CN117878164A - Light sensing chip, light sensing module and laser radar - Google Patents

Abstract

The application belongs to the technical field of sensor packaging, and provides a light sensing chip which comprises a base, a chip component and a cover body, wherein the base is provided with an input port for receiving light, and the input port is communicated with the inside of the base; the chip assembly is arranged in the base and comprises a plurality of photosensitive pieces; the cover body covers the input port, the cover body comprises a base plate and a first noise reduction piece which covers the base plate and is used for blocking light from penetrating, a plurality of through holes are formed in the first noise reduction piece, the positions of the through holes are in one-to-one correspondence with the positions of the photosensitive pieces, and the photosensitive pieces are used for receiving light passing through the through holes respectively. The application also provides a light sensing module comprising the light sensing chip and a laser radar with the light sensing module. The present application is to solve the problem of excessive noise of received light existing in the related art.

Description

Light sensing chip, light sensing module and laser radar

Technical Field

The application belongs to the technical field of sensor packaging, and particularly relates to a light sensing chip, a light sensing module and a laser radar.

Background

With the continuous development of intelligent driving technology, the detection requirement on distance sensing is higher and higher. As an advanced ranging technology, the laser radar has great advantages in the aspects of advanced driving assistance systems (Advanced Driving Assistance System, ADAS), 3D mapping (three dimensional Mapping,3 DM) and the like. Correspondingly, the packaging requirements on the light sensing chip in the laser radar are higher and higher, so that the reliability of the vehicle-mounted high requirements is required to be met, and the problem of eliminating interference among all light transmission paths when light is received is solved.

Disclosure of Invention

An object of the embodiment of the application is to provide a light sensing chip, a light sensing module and a laser radar, so as to solve the problem that the noise of the received light is too much in the existing light sensing chip.

In order to achieve the above purpose, the technical scheme adopted in the embodiment of the application is as follows:

in a first aspect, a light sensing chip is provided, including a base, a chip assembly, and a cover; the chip comprises a base, a chip assembly and a cover body, wherein the base is provided with an input port for receiving light, and the input port is communicated with the inside of the base; the chip assembly is arranged in the base and comprises a plurality of photosensitive pieces; the cover body covers the input port, the cover body comprises a base plate and a first noise reduction piece which covers the base plate and is used for blocking light from penetrating, a plurality of through holes are formed in the first noise reduction piece, the positions of the through holes are in one-to-one correspondence with the positions of the photosensitive pieces, and the photosensitive pieces are used for receiving light passing through the through holes respectively.

In one embodiment provided in the present application, the substrate includes a transparent cover and a second noise reduction member for filtering input light, and the second noise reduction member is disposed at one side of the transparent cover.

In one embodiment provided in the present application, the substrate includes a transparent cover and a second noise reduction member for filtering input light, and the second noise reduction member is disposed on two sides of the transparent cover.

In one embodiment provided herein, the first noise reduction member includes a first mask layer disposed on a side of the substrate facing away from the base; and/or, the first noise reduction piece further comprises a second shielding layer, and the second shielding layer is arranged on one side of the substrate, which faces the base.

In one embodiment provided in the application, a first mask layer and a second mask layer are respectively arranged on two sides of the substrate along the direction of receiving the light; the first shade layer is provided with a plurality of first through holes, the second shade layer is provided with a plurality of second through holes, and the positions of the first through holes and the positions of the second through holes are in one-to-one correspondence.

In one embodiment provided in the present application, the first through hole and the second through hole are coaxially disposed; and/or the ratio of the open area of the first through hole to the open area of the second through hole is 1-2.

In one embodiment provided in the application, the base comprises a bearing part for placing the chip assembly and a supporting part arranged around the periphery of the bearing part, wherein one end of the supporting part, which is away from the bearing part, forms the input port, and the input port is fixedly connected with the cover body through fixing glue.

In one embodiment provided herein, the support includes a first peripheral edge and a second peripheral edge; the first surrounding edge comprises a top surface and a bottom surface which are oppositely arranged, the bottom surface surrounds the periphery of the bearing part, the top surface is surrounded by the second surrounding edge to form a step groove, and the cover body is arranged in the step groove, so that an isolation space for accommodating the chip assembly is formed between the cover body and the bearing part.

In one embodiment provided in the present application, the cover body is fixedly connected with the top surface of the first surrounding edge through a fixing adhesive; the second surrounding edge is connected with the side edge of the cover body through sealant, and the sealant is arranged at the joint of the cover body and the second surrounding edge, which is far away from the isolation space, and is filled in a gap between the cover body and the second surrounding edge.

In one embodiment provided in the application, the bottom of the step groove is provided with a first concave-convex structure; one side of the cover body facing the base is provided with a second concave-convex structure matched with the first concave-convex structure.

In one embodiment provided herein, the first and second relief structures are each comprised of a plurality of serrated bar posts; alternatively, the first concave-convex structure and the second concave-convex structure are each formed by a plurality of rectangular columns arranged at intervals.

In one embodiment provided in the present application, the bearing portion and the supporting portion are two connected components, the bearing portion is made of a ceramic material, and the supporting portion is made of a metal material.

In one embodiment provided in the present application, the bearing portion and the supporting portion are integrally formed, and are made of ceramic materials.

In one embodiment provided herein, the photosensitive member employs a silicon photomultiplier formed from a plurality of avalanche diode arrays.

In a second aspect, the present application further provides a light sensing module, including the light sensing chip of the first aspect.

In a third aspect, the present application further provides a lidar, which includes a light-emitting module and the light-sensing module according to the second aspects.

