SG145722A1 - Light emitting apparatus - Google Patents

Light emitting apparatus

Info

Publication number
SG145722A1
SG145722A1 SG200805892-7A SG2008058927A SG145722A1 SG 145722 A1 SG145722 A1 SG 145722A1 SG 2008058927 A SG2008058927 A SG 2008058927A SG 145722 A1 SG145722 A1 SG 145722A1
Authority
SG
Singapore
Prior art keywords
nitride semiconductor
light emitting
semiconductor layer
main surface
type nitride
Prior art date
Application number
SG200805892-7A
Other languages
English (en)
Inventor
Youichi Nagai
Makoto Kiyama
Takao Nakamura
Takashi Sakurada
Katsushi Akita
Koji Uematsu
Ayako Ikeda
Koji Katayama
Susumu Yoshimoto
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of SG145722A1 publication Critical patent/SG145722A1/en

Links

Classifications

    • H—ELECTRICITY
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    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
SG200805892-7A 2003-08-26 2004-08-04 Light emitting apparatus SG145722A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003301706 2003-08-26
JP2003429818 2003-12-25

Publications (1)

Publication Number Publication Date
SG145722A1 true SG145722A1 (en) 2008-09-29

Family

ID=34220742

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200805892-7A SG145722A1 (en) 2003-08-26 2004-08-04 Light emitting apparatus

Country Status (9)

Country Link
US (2) US7202509B2 (fr)
EP (1) EP1571716A4 (fr)
JP (2) JP3841092B2 (fr)
KR (1) KR100919657B1 (fr)
CN (1) CN100414724C (fr)
CA (1) CA2509785A1 (fr)
SG (1) SG145722A1 (fr)
TW (1) TW200522392A (fr)
WO (1) WO2005020337A1 (fr)

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JP2005191530A (ja) 2003-12-03 2005-07-14 Sumitomo Electric Ind Ltd 発光装置
JP5038147B2 (ja) * 2004-11-18 2012-10-03 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 発光体、及び前記発光体を製造する方法
JP4384019B2 (ja) * 2004-12-08 2009-12-16 住友電気工業株式会社 ヘッドランプ
JP2006179511A (ja) * 2004-12-20 2006-07-06 Sumitomo Electric Ind Ltd 発光装置
JP4244953B2 (ja) * 2005-04-26 2009-03-25 住友電気工業株式会社 発光装置およびその製造方法
JP2006324324A (ja) * 2005-05-17 2006-11-30 Sumitomo Electric Ind Ltd 発光装置、発光装置の製造方法および窒化物半導体基板
JP4297084B2 (ja) * 2005-06-13 2009-07-15 住友電気工業株式会社 発光装置の製造方法および発光装置
US20060289891A1 (en) * 2005-06-28 2006-12-28 Hutchins Edward L Electronic and/or optoelectronic devices grown on free-standing GaN substrates with GaN spacer structures
WO2007004572A1 (fr) * 2005-06-30 2007-01-11 Matsushita Electric Works, Ltd. Dispositif électroluminescent
JP2007019099A (ja) * 2005-07-05 2007-01-25 Sumitomo Electric Ind Ltd 発光装置およびその製造方法
JP2007088420A (ja) * 2005-08-25 2007-04-05 Sharp Corp 半導体発光素子の製造方法
JP2007088389A (ja) * 2005-09-26 2007-04-05 Yamaguchi Univ 半導体発光素子の内部量子効率を測定する装置及びその方法
US7928462B2 (en) 2006-02-16 2011-04-19 Lg Electronics Inc. Light emitting device having vertical structure, package thereof and method for manufacturing the same
JP2007266574A (ja) * 2006-02-28 2007-10-11 Sanyo Electric Co Ltd 半導体レーザ素子及び半導体レーザ素子の製造方法
US7754514B2 (en) 2006-08-22 2010-07-13 Toyoda Gosei Co., Ltd. Method of making a light emitting element
JP4894411B2 (ja) * 2006-08-23 2012-03-14 日立電線株式会社 半導体発光素子
JP2008140893A (ja) * 2006-11-30 2008-06-19 Sumitomo Electric Ind Ltd 半導体デバイスおよびその製造方法
US8080833B2 (en) * 2007-01-26 2011-12-20 Crystal Is, Inc. Thick pseudomorphic nitride epitaxial layers
JP5133087B2 (ja) * 2007-02-23 2013-01-30 株式会社ニューフレアテクノロジー 半導体装置の製造方法
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US8104945B2 (en) * 2007-12-27 2012-01-31 Samsung Led Co., Ltd. Backlight unit implementing local dimming for liquid crystal display device
JP4692602B2 (ja) 2008-09-26 2011-06-01 住友電気工業株式会社 窒化ガリウム系エピタキシャルウエハ、およびエピタキシャルウエハを作製する方法
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US7687822B2 (en) 2010-03-30
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CN100414724C (zh) 2008-08-27
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US20080210959A1 (en) 2008-09-04
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US20050062060A1 (en) 2005-03-24

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