JPS5455390A - Light emitting element - Google Patents

Light emitting element

Info

Publication number
JPS5455390A
JPS5455390A JP12278977A JP12278977A JPS5455390A JP S5455390 A JPS5455390 A JP S5455390A JP 12278977 A JP12278977 A JP 12278977A JP 12278977 A JP12278977 A JP 12278977A JP S5455390 A JPS5455390 A JP S5455390A
Authority
JP
Japan
Prior art keywords
face
junction
layer
substrate
serration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12278977A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Hayakawa
Tetsuro Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12278977A priority Critical patent/JPS5455390A/en
Publication of JPS5455390A publication Critical patent/JPS5455390A/en
Pending legal-status Critical Current

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  • Led Devices (AREA)

Abstract

PURPOSE: To prevent contamination of pn junction at the time of mounting by leaving excess hems on the pn junction face with respect to the mount side bottom face thereby providing a serration in a pellet in which the pn junction exposes to the side face.
CONSTITUTION: An N layer 12 and a P layer 13 are liquid phase epitaxially formed on an N type GaP substrate 11, and an Al electrode 14 and a gold-Si alloy electrode 15 are deposited. Next, grooves are formed, after which the substrate is separated to pellets, then a serration is formed on the side faces of the layers 12, 13 and the side face of the layer 11. This prevents solder and paste from creeping up to the pn junction part at the time of mounting the substrate 11 face
COPYRIGHT: (C)1979,JPO&Japio
JP12278977A 1977-10-12 1977-10-12 Light emitting element Pending JPS5455390A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12278977A JPS5455390A (en) 1977-10-12 1977-10-12 Light emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12278977A JPS5455390A (en) 1977-10-12 1977-10-12 Light emitting element

Publications (1)

Publication Number Publication Date
JPS5455390A true JPS5455390A (en) 1979-05-02

Family

ID=14844651

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12278977A Pending JPS5455390A (en) 1977-10-12 1977-10-12 Light emitting element

Country Status (1)

Country Link
JP (1) JPS5455390A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7190004B2 (en) 2003-12-03 2007-03-13 Sumitomo Electric Industries, Ltd. Light emitting device
US7202509B2 (en) 2003-08-26 2007-04-10 Sumitomo Electric Industries, Ltd. Light emitting apparatus
US8823028B2 (en) 2008-07-21 2014-09-02 Lg Innotek Co., Ltd. Light emitting diode and method of manufacturing the same, and light emitting device and method of manufacturing the light emitting device
US10519837B2 (en) 2016-09-12 2019-12-31 Chugoku Electric Power Co., Inc. Combustion system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7202509B2 (en) 2003-08-26 2007-04-10 Sumitomo Electric Industries, Ltd. Light emitting apparatus
US7687822B2 (en) 2003-08-26 2010-03-30 Sumitomo Electric Industries, Ltd. Light emitting apparatus
US7190004B2 (en) 2003-12-03 2007-03-13 Sumitomo Electric Industries, Ltd. Light emitting device
US8823028B2 (en) 2008-07-21 2014-09-02 Lg Innotek Co., Ltd. Light emitting diode and method of manufacturing the same, and light emitting device and method of manufacturing the light emitting device
US9680064B2 (en) 2008-07-21 2017-06-13 Lg Innotek Co., Ltd. Light emitting diode and method of manufacturing the same, and light emitting device and method of manufacturing the light emitting device
US10519837B2 (en) 2016-09-12 2019-12-31 Chugoku Electric Power Co., Inc. Combustion system

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