Compared with the prior art, the embodiment of the application has the beneficial effects that: the first noise reduction layers which are staggered with the photosensitive pieces are arranged on the cover body, so that light passing through the cover body can be successfully received by the different photosensitive pieces along different paths, and meanwhile, the paths cannot interfere with each other.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required for the description of the embodiments or exemplary techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

Fig. 1 is a schematic diagram of the overall structure of a light sensing chip according to an embodiment of the present application;

FIG. 2 is a schematic view of the overall structure of a base in an embodiment provided in the present application;

FIG. 3 is a schematic diagram of the overall structure of a chip assembly according to an embodiment of the present disclosure;

FIG. 4 is a schematic view of an angle of a cover according to an embodiment of the present disclosure;

FIG. 5 is an exploded view of another angle of the cover in one embodiment provided herein;

FIG. 6 is an exploded view of the overall structure of a cover according to one embodiment of the present disclosure;

FIG. 7 is an exploded view of the overall structure of a cover according to one embodiment of the present disclosure;

FIG. 8 is an exploded view of the overall structure of a cover in one embodiment provided by the present application;

FIG. 9 is an exploded view of the overall structure of a cover according to one embodiment of the present disclosure;

FIG. 10 is an exploded view of the overall structure of a cover according to one embodiment provided herein;

FIG. 11 is an exploded view of the overall structure of a cover according to one embodiment of the present disclosure;

FIG. 12 is an exploded view of the overall structure of a cover according to one embodiment provided herein;

FIG. 13 is an exploded view of the overall structure of a cover according to one embodiment of the present disclosure;

FIG. 14 is an exploded view of the overall structure of a cover according to one embodiment provided herein;

FIG. 15 is a cross-sectional view of the overall structure of a photo-sensing chip according to an embodiment of the present application;

FIG. 16 is a graph of simulated performance of comparative example 1 provided in the examples of the present application;

FIG. 17 is a graph of simulated performance of example 1 provided in an embodiment of the present application;

FIG. 18 is a cross-sectional view of the overall structure of a photo-sensing chip according to another embodiment of the present application;

FIG. 19 is an exploded view of FIG. 18;

FIG. 20 is a cross-sectional exploded view of the overall structure of a photo-sensing chip in one embodiment provided herein;

FIG. 21 is a cross-sectional exploded view of the overall structure of a photo-sensing chip in one embodiment provided herein;

FIG. 22 is a graph of simulated performance of comparative example 2 provided in the examples of the present application;

fig. 23 is a simulation performance diagram of example 2 provided in the embodiment of the present application.

Wherein, each reference numeral in the figure mainly marks:

100-base; 110-an input port; 120-a carrier; 130-a support; 131-a first peripheral edge; 131 a-top surface; 131 b-bottom surface; 132-a second peripheral edge; 133-step groove; 133 a-groove bottom; 134-first relief structure; 134 a-first toothed column; 134 b-first posts;

200-chip assembly; 210-a photosensitive member; 211-a first silicon photomultiplier; 212-a second silicon photomultiplier; 213-a third silicon photomultiplier; 220-a circuit board;

300-cover: 310-substrate; 311-transparent cover; 311 a-an inner surface; 311 b-outer surface; 312-a second noise reducer; 320-a first noise reducer; 321-through holes; 321 a-a third through hole; 321 b-fourth through holes; 321 c-a first through hole; 321 d-a second through hole; 322-a first masking layer; 323-a second masking layer; 330-side edges; 340-a second relief structure; 341-a second toothed column; 342-second posts;

410-fixing glue; 420-sealant.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first," "second," "third," "fourth" and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", "a third" and a fourth "may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise. The meaning of "a number" is one or more than one unless specifically defined otherwise.

In the description of the present application, it should be understood that the terms "center," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships that are based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrase "in one embodiment" or "in some embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Along with the continuous development of intelligent driving technology, the detection requirement on distance sensing is higher and higher, and correspondingly, the packaging requirement on a photodiode in a laser radar is higher and higher, so that the reliability of the vehicle standard high requirement is met, and the problem of eliminating interference among all optical transmission paths when light is received is solved. For example, if the problems of ambient light and noise light are eliminated when the sensor receives light; or, when the sensor receives the light, how to eliminate the problem that the light paths of the sensors do not interfere with each other when receiving the light. In view of this, the present application is presented.

Referring to fig. 1 to 5, the present application provides a photo-sensing chip, which includes a base 100, a chip assembly 200 and a cover 300. The base 100 is provided with an input port 110 for receiving light, and the input port 110 communicates with the inside of the base 100; the chip assembly 200 is disposed in the base 100, and the chip assembly 200 includes a plurality of photosensitive members 210; the cover 300 is covered on the input port 110, the cover 300 includes a substrate 310 and a first noise reduction member 320 covering the substrate 310 and used for blocking light from passing through, the first noise reduction member 320 is provided with a plurality of through holes 321, and positions of the through holes 321 are in one-to-one correspondence with positions of the photosensitive members 210, so that the photosensitive members 210 can respectively receive light passing through the through holes 321.

Referring to fig. 1 and 2, a submount 100 refers to a member for placing a chip to be packaged. Specifically, the base 100 is a semi-enclosed structure with an input port 110 and is hollow inside, and a conductive hole is formed at the bottom of the base 100 (the bottom is the bottom corresponding to the position shown in the drawing), and the conductive hole is a via hole filled with metal, so that a wire for a contact on the chip assembly 200 can pass through the conductive hole to transmit current to a metal pin on the opposite surface of the bottom of the base 100. The base 100 is one of the cases for packaging chips, and has effects not only on mounting, fixing, sealing, protecting chips, etc., but also on connecting the contacts on the chip assembly 200 to the pins of the package case through the base 100 by wires, which are connected to other devices through wires on the printed circuit board, so as to realize connection of the internal chips to external circuits.

Referring to fig. 3, the chip assembly 200 is a photodetector disposed inside the base 100, and is configured to receive light transmitted through the input port 110. The chip assembly 200 includes a plurality of photosensitive members 210 and a circuit board 220, and the circuit board 220 is electrically connected to the plurality of photosensitive members 210. Each photosensitive element 210 is a silicon photomultiplier (Silicon photo Multiplier, siPM) formed by a plurality of single photon avalanche diode (Single Photon Avalanche Diode, SPAD) unit arrays, each unit is formed by connecting a single photon avalanche diode and a large-resistance quenching resistor in series, the micro elements are connected in parallel to form a plane array, and the output current of the single photon avalanche diode is proportional to the number of single photon avalanche diode units generating avalanche, so that the output current is proportional to the number of incident photons in a certain range.

Referring to fig. 4 and 5, the cover 300 is a workpiece for covering the input port 110 of the base 100 to form a sealed whole with the base 100, so that, on one hand, the chip assembly 200 is isolated from the outside, and the corrosion of impurities in the air to the chip assembly 200 is prevented, thereby reducing the electrical performance, and on the other hand, the packaged chip assembly 200 is more convenient to install and transport. In order to ensure that light can enter the light sensing chip normally and externally (i.e. in the accommodating space formed by the base 100 and the cover 300), the light sensing element 210 in the light sensing chip receives the light.

