TW201524284A - 電子元件以及片材 - Google Patents
電子元件以及片材 Download PDFInfo
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- TW201524284A TW201524284A TW103138729A TW103138729A TW201524284A TW 201524284 A TW201524284 A TW 201524284A TW 103138729 A TW103138729 A TW 103138729A TW 103138729 A TW103138729 A TW 103138729A TW 201524284 A TW201524284 A TW 201524284A
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- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
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- 229920000573 polyethylene Polymers 0.000 description 1
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- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
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- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0064—Earth or grounding circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
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| JP2013249809 | 2013-12-03 |
Publications (1)
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| TW201524284A true TW201524284A (zh) | 2015-06-16 |
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| TW103138729A TW201524284A (zh) | 2013-12-03 | 2014-11-07 | 電子元件以及片材 |
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| JP (1) | JP6623513B2 (ja) |
| KR (2) | KR102150258B1 (ja) |
| CN (1) | CN105794331A (ja) |
| TW (1) | TW201524284A (ja) |
| WO (1) | WO2015083491A1 (ja) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018060990A (ja) * | 2016-07-08 | 2018-04-12 | 住友ベークライト株式会社 | 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板 |
| JP6747129B2 (ja) * | 2016-07-20 | 2020-08-26 | 東洋インキＳｃホールディングス株式会社 | 電子素子 |
| KR101915947B1 (ko) * | 2016-07-20 | 2019-01-30 | 스템코 주식회사 | 연성 회로 기판 및 그 제조 방법 |
| JP2018060991A (ja) * | 2016-09-28 | 2018-04-12 | 住友ベークライト株式会社 | 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板 |
| FR3062982B1 (fr) * | 2017-02-13 | 2019-04-19 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Structure de blindage electromagnetique pour cartes electroniques |
| FR3062981A1 (fr) * | 2017-02-13 | 2018-08-17 | Commissariat Energie Atomique | Structure de blindage electromagnetique pour cartes electroniques |
| US10403582B2 (en) * | 2017-06-23 | 2019-09-03 | Tdk Corporation | Electronic circuit package using composite magnetic sealing material |
| JP2019021757A (ja) * | 2017-07-14 | 2019-02-07 | 住友ベークライト株式会社 | 封止用フィルムおよび電子部品搭載基板の封止方法 |
| KR102071110B1 (ko) | 2017-09-19 | 2020-01-29 | 학교법인혜화학원 | 독활 복합오일을 포함하는 항아토피성 약학 조성물 |
| KR102031418B1 (ko) | 2017-09-19 | 2019-10-11 | 학교법인혜화학원 | 산조인 복합오일을 포함하는 항아토피성 피부염 약학 조성물 |
| WO2019073809A1 (ja) * | 2017-10-13 | 2019-04-18 | タツタ電線株式会社 | シールドパッケージ |
| JP2019091866A (ja) * | 2017-11-17 | 2019-06-13 | 東洋インキＳｃホールディングス株式会社 | 電子素子の製造方法 |
| US10541065B2 (en) * | 2017-12-21 | 2020-01-21 | The Boeing Company | Multilayer stack with enhanced conductivity and stability |
| JP6497477B1 (ja) * | 2018-10-03 | 2019-04-10 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシート、および電子部品搭載基板 |
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| KR101250677B1 (ko) * | 2011-09-30 | 2013-04-03 | 삼성전기주식회사 | 반도체 패키지 및 그의 제조 방법 |
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- 2014-11-07 WO PCT/JP2014/079573 patent/WO2015083491A1/ja active Application Filing
- 2014-11-07 TW TW103138729A patent/TW201524284A/zh unknown
- 2014-11-07 CN CN201480065951.5A patent/CN105794331A/zh active Pending
- 2014-11-07 JP JP2014226595A patent/JP6623513B2/ja active Active
- 2014-11-07 KR KR1020167012862A patent/KR20160074559A/ko active Application Filing
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| KR20180059952A (ko) | 2018-06-05 |
| KR20160074559A (ko) | 2016-06-28 |
| WO2015083491A1 (ja) | 2015-06-11 |
| JP2015130484A (ja) | 2015-07-16 |
| JP6623513B2 (ja) | 2019-12-25 |
| CN105794331A (zh) | 2016-07-20 |
| KR102150258B1 (ko) | 2020-09-01 |
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