TW201224542A - Optical sensing module - Google Patents

Optical sensing module Download PDF

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Publication number
TW201224542A
TW201224542A TW99143538A TW99143538A TW201224542A TW 201224542 A TW201224542 A TW 201224542A TW 99143538 A TW99143538 A TW 99143538A TW 99143538 A TW99143538 A TW 99143538A TW 201224542 A TW201224542 A TW 201224542A
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Taiwan
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light
optical
sensing module
optical sensing
emitting
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TW99143538A
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Chinese (zh)
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TWI408429B (en
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Chiung-Han Wang
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Au Optronics Corp
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Priority to CN2011100267593A priority patent/CN102081483B/en
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Publication of TWI408429B publication Critical patent/TWI408429B/en

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Abstract

An optical sensing module including a light guiding member, a light source, a light shielding member, a plurality of photo sensors and an optical component is provided. The light guiding member has a light incident surface and a light emitting surface. The light source is suitable for providing a light. The light shielding member is disposed over a parts of the light emitting surface. A plurality of the photo sensors are disposed on the light shading devicelight shielding member. The optical component is disposed above the light emitting surface, wherein the photo sensors and light shielding member are located between the optical component and the light guiding member. The optical component has a touch-sensing surface, the light passes through the optical component after leaving the light guiding member. When an object touches the touch-sensing surface, the light is reflected to be received by the photo sensors.

Description

201224542 /\υ ιυυ /134 36142twf.doc/t 六、發明說明: 【發明所屬之技術領域】 本發明是有關於一種光學感測模組,且特別是有關於 一種薄型化的光學感測模組。 【先前技術】 隨著資訊技術、無線行動通訊和資訊家電的快速發展 與應用’為了達到操作更人性化的目的,許多資訊產品, 如智慧型手機、筆記型電麟,纽有光學手指導航^組 (optical finger navigation,OFN)。在習知的光學手指導航模 組中,多半採用紅外線發光二極體作為光源,而紅外線發 光二極體所發出之紅外光係經由稜鏡投射至使用者之手指 上,手指的影像則係透過影像感測器(例如互補金氧半導^ 影像感測器)操取。接著,在手指的影像被影像感測器掘取 之後’可利弱彡像處理方法來分析不同時間點所操取之景多 像的差異性,藉以判斷手指移動的方向和距離。 然而,在習知的光學手指導航模組中,影像感測器(例 如互補金氧半導體影像感測器)多為不透光的晶片,且通常 而搭配透鏡方可擷取到良好的手指影像,影像感測器以及透 鏡的没置使得習知的光學手指導航模組皆具有一定的厚度 與體積,不易於薄型化。舉例而言,在美國專利第7〇45775 唬、美國專利第7161682號、美國專利第6433780號、美 國專利第5686720號、美國專利第7408718號以及美國專 利公開20100071967號中所揭露之光學手指導航模組皆有 201224542 AU1007134 36142twf.doc/t 不易於薄型化的缺點。 【發明内容】 本發明提供一種薄型化光學感測模組。 本發明提供一種光學感測模組,其包括光傳導件、光 源、遮光元件、多個光感測器以及光學元件。光傳導件具 有入光面以及出光面,入光面與出光面間係具有失角。光 鲁 源適於^供光線,而光線由入光面進入光傳導件,並從出 光面離開光傳導件。遮光元件配置於出光面之部分區域 上。多個光感測器配置於遮光元件上。光學元件配置於出 光面之上方,其中光感測器與遮光元件位於光學元件與光 傳導件之間’光學元件具有觸碰表面,光線從出光面離開 光傳導件之後會穿過光學元件,當物體觸碰觸碰表面時, 光線被反射而被光感測器所接收。 在本發明的一實施例中,前述之光傳導件更具有光學 面,而光學面與出光面相對。 • 在本發明的一實施例中,前述之光傳導件具有多個光 學微結構,這些光學微結構位於光學面上。 在本發明的一實施例中,前述之多個光學微結構包括 多個V形槽或多個散射網點。 在本發明的一實施例中,前述之光源包括非可見光 源。 在本發明的一實施例中,前述之遮光元件包括反射層 或光吸收層。 在本發明的一實施例中,前述之遮光元件包括多個陣 201224542 ,34 36142twf.doc/t 列排列之遮光圖案以及多個由遮光圖案所定義出的出光開 口’遮光圖案與出光開口係沿著行方向以及列方向交替^ 列。 在本發明的一實施例中,前述之排列於同一列之遮光 圖案及出光開口係沿著列方向交替排列,而排列於同一行 之遮光圖案及出光開口係沿著行方向交替排列。 在本發明的一實施例中’前述之出光開口分佈於光减 測器之間。 ' 在本發明的一實施例中’前述之光學元件為微透鏡陣 列基板(micro-lens array substrate),而此微透鏡陣列基板具 有觸碰表面以及與觸碰表面相對之微透鏡表面,且微透鏡 表面係面向出光面。 在本發明的一實施例中,前述之光學元件包括蓋板以 及微透鏡陣列基板。蓋板具有觸碰表面。微透鏡陣列基板 配置於蓋板與光傳導件之間。微透鏡陣列基板具有微透鏡 表面’且微透鏡表面係面向蓋板。 在本發明的一實施例中,前述之光線從出光面離開 時,其發散角度低於40度,光學元件包括蓋板,而蓋板具 有觸碰表面。 在本發明的一實施例中’前述之光學元件包括準直透 鏡(collimated lens)。 在本發明的一實施例中,前述之光傳導件為彩色濾光 基板或主動元件陣列基板。 基於上述,在本發明之光學感測模組中,藉由將光感 測器配置於光傳導件的部份出光面上,使得本發明之光學 201224542 AU1007134 36142twf.doc/t 感測模組可有效地薄型化。 下文特 為讓本發明之上述特徵和優點能更明顯易懂, 舉實施例,並配合所附圖式作詳細說明如下。 【實施方式】 【第一實施例】 • 為本發明第—實施例之光學感測模組剖面示意 圖。叫參照m,本實施例之光學感測模矣且】⑻可 傳導件no、光源120、遮光元件130、多個光感測器14〇 以及光學元件iso。光傳導件110具有入光面·以及出 ,面ll〇b,入光面110a與出光面11〇b間係具有夾角0。 詳言之’入光面11如與出光面11〇b可相連接,入光面li〇a 與出光面110b間具有夾角0,夾角θ例如為9〇〇。然,本 發明不限於此,入光面110a與出光面u〇b間之夾角Θ可 依實際需求做不同的設計。 鲁光傳導件110更具有光學面11 〇c,光學面ll〇c與出 光面110b相對。光傳導件110可進一步地具有多個光學微 結構112,這些光學微結構ip位於光學面11〇c上。