In the present embodiment, since the chip assembly 200 includes a plurality of photosensitive members 210, a path of light sensed by each photosensitive member 210 through the cover 300 is defined as an optical path channel. For example, the chip assembly 200 includes 6 photosensitive members 210 arranged in a staggered manner, when light is received by each photosensitive member 210 through the cover 300, the induced light paths of the 6 photosensitive members 210 interfere with each other, where the interference of the light paths is: the light of the optical path channel of the first silicon photomultiplier 211 reaches the optical path channel of the second silicon photomultiplier 212 adjacent thereto before being completely absorbed by the first silicon photomultiplier 211 and is absorbed by the second silicon photomultiplier 212 when transmitted. The more serious the phenomenon of mutual interference between the optical path channels, the lower the detection accuracy of the final sensor. In view of this, the following embodiments are presented in this example:

Referring to fig. 5, the cover 300 includes a substrate 310 and a first noise reduction member 320, wherein the first noise reduction member 320 is disposed on the substrate 310, and the first noise reduction member 320 may be disposed on one side of the substrate 310 or may be disposed on two sides of the substrate 310, which is not limited herein.

The substrate 310 is a member for covering the input port 110 of the base 100, and the substrate 310 may be made of transparent glass material, so as to facilitate light penetration.

The first noise reduction member 320 is a member covering the substrate 310 and blocking light transmission. The first noise reduction member 320 may be a plate-shaped body or a sheet-shaped body, and is not particularly limited herein, as long as it can block light from passing therethrough.

It should be noted that, the first noise reduction member 320 is provided with a plurality of through holes 321, and the positions of the through holes 321 correspond to the positions of the photosensitive members 210 one by one, so that the photosensitive members 210 can receive the light passing through the through holes 321 respectively, thereby avoiding the problem of mutual interference between the light path channels of the photosensitive members 210. For example, the first silicon photomultiplier 211 receives only light that passes through the optical path of the third through-hole 321a, and the second silicon photomultiplier 212 receives only light that passes through the optical path of the fourth through-hole 321 b.

Compared with the prior art, the embodiment of the application has the beneficial effects that: in this embodiment, the plurality of through holes 321 disposed on the first noise reduction member 320 are staggered and correspond to the positions of the photosensitive members 210 one by one, so as to limit the angle of the light incident into each through hole 321, so that the light passing through the cover 300 can be received by the corresponding photosensitive member 210 along different light path channels, so as to reduce the problem of mutual interference between the light path channels of each photosensitive member 210.

Optionally, in one embodiment provided in the present application, referring to fig. 6, the substrate 310 includes a transparent cover 311 and a second noise reduction member 312 for filtering input light, and the second noise reduction member 312 is disposed at one side of the transparent cover 311.

Specifically, the transparent cover 311 refers to a glass member or a transparent resin member for fitting with the base 100, and the transparent cover 311 has an inner surface 311a and an outer surface 311b disposed opposite to each other, the inner surface 311a refers to a surface of the transparent cover 311 facing the base 100, and the outer surface 311b refers to a surface of the transparent cover 311 facing away from the base 100. The second noise reduction member 312 refers to a means for filtering input light. The second noise reduction member 312 may be an antireflection film (i.e., an antireflection film).

In some embodiments, the second noise reduction member 312 is disposed on the inner surface 311a of the transparent cover 311.

In some embodiments, the second noise reduction member 312 is disposed on the outer surface 311b of the transparent cover 311.

In the present embodiment, by providing the second noise reduction member 312 at one side of the transparent cover 311, the reflected light of the optical surface of the transparent cover 311 can be eliminated, thereby increasing the light transmission amount and reducing/eliminating the stray light passing through the transparent cover 311.

In one embodiment provided herein, the substrate 310 includes a transparent cover 311 and a second noise reduction member 312 for filtering input light, where the second noise reduction member 312 is disposed on two sides of the transparent cover 311.

The second noise reduction members 312 are disposed at two sides of the transparent cover 311, that is, the second noise reduction members 312 are disposed on the inner surface 311a and the outer surface 311b of the transparent cover 311, so that the light transmission effect is better, and the stray light passing through the transparent cover 311 is further reduced.

In this embodiment, the second noise reduction members 312 are added on both sides of the transparent cover 311, so that the light transmission is further improved, and the light with a specific wavelength can enter the accommodating space to be received by the photosensitive member 210, and the light with a non-specific wavelength is filtered.

Optionally, in one embodiment provided herein, the first noise reducer 320 includes a first mask layer 322, where the first mask layer 322 is disposed on a side of the substrate 310 facing away from the base 100; and/or, the first noise reducer 320 further includes a second mask layer 323, where the second mask layer 323 is disposed on a side of the substrate 310 facing the base 100.

In some embodiments, the first noise reducer 320 includes a first mask layer 322, and the first mask layer 322 is disposed on a side of the substrate 310 facing away from the base 100. Since the first noise reduction member 320 covers the substrate 310, the following situations are given to the photo-sensing chip in the present embodiment:

first, referring to fig. 6, the outer surface 311b of the transparent cover 311 is provided with a second noise reduction member 312 to form a substrate 310, and a first mask layer 322 is disposed on a side of the substrate 310 facing away from the base 100, so that each layer of light received by the photosensitive member 210 in the photosensitive chip in this embodiment sequentially passes through: the first mask layer 322, the second noise reduction member 312, and the transparent cover 311 are then received by the photosensitive member 210;

second, referring to fig. 7, the inner surface 311a of the transparent cover 311 is provided with a second noise reduction member 312 to form a substrate 310, and a first mask layer 322 is disposed on a side of the substrate 310 facing away from the base 100, so that each layer of light received by the photosensitive member 210 in the photosensitive chip in this embodiment sequentially passes through: the first mask layer 322, the transparent cover 311, and the second noise reduction member 312 are then received by the photosensitive member 210;

third, referring to fig. 8, the outer surface 311b and the inner surface 311a of the transparent cover 311 are both provided with a second noise reduction member 312 to form a substrate 310, and a first mask layer 322 is disposed on a side of the substrate 310 facing away from the base 100, so that each layer of light received by the photosensitive member 210 in the light sensing chip in this embodiment sequentially passes through: the first mask layer 322, the second noise reduction member 312, the transparent cover 311, and the second noise reduction member 312 are then received by the photosensitive member 210.

