KR102150258B1 - 전자 소자 및 시트재 - Google Patents
전자 소자 및 시트재 Download PDFInfo
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- KR102150258B1 KR102150258B1 KR1020187014727A KR20187014727A KR102150258B1 KR 102150258 B1 KR102150258 B1 KR 102150258B1 KR 1020187014727 A KR1020187014727 A KR 1020187014727A KR 20187014727 A KR20187014727 A KR 20187014727A KR 102150258 B1 KR102150258 B1 KR 102150258B1
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0064—Earth or grounding circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
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| JP6747129B2 (ja) * | 2016-07-20 | 2020-08-26 | 東洋インキＳｃホールディングス株式会社 | 電子素子 |
| KR101915947B1 (ko) * | 2016-07-20 | 2019-01-30 | 스템코 주식회사 | 연성 회로 기판 및 그 제조 방법 |
| JP2018060991A (ja) * | 2016-09-28 | 2018-04-12 | 住友ベークライト株式会社 | 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板 |
| FR3062982B1 (fr) * | 2017-02-13 | 2019-04-19 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Structure de blindage electromagnetique pour cartes electroniques |
| FR3062981A1 (fr) * | 2017-02-13 | 2018-08-17 | Commissariat Energie Atomique | Structure de blindage electromagnetique pour cartes electroniques |
| US10403582B2 (en) * | 2017-06-23 | 2019-09-03 | Tdk Corporation | Electronic circuit package using composite magnetic sealing material |
| JP2019021757A (ja) * | 2017-07-14 | 2019-02-07 | 住友ベークライト株式会社 | 封止用フィルムおよび電子部品搭載基板の封止方法 |
| KR102071110B1 (ko) | 2017-09-19 | 2020-01-29 | 학교법인혜화학원 | 독활 복합오일을 포함하는 항아토피성 약학 조성물 |
| KR102031418B1 (ko) | 2017-09-19 | 2019-10-11 | 학교법인혜화학원 | 산조인 복합오일을 포함하는 항아토피성 피부염 약학 조성물 |
| JP6992083B2 (ja) * | 2017-10-13 | 2022-01-13 | タツタ電線株式会社 | シールドパッケージ |
| JP2019091866A (ja) * | 2017-11-17 | 2019-06-13 | 東洋インキＳｃホールディングス株式会社 | 電子素子の製造方法 |
| US10541065B2 (en) | 2017-12-21 | 2020-01-21 | The Boeing Company | Multilayer stack with enhanced conductivity and stability |
| JP6497477B1 (ja) * | 2018-10-03 | 2019-04-10 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシート、および電子部品搭載基板 |
| JP7290083B2 (ja) * | 2019-07-31 | 2023-06-13 | 株式会社オートネットワーク技術研究所 | 配線部材 |
| JP7010323B2 (ja) * | 2020-04-02 | 2022-01-26 | 東洋インキＳｃホールディングス株式会社 | 電子素子 |
| CN118266274A (zh) * | 2021-11-29 | 2024-06-28 | 爱天思株式会社 | 保护片、电子器件封装及电子器件封装的制造方法 |
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| JPH10173392A (ja) * | 1996-12-09 | 1998-06-26 | Daido Steel Co Ltd | 電磁波遮蔽用シート |
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- 2014-11-07 CN CN201480065951.5A patent/CN105794331A/zh active Pending
- 2014-11-07 JP JP2014226595A patent/JP6623513B2/ja active Active
- 2014-11-07 WO PCT/JP2014/079573 patent/WO2015083491A1/ja active Application Filing
- 2014-11-07 TW TW103138729A patent/TW201524284A/zh unknown
- 2014-11-07 KR KR1020167012862A patent/KR20160074559A/ko active Application Filing
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201524284A (zh) | 2015-06-16 |
| JP6623513B2 (ja) | 2019-12-25 |
| JP2015130484A (ja) | 2015-07-16 |
| CN105794331A (zh) | 2016-07-20 |
| KR20180059952A (ko) | 2018-06-05 |
| WO2015083491A1 (ja) | 2015-06-11 |
| KR20160074559A (ko) | 2016-06-28 |
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