這些 光學微結構112可包括多個V形槽或多個散射網點。這些 V形槽或散射網點可使光源120所發出的光線l均勻地由 出光面110b出射。在本實施例中,光傳導件HQ之材質可 為聚曱基丙烯酸曱酯(polymethyl methacrylate, PMMA)、聚碳 酉夂月曰(polycarbonate, PC)、乙烯對苯二甲酸醋(p〇iyethylene terephthalate,PET)或玻璃,但本發明並不以此為限。 201224542 〜i34 36142tw£doc/t 逸入適於提供光線l,而光線l由入光面n〇a 4 U〇,並從出光面UOb離開光傳導件110。 由人光面110a進入光傳導件110後,可 透過光學微結構112j5_|+5 Φ止z 风。傅反射至出先面110b出射。在本實施例 中,光源120包括非可見光源。舉例而言 ,光源120例如 為紅外線發光二極體(infrared ray light emitting di〇de,IR led) ’但本發明並不以此為限。 ▲遮,元件130覆蓋出光面11〇b的部分區域。舉例而 言’遮光元件130可包括多個陣列排列之遮光圖案132以 及夕個由這些遮光圖案丨32所定義出的出光開口 H,遮光 圖案>132與出光開口 H係沿著行方向以及列方向交替排 列二之排列於同一列之遮光圖案132及出光開口 H 係沿著列方向交替排列,而排列於同一行之遮光圖案132 及出光開口 Η係沿著行方向交替排列,換言之,遮光圖案 132與出光開口 Η以形成棋格狀之交替排列,例如為圖2 中所示。然,本發明不限於此,在其他實施例中,遮光元 件130亦可為具有多個開口的一片或多片遮光板,而前述 之開口例如是均勻地分布在遮光板中。 值得一提的是,光源120所發出之光線l並不會完全 被遮光元件130阻擋,意即,光線l仍可透過出光開口 η 自出光面ll〇b出射,進而供做感測之用。在本實施例中, 遮光元件130例如為反射層或光吸收層,遮光元件材 質之選用以能夠反射或吸收光線的材質為佳,例如金屬、 白色反射片(white sheet)或吸光樹脂等。 多個光感測器140配置於遮光元件130上。舉例而 201224542 AU1007134 36142twf.doc/t 言’各光感測器140可分別配置於各遮光圖案132上。換 言之,由遮光圖案132所定義出的出光開口 Η分佈於這些 光感測器140之間。值得一提的是,透過上述之配置方式 使得光感測器140可整合於光傳導件110上,進而使本實 施例之光學感測模組1〇〇可有效地薄型化。 光學元件150配置於出光面110b之上方,其中光感 測器140與遮光元件130位於光學元件15〇與光傳導件11〇 φ 之間。光學元件150具有觸碰表面100d,光線L從出光面 110b離開光傳導件ι10之後會穿過光學元件15〇,當物體 F觸碰到觸碰表面l〇〇d時,光線L會被物體反射而被光感 測器140所接收。 舉例而言,光學元件150可為微透鏡陣列基板 152(micro-lens array substrate),此微透鏡陣列基板具有觸 碰表面100d以及與觸碰表面i〇〇d相對之微透鏡表面S, 且微透鏡表面S係面向出光面ii〇b。這樣一來,當光線L 自出光面110b離開光傳導件11〇後,光線l可透過微透 _ 鏡陣列基板中的多個微透鏡有效地收斂至多個焦點P上, 這些焦點P位於觸碰^表面1 〇〇d上。如此~-來’當物體F 觸碰觸碰表面l〇〇d時’由物體F上某一觸碰點A反射出 之光束L’ ’其發散程度較小。換言之,由物體F上某一觸 碰點A反射出之光線L’可精準地投射到觸碰點A下方周 圍之光感測器140上’進而使得本實施例之光學感測模組 100可準確地感測出物體F的形狀、移動方向及位置。 在其他實施例中’光學元件15〇可包括微透鏡陣列基 板152以及蓋板154。蓋板丨54具有觸碰表面1〇〇d,微透 201224542 ^uiv/u/134 36142twf.doc/t 鏡陣列基板152配置於蓋板154與光傳導件no之間,微 透鏡陣列基板152具有微透鏡表面S,且微透鏡表面S係 面向蓋板154,例如為圖3中所示。值得一提的是,蓋板 152之觸碰表面100d的位置例如係位於微透鏡陣列基板 152的焦平面(focal plane)上。這樣一來,光線l在穿過微 透鏡陣列基板152之後’即可聚焦於觸碰表面上。如 此一來,當物體F觸碰觸碰表面i〇〇d時,由物體f上之 某一觸碰點A反射出光線L’便可更精準地投射到觸碰點a 下方周圍之光感測器140上,而進一步地提升光學感測模 組100的感測靈敏度以及精準度。 當然’光學元件150亦可包括準直透鏡156(c〇llimated lens),例如為圖4A及圖4B中所示。此準直透鏡 156(collimated lens)的功能與微透鏡陣列基板152類似。 需特別說明的是’當光學微結構H2與光感測器14〇未重 疊時(例如圖4B中所示)’準直透鏡156可將光學微結構 112反射出之光線L收集到觸碰表面1 〇〇d上,再將物體F 反射之光線L’傳遞至光感測器14〇上,而使得本實施例之 光學感測模組100順利地進行感測的動作。 本實施例之光學感測模組丨〇 〇可進一步地整合在顯示 面板200中。詳言之,本實施例之光傳導件11〇可以是顯 示面板200中的彩色濾光基板c,如圖5A中所示。當然, 在其他實施例中,亦可選擇顯示面板2〇〇中主動元件陣列 基板T做為光傳導件11〇,如圖中所示。值得一提的 是,若以主動元件陣列基板τ做為光傳導件11(),可進一 步地以部份彩色濾光基板C製作微透鏡陣列15 2並以其做 201224542 AU1007134 36142twf.doc/t 為光學元件150使用。如此一來,採用此光學感測模組j〇〇 的顯示面板200,其厚度其體積皆可獲得最佳化。 【第二實施例】 圖6為本發明第二實施例之光學感測模組3〇〇剖面示 意圖。本實施例之光學感測模組300與第一實施例之光學 感測模組100類似,以下僅就兩者不同之處做說明,相同 0 之處便不再重述。 請參照圖ό ’本實施例之光學感測模組3〇〇包括光傳 導件110、光源120、遮光元件130、多個光感測器14〇以 及光學元件150。光傳導件110具有入光面u〇a以及出光 面110b,入光面li〇a與出光面u〇b間係具有夾角0。光 源120適於提供光線l,而光線l由入光面ii〇a進入光傳 導件110,並從出光面110b離開光傳導件11〇。遮光元件 130配置於出光面ii〇b之部分區域上。多個光感測器14〇 配置於遮光元件130上。光學元件15〇配置於出光面n〇b • 之上方,其中光感測器14〇與遮光元件130位於光學元件 150與光傳導件11〇之間,光學元件具有觸碰表面1〇〇d, 光線L從出光面i10b離開光傳導件11〇之後會穿過光學 元件150’當物體F觸碰觸碰表面1〇〇(1時,光線[被反射 而被光感測器140所接收。 值得一提的是,在本實施例中,當光源12〇所發出之 光線L從出光面U〇b離開時,其發散角度α低於4〇度, 本實施例之光學元件15〇例如為蓋板154,而蓋板154具 有觸碰表面l〇〇d。詳言之,由於本實施例之光源12〇為指 201224542 *34 36142twf.doc/t 向性(directionality)光源,且本實施例之光學微結構112具 有特殊的角度設計’因此光線L可以較小的發散角α(較一 致的方向)離開出光面1 l〇b。這樣一來,即便在無設置微 透鏡陣列基板152的情況下,當物體F觸碰觸碰表面1〇〇d 時’由物體F上之某一觸碰點A反射出光線L,仍可精準地 投射在與其對應之光感測器140上,而使得本實施例之光 學感測模組300無需透過微透鏡陣列基板152仍可正確地 感測出物體F的形狀、移動方向及位置。舉例而言,當蓋 板154之厚度D為0.1釐米,手指紋路間隙κ小於〇1釐 米時,光線L從出光面ii〇b離開時其發散角度α可低於 4〇度,以使本實施例之光學感測模組3〇()感測效果佳。然, 本發明不限於此,上述之發散角度α亦可視蓋板154厚度 D及手指紋路間隙κ的大小作適當地設計。 本實施例之光學微結構112更具有特殊的設計,本實 知例之光學微結構112例如為ν形槽,此ν形槽具有第一 表面S1與第二表面S2,第一表面S1與第二表面s2連接 而構成v形槽,其中,第一表面S1與光學面u〇c夾有角 度6»卜第一表面S2與光學面u〇c夾有角度们。當光線 ^僅於入光面ll〇a進入光傳導件11〇時角度el較佳的 疋介於1〇〜1〇〇之間’而角度較^2佳的是介於3〇0〜45〇 ,間。另外’光線L分別由入光面n〇a及與入光面u〇a =對之另-入光面U〇a,進入光傳導件11〇時角度川交 佳的是小於35°,而角度Θ2較佳的是小於50〇。 s 12 201224542 AU1007134 36142twf.d〇c/t 感測模組可有效地薄型化。此外,本發 雖然本發明已以實施例揭露如上,然其並非用以限定 本發明,任何所屬技術領域中具有通常知識者,在不脫離 本發明之精神和範圍内,當可作些許之更動與潤飾,故本 發明之保護範圍當視後附之申請專利範圍所界定者為準。