In some embodiments, the first noise reducer 320 includes a second mask layer 323, the second mask layer 323 being disposed on a side of the substrate 310 facing the base 100. Since the first noise reduction member 320 covers the substrate 310, the following situations are given to the photo-sensing chip in the present embodiment:

first, referring to fig. 9, the outer surface 311b of the transparent cover 311 is provided with a second noise reduction member 312 to form a substrate 310, and the side of the substrate 310 facing the base 100 is provided with a second mask layer 323, so that each layer of the light sensing chip in the present embodiment, through which the light received by the light sensing member 210 sequentially passes, includes: the second noise reduction member 312, the transparent cover 311, and the second mask layer 323, and then received by the photosensitive member 210;

second, referring to fig. 10, the inner surface 311a of the transparent cover 311 is provided with a second noise reduction member 312 to form a substrate 310, and a second mask layer 323 is provided on a side of the substrate 310 facing the base 100, so that each layer of the light sensing chip in the present embodiment, through which the light received by the light sensing member 210 sequentially passes, includes: the transparent cover 311, the second noise reduction member 312, and the second mask layer 323, and then received by the photosensitive member 210;

third, referring to fig. 11, the outer surface 311b and the inner surface 311a of the transparent cover 311 are provided with the second noise reduction member 312 to form the substrate 310, and the side of the substrate 310 facing the base 100 is provided with the second mask layer 323, so that each layer of the light sensing chip in the present embodiment, through which the light received by the light sensing member 210 sequentially passes, includes: the second noise reduction member 312, the transparent cover 311, the second noise reduction member 312, and the second mask layer 323 are then received by the photosensitive member 210.

In some embodiments, the first noise reduction component 320 includes a first mask layer 322 and a second mask layer 323, the first mask layer 322 is disposed on a side of the substrate 310 facing away from the base 100, and the second mask layer 323 is disposed on a side of the substrate 310 facing toward the base 100, so that the following situations are given in the light sensing chip in this embodiment:

first, referring to fig. 12, the outer surface 311b of the transparent cover 311 is provided with the second noise reduction member 312 to form the substrate 310, the side of the substrate 310 facing away from the base 100 is provided with the first mask layer 322, and the side of the substrate 310 facing toward the base 100 is provided with the second mask layer 323, so that each layer of the light received by the photosensitive member 210 in the light sensing chip in this embodiment sequentially passes through: the first mask layer 322, the second noise reduction member 312, the transparent cover 311, and the second mask layer 323, and then received by the photosensitive member 210;

second, referring to fig. 13, the inner surface 311a of the transparent cover 311 is provided with a second noise reduction member 312 to form a substrate 310, a first mask layer 322 is disposed on a side of the substrate 310 facing away from the base 100, and a second mask layer 323 is disposed on a side of the substrate 310 facing toward the base 100, so that each layer of light received by the photosensitive member 210 in the light sensing chip in this embodiment sequentially passes through: the first mask layer 322, the transparent cover 311, the second noise reduction member 312, and the second mask layer 323, and then received by the photosensitive member 210;

Third, referring to fig. 14, the outer surface 311b and the inner surface 311a of the transparent cover 311 are both provided with the second noise reduction member 312 to form the substrate 310, the side of the substrate 310 facing away from the base 100 is provided with the first mask layer 322, and the side of the substrate 310 facing toward the base 100 is provided with the second mask layer 323, so that each layer of light received by the photosensitive member 210 in the light sensing chip in this embodiment sequentially passes through: the first mask layer 322, the second noise reduction member 312, the transparent cover 311, the second noise reduction member 312, and the second mask layer 323 are then received by the photosensitive member 210.

In this embodiment, by providing the first mask layer 322 and/or the second mask layer 323 and the second noise reduction member 312 in combination, not only part of noise light, such as light with low transmittance and high reflectivity, can be filtered, but also light with an excessive incident angle, which is incident into the accommodating space formed by the base 100 and the cover 300, can be eliminated, so that the problem of mutual interference between the optical paths of the photosensitive members 210 can be further reduced.

In one embodiment provided in the present application, with continued reference to fig. 12 to 14, along the direction of receiving light, two sides of the substrate 310 are respectively provided with a first mask layer 322 and a second mask layer 323; the first mask layer 322 is provided with a plurality of first through holes 321c, and the second mask layer 323 is provided with a plurality of second through holes 321d, wherein the positions of the first through holes 321c and the positions of the second through holes 321d are in one-to-one correspondence.

The first through hole 321c is a through hole 321 formed on the first mask layer 322, and a position of the first through hole 321c corresponds to a position of the sensor 210. The second through hole 321d is a through hole 321 provided on the second mask layer 323, and the second through hole 321d corresponds to the first through hole 321 c.

In this embodiment, the optical path refers to a path through which the light can sequentially pass through the first through hole 321c and the second through hole 321d to reach the sensing element 210 at the corresponding position. The first through hole 321c and the second through hole 321d may have a circular shape or a rectangular shape, and are not particularly limited herein, but the first through hole 321c and the second through hole 321d have the same shape.

The center lines of the first through hole 321c, the second through hole 321d, and the sensor 210 overlap.

In this embodiment, the angle of the incident light is further limited, and the incident light is reduced in noise, so that the vertical light is received by the sensing element 210 at the position corresponding to the first through hole 321 c.

In one embodiment provided in the present application, the first through hole 321c and the second through hole 321d are coaxially disposed; and/or, the ratio of the opening area of the first through hole 321c to the opening area of the second through hole 321d is in the range of 1 to 2.

For example: the area of the first through hole 321c is 4mm ² The area of the second through hole 321d is 2mm ² The light passes through the first through hole 321c to filter out a part of light with larger incident angle for the first time, and then passes through the second through hole 321d to filter a part of light with larger incident angle for the second time, and since the first through hole 321c and the second through hole 321d are coaxially arranged, and the cover plate has a certain thickness, the light received by the photosensitive member 210 is nearly vertical light, and the light path channels of the photosensitive members 210 do not interfere with each other.

Also for example: the area of the first through hole 321c is 4mm ² The area of the second through hole 321d is 4mm ² The light passes through the first through hole 321c to filter out a part of light with larger incident angle for the first time, and then passes through the second through hole 321d to filter out a part of light with larger incident angle for the second time, and since the first through hole 321c and the second through hole 321d are coaxially arranged, the light received by the photosensitive member 210 is vertical light, and the light path channels of the photosensitive members 210 do not interfere with each other.

