MY169102A - Epoxy resin composition and cured product thereof and curable resin composition - Google Patents
Epoxy resin composition and cured product thereof and curable resin compositionInfo
- Publication number
- MY169102A MY169102A MYPI2014703663A MYPI2014703663A MY169102A MY 169102 A MY169102 A MY 169102A MY PI2014703663 A MYPI2014703663 A MY PI2014703663A MY PI2014703663 A MYPI2014703663 A MY PI2014703663A MY 169102 A MY169102 A MY 169102A
- Authority
- MY
- Malaysia
- Prior art keywords
- resin composition
- epoxy resin
- cured product
- curable resin
- carbon atoms
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/26—Di-epoxy compounds heterocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/681—Metal alcoholates, phenolates or carboxylates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
- C08G2650/20—Cross-linking
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Provided are an epoxy resin composition containing an epoxy resin represented by the following formula (2) and a carboxylic acid and/or a cationic polymerization catalyst, the epoxy resin having a hue by the Gardner colorimetry (in a 40% MEK solution) of not more than 2; and a curable resin composition containing an epoxy resin represented by the following formula (2) and a phenol resin and/or a polymerization catalyst. (In the formula, each of plurally existent Rs independently represents a hydrogen atom, an alkyl group having from I to 6 carbon atoms, or an alkoxy group having from I to 6 carbon atoms.)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012129408 | 2012-06-07 | ||
JP2012129406 | 2012-06-07 | ||
PCT/JP2013/065756 WO2013183736A1 (en) | 2012-06-07 | 2013-06-06 | Epoxy resin composition, cured product thereof, and curable resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
MY169102A true MY169102A (en) | 2019-02-18 |
Family
ID=49712123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2014703663A MY169102A (en) | 2012-06-07 | 2013-06-06 | Epoxy resin composition and cured product thereof and curable resin composition |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6240069B2 (en) |
KR (1) | KR101913603B1 (en) |
CN (1) | CN104395371B (en) |
MY (1) | MY169102A (en) |
SG (1) | SG11201408155RA (en) |
TW (2) | TW201412804A (en) |
WO (1) | WO2013183736A1 (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6239599B2 (en) * | 2013-04-25 | 2017-11-29 | 日本化薬株式会社 | Phenol resin, epoxy resin composition containing the phenol resin, and cured product thereof |
JP6550843B2 (en) * | 2014-03-31 | 2019-07-31 | 三菱ケミカル株式会社 | Epoxy resin, epoxy resin composition, cured product, and laminate for electric / electronic circuit |
EP3133108B1 (en) * | 2014-04-15 | 2023-08-02 | Mitsubishi Gas Chemical Company, Inc. | Fiber-reinforced composite material |
JP2015209509A (en) * | 2014-04-28 | 2015-11-24 | 京セラケミカル株式会社 | Epoxy resin composition and resin-sealed electronic component device |
KR102327347B1 (en) | 2014-08-22 | 2021-11-16 | 닛뽄 가야쿠 가부시키가이샤 | Epoxy(meth)acrylate compound, resin composition containing the same and cured product thereof, color filter and display device |
KR102228850B1 (en) * | 2014-08-26 | 2021-03-17 | 닛뽄 가야쿠 가부시키가이샤 | Reactive polyester compound and active energy ray-curable resin composition using same |
JP6428147B2 (en) * | 2014-10-22 | 2018-11-28 | 味の素株式会社 | Resin composition |
CN107406577A (en) * | 2015-03-18 | 2017-11-28 | 三菱瓦斯化学株式会社 | Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board (PCB) |
JP2017071706A (en) * | 2015-10-08 | 2017-04-13 | 日本化薬株式会社 | Epoxy resin composition, curable resin composition and cured product thereof |
US10717901B2 (en) | 2015-11-04 | 2020-07-21 | Lintec Corporation | Curable resin film and first protective film forming sheet |
CN105714857A (en) * | 2016-02-03 | 2016-06-29 | 袁根木 | Method for replacing template with steel wire mesh during prefabricating longest sea-crossing river bottom pipe section |
JP7385344B2 (en) * | 2016-03-28 | 2023-11-22 | 積水化学工業株式会社 | Thermosetting resin composition and multilayer substrate |
US10487077B1 (en) | 2018-06-14 | 2019-11-26 | Sabic Global Technologies B.V. | Bis(benzoxazinyl)phthalimidine and associated curable composition and composite |
CN109401707B (en) * | 2018-11-01 | 2020-12-08 | 烟台信友新材料有限公司 | Single-component high-temperature-resistant impact-resistant flame-retardant structural adhesive and preparation method thereof |