201224542 /\υ ιυυ /134 36142twf.doc/t VI. Description of the Invention: [Technical Field] The present invention relates to an optical sensing module, and more particularly to a thinned optical sensing module . [Prior Art] With the rapid development and application of information technology, wireless mobile communication and information appliances, in order to achieve more user-friendly operation, many information products, such as smart phones, notebooks, and optical finger navigation Optical finger navigation (OFN). In the conventional optical finger navigation module, most of the infrared light-emitting diodes are used as the light source, and the infrared light emitted by the infrared light-emitting diode is projected onto the user's finger via the cymbal, and the image of the finger is transmitted through An image sensor (such as a complementary gold-oxygen semiconductor image sensor) is operated. Then, after the image of the finger is dug by the image sensor, the image processing method can be used to analyze the difference of the multi-image image taken at different time points, thereby judging the direction and distance of the finger movement. However, in the conventional optical finger navigation module, the image sensor (for example, a complementary MOS image sensor) is mostly an opaque wafer, and usually a lens is used to capture a good finger image. The image sensor and the lens are not placed so that the conventional optical finger navigation module has a certain thickness and volume, and is not easy to be thinned. For example, the optical finger navigation mode disclosed in U.S. Patent No. 7,45,775, U.S. Patent No. 7, 716, 682, U.S. Patent No. 6,433,780, U.S. Patent No. 5,686, 720, U.S. Patent No. 7,407,718, and U.S. Patent Publication No. 20100071967 The group has the disadvantages of 201224542 AU1007134 36142twf.doc/t not easy to thin. SUMMARY OF THE INVENTION The present invention provides a thinned optical sensing module. The invention provides an optical sensing module comprising a light conducting member, a light source, a shading element, a plurality of photo sensors, and an optical element. The light-conducting member has a light-incident surface and a light-emitting surface, and has a lost angle between the light-incident surface and the light-emitting surface. The light source is suitable for supplying light, and the light enters the light guiding member from the light incident surface and exits the light conducting member from the light emitting surface. The shading element is disposed on a portion of the light exiting surface. A plurality of photo sensors are disposed on the shading element. The optical component is disposed above the light-emitting surface, wherein the light sensor and the light-shielding component are located between the optical component and the light-conducting component. The optical component has a touch surface, and the light passes through the optical component after leaving the light-transmitting component from the light-emitting surface. When an object touches the surface, the light is reflected and received by the light sensor. In an embodiment of the invention, the aforementioned light-conducting member further has an optical surface, and the optical surface is opposite to the light-emitting surface. • In an embodiment of the invention, the aforementioned light-conducting member has a plurality of optical microstructures on the optical surface. In an embodiment of the invention, the plurality of optical microstructures comprises a plurality of V-shaped grooves or a plurality of scattering dots. In an embodiment of the invention, the aforementioned light source comprises a source of non-visible light. In an embodiment of the invention, the aforementioned shading element comprises a reflective layer or a light absorbing layer. In an embodiment of the invention, the light-shielding element comprises a plurality of arrays of 201224542, 34 36142 twf.doc/t arrays of light-shielding patterns and a plurality of light-emitting openings defined by the light-shielding patterns. The row direction and column direction alternate ^ column. In an embodiment of the invention, the light-shielding patterns and the light-emitting openings arranged in the same row are alternately arranged along the column direction, and the light-shielding patterns and the light-emitting openings arranged in the same row are alternately arranged in the row direction. In an embodiment of the invention, the aforementioned light exit openings are distributed between the optical reducers. In an embodiment of the invention, the optical element is a