IN2013DE02875A - - Google Patents

Info

Publication number
IN2013DE02875A
IN2013DE02875A IN2875DE2013A IN2013DE02875A IN 2013DE02875 A IN2013DE02875 A IN 2013DE02875A IN 2875DE2013 A IN2875DE2013 A IN 2875DE2013A IN 2013DE02875 A IN2013DE02875 A IN 2013DE02875A
Authority
IN
India
Prior art keywords
epoxy resin
hardener
self
healing
modified
Prior art date
Application number
Inventor
Pradip Kumar Dubey
Amit Dixit
Pankaj Verma
Original Assignee
Aditya Birla Chemicals Thailand Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aditya Birla Chemicals Thailand Ltd filed Critical Aditya Birla Chemicals Thailand Ltd
Priority to IN2875DE2013 priority Critical patent/IN2013DE02875A/en
Priority to EP14848204.5A priority patent/EP3049256A4/en
Priority to US15/025,215 priority patent/US10221276B2/en
Priority to PCT/IB2014/001928 priority patent/WO2015044757A1/en
Priority to CN201480059536.9A priority patent/CN105682936B/en
Publication of IN2013DE02875A publication Critical patent/IN2013DE02875A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/38Polysiloxanes modified by chemical after-treatment
    • C08G77/382Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
    • C08G77/388Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing nitrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

ABSTRACT A SELF-HEALING EPOXY RESIN COMPOSITION A self-healing hydrophobic epoxy resin composition is provided. The self-healing epoxy resin composition comprises an epoxy resin component and a hardener component, the hardener component comprises at least 0.1 weight % of a modified epoxy resin hardener. The modified epoxy resin hardener is a reaction product of an amino modified oligomericsiloxane and a carboxylic acid anhydride. A process for preparing the modified epoxy resin hardener is also disclosed.
IN2875DE2013 2013-09-27 2014-09-26 IN2013DE02875A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IN2875DE2013 IN2013DE02875A (en) 2013-09-27 2014-09-26
EP14848204.5A EP3049256A4 (en) 2013-09-27 2014-09-26 A self-healing epoxy resin composition
US15/025,215 US10221276B2 (en) 2013-09-27 2014-09-26 Self-healing epoxy resin composition
PCT/IB2014/001928 WO2015044757A1 (en) 2013-09-27 2014-09-26 A self-healing epoxy resin composition
CN201480059536.9A CN105682936B (en) 2013-09-27 2014-09-26 A kind of selfreparing composition epoxy resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IN2875DE2013 IN2013DE02875A (en) 2013-09-27 2014-09-26

Publications (1)

Publication Number Publication Date
IN2013DE02875A true IN2013DE02875A (en) 2015-04-03

Family

ID=52742159

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2875DE2013 IN2013DE02875A (en) 2013-09-27 2014-09-26

Country Status (5)

Country Link
US (1) US10221276B2 (en)
EP (1) EP3049256A4 (en)
CN (1) CN105682936B (en)
IN (1) IN2013DE02875A (en)
WO (1) WO2015044757A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105440884B (en) * 2015-12-12 2017-12-19 青岛农业大学 A kind of preparation and application of aqueous epoxy resins selfreparing erosion shield
CN107602820B (en) * 2017-09-13 2019-06-25 中国科学院化学研究所 A kind of the organosilicon polyamine curing agent and selfreparing epoxy resin prepared therefrom of silicon alkoxide sealing end
CN108440740B (en) * 2018-02-14 2020-05-05 苏州大学 Reversible self-repairing epoxy resin and preparation and recycling remodeling methods thereof
WO2019165583A1 (en) * 2018-02-27 2019-09-06 苏州大学张家港工业技术研究院 Reversible self-repairing epoxy resin and preparation and recovery remoulding method therefor

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900000190B1 (en) 1984-11-16 1990-01-23 미쓰비시전기 주식회사 Epoxy resin composition
JPS63130619A (en) * 1986-11-21 1988-06-02 Hitachi Chem Co Ltd Epoxy resin molding material for sealing electronic component
JPH0259185A (en) 1988-08-25 1990-02-28 Toshiba Corp Production of clad material
JPH02258829A (en) * 1989-03-30 1990-10-19 Toray Ind Inc Epoxy resin composition
JP3012358B2 (en) 1991-04-30 2000-02-21 東レ・ダウコーニング・シリコーン株式会社 Heat-curable epoxy resin composition
KR960010844B1 (en) * 1991-07-11 1996-08-09 제일모직 주식회사 Resin composition for encapsulating semiconductor elements having a improved heat resistance
JPH06240002A (en) * 1993-02-19 1994-08-30 Toray Dow Corning Silicone Co Ltd Organopolysiloxane and its preparation
US5939491A (en) * 1997-08-01 1999-08-17 Ppg Industries Ohio, Inc. Curable compositions based on functional polysiloxanes
JP3344315B2 (en) * 1998-04-28 2002-11-11 宇部興産株式会社 Single color coated polyimide siloxane coating material and cured film
WO2001086860A1 (en) 2000-05-09 2001-11-15 Verizon Laboratories Inc. Stream-cipher method and apparatus
JP3855649B2 (en) * 2000-09-26 2006-12-13 宇部興産株式会社 One-part epoxy resin composition and cured product
DE102004022150A1 (en) * 2004-05-05 2005-12-01 Henkel Kgaa Two-component adhesive and sealant
CN101469133B (en) * 2007-12-26 2012-01-04 国家纳米科学中心 High polymer composite material with hydrophobic, self-cleaning and self-repair functions and use thereof
WO2010031445A1 (en) 2008-09-19 2010-03-25 Abb Research Ltd Epoxy resin composition
US20120208924A1 (en) 2009-07-14 2012-08-16 Abb Research Ltd Epoxy resin composition
EP2470583A1 (en) 2009-08-27 2012-07-04 ABB Research Ltd. Curable epoxy resin composition
WO2013042052A1 (en) * 2011-09-19 2013-03-28 Corinne Jean Greyling Superhydrophobic coatings and methods of preparation
JP5918590B2 (en) 2012-03-29 2016-05-18 東京電力株式会社 Method and apparatus for decomposing dioxins in exhaust gas
US9085719B2 (en) * 2013-03-18 2015-07-21 International Business Machines Corporation Thermally reversible thermal interface materials with improved moisture resistance

Also Published As

Publication number Publication date
EP3049256A4 (en) 2017-04-26
US10221276B2 (en) 2019-03-05
WO2015044757A9 (en) 2016-06-30
US20160229950A1 (en) 2016-08-11
CN105682936A (en) 2016-06-15
EP3049256A1 (en) 2016-08-03
CN105682936B (en) 2017-09-15
WO2015044757A1 (en) 2015-04-02

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