CN104881629A - Fingerprint identification device - Google Patents
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- CN104881629A CN104881629A CN201510147025.9A CN201510147025A CN104881629A CN 104881629 A CN104881629 A CN 104881629A CN 201510147025 A CN201510147025 A CN 201510147025A CN 104881629 A CN104881629 A CN 104881629A
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Abstract
A fingerprint identification device is disclosed. The fingerprint identification device includes a fingerprint identification induction layer, an induction signal processing module and a colloid. The fingerprint identification induction layer is used for receiving the touch of a finger, induction and acquiring fingerprint information of the finger, and generating a corresponding induction signal to the induction signal processing module. The induction signal processing module is used for receiving and processing the induction signal and identifying the fingerprint. The induction signal processing module comprises a flexible circuit board. One end of the flexible circuit board is connected with the fingerprint identification induction layer, and the flexible circuit board is bent through the side of the fingerprint identification induction layer from the binding position with the fingerprint identification induction layer to a departing side of the fingerprint identification induction layer from a sensing surface. The colloid is coated at the bent position of the flexible circuit board, and is surrounded by the flexible circuit board and the fingerprint identification induction layer. According to the invention, as the bent position of the flexible circuit board is provided with colloid, the mechanical strength of the flexible circuit board can be effectively enhanced, and the stability of the fingerprint identification device is improved.
Description
Technical field
The present invention relates to a kind of fingerprint identification device.
Background technology
Fingerprint identification device is to be widely used in the different field such as industry, national defence, fire-fighting, electronics.A kind of typical material waves fingerprint identification device is ultrasonic sensor, produced by piezoelectric element and received ultrasonic signal to identify the image of fingerprint.But, not easily fix for the flexible circuit board connecting piezoelectric element and fingerprint recognition driver in current ultrasonic type fingerprint identification device, poor stability.
Summary of the invention
Given this, be necessary to provide a kind of fingerprint identification device.Described fingerprint identification device comprises fingerprint recognition inductive layer, induced signal process module and colloid.Described fingerprint recognition inductive layer, for receiving touching of finger, is responded to and gathers the finger print information of this finger and produce corresponding sensor signal to this induced signal process module.Described induced signal process module is used for receiving and processing induced signal and then identify this fingerprint.Described induced signal process module comprises flexible circuit board.One end of described flexible circuit board connects described fingerprint recognition inductive layer, and this flexible circuit board from this fingerprint recognition inductive layer mutually binding place be bent to via the side of this fingerprint recognition inductive layer the side that this fingerprint recognition inductive layer deviates from this sensing face.Described colloid is coated on the bending place of described flexible circuit board, and surrounded by described flexible circuit board and described fingerprint recognition inductive layer.
Compare with prior art, fingerprint identification device provided by the present invention is provided with colloid due to the bending place of flexible circuit board, effectively can strengthen the physical strength of described flexible circuit board, improves the stability of fingerprint identification device.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the fingerprint identification device that first embodiment of the invention provides.
Fig. 2 is the explosive view of fingerprint identification device in Fig. 1.
Fig. 3 is the diagrammatic cross-section done along III-III line of cut in Fig. 1.
Fig. 4 is the schematic diagram of the fingerprint identification device that second embodiment of the invention provides.
Fig. 5 is the explosive view of fingerprint identification device in Fig. 4.
Fig. 6 is the diagrammatic cross-section done along VI-VI line of cut in Fig. 4.