micro-lens array substrate, and the microlens array substrate has a touch surface and a microlens surface opposite to the touch surface, and The lens surface faces the light exit surface. In an embodiment of the invention, the optical element comprises a cover plate and a microlens array substrate. The cover has a touch surface. The microlens array substrate is disposed between the cover plate and the light conducting member. The microlens array substrate has a microlens surface' and the microlens surface faces the cover. In an embodiment of the invention, when the aforementioned light exits the light exiting surface, the divergence angle is less than 40 degrees, the optical element includes a cover plate, and the cover plate has a touch surface. In an embodiment of the invention, the optical element previously described comprises a collimated lens. In an embodiment of the invention, the optical conducting member is a color filter substrate or an active device array substrate. Based on the above, in the optical sensing module of the present invention, the optical 201224542 AU1007134 36142twf.doc/t sensing module of the present invention can be configured by disposing the photo sensor on a part of the light emitting surface of the light conducting member. Effectively thinned. The above features and advantages of the present invention will be more apparent from the following description of the appended claims. [Embodiment] [First Embodiment] A schematic sectional view of an optical sensing module according to a first embodiment of the present invention. Referring to m, the optical sensing module of the present embodiment and (8) the conductive member no, the light source 120, the shading member 130, the plurality of photo sensors 14A, and the optical element iso. The light-conducting member 110 has a light-incident surface and a light-emitting surface 110b, and has an angle of 0 between the light-incident surface 110a and the light-emitting surface 11b. In detail, the incident surface 11 can be connected to the light-emitting surface 11b, and the incident surface li〇a and the light-emitting surface 110b have an angle of 0, and the angle θ is, for example, 9〇〇. However, the present invention is not limited thereto, and the angle 入 between the light incident surface 110a and the light exit surface u〇b can be differently designed according to actual needs. The Lu light conducting member 110 further has an optical surface 11 〇c, and the optical surface 11〇c is opposite to the light emitting surface 110b. The light conducting member 110 can further have a plurality of optical microstructures 112 that are located on the optical surface 11〇c. These optical microstructures 112 can include a plurality of V-shaped grooves or a plurality of scattering dots. These V-shaped grooves or scattering dots allow the light l emitted from the light source 120 to be uniformly emitted from the light-emitting surface 110b. In this embodiment, the material of the light-conducting member HQ may be polymethyl methacrylate (PMMA), polycarbonate (PC), or ethylene terephthalate (p〇iyethylene terephthalate). , PET) or glass, but the invention is not limited thereto. 201224542 ~ i34 36142tw£doc/t The escape is suitable for providing light l, and the light l is emitted from the light incident surface n〇a 4 U〇 and exits the light guide 110 from the light exit surface UOb. After the human light surface 110a enters the light-conducting member 110, the wind can be transmitted through the optical microstructure 112j5_|+5 Φ. The Fu reflection is emitted to the first surface 110b. In this embodiment, light source 120 includes a source of non-visible light. For example, the light source 120 is, for example, an infrared ray light emitting diode (IR led), but the invention is not limited thereto. ▲, the component 130 covers a partial area of the light surface 11〇b. For example, the light-shielding element 130 may include a plurality of arrays of light-shielding patterns 132 and light-emitting openings H defined by the light-shielding patterns 丨32, and the light-shielding patterns <132 and the light-emitting openings H are along the row direction and the columns. The light-shielding pattern 132 and the light-emitting