MY169102A - Epoxy resin composition and cured product thereof and curable resin composition - Google Patents

Epoxy resin composition and cured product thereof and curable resin composition

Info

Publication number
MY169102A
MY169102A MYPI2014703663A MYPI2014703663A MY169102A MY 169102 A MY169102 A MY 169102A MY PI2014703663 A MYPI2014703663 A MY PI2014703663A MY PI2014703663 A MYPI2014703663 A MY PI2014703663A MY 169102 A MY169102 A MY 169102A
Authority
MY
Malaysia
Prior art keywords
resin composition
epoxy resin
cured product
curable resin
carbon atoms
Prior art date
Application number
MYPI2014703663A
Inventor
Masataka Nakanishi
Seiji Ebara
Kazuma Inoue
Kazumi Obuchi
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of MY169102A publication Critical patent/MY169102A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/681—Metal alcoholates, phenolates or carboxylates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
    • C08G2650/20—Cross-linking

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Provided are an epoxy resin composition containing an epoxy resin represented by the following formula (2) and a carboxylic acid and/or a cationic polymerization catalyst, the epoxy resin having a hue by the Gardner colorimetry (in a 40% MEK solution) of not more than 2; and a curable resin composition containing an epoxy resin represented by the following formula (2) and a phenol resin and/or a polymerization catalyst. (In the formula, each of plurally existent Rs independently represents a hydrogen atom, an alkyl group having from I to 6 carbon atoms, or an alkoxy group having from I to 6 carbon atoms.)
MYPI2014703663A 2012-06-07 2013-06-06 Epoxy resin composition and cured product thereof and curable resin composition MY169102A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012129408 2012-06-07
JP2012129406 2012-06-07
PCT/JP2013/065756 WO2013183736A1 (en) 2012-06-07 2013-06-06 Epoxy resin composition, cured product thereof, and curable resin composition

Publications (1)

Publication Number Publication Date
MY169102A true MY169102A (en) 2019-02-18

Family

ID=49712123

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014703663A MY169102A (en) 2012-06-07 2013-06-06 Epoxy resin composition and cured product thereof and curable resin composition

Country Status (7)

Country Link
JP (1) JP6240069B2 (en)
KR (1) KR101913603B1 (en)
CN (1) CN104395371B (en)
MY (1) MY169102A (en)
SG (1) SG11201408155RA (en)
TW (2) TW201412804A (en)
WO (1) WO2013183736A1 (en)

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JP6239599B2 (en) * 2013-04-25 2017-11-29 日本化薬株式会社 Phenol resin, epoxy resin composition containing the phenol resin, and cured product thereof
JP6550843B2 (en) * 2014-03-31 2019-07-31 三菱ケミカル株式会社 Epoxy resin, epoxy resin composition, cured product, and laminate for electric / electronic circuit
EP3133108B1 (en) * 2014-04-15 2023-08-02 Mitsubishi Gas Chemical Company, Inc. Fiber-reinforced composite material
JP2015209509A (en) * 2014-04-28 2015-11-24 京セラケミカル株式会社 Epoxy resin composition and resin-sealed electronic component device
KR102327347B1 (en) 2014-08-22 2021-11-16 닛뽄 가야쿠 가부시키가이샤 Epoxy(meth)acrylate compound, resin composition containing the same and cured product thereof, color filter and display device
KR102228850B1 (en) * 2014-08-26 2021-03-17 닛뽄 가야쿠 가부시키가이샤 Reactive polyester compound and active energy ray-curable resin composition using same
JP6428147B2 (en) * 2014-10-22 2018-11-28 味の素株式会社 Resin composition
CN107406577A (en) * 2015-03-18 2017-11-28 三菱瓦斯化学株式会社 Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board (PCB)
JP2017071706A (en) * 2015-10-08 2017-04-13 日本化薬株式会社 Epoxy resin composition, curable resin composition and cured product thereof
US10717901B2 (en) 2015-11-04 2020-07-21 Lintec Corporation Curable resin film and first protective film forming sheet
CN105714857A (en) * 2016-02-03 2016-06-29 袁根木 Method for replacing template with steel wire mesh during prefabricating longest sea-crossing river bottom pipe section
JP7385344B2 (en) * 2016-03-28 2023-11-22 積水化学工業株式会社 Thermosetting resin composition and multilayer substrate
US10487077B1 (en) 2018-06-14 2019-11-26 Sabic Global Technologies B.V. Bis(benzoxazinyl)phthalimidine and associated curable composition and composite
CN109401707B (en) * 2018-11-01 2020-12-08 烟台信友新材料有限公司 Single-component high-temperature-resistant impact-resistant flame-retardant structural adhesive and preparation method thereof
JP7184002B2 (en) * 2019-09-13 2022-12-06 味の素株式会社 resin composition
JP7491741B2 (en) * 2020-05-27 2024-05-28 住友化学株式会社 Epoxy resin composition and its cured product
CN112379546B (en) * 2020-11-23 2022-08-19 珠海兴业新材料科技有限公司 Polymer disperse dye liquid crystal material, electrochromic dimming film and preparation method
WO2024024620A1 (en) * 2022-07-26 2024-02-01 三井化学株式会社 Sealing material for display device, sealing material, organic el display, and led display

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JPH01108218A (en) * 1987-10-21 1989-04-25 Mitsui Petrochem Ind Ltd Purification of epoxy resin
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JP2000007757A (en) * 1998-04-22 2000-01-11 Asahi Chiba Kk New epoxy resin
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Also Published As

Publication number Publication date
TW201809054A (en) 2018-03-16
CN104395371A (en) 2015-03-04
TW201412804A (en) 2014-04-01
CN104395371B (en) 2017-03-15
JPWO2013183736A1 (en) 2016-02-01
KR101913603B1 (en) 2018-10-31
JP6240069B2 (en) 2017-11-29
SG11201408155RA (en) 2015-01-29
WO2013183736A1 (en) 2013-12-12
TWI647248B (en) 2019-01-11
KR20150030645A (en) 2015-03-20

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