Main element symbol description
| Fingerprint identification device | 200、300 |
| Fingerprint recognition inductive layer | 200a、300a |
| Induced signal process module | 200b、300b |
| Signal transmit layer | 210、310 |
| Substrate | 220、320 |
| Elongated end | 221、321 |
| Signal reception layer | 230、330 |
| Flexible circuit board | 240、340 |
| Colloid | 250、350 |
| Driver | 260、360 |
| Part I | 241、341 |
| Part II | 242、342 |
| Part III | 243、343 |
| Transmitance region | 246、346 |
| Through hole | 348 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
See also Fig. 1 to Fig. 3, the fingerprint identification device 200 that first embodiment of the invention provides comprises an a fingerprint recognition inductive layer 200a and induced signal process module 200b.This fingerprint recognition inductive layer 200a, for receiving touching of finger, responds to and gathers the finger print information of this finger and produce corresponding sensor signal to this induced signal process module 200b.This induced signal process module 200b is used for receiving and processing induced signal, and then reaches the object identifying this fingerprint.This fingerprint recognition inductive layer 200a definition has a sensing face, for receiving touching of this finger.This induced signal process module 200b comprises a flexible circuit board 240 and and drives inductor 260.One end of this flexible circuit board 240 connects this fingerprint recognition inductive layer 200a, the other end connects this driving inductor 260, and this flexible circuit board 240 from this fingerprint recognition inductive layer mutually binding place be bent to via the side of this fingerprint recognition inductive layer 200a the side that this fingerprint recognition inductive layer 200a deviates from this sensing face.This fingerprint identification device 20 comprises colloid 250 further, this colloid 250 is coated on the bending place of this flexible circuit board 240 towards the side of this fingerprint recognition inductive layer 200a, for strengthening the physical strength of this bending place, thus being arranged in the bending of this flexible circuit board 240 rear flank that this fingerprint recognition inductive layer 200a deviates from this sensing face, this colloid 250 is to should the side of fingerprint recognition inductive layer 200a arrange.In the present embodiment, this colloid 250 can be preferably optic-solidified adhesive (UV Curing Type Glue), thus can solidify under the irradiation of ultraviolet light.This driving inductor 260 is arranged on this flexible circuit board 250, preferably, is arranged on the one side that this flexible circuit board 250 deviates from this fingerprint recognition inductive layer 200a.Change ground, this driving inductor 260 also can be arranged in a circuit board (not shown), and the bending of this flexible circuit board 250 extends to the rear flank that fingerprint recognition inductive layer 200a deviates from this sensing face and is electrically connected via this circuit board and this driving inductor 260.In the present embodiment, this this fingerprint recognition inductive layer 200a can be a ultrasonic type fingerprint recognition inductive layer.
This fingerprint recognition inductive layer 200a comprises a signal transmit layer 210, substrate 220 and a Signal reception layer 230.Described signal transmit layer 210 is oppositely arranged with Signal reception layer 230.Described substrate 220 is between described signal transmit layer 210 and Signal reception layer 230.The outside surface of this Signal reception layer 230 defines this sensitive surface.This substrate 220 is a substrate being provided with thin film transistor (TFT) (Thin Film Transistor, TFT) array, for and accept this Signal reception layer 230 export induced signal.In the present embodiment, this substrate 220 comprises the elongated end 221 that exceeds this signal transmit layer 210 and this Signal reception layer 230 place place.
The elongated end 221 that one end of described flexible circuit board 240 is arranged on this substrate 220 deviates from the surface of described signal transmit layer 210, and bend to the surface of described signal transmit layer 210 away from described substrate 220, thus be arranged on the bottom side of this fingerprint recognition inductive layer 200a.Particularly, described flexible circuit board 240 comprises Part I 241, Part II 242 and Part III 243.Wherein, described Part I 241 is positioned at the surface of described signal transmit layer 210 away from described substrate 220.Described Part II 242 deviates from the one side of described signal transmit layer 210 at the elongated end 221 of this substrate 220, and is electrically connected with described substrate 220.Described Part III 243 connects this Part I 241 and Part II 242, is the bending place of this flexible circuit board 240.
Described colloid 250 is coated on should Part III 242 place of bending place of flexible circuit board 240, thus after flexible circuit board 240 bends, the side of the fingerprint recognition inductive layer 200a that this colloid 250 correspondence is made up of described signal transmit layer 210, substrate 220 and Signal reception layer 230 is arranged, and is enclosed in space that the fingerprint recognition inductive layer 200a that is made up of described Part I 241, Part II 242, Part III 243 and described Signal reception layer 210, substrate 220 and signal transmit layer 230 surrounds.This colloid 250 is for supporting the Part III 243 of the described corresponding bending place of flexible circuit board 240 to strengthen the physical strength of described fingerprint identification device 200.
Described signal transmit layer 210 includes piezoelectric with described Signal reception layer 230.In the present embodiment, described signal transmit layer 210 includes poly-vinylidene difluoride (Polyvinylidene Fluoride, PVDF) with Signal reception layer 230.Wherein, described signal transmit layer 210 is for generation of vibration to send ultrasound wave, and described Signal reception layer 230 is positioned over by one ultrasound wave that the finger on described Signal reception layer 230 is reflected back for receiving and is electric signal by described Ultrasonic transformation.