In one embodiment provided in this application, the base 100 includes a carrying portion 120 for placing the chip assembly 200 and a supporting portion 130 disposed around the periphery of the carrying portion 120, where one end of the supporting portion 130, which is opposite to the carrying portion 120, forms an input port 110, and the input port 110 is fixedly connected with the cover 300 through a fixing adhesive 410.

The carrier 120 is a component for fixing the chip assembly 200 to the base 100 by using diphenylethylene glue (DB glue). The bearing portion 120 may be made of metal or ceramic, and may be adjusted according to the requirement. The carrier 120 is provided with a plurality of conductive holes, which are vias filled with metal, so that the wires for the contacts on the chip assembly 200 can pass through the conductive holes to transmit the current to the metal pins on the opposite surface of the carrier 120.

The supporting portion 130 is a member protruding from the outer surface of the carrying portion 120 and surrounding the outer periphery of the carrying portion 120, so that a receiving space can be formed inside by the supporting portion 130 when the base 100 and the cover 300 are connected. One end of the supporting portion 130 is connected to the outer surface of the bearing portion 120, and the other end forms the input port 110.

It should be noted that, from the direction of light propagation, the height of the supporting portion 130 is greater than the height of the chip assembly 200, so that the accommodating space formed by the bearing portion 120 and the supporting portion 130 has an air cavity therein.

In one embodiment provided herein, the bearing portion 120 and the supporting portion 130 are integrally formed, and are made of ceramic materials.

Referring to fig. 15, in the present embodiment, the bearing portion 120 and the supporting portion 130 are integrally formed, that is, the structure of the base 100 is a structure in which a rectangular parallelepiped is provided with a groove.

In order to explain the effect comparison of the package structure in the present embodiment and the existing package structure, in the present embodiment, comparison of embodiment 1 and comparative example 1 is provided, and referring to fig. 3, it is assumed that the first silicon photomultiplier 211, the second silicon photomultiplier 212 and the third silicon photomultiplier 213 are provided on the sensing element 210, wherein the second silicon photomultiplier 212 is a main detection surface, and the first silicon photomultiplier 211 and the third silicon photomultiplier 213 are adjacent detection surfaces.

Comparative example 1:

the conventional package structure without the noise reduction member is provided.

Referring to fig. 16, fig. 16 is a simulation diagram of mutual interference between respective optical path channels of the first silicon photomultiplier 211, the second silicon photomultiplier 212, and the third silicon photomultiplier 213 in comparative example 1.

In comparative example 1, the ratio of the total power of the detection surface of the first silicon photomultiplier 211 to the total power of the detection surface of the second silicon photomultiplier 212 is:

5.93e-1/5.05＝11.7％

the ratio of the total power of the detection surface of the third silicon photomultiplier 213 to the total power of the detection surface of the second silicon photomultiplier 212 is:

3.36e-1/5.05＝6.65％

example 1:

the structure in this embodiment is adopted.

Referring to fig. 17, fig. 17 is a simulation diagram of mutual interference between respective optical path channels of the first silicon photomultiplier 211, the second silicon photomultiplier 212, and the third silicon photomultiplier 213 in embodiment 1.

In embodiment 1, the ratio of the total power of the detection surface of the first silicon photomultiplier 211 to the total power of the detection surface of the second silicon photomultiplier 212 is:

3.32e-5/2.23＝0.00149％

the ratio of the total power of the detection surface of the third silicon photomultiplier 213 to the total power of the detection surface of the second silicon photomultiplier 212 is:

3.23e-5/2.23＝0.00145％

in comparative example 1 and example 1, by setting a light source, a simulated light source enters a cavity structure from a diaphragm aperture, finally enters a detection surface through a series of refraction, reflection, diffraction, polarization and the like, and calculates the energy entering the detection surface to calculate the direct mutual interference problem of an optical path channel. The influence of the mutual interference of the light paths of the individual sensing elements 210 when receiving light is evaluated by analyzing the total power of the secondary detection surface and the total power of the primary detection surface in the simulation result. By comparing the above comparative example 1 with example 1, it was found that the ratio of the two was different by an order of magnitude of 10 ^-4 。

Referring to fig. 18 and 19, in one embodiment provided herein, the support 130 includes a first peripheral edge 131 and a second peripheral edge 132; the first peripheral edge 131 includes a top surface 131a and a bottom surface 131b that are disposed opposite to each other, the bottom surface 131b surrounds the periphery of the carrier 120, the top surface 131a is surrounded by the second peripheral edge 132 to form a stepped groove 133, and the cover body is disposed in the stepped groove 133, so that an isolation space for accommodating the chip assembly 200 is formed between the cover body 300 and the carrier 120.

Referring to fig. 19, the first peripheral edge 131 is a part protruding from the surface of the carrier 120 and surrounding the outer periphery of the carrier 120, and is used to form a height difference with the carrier 120, so as to form an accommodating space in which the chip assembly 200 can be stored. The cross section of the first surrounding edge 131 is rectangular, has an opening, is axially arranged along the surface of the bearing part 120, and comprises a top surface 131a and a bottom surface 131b which are oppositely arranged, wherein the bottom surface 131b is connected with the bearing part 120, and the connection position is the surrounding edge of the end surface of the bearing part 120 facing the first surrounding edge 131.

Referring to fig. 19, the second peripheral edge 132 is a member protruding from the surface of the first peripheral edge 131 and surrounding the outer periphery of the first peripheral edge 131, for forming a height difference with the first peripheral edge 131 to form a stepped groove 133 in which the cover 300 can be stored. The cross section of the second surrounding edge 132 is rectangular, and is provided with an opening, and the second surrounding edge 132 is axially arranged along the first surrounding edge 131 and is connected with the top surface 131a of the first surrounding edge 131, and the connection positions of the second surrounding edge 132 and the first surrounding edge are four circumferences of the top surface 131a of the first surrounding edge 131, namely, in terms of positions in the illustration, the second surrounding edge 132 and the first surrounding edge 131 form a supporting part 130, the surfaces exposed to the outside are in smooth seamless connection, and the positions of forming the step groove 133 are in a space surrounded by the second surrounding edge 132.

Optionally, the first peripheral edge 131 and the second peripheral edge 132 are integrally formed, and form a step groove 133.

Alternatively, the first peripheral edge 131 and the second peripheral edge 132 are two separate structures and form a stepped groove 133.