opening H arranged in the same row are alternately arranged along the column direction, and the light-shielding pattern 132 and the light-emitting opening 排列 arranged in the same row are alternately arranged along the row direction, in other words, the light-shielding pattern 132 and the light-emitting opening Η are alternately arranged to form a checkerboard shape, for example, as shown in FIG. 2. However, the present invention is not limited thereto. In other embodiments, the light shielding member 130 may also be one or more light shielding plates having a plurality of openings, and the aforementioned openings are, for example, uniformly distributed in the light shielding plate. It is worth mentioning that the light l emitted by the light source 120 is not completely blocked by the light shielding member 130, that is, the light 1 can still be emitted from the light exiting surface 11b through the light exit opening η, and is used for sensing. In the present embodiment, the light shielding member 130 is, for example, a reflective layer or a light absorbing layer, and the material of the light shielding member is preferably a material capable of reflecting or absorbing light, such as a metal, a white sheet or a light absorbing resin. The plurality of photo sensors 140 are disposed on the shading element 130. For example, 201224542 AU1007134 36142twf.doc/t', each of the photo sensors 140 can be disposed on each of the shading patterns 132. In other words, the light exit opening 定义 defined by the light shielding pattern 132 is distributed between the light sensors 140. It is worth mentioning that the optical sensor 140 can be integrated on the light-conducting member 110 through the above-mentioned arrangement, so that the optical sensing module 1 of the embodiment can be effectively thinned. The optical element 150 is disposed above the light-emitting surface 110b, wherein the light sensor 140 and the light-shielding element 130 are located between the optical element 15A and the light-conducting member 11?. The optical element 150 has a touch surface 100d. The light L passes through the optical element 15〇 after leaving the light-transmitting surface 110b from the light-emitting surface 110b. When the object F touches the touch surface l〇〇d, the light L is reflected by the object. It is received by the photo sensor 140. For example, the optical element 150 may be a micro-lens array substrate 152 having a touch surface 100d and a microlens surface S opposite to the touch surface i〇〇d, and micro The lens surface S faces the light exit surface ii 〇 b. In this way, after the light L exits the light guiding member 11 from the light emitting surface 110b, the light 1 can effectively converge to the plurality of focal points P through the plurality of microlenses in the micro mirror array substrate, and the focus P is located in the touch. ^ Surface 1 〇〇d. Thus, when the object F touches the touch surface l〇〇d, the light beam L'' reflected by a certain touch point A on the object F has a small degree of divergence. In other words, the light L' reflected by a certain touch point A on the object F can be accurately projected onto the light sensor 140 around the touch point A', thereby making the optical sensing module 100 of the embodiment The shape, moving direction and position of the object F are accurately sensed. In other embodiments, the optical element 15 can include a microlens array substrate 152 and a cover 154. The cover plate 54 has a touch surface 1〇〇d, and the micro-lens array substrate 152 is disposed between the cover plate 154 and the light-conducting member no. The micro-lens array substrate 152 has a micro-lens array substrate 152 having a touch surface 1〇〇d, a micro-transparent 201224542 ^uiv/u/134 36142 twf. The microlens surface S, and the microlens surface S is facing the cover 154, for example as shown in FIG. It is to be noted that the position of the touch surface 100d of the cover 152 is, for example, on the focal plane of the microlens array substrate 152. In this way, the light 1 can be focused on the touch surface after passing through the microlens array substrate 152. In this way, when the object F touches the touch surface i〇〇d, the light L' reflected