SG11201408155RA - Epoxy resin composition and cured product thereof and curable resin composition - Google Patents

Epoxy resin composition and cured product thereof and curable resin composition

Info

Publication number
SG11201408155RA
SG11201408155RA SG11201408155RA SG11201408155RA SG11201408155RA SG 11201408155R A SG11201408155R A SG 11201408155RA SG 11201408155R A SG11201408155R A SG 11201408155RA SG 11201408155R A SG11201408155R A SG 11201408155RA SG 11201408155R A SG11201408155R A SG 11201408155RA
Authority
SG
Singapore
Prior art keywords
resin composition
tokyo
epoxy resin
formula
curable resin
Prior art date
Application number
SG11201408155RA
Other languages
English (en)
Inventor
Masataka Nakanishi
Seiji Ebara
Kazuma Inoue
Kazumi Obuchi
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of SG11201408155RA publication Critical patent/SG11201408155RA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/681—Metal alcoholates, phenolates or carboxylates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
    • C08G2650/20—Cross-linking

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
SG11201408155RA 2012-06-07 2013-06-06 Epoxy resin composition and cured product thereof and curable resin composition SG11201408155RA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012129408 2012-06-07
JP2012129406 2012-06-07
PCT/JP2013/065756 WO2013183736A1 (ja) 2012-06-07 2013-06-06 エポキシ樹脂組成物、およびその硬化物、並びに、硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
SG11201408155RA true SG11201408155RA (en) 2015-01-29

Family

ID=49712123

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201408155RA SG11201408155RA (en) 2012-06-07 2013-06-06 Epoxy resin composition and cured product thereof and curable resin composition

Country Status (7)

Country Link
JP (1) JP6240069B2 (zh)
KR (1) KR101913603B1 (zh)
CN (1) CN104395371B (zh)
MY (1) MY169102A (zh)
SG (1) SG11201408155RA (zh)
TW (2) TW201412804A (zh)
WO (1) WO2013183736A1 (zh)

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WO2014175346A1 (ja) * 2013-04-25 2014-10-30 日本化薬株式会社 フェノール樹脂、該フェノール樹脂を含有するエポキシ樹脂組成物、およびその硬化物
JP6550843B2 (ja) * 2014-03-31 2019-07-31 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板
KR102332174B1 (ko) * 2014-04-15 2021-12-01 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 섬유강화 복합재료
JP2015209509A (ja) * 2014-04-28 2015-11-24 京セラケミカル株式会社 エポキシ樹脂組成物および樹脂封止型電子部品装置
KR102327347B1 (ko) 2014-08-22 2021-11-16 닛뽄 가야쿠 가부시키가이샤 에폭시(메타)아크릴레이트 화합물 및 그것을 함유하는 수지 조성물 그리고 그의 경화물, 컬러 필터 및 표시 소자
CN106604947B (zh) * 2014-08-26 2019-08-06 日本化药株式会社 反应性聚酯化合物、使用该化合物的活性能量射线固化型树脂组合物
JP6428147B2 (ja) * 2014-10-22 2018-11-28 味の素株式会社 樹脂組成物
JP7046602B2 (ja) * 2015-03-18 2022-04-04 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、及びプリント配線板
JP2017071706A (ja) * 2015-10-08 2017-04-13 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物およびその硬化物
SG11201803179YA (en) 2015-11-04 2018-05-30 Lintec Corp Curable resin film and first protective film forming sheet
CN105714857A (zh) * 2016-02-03 2016-06-29 袁根木 最长的跨海江底的管段预制用钢丝网片代替模板方法
KR102340503B1 (ko) * 2016-03-28 2021-12-20 세키스이가가쿠 고교가부시키가이샤 수지 조성물 및 다층 기판
US10487077B1 (en) 2018-06-14 2019-11-26 Sabic Global Technologies B.V. Bis(benzoxazinyl)phthalimidine and associated curable composition and composite
CN109401707B (zh) * 2018-11-01 2020-12-08 烟台信友新材料有限公司 一种单组份高耐温抗冲击阻燃型结构胶黏剂及其制备方法
JP7184002B2 (ja) * 2019-09-13 2022-12-06 味の素株式会社 樹脂組成物
JP7491741B2 (ja) 2020-05-27 2024-05-28 住友化学株式会社 エポキシ樹脂組成物及びその硬化物
CN112379546B (zh) * 2020-11-23 2022-08-19 珠海兴业新材料科技有限公司 聚合物分散染料液晶材料、电致变色调光薄膜及制备方法
WO2024024620A1 (ja) * 2022-07-26 2024-02-01 三井化学株式会社 表示装置用封止材、封止材、有機ｅｌディスプレイおよびｌｅｄディスプレイ

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JPH01108217A (ja) * 1987-10-21 1989-04-25 Mitsui Petrochem Ind Ltd エポキシ樹脂の精製方法
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JP5153000B2 (ja) * 2009-04-01 2013-02-27 新日鉄住金化学株式会社 エポキシ樹脂、その製造方法、エポキシ樹脂組成物および硬化物
KR20120026035A (ko) * 2009-04-17 2012-03-16 니폰 카야쿠 가부시키가이샤 올레핀 수지, 에폭시 수지, 경화성 수지 조성물 및 그 경화물
KR20130059327A (ko) * 2010-03-15 2013-06-05 스미또모 베이크라이트 가부시키가이샤 반도체 밀봉용 수지 조성물 및 이것을 사용한 반도체 장치
JP5404514B2 (ja) * 2010-04-19 2014-02-05 日本化薬株式会社 エポキシ樹脂の製造法、エポキシ樹脂、および硬化性樹脂組成物
JP5732774B2 (ja) * 2010-08-16 2015-06-10 Dic株式会社 エポキシ樹脂組成物、硬化性樹脂組成物、その硬化物、及びプリント配線基板
JP5745248B2 (ja) * 2010-10-08 2015-07-08 株式会社ダイセル エポキシ樹脂用硬化剤組成物、硬化性樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
CN104395371A (zh) 2015-03-04
CN104395371B (zh) 2017-03-15
KR101913603B1 (ko) 2018-10-31
TWI647248B (zh) 2019-01-11
KR20150030645A (ko) 2015-03-20
WO2013183736A1 (ja) 2013-12-12
JPWO2013183736A1 (ja) 2016-02-01
MY169102A (en) 2019-02-18
TW201412804A (zh) 2014-04-01
TW201809054A (zh) 2018-03-16
JP6240069B2 (ja) 2017-11-29

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