In this embodiment, the step groove 133 formed by the second peripheral edge 132 and the first peripheral edge 131 and capable of placing the cover 300, so that the placement position of the cover 300 is relatively fixed, positioning is facilitated, and the tightness between the base 100 and the cover 300 is improved.

Referring to fig. 19, in one embodiment provided in the present application, the cover 300 is fixedly connected to the top surface 131a of the first peripheral edge 131 through a fixing adhesive 410; the second peripheral edge 132 is connected with the side edge 330 of the cover 300 through a sealant 420, and the sealant 420 is arranged at the joint of the cover 300 and the second peripheral edge 132 which is far away from the isolation space, and fills the gap between the cover 300 and the second peripheral edge 132.

In the process of packaging the chip assembly 200, the fixing adhesive 410 may be coated on the top surface 131a of the first peripheral edge 131, where the top surface 131a may be the entire top surface of the first peripheral edge 131, or may be the remaining surface after the second peripheral edge 132 occupies the top surface 131a of the first peripheral edge 131 is removed.

The cover 300 is placed in the step groove 133 formed by the first surrounding edge 131 and the second surrounding edge 132, so that the placement position of the cover 300 can be initially positioned, packaging is facilitated, and the placement position of the cover 300 in the step groove 133 can be fixed by coating the top surface 131a of the first surrounding edge 131 with the fixing adhesive 410, so that the cover 300, the first surrounding edge 131, the second surrounding edge 132 and the base 100 formed by the bearing part 120 form a closed light sensing chip.

In order to ensure the sealability of the receiving space within the photo-sensing chip, in the present embodiment, the sealability of the receiving space is maintained by filling the sealant 420 between the second peripheral edge 132 and the side edge 330 of the cover 300. The side edge 330 refers to a side surface of the cover 300 facing the second peripheral edge 132 and an end surface of the cover 300 facing away from the isolation space.

Further, when the sealant 420 is filled, a proper amount of sealant 420 is used to fill the gap between the side surface of the cover 300 facing the second peripheral edge 132 and the second peripheral edge 132, and the end surface of the cover 300 facing away from the isolation space and the end surface of the second peripheral edge 132 facing away from the first peripheral edge 131 are connected, so that the sealant 420 seals the isolation space from the top of the cover 300 in the illustrated position.

Optionally, the sealant 420 is formed with a protrusion at a position connecting the end surface of the cover 300 facing away from the isolation space and the end surface of the second surrounding edge 132 facing away from the first surrounding edge 131, so as to improve the tightness between the sealant 420 and the cover 300 and the second surrounding edge 132. Referring to fig. 20 and 21, in one embodiment provided herein, a groove bottom 133a of the step groove 133 is provided with a first concave-convex structure 134; the cover 300 is provided with a second concave-convex structure 340 matching with the first concave-convex structure 134 on a side facing the base 100.

The step groove 133 is a groove formed by a difference in height between the first peripheral edge 131 and the second peripheral edge 132, the groove bottom 133a of the step groove 133 is a part of the top surface 131a of the first peripheral edge 131, and the groove wall of the step groove 133 is a side surface of the second peripheral edge 132.

The first concave-convex structure 134 refers to a concave-convex surface for increasing friction and facilitating assembly, and the first concave-convex structure 134 may be a serrated end surface, or may be provided with a plurality of grooves or a plurality of protrusions, etc., which are not particularly limited herein.

The second concave-convex structure 340 refers to a concave-convex surface for being mated with the first concave-convex structure 134, and the second concave-convex structure 340 may be a serrated end surface, or may be provided with a plurality of grooves or a plurality of protrusions, etc., and is not particularly limited herein, but the specific structural mode adopted is required to be consistent with the first concave-convex structure 134.

In this embodiment, the friction between the cover 300 and the step groove 133 is increased by the first concave-convex structure 134 and the second concave-convex structure 340, so that the cover 300 is not easy to slide when placed in the step groove 133, and the contact area between the rest of the step grooves 133 of the cover 300 is larger, which is beneficial to increasing the binding force between the two, and further improving the sealing effect.

In one embodiment provided herein, the first concave-convex structure 134 and the second concave-convex structure 340 are each composed of a plurality of serrated bar-shaped columns; alternatively, the first concave-convex structure 134 and the second concave-convex structure 340 are each constituted by a plurality of rectangular columns arranged at intervals.

For example: referring to fig. 20, each of the first and second concave-convex structures 134 and 340 is composed of a plurality of zigzag bar-shaped columns.

The groove bottom 133a of the step groove 133 is provided with a first toothed column 134a, and the first toothed column 134a may be disposed along the length of the groove bottom 133a and along a width array (i.e., the first toothed column 134a is a plurality of vertical columns provided at the groove bottom 133 a), may be disposed along the width of the groove bottom 133a and along a length array (i.e., the first toothed column 134a is a plurality of horizontal columns provided at the groove bottom 133 a), may be disposed obliquely along the length of the groove bottom 133a and in an equidistant/non-equidistant array (i.e., the first toothed column 134a is a plurality of oblique columns provided at the groove bottom 133 a), and the like, without being limited thereto.

Correspondingly, the second toothed columns 341 are disposed on a side of the cover 300 facing the base 100, and the second toothed columns 341 may be disposed along a length of the cover 300 and along a width array (i.e., the second toothed columns 341 are a plurality of vertical columns disposed on a side of the cover 300 facing the base 100), may be disposed along a width of the cover 300 and along a length array (i.e., the second toothed columns 341 are a plurality of horizontal columns disposed on a side of the cover 300 facing the base 100), may be disposed along a length of the cover 300 in an inclined equidistant array of adjacent teeth (i.e., the second toothed columns 341 are a plurality of inclined columns disposed on a side of the cover 300 facing the base 100, and the tooth widths of the adjacent teeth are equal), may be disposed along a length of the cover 300 in an unequal array (i.e., the second toothed columns 341 are a plurality of inclined columns disposed on a side of the cover 300 facing the base 100, and the tooth widths of the adjacent teeth are not equal, or the adjacent teeth are not equal.

Also for example: referring to fig. 21, the first concave-convex structure 134 and the second concave-convex structure 340 are each composed of a plurality of rectangular columns arranged at intervals.

