SG90748A1 - Csp plate holder - Google Patents

Csp plate holder

Info

Publication number
SG90748A1
SG90748A1 SG200005012A SG200005012A SG90748A1 SG 90748 A1 SG90748 A1 SG 90748A1 SG 200005012 A SG200005012 A SG 200005012A SG 200005012 A SG200005012 A SG 200005012A SG 90748 A1 SG90748 A1 SG 90748A1
Authority
SG
Singapore
Prior art keywords
plate holder
csp plate
csp
holder
plate
Prior art date
Application number
SG200005012A
Other languages
English (en)
Inventor
Yoshimura Eiichi
Namioka Shinichi
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG90748A1 publication Critical patent/SG90748A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
SG200005012A 1999-09-10 2000-09-01 Csp plate holder SG90748A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25725699A JP4388640B2 (ja) 1999-09-10 1999-09-10 Ｃｓｐ基板保持部材及び該ｃｓｐ基板保持部材が載置されるｃｓｐ基板用テーブル

Publications (1)

Publication Number Publication Date
SG90748A1 true SG90748A1 (en) 2002-08-20

Family

ID=17303864

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200005012A SG90748A1 (en) 1999-09-10 2000-09-01 Csp plate holder

Country Status (5)

Country Link
US (1) US6386191B1 (ja)
JP (1) JP4388640B2 (ja)
KR (1) KR100652152B1 (ja)
SG (1) SG90748A1 (ja)
TW (1) TW472358B (ja)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
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US6321739B1 (en) * 1999-04-16 2001-11-27 Micron Technology, Inc. Film frame substrate fixture
JP3422754B2 (ja) * 2000-05-31 2003-06-30 三菱重工業株式会社 印刷用版材の作製方法、再生方法及び印刷機
US6949146B2 (en) 2002-04-30 2005-09-27 Asm Assembly Automation Ltd Ultrasonic cleaning module for singulated electronic packages
JP2004055860A (ja) 2002-07-22 2004-02-19 Renesas Technology Corp 半導体装置の製造方法
US7281535B2 (en) * 2004-02-23 2007-10-16 Towa Intercon Technology, Inc. Saw singulation
JP4464794B2 (ja) * 2004-11-10 2010-05-19 日本碍子株式会社 研磨加工用治具セット及び複数被研磨体の研磨方法
US7220175B2 (en) * 2005-04-28 2007-05-22 Win Semiconductors Corp. Device for carrying thin wafers and method of carrying the thin wafers
DE102005046031B3 (de) * 2005-09-26 2007-07-12 Schott Ag Verfahren zur Separierung von Teilen aus einem Substrat
JP4824425B2 (ja) * 2006-02-22 2011-11-30 Ｈｏｙａ株式会社 スピン洗浄装置
US7531432B2 (en) * 2007-02-14 2009-05-12 Texas Instruments Incorporated Block-molded semiconductor device singulation methods and systems
JP2009032867A (ja) * 2007-07-26 2009-02-12 Disco Abrasive Syst Ltd 分割装置
JP5378746B2 (ja) * 2008-10-09 2013-12-25 株式会社ディスコ 分割加工用治具
JP5679735B2 (ja) * 2010-08-18 2015-03-04 株式会社ディスコ パッケージ基板のハンドリング方法
EP2476514A1 (en) * 2011-01-12 2012-07-18 Sandvik Intellectual Property AB A method and an apparatus for treating at least one work-piece
JP5975703B2 (ja) * 2012-04-09 2016-08-23 株式会社ディスコ 切削装置
US8752751B2 (en) 2012-07-13 2014-06-17 Asm Technology Singapore Pte Ltd Lead frame support plate and window clamp for wire bonding machines
JP6044986B2 (ja) * 2012-11-13 2016-12-14 株式会社ディスコ 切削装置
JP6096047B2 (ja) * 2013-05-15 2017-03-15 株式会社ディスコ 切削装置およびパッケージ基板の加工方法
JP6081868B2 (ja) 2013-06-18 2017-02-15 株式会社ディスコ 切削装置
JP6301147B2 (ja) * 2014-02-13 2018-03-28 株式会社ディスコ 保持治具
JP6287548B2 (ja) * 2014-04-28 2018-03-07 三星ダイヤモンド工業株式会社 脆性材料基板の端材分離方法及び端材分離装置
JP6282176B2 (ja) * 2014-05-29 2018-02-21 三星ダイヤモンド工業株式会社 脆性材料基板の端材分離装置
JP2017054956A (ja) 2015-09-10 2017-03-16 株式会社ディスコ 被加工物の支持治具
JP2018006395A (ja) * 2016-06-28 2018-01-11 株式会社ディスコ 搬送方法
JP6626413B2 (ja) * 2016-06-29 2019-12-25 東京応化工業株式会社 支持体分離方法、および基板処理方法
JP2018133432A (ja) * 2017-02-15 2018-08-23 株式会社ディスコ 切削装置
JP2020192646A (ja) * 2019-05-28 2020-12-03 株式会社ディスコ チャックテーブルおよびチャックテーブルの製造方法
CN111180312B (zh) * 2019-12-31 2023-08-11 贵州振华风光半导体股份有限公司 一种适用于集成电路的回流焊清洗方法