from a certain touch point A on the object f can be more accurately projected to the light around the touch point a. On the detector 140, the sensing sensitivity and accuracy of the optical sensing module 100 are further improved. Of course, the optical element 150 can also include a collimating lens 156, such as shown in Figures 4A and 4B. The function of the collimated lens 156 is similar to that of the microlens array substrate 152. It should be specially noted that 'when the optical microstructure H2 and the photo sensor 14 are not overlapped (for example, as shown in FIG. 4B), the collimating lens 156 can collect the light L reflected from the optical microstructure 112 onto the touch surface. The optical sensing module 100 of the present embodiment smoothly performs the sensing operation. The optical sensing module 本 of the present embodiment can be further integrated in the display panel 200. In detail, the light-transmitting member 11A of the present embodiment may be the color filter substrate c in the display panel 200 as shown in Fig. 5A. Of course, in other embodiments, the active device array substrate T in the display panel 2 can also be selected as the light conducting member 11A as shown in the drawing. It is worth mentioning that if the active device array substrate τ is used as the light conducting member 11 (), the microlens array 15 2 can be further fabricated with the partial color filter substrate C and used as 201224542 AU1007134 36142twf.doc/t Used for optical component 150. In this way, the display panel 200 using the optical sensing module j can be optimized in thickness and volume. [Second Embodiment] Fig. 6 is a cross-sectional view showing an optical sensing module 3 according to a second embodiment of the present invention. The optical sensing module 300 of the present embodiment is similar to the optical sensing module 100 of the first embodiment. The following only describes the differences between the two, and the same 0 will not be repeated. Referring to the figure, the optical sensing module 3 of the present embodiment includes a light guiding member 110, a light source 120, a light blocking member 130, a plurality of photo sensors 14A, and an optical member 150. The light-conducting member 110 has a light-incident surface u〇a and a light-emitting surface 110b, and has an angle of 0 between the light-incident surface li〇a and the light-emitting surface u〇b. The light source 120 is adapted to provide light 1, and the light 1 enters the light guiding member 110 from the light incident surface ii〇a and exits the light conducting member 11A from the light emitting surface 110b. The light shielding member 130 is disposed on a partial region of the light exit surface ii 〇 b. A plurality of photo sensors 14A are disposed on the shading element 130. The optical element 15A is disposed above the light-emitting surface n〇b•, wherein the light sensor 14〇 and the light-shielding element 130 are located between the optical element 150 and the light-conducting element 11〇, and the optical element has a touch surface 1〇〇d, The light L passes through the optical element 150' after exiting the light-transmitting surface 11 from the light-emitting surface i10b. When the object F touches the touch surface 1 (1, the light [is reflected and received by the light sensor 140. It is noted that, in this embodiment, when the light L emitted from the light source 12 is separated from the light exit surface U〇b, the divergence angle α is lower than 4 degrees, and the optical element 15 of the embodiment is, for example, a cover. The plate 154, and the cover plate 154 has a touch surface 103d. In detail, since the light source 12A of the present embodiment refers to the 201224542 *34 36142twf.doc/directionality light source, and the embodiment The optical microstructure 112 has a special angular design 'so that the light L can exit the light exit surface 1 l〇b with a small divergence angle α (a relatively uniform direction), thus even without the microlens array substrate 152 being disposed. When the object F touches the touch surface 1〇〇d, 'by the object F The touch point A reflects the light L, and can still be accurately projected on the corresponding light sensor 