JP7184002B2 (en) * | 2019-09-13 | 2022-12-06 | 味の素株式会社 | resin composition |
JP7491741B2 (en) * | 2020-05-27 | 2024-05-28 | 住友化学株式会社 | Epoxy resin composition and its cured product |
CN112379546B (en) * | 2020-11-23 | 2022-08-19 | 珠海兴业新材料科技有限公司 | Polymer disperse dye liquid crystal material, electrochromic dimming film and preparation method |
WO2024024620A1 (en) * | 2022-07-26 | 2024-02-01 | 三井化学株式会社 | Sealing material for display device, sealing material, organic el display, and led display |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH496021A (en) * | 1966-03-10 | 1970-09-15 | Ciba Geigy | Preparation of polyglycidyl ethers |
JPH01108218A (en) * | 1987-10-21 | 1989-04-25 | Mitsui Petrochem Ind Ltd | Purification of epoxy resin |
JPH01108217A (en) * | 1987-10-21 | 1989-04-25 | Mitsui Petrochem Ind Ltd | Purification of epoxy resin |
JP2556366B2 (en) * | 1988-11-25 | 1996-11-20 | 日本化薬株式会社 | High-purity epoxy resin and method for producing the same |
JPH0892231A (en) * | 1994-09-22 | 1996-04-09 | Mitsui Toatsu Chem Inc | Spirobiindan diglycidyl ether and its production |
JPH11255864A (en) * | 1998-03-09 | 1999-09-21 | Toshiba Corp | Liquid epoxy rein composition and resin-sealed type semiconductor apparatus |
JP2000007757A (en) * | 1998-04-22 | 2000-01-11 | Asahi Chiba Kk | New epoxy resin |
JP2002114835A (en) * | 2000-10-06 | 2002-04-16 | Asahi Denka Kogyo Kk | Curing agent composition for epoxy resin and coating composition |
JP2004099744A (en) * | 2002-09-10 | 2004-04-02 | Mitsui Chemicals Inc | Method for purifying epoxy resin |
WO2004069893A1 (en) * | 2003-02-03 | 2004-08-19 | Nippon Steel Chemical Co., Ltd. | Epoxy resin, process for producing the same, epoxy resin composition containing the same, and cured object |
JP2005154719A (en) * | 2003-04-25 | 2005-06-16 | Mitsui Chemicals Inc | Epoxy resin composition and its application |
JP2007063565A (en) * | 2006-10-17 | 2007-03-15 | Sumitomo Bakelite Co Ltd | Resin paste for semiconductor and semiconductor device |
WO2008140008A1 (en) * | 2007-05-08 | 2008-11-20 | Mitsubishi Gas Chemical Company, Inc. | Process for producing tetraglycidylamino compound |
JP4782870B2 (en) * | 2008-07-31 | 2011-09-28 | 積水化学工業株式会社 | Cured body, sheet-like molded body, laminated board and multilayer laminated board |
JP5153000B2 (en) * | 2009-04-01 | 2013-02-27 | 新日鉄住金化学株式会社 | Epoxy resin, production method thereof, epoxy resin composition and cured product |
JP5559154B2 (en) * | 2009-04-17 | 2014-07-23 | 日本化薬株式会社 | Olefin resin, epoxy resin, curable resin composition and cured product thereof |
US20130009327A1 (en) * | 2010-03-15 | 2013-01-10 | Yusuke Tanaka | Resin composition for semiconductor encapsulation, and semiconductor device using same |
JP5404514B2 (en) * | 2010-04-19 | 2014-02-05 | 日本化薬株式会社 | Epoxy resin production method, epoxy resin, and curable resin composition |
JP5732774B2 (en) * | 2010-08-16 | 2015-06-10 | Dic株式会社 | Epoxy resin composition, curable resin composition, cured product thereof, and printed wiring board |
JP5745248B2 (en) * | 2010-10-08 | 2015-07-08 | 株式会社ダイセル | Curing agent composition for epoxy resin, curable resin composition and cured product thereof |
-
2013
- 2013-06-06 JP JP2014520060A patent/JP6240069B2/en active Active
- 2013-06-06 CN CN201380030140.7A patent/CN104395371B/en active Active
- 2013-06-06 SG SG11201408155RA patent/SG11201408155RA/en unknown
- 2013-06-06 WO PCT/JP2013/065756 patent/WO2013183736A1/en active Application Filing
- 2013-06-06 KR KR1020147033069A patent/KR101913603B1/en active IP Right Grant
- 2013-06-06 MY MYPI2014703663A patent/MY169102A/en unknown
- 2013-06-07 TW TW102120279A patent/TW201412804A/en unknown
- 2013-06-07 TW TW106141641A patent/TWI647248B/en active
Also Published As
Publication number | Publication date |
---|---|
TW201809054A (en) | 2018-03-16 |
CN104395371A (en) | 2015-03-04 |
TW201412804A (en) | 2014-04-01 |
CN104395371B (en) | 2017-03-15 |
JPWO2013183736A1 (en) | 2016-02-01 |
KR101913603B1 (en) | 2018-10-31 |
JP6240069B2 (en) | 2017-11-29 |
SG11201408155RA (en) | 2015-01-29 |
WO2013183736A1 (en) | 2013-12-12 |
TWI647248B (en) | 2019-01-11 |
KR20150030645A (en) | 2015-03-20 |
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