Citations (3)

* Cited by examiner, † Cited by third party
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US3811182A (en) * 1972-03-31 1974-05-21 Ibm Object handling fixture, system, and process
US5964646A (en) * 1997-11-17 1999-10-12 Strasbaugh Grinding process and apparatus for planarizing sawed wafers
US6165232A (en) * 1998-03-13 2000-12-26 Towa Corporation Method and apparatus for securely holding a substrate during dicing

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US3809050A (en) * 1971-01-13 1974-05-07 Cogar Corp Mounting block for semiconductor wafers
US3976288A (en) * 1975-11-24 1976-08-24 Ibm Corporation Semiconductor wafer dicing fixture
JPS58115833A (ja) * 1981-12-28 1983-07-09 Sony Corp ウエ−ハの分割方法
JPS59187147U (ja) * 1983-05-31 1984-12-12 日本電信電話株式会社 シリコンウエハ真空吸着盤
US4600936A (en) * 1983-07-12 1986-07-15 International Business Machines Corporation Chip registration mechanism
JPS61222146A (ja) * 1985-02-12 1986-10-02 Matsushita Electronics Corp 半導体ウエハ支持装置
JPS63274509A (ja) * 1987-05-07 1988-11-11 Matsushita Electric Ind Co Ltd 切断装置
JPH01101112A (ja) * 1987-10-15 1989-04-19 Sony Corp 半導体ウエハのダイシング方法
JPH01238907A (ja) * 1988-03-18 1989-09-25 Nec Corp 半導体組立治具
JPH02130103A (ja) * 1988-11-11 1990-05-18 Toshiba Corp ダイシング用治具
JPH0414848A (ja) * 1990-05-09 1992-01-20 Shibayama Kikai Kk Ｉｃの製造工程における半導体ウエハのチャック機構
JPH05286568A (ja) * 1992-04-10 1993-11-02 Oki Electric Ind Co Ltd ウエハ吸着装置とこれを用いた半導体装置製造方法
US5445559A (en) * 1993-06-24 1995-08-29 Texas Instruments Incorporated Wafer-like processing after sawing DMDs
JP3438369B2 (ja) * 1995-01-17 2003-08-18 ソニー株式会社 部材の製造方法
JP3463398B2 (ja) * 1995-03-10 2003-11-05 株式会社デンソー 半導体装置の製造方法
US5618759A (en) * 1995-05-31 1997-04-08 Texas Instruments Incorporated Methods of and apparatus for immobilizing semiconductor wafers during sawing thereof
JP3621182B2 (ja) * 1996-02-23 2005-02-16 株式会社シチズン電子 チップサイズパッケージの製造方法
US5803797A (en) * 1996-11-26 1998-09-08 Micron Technology, Inc. Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck
JPH10303151A (ja) * 1997-04-28 1998-11-13 Sony Corp 電子部品の製造方法
JPH10335271A (ja) * 1997-06-02 1998-12-18 Texas Instr Japan Ltd ウェハ貼着用シートおよび半導体装置の製造方法
JP3064979B2 (ja) * 1997-08-19 2000-07-12 日本電気株式会社 半導体ウェハのダイシング方法
JPH1161065A (ja) * 1997-08-25 1999-03-05 Sumitomo Bakelite Co Ltd 半導体ウエハ加工用粘着シート
JPH11121402A (ja) * 1997-10-14 1999-04-30 Disco Abrasive Syst Ltd Ｕｖ照射ユニット及び該ｕｖ照射ユニットを搭載したダイシング装置
SG84524A1 (en) * 1998-03-13 2001-11-20 Towa Corp Nest for dicing, and method and apparatus for cutting tapeless substrate using the same
JP2000124161A (ja) * 1998-10-14 2000-04-28 Disco Abrasive Syst Ltd 基盤の分割方法
JP4339452B2 (ja) * 1999-07-09 2009-10-07 株式会社ディスコ Ｃｓｐ基板分割装置
JP2000332086A (ja) * 1999-05-21 2000-11-30 Disco Abrasive Syst Ltd 被加工物の保持方法及び被加工物保持ユニット
JP4312304B2 (ja) * 1999-07-13 2009-08-12 株式会社ディスコ Ｃｓｐ基板分割装置
JP2001077057A (ja) * 1999-09-06 2001-03-23 Disco Abrasive Syst Ltd Ｃｓｐ基板分割装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3811182A (en) * 1972-03-31 1974-05-21 Ibm Object handling fixture, system, and process
US5964646A (en) * 1997-11-17 1999-10-12 Strasbaugh Grinding process and apparatus for planarizing sawed wafers
US6165232A (en) * 1998-03-13 2000-12-26 Towa Corporation Method and apparatus for securely holding a substrate during dicing

Also Published As

Publication number Publication date
KR20010030084A (ko) 2001-04-16
US6386191B1 (en) 2002-05-14
JP4388640B2 (ja) 2009-12-24
TW472358B (en) 2002-01-11
JP2001085449A (ja) 2001-03-30
KR100652152B1 (ko) 2006-11-29

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