140, so that the optical sensing module 300 of the embodiment can be correctly sensed without passing through the microlens array substrate 152. The shape, moving direction and position of the object F. For example, when the thickness D of the cover plate 154 is 0.1 cm and the hand fingerprint path gap κ is smaller than 〇1 cm, the light beam L is divergent angle α when it exits from the light exit surface ii〇b. The optical sensing module 3 can be used for better sensing. However, the present invention is not limited thereto, and the divergence angle α can also be seen by the thickness D of the cover 154 and the fingerprint path of the hand. The size of the gap κ is appropriately designed. The optical microstructure 112 of the present embodiment has a special design. The optical microstructure 112 of the present embodiment is, for example, a ν-shaped groove having a first surface S1 and a second surface. The surface S2, the first surface S1 is connected to the second surface s2 to form a v-shaped groove, wherein the first surface S1 and the optical surface u〇c have an angle of 6»b, the first surface S2 and the optical surface u〇c are angled When the light ^ only enters the light-emitting surface 11〇 into the light-emitting surface 11〇 El is better between 1〇~1〇〇' and the angle is better than ^2~45〇, and the 'light L' is from the entrance surface n〇a and The smooth surface u〇a = the other light-input surface U〇a, the angle of the light-conducting member 11〇 is preferably less than 35°, and the angle Θ2 is preferably less than 50〇. s 12 201224542 AU1007134 36142twf The .d〇c/t sensing module can be effectively thinned. In addition, although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art, The scope of the present invention is defined by the scope of the appended claims.

【圖式簡單說明】 圖1為本發明第一實施例之光學感測模組剖面示意 圖。 圖2為本發明第一實施例之遮光元件上視示意圖。 圖3、圖4A、圖4B、圖5A、圖5B為本發明一實施 例之光學感測模組剖面示意圖。 圖6為本發明第二實施例之光學感測模組剖面示意BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an optical sensing module according to a first embodiment of the present invention. 2 is a top plan view of a shading element according to a first embodiment of the present invention. 3, 4A, 4B, 5A, and 5B are schematic cross-sectional views of an optical sensing module according to an embodiment of the present invention. 6 is a cross-sectional view of an optical sensing module according to a second embodiment of the present invention;

【主要元件符號說明】 1〇〇、300 :光學感測模組 100d .觸碰表面 110 :光傳導件 ll〇a、ll〇a,:入光面 110b .出光面 110c .光學面 112 :光學微結構 13 36142twf.doc/t 201224542 1 \J\J / 1 34 120 :光源 130 :遮光元件 132 :遮光圖案 Η :出光開口 140 :光感測器 150 :光學元件 152 :微透鏡陣列基板 154 :蓋板 200 :顯示面板 C:彩色濾光基板 Τ :主動元件陣列基板 S :微透鏡表面 0、01、02、α:夾角 L、L,:光線 F :物體 Ρ :焦點 A :觸碰點 D:蓋板厚度 K:手指紋路間隙 14[Main component symbol description] 1〇〇, 300: optical sensing module 100d. Touch surface 110: light-conducting member 11A, ll〇a, light-incident surface 110b, light-emitting surface 110c, optical surface 112: optical Microstructure 13 36142twf.doc/t 201224542 1 \J\J / 1 34 120 : Light source 130 : shading element 132 : shading pattern Η : light exit opening 140 : photo sensor 150 : optical element 152 : microlens array substrate 154 : Cover plate 200: Display panel C: Color filter substrate Τ: Active device array substrate S: Microlens surface 0, 01, 02, α: Angle L, L, Light ray F: Object Ρ: Focus A: Touch point D : Cover thickness K: Hand fingerprint path clearance 14

Claims (1)

201224542 AU1007134 36142twf.doc/t 七、申請專利範圍·· 1.一種光學感測模組,包括 光傳導件,具有一入光面以及一出光面 ,該入光面 進入 與該出光面間係具有一夾角; 一光源,適於提供一光線,而該光線由該入光面 該光傳導件,並從該出光面離開該光傳導件’ 一遮光元件’配置於該出光面之部分區威上’ 多個光感測器,配置於該遮光元件上;以及> 此光咸 一光學元件,配置於該出光面之上方,其中瀘I續光 測器與該遮光元件位於該光學元件與光傳導件之間i導 學元件具有一觸碰表面,該光線從該出光面離開該光時, 件之後會穿過該光學元件,當一物體觸碰該觸漆表面a’ 該些光線被反射而被該些光感測器所接收。 其中 2. 如申請專利範圍第1項所述之光學感測模組’、 該光傳導件更具有一光學面,與該出光面相對],其中 3. 如申請專利範圍第2項所述之光學感測模組… φ 該光傳導件具有多個光學微結構,位於該光學面f,其中 4·如申請專利範圍第3項所述之光學感測模組" 該些光學微結構包括多個V形槽或多個散射網點:,其中 5.如申請專利範圍第1項所述之光學感别模組 該光源包括一非可見光源。 * ,其中 6·如申請專利範圍第1項所述之光學感别模$ 7·如申請專利範圍第1項所述之光學感測模維 5亥遮,元件包括反射層或光吸收層。 μ加,其中 個由該些 U 孑匕阳片7 JL >只 /7] Jit < ---- 該遮光元件包括多個陣列排列之遮光圖案以及多 15 36142twf.doc/t 201224542 i\j\j I X 遮光圖案所定義出的出光開口,該些遮光圖案與該些出光 開口係沿者行方向以及列方向交替排列。 8. 如申請專利範圍第7項所述之光學感測模組,其中 排列於同一列之該些遮光圖案及該些出光開口係沿著列方 向交替排列’而排列於同一行之該些遮光圖案及該些出光 開口係沿者行方向交替排列。 9. 如申請專利範圍第7項所述之光學感測模組,其中 該出光開口分佈於該些光感測器之間。 