The groove bottom 133a of the step groove 133 is provided with a first protrusion 134b, and the first protrusion 134b may be disposed along the length of the groove bottom 133a and along a width array (i.e., the first protrusion 134b is a plurality of longitudinal elongated protrusions disposed at the groove bottom 133 a), may be disposed along the width of the groove bottom 133a and along a length array (i.e., the first protrusion 134b is a plurality of transverse elongated protrusions disposed at the groove bottom 133 a), may be disposed obliquely along the length of the groove bottom 133a and equidistantly/non-equidistantly array (i.e., the first protrusion 134b is a plurality of oblique protrusions disposed at the groove bottom 133 a), and the like, without being limited thereto.

Correspondingly, the side of the cover 300 facing the base 100 is provided with the second posts 342, and the second posts 342 may be disposed along the length of the cover 300 and along the width array (i.e., the second posts 342 are a plurality of longitudinal elongated posts disposed on the side of the cover 300 facing the base 100), may be disposed along the width of the cover 300 and along the length array (i.e., the second posts 342 are a plurality of transverse elongated posts disposed on the side of the cover 300 facing the base 100), may be disposed obliquely and equidistantly/non-equidistantly along the length of the cover 300 (i.e., the second posts 342 are a plurality of oblique posts disposed on the side of the cover 300 facing the base 100), and the like.

It should be noted that, the arrangement positions and the array directions of the first toothed column 134a and the second toothed column 341 (or the first convex column 134b and the second convex column 342) are the same, and the gap between two adjacent first toothed columns 134a is not smaller than the maximum width of the second toothed column 341 (or the gap between the first convex column 134b is not smaller than the width of the second convex column 342), so that the first toothed column 134a and the second toothed column 341 (or the first convex column 134b and the second convex column 342) may cooperate with each other when the cover 300 is placed in the step groove 133.

It should be noted that the second toothed column 341 (or the second protruding column 342) on the cover 300 may be disposed on the transparent cover 311, and made by changing the surface flatness of the transparent cover 311 facing to the side of the isolation space; the first noise reduction member 320 may be formed by increasing the thickness of the first noise reduction member 320 and changing the surface flatness of the side facing the isolation space; or may be disposed on the second noise reduction member 312, and manufactured by increasing the thickness of the second noise reduction member 312 and changing the surface flatness of the side thereof facing the isolation space, specifically, according to the specific structure of the cover 300.

For example, if the second toothed column 341 is disposed on the first noise reducer 320, it may be achieved by the following ways:

First, the roughness of the two ends of the transparent cover 311 is changed, and when the first noise reduction member 320 is disposed on the transparent cover 311, the first noise reduction member 320 deforms along with the concave-convex structure of the transparent cover 311, so as to form a structure consistent with the shape of the transparent cover 311. When the cover 300 is engaged with the base 100, the first toothed column 134a on the bottom 133a of the stepped groove 133 is engaged with the second toothed column 341 provided on the first noise reduction member 320;

secondly, the roughness of the two ends of the transparent cover 311 is not changed, the thickness of the first noise reduction pieces 320 arranged at the two ends of the cover 311 is changed, and the first noise reduction pieces 320 at the two ends are arranged into a concave-convex structure. When the cover 300 is engaged with the base 100, the first toothed column 134a on the bottom 133a of the stepped groove 133 is engaged with the second toothed column 341 provided on the first noise reduction member 320.

In one embodiment provided herein, the bearing portion 120 and the supporting portion 130 are two connected components, the bearing portion 120 is made of a ceramic material, and the supporting portion 130 is made of a metal material.

In order to explain the comparison of the effect of the package structure in this embodiment and the conventional package structure, in this embodiment, comparison of embodiment 2 and comparative example 2 is provided, and referring to fig. 3, it is assumed that the sensing element 210 is provided with a first silicon photomultiplier 211 and a second silicon photomultiplier 212, wherein the second silicon photomultiplier 212 is a main detection surface, and the first silicon photomultiplier 211 is an adjacent detection surface.

Comparative example 2:

only one layer of the peripheral edge and the bearing portion 120 form a low-cavity structure in the prior art.

Referring to fig. 22, fig. 22 is a simulation diagram of mutual interference between respective optical path channels of the first silicon photomultiplier 211 and the second silicon photomultiplier 212 in comparative example 2.

In comparative example 2, the ratio of the total power of the detection surface of the first silicon photomultiplier 211 to the total power of the detection surface of the second silicon photomultiplier 212 is:

8.48e-6/2.23＝0.00038％

example 2:

the supporting portion 130 including the first peripheral edge 131 and the second peripheral edge 132 in this embodiment is used, and a high cavity structure is formed between the supporting portion 130 and the bearing portion 120.

Referring to fig. 23, fig. 23 is a simulation diagram of mutual interference between respective optical path channels of the first silicon photomultiplier 211 and the second silicon photomultiplier 212 in embodiment 2.

In embodiment 2, the ratio of the total power of the detection surface of the first silicon photomultiplier 211 to the total power of the detection surface of the second silicon photomultiplier 212 is:

3.32e-5/2.23＝0.00149％

in comparative example 2 and example 2, by setting a light source, a simulated light source enters a cavity structure from a diaphragm aperture, and finally enters a detection surface through a series of refraction, reflection, diffraction, polarization and the like, and the direct mutual interference problem of an optical path channel is calculated by calculating the energy entering the detection surface. The influence of the mutual interference of the light paths of the individual sensing elements 210 when receiving light is evaluated by analyzing the total power of the secondary detection surface and the total power of the primary detection surface in the simulation result. By comparison of the above comparative example 2 and example 2, the effect of the encapsulation performance in example 2 is significantly superior to that in comparative example 2.

In one embodiment provided herein, the photosensitive member 210 employs a silicon photomultiplier that is formed from a plurality of single photon avalanche diode arrays.

Based on the same inventive concept, the application also provides a chip packaging process, which comprises the following steps:

s1, manufacturing a base 100;

a groove is dug on the cuboid of the ceramic, the bottom of the groove forms a bearing part 120 and four walls form a supporting part 130, and a base 100 with an accommodating space for placing a chip assembly 200 is integrally formed;

or, the ceramic carrier 120 and the metal support 130 are connected to form the susceptor 100 having a receiving space in which the chip module 200 can be placed.

S2, manufacturing a chip assembly 200;

a plurality of sensing elements 210 are disposed on the circuit board 220, and the sensing elements 210 are silicon photomultipliers formed by a plurality of single photon avalanche diode arrays.

