018-08-21 Gingy Technology Inc. Image capture apparatus
CN109426768A (en) * 2017-08-24 2019-03-05 蓝思科技(长沙)有限公司 Fingerprint recognition component and intelligent terminal
EP3531336A4 (en) 2017-12-05 2020-02-26 Shenzhen Weitongbo Technology Co., Ltd. Optical path modulator and manufacturing method thereof, fingerprint recognition device, and terminal device
US10817700B2 (en) 2017-12-18 2020-10-27 China Wafer Level Csp Co., Ltd. Optical fingerprint recognition chip package and packaging method
CN107910344B (en) * 2017-12-18 2021-02-23 苏州晶方半导体科技股份有限公司 Packaging structure and packaging method of optical fingerprint identification chip
CN107919332B (en) * 2017-12-20 2021-03-26 苏州晶方半导体科技股份有限公司 Packaging structure and packaging method of optical fingerprint chip
CN109959981A (en) * 2017-12-23 2019-07-02 苏州迈瑞微电子有限公司 Optical sensor slide glass
CN110033699A (en) * 2018-01-12 2019-07-19 京东方科技集团股份有限公司 Display base plate and preparation method thereof, display device
CN108681687B (en) * 2018-03-26 2022-01-07 Oppo广东移动通信有限公司 Cover plate and manufacturing method thereof, fingerprint identification module and electronic device
CN108520224B (en) * 2018-04-02 2020-10-09 武汉天马微电子有限公司 Display panel and display device
CN108596080B (en) * 2018-04-20 2021-05-14 Oppo广东移动通信有限公司 Fingerprint identification assembly, display device and electronic device
CN108615003B (en) * 2018-04-20 2019-06-11 Oppo广东移动通信有限公司 Fingerprint recognition component, display device and electronic device
CN109409346A (en) * 2018-12-20 2019-03-01 苏州多感科技有限公司 A kind of fingerprint recognition mould group and preparation method thereof, electronic equipment
WO2022004581A1 (en) * 2020-06-30 2022-01-06 パナソニックIpマネジメント株式会社 Display apparatus, and optical device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1801182A (en) * 2005-07-11 2006-07-12 张炯里 Fingerprint acquisition device
CN104700080A (en) * 2015-03-06 2015-06-10 南昌欧菲生物识别技术有限公司 Fingerprint recognition module and touch screen based on fingerprint recognition
CN204576537U (en) * 2015-03-06 2015-08-19 南昌欧菲生物识别技术有限公司 Fingerprint recognition module and the touch screen based on fingerprint recognition
CN104881629A (en) * 2015-03-31 2015-09-02 麦克思股份有限公司 Fingerprint identification device
CN105184230A (en) * 2015-08-14 2015-12-23 上海箩箕技术有限公司 Optical fingerprint sensor and electronic product

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1801182A (en) * 2005-07-11 2006-07-12 张炯里 Fingerprint acquisition device
CN104700080A (en) * 2015-03-06 2015-06-10 南昌欧菲生物识别技术有限公司 Fingerprint recognition module and touch screen based on fingerprint recognition
CN204576537U (en) * 2015-03-06 2015-08-19 南昌欧菲生物识别技术有限公司 Fingerprint recognition module and the touch screen based on fingerprint recognition
CN104881629A (en) * 2015-03-31 2015-09-02 麦克思股份有限公司 Fingerprint identification device
CN105184230A (en) * 2015-08-14 2015-12-23 上海箩箕技术有限公司 Optical fingerprint sensor and electronic product

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