When described fingerprint identification device 200 works, described driver 260 controls described signal transmit layer 210 and produces vibration thus send ultrasound wave, when finger is placed on described fingerprint identification device 200, described ultrasound wave is reflexed to described Signal reception layer 230 by finger, shape by finger print fovea superior and ridge affects, corresponding change is there is by the ultrasound wave reflected, the Ultrasonic transformation received is electric signal by described Signal reception layer 230, and by the thin film transistor (TFT) array in described electrical signal transfer to described substrate 220, described is the gray level image of fingerprint by described thin film transistor (TFT) array by described transform electrical signals, thus acquisition fingerprint.
In the present embodiment, described flexible circuit board 240 comprises the transmitance region 246 corresponding with described colloid 250 further, and by this transmitance region 246, light, as ultraviolet light can direct this colloid 250 of directive.In the present embodiment, described transmitance region 246 is defined in described Part I 241 position corresponding with described colloid 250, be appreciated that, in other embodiments, described transmitance region 246 can also be defined in described Part II 242 or Part III 243 position corresponding with described colloid 250.Described transmitance region 246 pairs of wavelength are greater than 30% at the transmittance of the light of 315nm to 400nm.In the present embodiment, the material of described transmitance region 246 is selected from material wavelength being greater than to 30% at the transmittance of the light of 315nm to 400nm, such as polycarbonate (Polycarbonate; Or tygon (Polyethylene PC); PE) etc.Thus, when solidifying described colloid 250, ultraviolet light can fully be irradiated to described colloid 250 by described transmitance region 246, and described colloid 250 is fully solidified.Be appreciated that the making for convenience of described flexible circuit board 240, the base material of described flexible circuit board 240 entirety all can be adopted material wavelength being greater than to 30% at the transmittance of the light of 315nm to 400nm.
In the present embodiment, also light initiator can be added with in described colloid 250.Preferably, the content of described smooth initiator accounts for 1% to 10% of described colloid 250 total content.The material of described smooth initiator is 1, phenyl copper based compound and the derivants thereof such as 2-diphenylthanedione (Benzil), benzophenone (Benzophenone), below be respectively the chemical molecular formula of 1,2-diphenylthanedione and benzophenone:
1,2-diphenylthanedione benzophenone
Described smooth initiator effectively can increase the curing rate of described colloid 250, and described colloid 250 is solidified faster.Meanwhile, in the present embodiment, the acrylate-functional groups (Acrylic function group) that content accounts for described colloid 250 total content more than 5% is also comprised in described colloid 250.Described acrylate-functional groups more effectively can improve the solidification intensity of described colloid 250.
Thus, because described flexible circuit board 240 comprises the transmitance region 246 corresponding with described colloid 250, make light can the larger transmitance region 246 of transmission area to solidify colloid 250, and not only carry out side direction through the two sides in this flexible circuit board 240 knee and irradiate described colloid 250, described colloid 250 can fully be solidified, to improve the physical strength of described fingerprint identification device 200.Meanwhile, the light initiator in described colloid 250 and/or acrylate-functional groups can be accelerated the curing rate of described colloid 250 respectively and improve the solidification intensity of described colloid 250, to improve the physical strength of described fingerprint identification device 200 further.
See also Fig. 4 to Fig. 6, the fingerprint identification device 300 that second embodiment of the invention provides comprises an a fingerprint recognition inductive layer 300a and induced signal process module 300b.This fingerprint recognition inductive layer 300a, for receiving touching of finger, responds to and gathers the finger print information of this finger and produce corresponding sensor signal to this induced signal process module 300b.This induced signal process module 300b is used for receiving and processing induced signal, and then reaches the object identifying this fingerprint.This fingerprint recognition inductive layer 300a definition has a sensing face, for receiving touching of this finger.This induced signal process module 300b comprises a flexible circuit board 340 and and drives inductor 360.One end of this flexible circuit board 340 connects this fingerprint recognition inductive layer 300a, the other end connects this driving inductor 360, and this flexible circuit board 340 from this fingerprint recognition inductive layer mutually binding place be bent to via the side of this fingerprint recognition inductive layer 300a the side that this fingerprint recognition inductive layer 300a deviates from this sensing face.This fingerprint identification device 30 comprises colloid 350 further, this colloid 350 is coated on the bending place of this flexible circuit board 340 towards the side of this fingerprint recognition inductive layer 300a, for strengthening the physical strength of this bending place, thus being arranged in the bending of this flexible circuit board 340 rear flank that this fingerprint recognition inductive layer 300a deviates from this sensing face, this colloid 350 is to should the side of fingerprint recognition inductive layer 300a arrange.In the present embodiment, this colloid 350 can be preferably optic-solidified adhesive (UV Curing Type Glue), thus can solidify under the irradiation of ultraviolet light.This driving inductor 360 is arranged on this flexible circuit board 350, preferably, is arranged on the one side that this flexible circuit board 350 deviates from this fingerprint recognition inductive layer 300a.Change ground, this driving inductor 360 also can be arranged in a circuit board (not shown), and the bending of this flexible circuit board 350 extends to the rear flank that fingerprint recognition inductive layer 300a deviates from this sensing face and is electrically connected via this circuit board and this driving inductor 360.In the present embodiment, this this fingerprint recognition inductive layer 300a can be a ultrasonic type fingerprint recognition inductive layer.