S3, manufacturing a cover 300;

the substrate 310 is covered with a first noise reduction member 320, and the first noise reduction member 320 is provided with a plurality of through holes 321, and each through hole 321 corresponds to the position of the sensing member 210 on the chip assembly 200 one by one.

S4, assembling;

the chip assembly 200 is adhered to the bearing portion 120 through DB glue, and the cover 300 is fixedly connected to the supporting portion 130 of the base 100 through the fixing glue 410, that is, is fixed at the position of the input port 110 of the base 100, so as to realize the encapsulation of the chip assembly 200 in the sealed space.

It should be understood that, the sequence number of each step in the foregoing embodiment does not mean the sequence of execution sequence, and the execution sequence of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. For example, the step S1 and the step S2 may be exchanged, that is, the step S2 may be performed first, and then the step S1 may be performed.

Based on the same inventive concept, the application also provides a light sensing module, which comprises the light sensing chip in any one of the embodiments. It can be appreciated that the light sensing module includes optical functional elements besides the above light sensing chip, such as: the optical filter or the functional lens is used for improving the photosensitive performance of the light sensing chip.

Because the optical sensing module of the embodiment of the present application adopts all the technical schemes of the optical sensing chip in the above embodiment, the optical sensing module also has all the beneficial effects brought by the technical schemes of the above embodiment, and will not be described in detail herein.

Based on the same inventive concept, the application also provides a laser radar, which comprises a light emitting module, a processing circuit and a light sensing module in the embodiment, wherein the light emitting module is used for emitting a detection light beam, the detection light beam is received by the light sensing module after being reflected by a detection object, and the processing circuit performs distance measurement or three-dimensional point cloud imaging according to the flight time of the sensed light signal.

Based on the same inventive concept, the present application further provides an electronic device, which includes the distance detection device in the above embodiment, and uses the distance detection device to implement a corresponding function of the electronic device, for example: distance detection, three-dimensional imaging, or autopilot. The electronic device may be an intelligent mobile device such as an automobile, an industrial robot or an unmanned aerial vehicle, and the intelligent mobile device performs a corresponding operation by performing distance detection or three-dimensional information detection by using a laser radar.

Because the distance detection device in the embodiment of the present application adopts all the technical schemes of the light sensing chip in the above embodiment, the distance detection device also has all the beneficial effects brought by the technical schemes of the above embodiment, and will not be described in detail herein.

The foregoing description of the preferred embodiments is merely exemplary in nature and is in no way intended to limit the invention, since it is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Claims (16)

1. A photo-sensing chip, comprising:

the base is provided with an input port for receiving light, and the input port is communicated with the inside of the base;

The chip assembly is arranged in the base and comprises a plurality of photosensitive pieces;

the cover body covers the input port, the cover body includes the base plate and covers in the base plate is used for blocking the first piece of making an uproar that falls of light transmission, first piece of making an uproar that falls is equipped with a plurality of through-holes, each the through-hole the position with each the position one-to-one of sensitization piece is supplied for each the sensitization piece is received respectively and is passed through each the through-hole.

2. The light sensing chip of claim 1, wherein the substrate comprises a transparent cover and a second noise reduction member for filtering the input light, the second noise reduction member being disposed on one side of the transparent cover.

3. The light sensing chip of claim 1, wherein the substrate comprises a transparent cover and a second noise reduction member for filtering the input light, the second noise reduction member being disposed on both sides of the transparent cover.

4. A light sensing chip according to claim 2 or 3, wherein the first noise reduction member comprises a first mask layer provided on a side of the substrate facing away from the base;

and/or, the first noise reduction piece further comprises a second shielding layer, and the second shielding layer is arranged on one side of the substrate, which faces the base.

5. The light-sensitive chip of claim 4, wherein the first and second masking layers are disposed on opposite sides of the substrate in a direction to receive the light;

the first shade layer is provided with a plurality of first through holes, the second shade layer is provided with a plurality of second through holes, and the positions of the first through holes and the positions of the second through holes are in one-to-one correspondence.

6. The light-sensing chip of claim 5, wherein the first through-hole and the second through-hole are coaxially disposed;

and/or the ratio of the open area of the first through hole to the open area of the second through hole is 1-2.

7. The light-sensing chip according to any one of claims 1 to 3, 5 or 6, wherein the base comprises a carrying portion in which the chip assembly is placed and a supporting portion disposed around an outer periphery of the carrying portion, wherein an end of the supporting portion facing away from the carrying portion forms the input port, and the input port is fixedly connected to the cover body through a fixing adhesive.

8. The light-sensing chip of claim 7, wherein the support portion comprises a first peripheral edge and a second peripheral edge;

The first surrounding edge comprises a top surface and a bottom surface which are oppositely arranged, the bottom surface surrounds the periphery of the bearing part, the top surface is surrounded by the second surrounding edge to form a step groove, and the cover body is arranged in the step groove, so that an isolation space for accommodating the chip assembly is formed between the cover body and the bearing part.

9. The light sensing chip of claim 8, wherein the cover is fixedly connected to the top surface of the first peripheral edge by a fixing adhesive;

the second surrounding edge is connected with the side edge of the cover body through sealant, and the sealant is arranged at the joint of the cover body and the second surrounding edge, which is far away from the isolation space, and is filled in a gap between the cover body and the second surrounding edge.

10. The light sensing chip of claim 8, wherein the bottom of the step groove is provided with a first concave-convex structure;

one side of the cover body facing the base is provided with a second concave-convex structure matched with the first concave-convex structure.

11. The light sensing chip of claim 10, wherein the first and second concavo-convex structures are each comprised of a plurality of serrated bar-shaped columns;

Alternatively, the first concave-convex structure and the second concave-convex structure are each composed of a plurality of rectangular columns arranged at intervals.

12. The light-sensing chip according to any one of claims 8 to 11, wherein the carrying part and the supporting part are two connected parts, the carrying part is made of a ceramic material, and the supporting part is made of a metal material.

13. The light-sensing chip of any one of claims 1-3, 5, 6 or 8-11, wherein the light-sensing member is a silicon photomultiplier formed from a plurality of single photon avalanche diode arrays.

14. The light sensing chip of claim 7, wherein the carrier portion and the support portion are integrally formed and each made of a ceramic material.

15. A light sensing module comprising a light sensing chip according to any one of claims 1 to 14.

16. A lidar comprising a light-emitting module and the light-sensing module of claim 15.