IN2013DE02875A - - Google Patents
Info
- Publication number
- IN2013DE02875A IN2013DE02875A IN2875DE2013A IN2013DE02875A IN 2013DE02875 A IN2013DE02875 A IN 2013DE02875A IN 2875DE2013 A IN2875DE2013 A IN 2875DE2013A IN 2013DE02875 A IN2013DE02875 A IN 2013DE02875A
- Authority
- IN
- India
- Prior art keywords
- epoxy resin
- hardener
- self
- healing
- modified
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
- C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
- C08G77/388—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing nitrogen
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
ABSTRACT A SELF-HEALING EPOXY RESIN COMPOSITION A self-healing hydrophobic epoxy resin composition is provided. The self-healing epoxy resin composition comprises an epoxy resin component and a hardener component, the hardener component comprises at least 0.1 weight % of a modified epoxy resin hardener. The modified epoxy resin hardener is a reaction product of an amino modified oligomericsiloxane and a carboxylic acid anhydride. A process for preparing the modified epoxy resin hardener is also disclosed.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IN2875DE2013 IN2013DE02875A (en) | 2013-09-27 | 2014-09-26 | |
EP14848204.5A EP3049256A4 (en) | 2013-09-27 | 2014-09-26 | A self-healing epoxy resin composition |
US15/025,215 US10221276B2 (en) | 2013-09-27 | 2014-09-26 | Self-healing epoxy resin composition |
PCT/IB2014/001928 WO2015044757A1 (en) | 2013-09-27 | 2014-09-26 | A self-healing epoxy resin composition |
CN201480059536.9A CN105682936B (en) | 2013-09-27 | 2014-09-26 | A kind of selfreparing composition epoxy resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IN2875DE2013 IN2013DE02875A (en) | 2013-09-27 | 2014-09-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2013DE02875A true IN2013DE02875A (en) | 2015-04-03 |
Family
ID=52742159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN2875DE2013 IN2013DE02875A (en) | 2013-09-27 | 2014-09-26 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10221276B2 (en) |
EP (1) | EP3049256A4 (en) |
CN (1) | CN105682936B (en) |
IN (1) | IN2013DE02875A (en) |
WO (1) | WO2015044757A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105440884B (en) * | 2015-12-12 | 2017-12-19 | 青岛农业大学 | A kind of preparation and application of aqueous epoxy resins selfreparing erosion shield |
CN107602820B (en) * | 2017-09-13 | 2019-06-25 | 中国科学院化学研究所 | A kind of the organosilicon polyamine curing agent and selfreparing epoxy resin prepared therefrom of silicon alkoxide sealing end |
CN108440740B (en) * | 2018-02-14 | 2020-05-05 | 苏州大学 | Reversible self-repairing epoxy resin and preparation and recycling remodeling methods thereof |
WO2019165583A1 (en) * | 2018-02-27 | 2019-09-06 | 苏州大学张家港工业技术研究院 | Reversible self-repairing epoxy resin and preparation and recovery remoulding method therefor |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR900000190B1 (en) | 1984-11-16 | 1990-01-23 | 미쓰비시전기 주식회사 | Epoxy resin composition |
JPS63130619A (en) * | 1986-11-21 | 1988-06-02 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing electronic component |
JPH0259185A (en) | 1988-08-25 | 1990-02-28 | Toshiba Corp | Production of clad material |
JPH02258829A (en) * | 1989-03-30 | 1990-10-19 | Toray Ind Inc | Epoxy resin composition |
JP3012358B2 (en) | 1991-04-30 | 2000-02-21 | 東レ・ダウコーニング・シリコーン株式会社 | Heat-curable epoxy resin composition |
KR960010844B1 (en) * | 1991-07-11 | 1996-08-09 | 제일모직 주식회사 | Resin composition for encapsulating semiconductor elements having a improved heat resistance |
JPH06240002A (en) * | 1993-02-19 | 1994-08-30 | Toray Dow Corning Silicone Co Ltd | Organopolysiloxane and its preparation |
US5939491A (en) * | 1997-08-01 | 1999-08-17 | Ppg Industries Ohio, Inc. | Curable compositions based on functional polysiloxanes |
JP3344315B2 (en) * | 1998-04-28 | 2002-11-11 | 宇部興産株式会社 | Single color coated polyimide siloxane coating material and cured film |
WO2001086860A1 (en) | 2000-05-09 | 2001-11-15 | Verizon Laboratories Inc. | Stream-cipher method and apparatus |
JP3855649B2 (en) * | 2000-09-26 | 2006-12-13 | 宇部興産株式会社 | One-part epoxy resin composition and cured product |
DE102004022150A1 (en) * | 2004-05-05 | 2005-12-01 | Henkel Kgaa | Two-component adhesive and sealant |
CN101469133B (en) * | 2007-12-26 | 2012-01-04 | 国家纳米科学中心 | High polymer composite material with hydrophobic, self-cleaning and self-repair functions and use thereof |
WO2010031445A1 (en) | 2008-09-19 | 2010-03-25 | Abb Research Ltd | Epoxy resin composition |
US20120208924A1 (en) | 2009-07-14 | 2012-08-16 | Abb Research Ltd | Epoxy resin composition |
EP2470583A1 (en) | 2009-08-27 | 2012-07-04 | ABB Research Ltd. | Curable epoxy resin composition |
WO2013042052A1 (en) * | 2011-09-19 | 2013-03-28 | Corinne Jean Greyling | Superhydrophobic coatings and methods of preparation |
JP5918590B2 (en) | 2012-03-29 | 2016-05-18 | 東京電力株式会社 | Method and apparatus for decomposing dioxins in exhaust gas |
US9085719B2 (en) * | 2013-03-18 | 2015-07-21 | International Business Machines Corporation | Thermally reversible thermal interface materials with improved moisture resistance |
-
2014
- 2014-09-26 EP EP14848204.5A patent/EP3049256A4/en active Pending
- 2014-09-26 WO PCT/IB2014/001928 patent/WO2015044757A1/en active Application Filing
- 2014-09-26 IN IN2875DE2013 patent/IN2013DE02875A/en unknown
- 2014-09-26 CN CN201480059536.9A patent/CN105682936B/en active Active
- 2014-09-26 US US15/025,215 patent/US10221276B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3049256A4 (en) | 2017-04-26 |
US10221276B2 (en) | 2019-03-05 |
WO2015044757A9 (en) | 2016-06-30 |
US20160229950A1 (en) | 2016-08-11 |
CN105682936A (en) | 2016-06-15 |
EP3049256A1 (en) | 2016-08-03 |
CN105682936B (en) | 2017-09-15 |
WO2015044757A1 (en) | 2015-04-02 |
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