This fingerprint recognition inductive layer 300a comprises a signal transmit layer 310, substrate 320 and a Signal reception layer 330.Described signal transmit layer 310 is oppositely arranged with Signal reception layer 330.Described substrate 320 is between described signal transmit layer 310 and Signal reception layer 330.The outside surface of this Signal reception layer 330 defines this sensitive surface.This substrate 320 is a substrate being provided with thin film transistor (TFT) (Thin Film Transistor, TFT) array, for and accept this Signal reception layer 330 export induced signal.In the present embodiment, this substrate 320 comprises the elongated end 321 that exceeds this signal transmit layer 310 and this Signal reception layer 330 place place.
The elongated end 321 that one end of described flexible circuit board 340 is arranged on this substrate 320 deviates from the surface of described signal transmit layer 310, and bend to the surface of described signal transmit layer 310 away from described substrate 320, thus be arranged on the bottom side of this fingerprint recognition inductive layer 300a.Particularly, described flexible circuit board 340 comprises Part I 341, Part II 342 and Part III 343.Wherein, described Part I 341 is positioned at the surface of described signal transmit layer 310 away from described substrate 320.Described Part II 342 deviates from the one side of described signal transmit layer 310 at the elongated end 321 of this substrate 320, and is electrically connected with described substrate 320.Described Part III 343 connects this Part I 341 and Part II 342, is the bending place of this flexible circuit board 340.
Described colloid 350 is coated on should Part III 342 place of bending place of flexible circuit board 340, thus after flexible circuit board 340 bends, the side of the fingerprint recognition inductive layer 300a that this colloid 350 correspondence is made up of described signal transmit layer 310, substrate 320 and Signal reception layer 330 is arranged, and is enclosed in space that the fingerprint recognition inductive layer 300a that is made up of described Part I 341, Part II 342, Part III 343 and described Signal reception layer 310, substrate 320 and signal transmit layer 330 surrounds.This colloid 350 is for supporting the Part III 343 of the described corresponding bending place of flexible circuit board 340 to strengthen the physical strength of described fingerprint identification device 300.
Described signal transmit layer 310 includes piezoelectric with described Signal reception layer 330.In the present embodiment, described signal transmit layer 310 includes poly-vinylidene difluoride (Polyvinylidene Fluoride, PVDF) with Signal reception layer 330.Wherein, described signal transmit layer 310 is for generation of vibration to send ultrasound wave, and described Signal reception layer 330 is positioned over by one ultrasound wave that the finger on described Signal reception layer 330 is reflected back for receiving and is electric signal by described Ultrasonic transformation.
When described fingerprint identification device 300 works, described driver 360 controls described signal transmit layer 310 and produces vibration thus send ultrasound wave, when finger is placed on described fingerprint identification device 300, described ultrasound wave is reflexed to described Signal reception layer 330 by finger, shape by finger print fovea superior and ridge affects, corresponding change is there is by the ultrasound wave reflected, the Ultrasonic transformation received is electric signal by described Signal reception layer 330, and by the thin film transistor (TFT) array in described electrical signal transfer to described substrate 320, described is the gray level image of fingerprint by described thin film transistor (TFT) array by described transform electrical signals, thus acquisition fingerprint.