10. 如申請專利範圍第1項所述之光學感測模組,其中 該光學元件為一微透鏡陣列基板(micro-lens array substrate),該微透鏡陣列基板具有該觸碰表面以及一與該 觸碰表面相對之微透鏡表面,且該微透鏡表面係面向該出 光面。 11·如申請專利範圍第1項所述之光學感測模組,其中 該光學元件包括: 一蓋板’具有該觸碰表面;以及 一微透鏡陣列基板,配置於該蓋板與該光傳導件之 間,該微透鏡陣列基板具有一微透鏡表面,且該微透鏡表 面係面向該蓋板。 12. 如申請專利範圍第1項所述之光學感測模組,其中 當該光線從該出光面離開時其發散角度低於4〇度,該光學 元件包括一蓋板,而該蓋板具有該觸碰表面。 13. 如申請專利範圍第1項所述之光學感測模組,其中 該光學元件包括一準直透鏡(c〇llimated lens) 〇 14. 如申凊專利範圍第1項所述之光學感測模組,其中 201224542 AU1007134 36142twf.doc/t 該光傳導件為一彩色濾光基板或一主動元件陣列基板。201224542 AU1007134 36142twf.doc/t VII. Patent Application Range·· 1. An optical sensing module comprising a light-conducting member having a light-incident surface and a light-emitting surface, the light-incident surface entering and the light-emitting surface having a light source adapted to provide a light beam from the light incident surface of the light guide member, and from the light exit surface, the light guide member is disposed on a portion of the light exit surface a plurality of photo sensors disposed on the shading element; and a light-sensitive optical element disposed above the light-emitting surface, wherein the photo-detector and the shading element are located in the optical element and the light The guiding element between the conducting members has a touch surface, and when the light leaves the light from the light exiting surface, the piece passes through the optical element, and when an object touches the touched surface a', the light is reflected And received by the light sensors. 2. The optical sensing module of claim 1, wherein the optical conducting member further has an optical surface opposite to the light emitting surface, wherein 3. as described in claim 2 The optical sensing module has a plurality of optical microstructures on the optical surface f, wherein the optical sensing module according to claim 3 is included in the optical microstructure. A plurality of V-shaped grooves or a plurality of scattering mesh points, wherein: 5. The optical sensing module of claim 1, wherein the light source comprises a non-visible light source. *, wherein the optical sensing mode described in claim 1 is the optical sensing mode described in claim 1, the element comprising a reflective layer or a light absorbing layer. μ plus, one of these U-yang tablets 7 JL > only /7] Jit < ---- The shading element comprises a plurality of arrays arranged of shading patterns and more than 15 36142twf.doc/t 201224542 i\ The light-emitting openings defined by the j/j IX light-shielding patterns are alternately arranged along the row direction and the column direction of the light-emitting openings. 8. The optical sensing module of claim 7, wherein the light shielding patterns arranged in the same column and the light emitting openings are alternately arranged along the column direction and are arranged in the same row. The pattern and the light-emitting openings are alternately arranged along the row direction. 9. The optical sensing module of claim 7, wherein the light exiting opening is distributed between the light sensors. 10. The optical sensing module of claim 1, wherein the optical component is a micro-lens array substrate, the microlens array substrate has the touch surface and a The touch surface is opposite to the surface of the microlens, and the surface of the microlens faces the light exit surface. The optical sensing module of claim 1, wherein the optical component comprises: a cover plate having the touch surface; and a microlens array substrate disposed on the cover plate and the light transmission Between the pieces, the microlens array substrate has a microlens surface, and the microlens surface faces the cover. 12. The optical sensing module of claim 1, wherein the light element has a divergence angle of less than 4 degrees when the light exits the light exiting surface, the optical component includes a cover plate, and the cover plate has The touch surface. 13. The optical sensing module of claim 1, wherein the optical component comprises a collimating lens 〇14. Optical sensing as described in claim 1 Module, wherein 201224542 AU1007134 36142twf.doc/t The light conducting member is a color filter substrate or an active device array substrate. 1717
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