In the present embodiment, described flexible circuit board 340 comprises the transmitance region 346 corresponding with described colloid 350 further, and by this transmitance region 346, light, as ultraviolet light can direct this colloid 350 of directive.In the present embodiment, described transmitance region 346 is defined in described Part I 341 position corresponding with described colloid 350, be appreciated that, in other embodiments, described transmitance region 346 can also be defined in described Part II 342 or Part III 343 position corresponding with described colloid 350.In the present embodiment, described transmitance region 346 comprises multiple through hole 348, the area sum of described multiple through hole 348 is not less than 30% of described transmitance region 346 total area, is greater than 30% to make described transmitance region 346 pairs of wavelength at the transmittance of the light of 315nm to 400nm.Further, this through hole 348 arrangement on transmitance region 346 is as the criterion with the transmission not affecting flexible circuit board 340 signal lead.In the present embodiment, described through hole 348 is circular hole, and along this flexible circuit board 340 Width being distributed in two relative both sides of this transmitance region 346, the center section of flexible circuit board 340 is for arranging the cabling of flexible circuit board 340.Be appreciated that in other embodiments, the shape of described through hole 348 also can be the through hole of rectangle, rhombus or other shape.The arrangement mode of through hole 348 and the cabling of flexible circuit board 340 also correspondingly can coordinate and change, and are as the criterion not hinder flexible circuit board signal transmission.Thus, when solidifying described colloid 350, ultraviolet light can fully be irradiated to described colloid 350 by described transmitance region 346, and described colloid 350 is fully solidified.In the present embodiment, the material of this flexible circuit board 340 is not defined as material wavelength being greater than to 30% at the transmittance of the light of 315nm to 400nm, preferably, the material of this flexible circuit board 340 also can be selected from material wavelength being greater than to 30% at the transmittance of the light of 315nm to 400nm.
In the present embodiment, also light initiator can be added with in described colloid 350.Preferably, the content of described smooth initiator accounts for 1% to 10% of described colloid 350 total content.The material of described smooth initiator is phenyl copper based compound and the derivant thereof such as 1,2-diphenylthanedione (Benzil), benzophenone (Benzophenone).Described smooth initiator effectively can increase the curing rate of described colloid 350, and described colloid 350 is solidified faster.Meanwhile, in the present embodiment, the acrylate-functional groups (Acrylic function group) that content accounts for described colloid 350 total content more than 5% is also comprised in described colloid 350.Described acrylate-functional groups more effectively can improve the solidification intensity of described colloid 350.
Thus, because described flexible circuit board 340 comprises the transmitance region 346 corresponding with described colloid 350, make light can the larger transmitance region 346 of transmission area to solidify colloid 350, and not only carry out side direction through the two sides in this flexible circuit board 340 knee and irradiate described colloid 350, described colloid 350 can fully be solidified, to improve the physical strength of described fingerprint identification device 300.Meanwhile, the light initiator in described colloid 350 and/or acrylate-functional groups can be accelerated the curing rate of described colloid 350 respectively and improve the solidification intensity of described colloid 350, to improve the physical strength of described fingerprint identification device 300 further.Simultaneously, for present embodiment, even if printing opacity through hole 348 is incident to the ultraviolet light of colloid 350 local area, but owing to being added with above-mentioned smooth initiator and/or acrylate-functional groups material in colloid 350, accelerated reaction, make ultraviolet light also can have influence on other not by the colloid region of ultraviolet light direct projection, thus obtain more excellent colloid 350 solidification effect, to improve the physical strength of described fingerprint identification device 300 further.
Change ground, the colloid 350 of the present invention is preferably photocuring colloid, if but be appreciated that and select heat curing colloid, also can play the effect of the intensity that the bend of strengthening this flexible circuit board divides.If but select heat curing colloid, then the temperature of solidifying may damage flexible circuit board, strictly need control process temperatures.
Above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, upper and lower, the left and right direction occurred in diagram is only conveniently understood, although with reference to preferred embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, can modify to technical scheme of the present invention or equivalent replacement, and not depart from the spirit and scope of technical solution of the present invention.
Claims (15)
1. a fingerprint identification device, it comprises fingerprint recognition inductive layer, induced signal process module and colloid, described fingerprint recognition inductive layer is for receiving touching of finger, respond to and gather the finger print information of this finger and produce corresponding sensor signal to this induced signal process module, described induced signal process module is used for receiving and processing induced signal and then identify this fingerprint, described induced signal process module comprises flexible circuit board, one end of described flexible circuit board connects described fingerprint recognition inductive layer, and this flexible circuit board from this fingerprint recognition inductive layer mutually binding place be bent to via the side of this fingerprint recognition inductive layer the side that this fingerprint recognition inductive layer deviates from this sensing face, described colloid is coated on the bending place of described flexible circuit board, and surrounded by described flexible circuit board and described fingerprint recognition inductive layer.
2. fingerprint identification device as claimed in claim 1, it is characterized in that, described colloid is optic-solidified adhesive, and described flexible circuit board comprises the transmitance region corresponding with described colloid, and described transmitance region is greater than 30% to wavelength in the penetrance of the light of 315nm to 400nm.
3. fingerprint identification device as claimed in claim 2, is characterized in that, the material of described transmitance region is selected from material wavelength being greater than to 30% at the transmittance of the light of 315nm to 400nm.
4. fingerprint identification device as claimed in claim 3, is characterized in that, the base material of described flexible circuit slab integral all adopts material wavelength being greater than to 30% at the transmittance of the light of 315nm to 400nm.
5. the fingerprint identification device according to any one of claim 3 to 4, is characterized in that, is describedly selected from polycarbonate or tygon to the material that wavelength is greater than 30% at the transmittance of the light of 315nm to 400nm.
6. the fingerprint identification device according to any one of claim 2,3,4, it is characterized in that, described transmitance region comprises multiple through hole, and the area sum of described multiple through hole is not less than 30% of the described transmitance region total area.
7. fingerprint identification device as claimed in claim 6, it is characterized in that, described through hole is circular hole, and described through hole is along described flexible circuit board Width is distributed in described transmitance region two relative both sides.
8. fingerprint identification device as claimed in claim 2, it is characterized in that, described colloid is added with light initiator, and the material of described smooth initiator is phenyl copper based compound and derivant thereof.
9. fingerprint identification device as claimed in claim 8, it is characterized in that, the material of described smooth initiator comprises 1,2-diphenylthanedione (Benzil) or benzophenone (Benzophenone).
10. fingerprint identification device as claimed in claim 8, it is characterized in that, the content of described smooth initiator accounts for 1% to 10% of described colloid total content.
11. fingerprint identification devices as claimed in claim 2, is characterized in that, also comprise acrylate-functional groups in described colloid.
12. fingerprint identification devices as claimed in claim 11, is characterized in that, the content of described acrylate-functional groups accounts for described colloid total content more than 5%.
13. fingerprint identification devices as claimed in claim 2, it is characterized in that, described fingerprint recognition inductive layer comprises a signal transmit layer, substrate and a Signal reception layer, described signal transmit layer and Signal reception layer are oppositely arranged, described substrate is between described signal transmit layer and Signal reception layer, described substrate comprises the elongated end that exceeds this signal transmit layer and this Signal reception layer place place, described signal transmit layer is for generation of vibrating to send ultrasound wave, described Signal reception layer is positioned over by one ultrasound wave that the finger on described Signal reception layer is reflected back for receiving and is electric signal by described Ultrasonic transformation, it is the gray level image of fingerprint that described substrate is used for described transform electrical signals, thus acquisition fingerprint.
14. fingerprint identification devices as claimed in claim 13, it is characterized in that, described flexible circuit board comprises Part I, Part II and Part III, described Part I is positioned at the surface of described signal transmit layer away from described substrate, described Part II deviates from the one side of described signal transmit layer at the elongated end of described substrate, and be connected with described electrical property of substrate, described Part III connects this Part I and Part II, is the bending place of this flexible circuit board.
15. fingerprint identification devices as claimed in claim 14, it is characterized in that, described induced signal process module also comprises a driving inductor, described driving inductor is arranged on the one side that described flexible circuit board deviates from described fingerprint recognition inductive layer, and one end of described flexible circuit board connects described driving inductor.
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| CN106355165A (en) * | 2016-09-30 | 2017-01-25 | 北京小米移动软件有限公司 | Fingerprint data acquisition method and device |
| CN106503635A (en) * | 2016-10-11 | 2017-03-15 | 广东欧珀移动通信有限公司 | For the cover plate of optical finger print identification, input module and electronic installation |
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Effective date of registration: 20180814 Address after: No. 689, cooperative road, hi-tech West District, Chengdu, Sichuan Applicant after: Cheng Cheng Technology (Chengdu) Co., Ltd. Applicant after: Interface Optoelectronic (Shenzhen) Co., Ltd. Address before: Corvette Trust Services, 30 Castro Street, Vickhansky 1, Lodetown, Tortola, British Virgin Islands Applicant before: Mike thinks incorporated company |
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